CN106784256A - The COB method for packing and its structure of a kind of improving extraction efficiency - Google Patents
The COB method for packing and its structure of a kind of improving extraction efficiency Download PDFInfo
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- CN106784256A CN106784256A CN201710096409.1A CN201710096409A CN106784256A CN 106784256 A CN106784256 A CN 106784256A CN 201710096409 A CN201710096409 A CN 201710096409A CN 106784256 A CN106784256 A CN 106784256A
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- fluorescent glue
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- cob
- packing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses the COB method for packing and its structure of a kind of improving extraction efficiency, it is applied to the substrate layer of COB encapsulating structures, substrate layer includes substrate and the plate upper strata located at upper surface of base plate, and plate upper strata is provided with through hole, and the upper surface of the substrate in through hole is provided with LED chip；The method comprises the following steps：S1, fluorescent glue is carried out dispensing in through-holes, and fluorescent glue upper surface of the thickness no more than plate upper strata；Wherein fluorescent glue by fluorescent material and silica gel, the ratio lifting of fluorescent material and silica gel 120% 170%.The advantage of the invention is that being improved by by the ratio of the fluorescent material in fluorescent glue, and the thickness of fluorescent glue is reduced, make fluorescent glue closer to LED chip and substrate, to improve the light extraction efficiency of LED chip, and make the radiating effect of LED chip more excellent.
Description
Technical field
The present invention relates to the COB method for packing and its structure of a kind of improving extraction efficiency.
Background technology
COB encapsulation technologies are on the printed wiring board for directly fixing LED chip, compared to traditional SMD envelopes of SMD
Dress, COB is encapsulated in technical advantage in terms of directional lighting clearly, except that heat can be directly transmitted into heat by substrate
Outside heavy, low cost, stable performance, light quality are superior, moreover it is possible to carry out personalized designs, therefore COB is encapsulated in illumination side
The application in face becomes a kind of trend and trend, as a kind of packaged type that Illumination Enterprise is promoted mainly.
With the gradually maturation of LED application markets, requirement more and more higher of the client to particular product performance parameters does not require nothing more than product
Product can realize reliability higher, lower power consumption, lumen density higher, more excellent light quality, more consistent volume production light
Color, will also there is more competitive product price.Based on more harsh market demands, conventional COB packaging technologies are also gradually
Embody the deficiency of technical elements.Such as, the spacing between chip is smaller, have impact on radiating effect；Fluorescent material is dispersed in heat conduction
In the relatively low embedding silica gel of coefficient, when light source normal work, the heat that LED chip excitated fluorescent powder is produced can not be by silica gel
It is effectively conducted away, chip is passed on the contrary, causes junction temperature of chip to raise；Fluorescent glue flows on the substrate of intrinsic LED chip
During to be easy to occur fluorescent material sedimentation uneven so that the path of LED chip excitated fluorescent powder is inconsistent, cause COB
Light source light extraction is uneven；During volume production, the fluorescent material in fluorescent glue is settled in point gum machine sebific duct, and fluorescent glue occurs dense up and down
Degree layering, photochromic uniformity is poor between causing same batch products.
Therefore, LED Packaging Industries emerge the COB encapsulation modes of a series of new.Three kinds of comparative maturity are respectively：System
Standby fluorescent powder membrane, LED chip surface spraying fluorescent material, fluorescent material natural subsidence.Although three of the above encapsulation mode can reach
Requirement of the client to particular product performance parameters, but the production capacity inexpensive, high but pursued with most of encapsulation manufacturers is disagreed.Than
Such as：Prepare fluorescent powder membrane and need to introduce new equipment using spraying technology, and requirement to equipment precision is higher, phosphor powder layer
The yield of product is influenceed in the widely different degree of thickness, production cost and quality cost are higher；Fluorescent material natural subsidence pattern,
Although extra production equipment need not be introduced, complex production process, the production cycle is long, it is necessary to many experiments determine often
The dispensing amount of a product, production yield poor controllability.
The content of the invention
In order to overcome the deficiencies in the prior art, it is an object of the invention to provide a kind of COB encapsulation of improving extraction efficiency
Method and its structure, the light extraction efficiency that it can solve the problems, such as traditional COB method for packing are low.
The purpose of the present invention is realized using following technical scheme：
A kind of COB method for packing of improving extraction efficiency, is applied to the substrate layer of COB encapsulating structures, and substrate layer includes base
Plate and the plate upper strata located at upper surface of base plate, plate upper strata are provided with through hole, and the upper surface of the substrate in through hole is provided with LED chip；
The method comprises the following steps：
S1, fluorescent glue is carried out dispensing in through-holes, and fluorescent glue upper surface of the thickness no more than plate upper strata；It is wherein glimmering
Optical cement includes the ratio lifting 120%-170% of fluorescent material and silica gel, fluorescent material and silica gel；
S2, onboard layer upper surface set box dam circle；
S3, in box dam circle casting glue is coated, so that casting glue covering fluorescent glue.
Preferably, the fluorescent glue in S1 carries out dispensing by point gum machine using spiral coating method.
Preferably, the thickness reduction 50%-80% of fluorescent glue.
Preferably, being mixed with inorganic oxide powder in fluorescent glue.
A kind of COB encapsulating structures of improving extraction efficiency, are made up of the COB method for packing.
Compared to existing technology, the beneficial effects of the present invention are：Improved by by the ratio of the fluorescent material in fluorescent glue, with
And the thickness of reduction fluorescent glue, make fluorescent glue closer to LED chip and substrate, to improve the light extraction efficiency of LED chip, and make
The radiating effect of LED chip is more excellent.
Brief description of the drawings
Fig. 1 is the longitudinal section of COB encapsulating structures of the invention；
Fig. 2 is the flow chart of COB method for packing of the invention.
In figure：00th, substrate；01st, LED chip；10th, plate upper strata；100th, through hole；11st, upper insulating barrier；110th, pad；12nd, lead
Electric layer；13rd, lower insulating barrier；20th, box dam circle；21st, casting glue.
Specific embodiment
Below, with reference to accompanying drawing and specific embodiment, the present invention is described further：
Embodiment one,
A kind of COB method for packing of improving extraction efficiency, is applied to the substrate layer of COB encapsulating structures, as shown in figure 1, base
Flaggy includes substrate 00 and plate upper strata 10, and plate upper strata 10 is provided with through hole 100 located at the upper surface of substrate 00, plate upper strata 10, leads to
The upper surface of the substrate 00 in hole 100 is provided with LED chip 01.
In the present embodiment, plate upper strata 10 include set gradually from top to bottom upper insulating barrier 11, conductive layer 12 and it is lower absolutely
Edge layer 13；Pad 110 is provided with upper insulating barrier 11.The concrete structure and method for packing of plate upper strata 10 and substrate 00 can be from existing
Know in technology, will not be repeated here.
The COB method for packing of a kind of improving extraction efficiency, as shown in Fig. 2 comprising the following steps：
Step 101, fluorescent glue is carried out dispensing in through hole 100, and the thickness of fluorescent glue is upper no more than plate upper strata 10
Surface；By fluorescent material and silica gel, the ratio of fluorescent material and silica gel is compared to fluorescent material and silicon in conventional fluorescent glue for wherein fluorescent glue
The ratio lifting 120% of glue；
The ratio of fluorescent material and silica gel in traditional fluorescent glue, those skilled in the art can be known；For example, traditional
Fluorescent glue in the case of colour temperature 3000K, colour rendering index 80, the part by weight of fluorescent material therein and silica gel is 3:16, this
Based on ratio lifting 120%, then the part by weight of fluorescent material and silica gel is 6.6 for invention:16.
Specifically, fluorescent glue carries out dispensing by point gum machine using spiral coating method；Preferably, the thickness of fluorescent glue
Compared to the thickness reduction by 50% of traditional fluorescent glue.
The thickness of traditional fluorescent glue is 1mm~1.5mm, for example according to conventional fluorescent powder and silica gel than thickness be
The fluorescent glue of 1.2mm, its thickness is reduced to 0.6mm after being lifted according to previously described ratio.
Step 102, the onboard upper surface of layer 10 set box dam circle 20；
Step 103, the coating casting glue 21 in box dam circle 20, so that the covering fluorescent glue of casting glue 21.
Casting glue 21 can play a part of protection light source, and casting glue 21 can be but not limited to silica gel.Because of casting glue 21
In do not contain fluorescent material, the heat conducted by the relatively low casting glue 21 of thermal conductivity factor is less；Therefore the heat that LED chip 01 is produced
And the heat that the excitated fluorescent powder of LED chip 01 is produced can effectively be conducted by substrate 00.
Further, inorganic oxide powder is also mixed with fluorescent glue, on this basis, the consumption of fluorescent material can subtract
Few 5% or so.The heat that LED chip excitated fluorescent powder is produced will be reduced, and the thermal conductivity factor of inorganic oxide powder is higher,
Contribute to the conduction of heat, therefore the heat produced compared with the heat and LED chip excitated fluorescent powder of LED chip generation in traditional handicraft
Amount is conducted by embedding silica gel, and this kind of encapsulation mode all has a clear superiority in terms of heat production and heat conduction；Inorganic oxide powder
Metal oxide particle can be but not limited to.
Inorganic oxide powder is mixed in fluorescent glue, the powder of appropriate particle size can be played based on forward scattering
Random scattering process, will may be totally reflected in light-emitting face and the light that is totally reflected effectively scatters light extraction outgoing
Face, reduces the energy that total reflection loss occurs, so as to improve light outgoing efficiency, light efficiency can lift 5% or so.
The light that the light and LED chip excitated fluorescent powder that LED chip sends send is by the random scattering of inorganic oxide powder
Afterwards, luminous light is more uniform, can effectively lift the photochromic uniformity of light source diverse location, improves light quality.
After adding inorganic oxide powder in fluorescent glue, fluorescent glue viscosity increases 20%-50%, can effectively alleviate
Fluorescent material settles too fast problem in silica gel, extends the use time of fluorescent glue, the COB light source room temperature for (not entering roasting) after dispensing
Under the conditions of stand 12 hours, colour temperature change is no more than 50K, and photochromic uniformity is strong between same batch difference light source after encapsulation, can
It is obviously improved yield.
For the technological deficiency of existing COB packaging technologies, the present invention proposes a kind of inexpensive, simple to operate COB encapsulation
Method (is applied to formal dress, upside-down mounting, vertical three kinds of encapsulation modes), it is not necessary to introduce new production equipment, and the production cycle is shorter, raw
Producing yield will also be obviously improved, and with relatively low production cost client can be realized to product " reliability, lower work(higher
Consumption, lumen density higher, more excellent light quality, more consistent volume production are photochromic " etc. performance parameter requirement.The present invention is using high
The dispensing mode of density spot printing fluorescent glue, is proportionally added into the white inorganic oxidate powder of certain particle size in fluorescent glue
End.
Radiating aspect：Fluorescent material is dispersed near the position of substrate, and heat can effectively shed, and inorganic oxide powder
End has superior heat conductivility, after being uniformly mixed into fluorescent glue, can effectively lift the comprehensive heat conductivility of silica gel.Adopt
With new encapsulation mode, junction temperature and glue surface temperature during COB light source normal work can reduce 8-10 DEG C or so, so as to realize more
Reliability, lumen density higher high；
Light efficiency and light quality aspect：The inorganic oxide powder added in fluorescent glue is not involved in lighting, appropriate particle size size
Powder can effectively strengthen the random scattering of forward direction of light, make light extraction more uniform and avoid the invalid of fluorescent material from exciting.Adopt
With new encapsulation mode, light efficiency can lift 5% or so, so that lower power consumption is realized, lumen density higher；
The photochromic uniformity of product and yield aspect：Inorganic oxide powder is added in fluorescent glue, fluorescent glue can be increased
Viscosity, reduce fluorescent material sinking speed.Using new encapsulation mode, the COB light source room temperature bar for (not entering roasting) after dispensing
12 hours are stood under part, colour temperature change is no more than 50K.So as to yield can be obviously improved, realize that more consistent volume production is photochromic.
Traditional method for packing is：Box dam circle is onboard set on layer, fluorescent glue, traditional encapsulation are set in box dam circle
Method needs to set thicker fluorescent glue, and box dam circle is used to prevent fluorescent glue too high and overflow.Compared to traditional method for packing,
This method can reduce the thickness of fluorescent glue by improving the density of fluorescent glue, therefore the dispensing that can first carry out fluorescent glue is entered again
Row box dam；And the lifting and the reduction of thickness of the density due to fluorescent glue, fluorescent material is dispersed in fluorescent glue, fluorescent glue
Compared to traditional method for packing closer to substrate, therefore the heat that LED chip and fluorescent glue are produced can be dissipated by substrate
Heat.
Embodiment two：
The present embodiment is that the ratio of fluorescent material and silica gel is compared to fluorescence in conventional fluorescent glue with the difference of embodiment one
The ratio lifting 170% of powder and silica gel, the thickness reduction by 80% of the thickness compared to traditional fluorescent glue of fluorescent glue.
Embodiment three：
The present embodiment is that the ratio of fluorescent material and silica gel is compared to fluorescence in conventional fluorescent glue with the difference of embodiment one
The ratio lifting 145% of powder and silica gel, the thickness reduction by 65% of the thickness compared to traditional fluorescent glue of fluorescent glue.
Performance detection：The performance detection knot of the present invention and conventional fluorescent glue in the case of colour temperature 3000K, colour rendering index 80
Fruit is as shown in table 1：
Table 1
Result shows that the present invention is improved by by the ratio of the fluorescent material in fluorescent glue, and reduces the thickness of fluorescent glue,
Make fluorescent glue closer to LED chip and substrate, to improve the light extraction efficiency of LED chip, and make the radiating effect of LED chip more
It is excellent.
It will be apparent to those skilled in the art that technical scheme that can be as described above and design, make other various
It is corresponding to change and deformation, and all these change and deformation should all belong to the protection domain of the claims in the present invention
Within.
Claims (5)
1. a kind of COB method for packing of improving extraction efficiency, is applied to the substrate layer of COB encapsulating structures, and substrate layer includes substrate
With located at the plate upper strata of upper surface of base plate, plate upper strata is provided with through hole, and the upper surface of the substrate in through hole is provided with LED chip；Its
It is characterised by, the method comprises the following steps：
S1, fluorescent glue is carried out dispensing in through-holes, and fluorescent glue upper surface of the thickness no more than plate upper strata；Wherein fluorescent glue
Including fluorescent material and silica gel, the ratio lifting 120%-170% of fluorescent material and silica gel；
S2, onboard layer upper surface set box dam circle；
S3, in box dam circle casting glue is coated, so that casting glue covering fluorescent glue.
2. COB method for packing as claimed in claim 1, it is characterised in that the fluorescent glue in S1 uses spiral by point gum machine
Formula coating method carries out dispensing.
3. COB method for packing as claimed in claim 1, it is characterised in that the thickness reduction 50%-80% of fluorescent glue.
4. COB method for packing as claimed in claim 1, it is characterised in that inorganic oxide powder is mixed with fluorescent glue.
5. a kind of COB encapsulating structures of improving extraction efficiency, it is characterised in that the encapsulation as described in any one of Claims 1-4
Method is made.
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| CN201710096409.1A CN106784256A (en) | 2017-02-22 | 2017-02-22 | The COB method for packing and its structure of a kind of improving extraction efficiency |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710096409.1A CN106784256A (en) | 2017-02-22 | 2017-02-22 | The COB method for packing and its structure of a kind of improving extraction efficiency |
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| CN106784256A true CN106784256A (en) | 2017-05-31 |
Family
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| CN201710096409.1A Pending CN106784256A (en) | 2017-02-22 | 2017-02-22 | The COB method for packing and its structure of a kind of improving extraction efficiency |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946435A (en) * | 2017-11-27 | 2018-04-20 | 广州硅能照明有限公司 | L ED COB powder dispensing device and processing method thereof |
| CN109782461A (en) * | 2019-02-22 | 2019-05-21 | 信利光电股份有限公司 | A kind of the dispensing filling attaching process shielded comprehensively, comprehensively screen and electronic equipment |
| CN109817789A (en) * | 2018-12-25 | 2019-05-28 | 广州硅能照明有限公司 | A kind of COB encapsulation and preparation method thereof |
| CN110444647A (en) * | 2019-07-26 | 2019-11-12 | 深圳市华尔威光电科技有限公司 | A kind of LED encapsulation method based on COB technology |
| CN114464608A (en) * | 2022-02-16 | 2022-05-10 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1455462A (en) * | 2002-04-30 | 2003-11-12 | 丰田合成株式会社 | Luminous diode |
| CN101459163A (en) * | 2007-12-12 | 2009-06-17 | 富士迈半导体精密工业（上海）有限公司 | Light emitting diode |
| US20110006668A1 (en) * | 2009-07-10 | 2011-01-13 | Hussell Christopher P | Lighting Structures Including Diffuser Particles Comprising Phosphor Host Materials |
| CN102237474A (en) * | 2010-05-07 | 2011-11-09 | 浙江雄邦节能产品有限公司 | White light-emitting diode (LED) |
| CN102437276A (en) * | 2011-11-25 | 2012-05-02 | 四川新力光源有限公司 | Light emitting diode (LED) device and production method thereof |
| CN102569282A (en) * | 2012-01-18 | 2012-07-11 | 浙江英特来光电科技有限公司 | Light and color adjustable light-emitting diode (LED) structure |
| CN102956800A (en) * | 2011-08-31 | 2013-03-06 | 晶元光电股份有限公司 | Wavelength conversion structure, manufacturing method thereof and light emitting device |
| CN202888230U (en) * | 2012-09-28 | 2013-04-17 | 杭州恒诚光电科技有限公司 | LED packaging paster |
| CN103137830A (en) * | 2013-02-19 | 2013-06-05 | 东南大学 | Light guide stick type white light light-emitting diode (LED) packaging structure |
| CN103606614A (en) * | 2013-12-03 | 2014-02-26 | 南京琦光光电科技有限公司 | Fluorescent plate used for white-light LED and preparation process of fluorescent plate |
| CN103872227A (en) * | 2014-03-27 | 2014-06-18 | 广州市爱易迪新材料科技有限公司 | Method for manufacturing LED lamp filament light source capable of illuminating by 360 degrees |
| CN104037276A (en) * | 2014-06-24 | 2014-09-10 | 合肥工业大学 | Multi-layer white light LED (Light Emitting Diode) device with gradient refractive indexes and packaging method thereof |
| CN105097999A (en) * | 2014-05-06 | 2015-11-25 | 四川新力光源股份有限公司 | LED light-emitting device and manufacturing method thereof |
| CN105304772A (en) * | 2015-10-29 | 2016-02-03 | 弗洛里光电材料（苏州）有限公司 | Improved led packaging method and packaging structure |
-
2017
- 2017-02-22 CN CN201710096409.1A patent/CN106784256A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1455462A (en) * | 2002-04-30 | 2003-11-12 | 丰田合成株式会社 | Luminous diode |
| CN101459163A (en) * | 2007-12-12 | 2009-06-17 | 富士迈半导体精密工业（上海）有限公司 | Light emitting diode |
| US20110006668A1 (en) * | 2009-07-10 | 2011-01-13 | Hussell Christopher P | Lighting Structures Including Diffuser Particles Comprising Phosphor Host Materials |
| CN102237474A (en) * | 2010-05-07 | 2011-11-09 | 浙江雄邦节能产品有限公司 | White light-emitting diode (LED) |
| CN102956800A (en) * | 2011-08-31 | 2013-03-06 | 晶元光电股份有限公司 | Wavelength conversion structure, manufacturing method thereof and light emitting device |
| CN102437276A (en) * | 2011-11-25 | 2012-05-02 | 四川新力光源有限公司 | Light emitting diode (LED) device and production method thereof |
| CN102569282A (en) * | 2012-01-18 | 2012-07-11 | 浙江英特来光电科技有限公司 | Light and color adjustable light-emitting diode (LED) structure |
| CN202888230U (en) * | 2012-09-28 | 2013-04-17 | 杭州恒诚光电科技有限公司 | LED packaging paster |
| CN103137830A (en) * | 2013-02-19 | 2013-06-05 | 东南大学 | Light guide stick type white light light-emitting diode (LED) packaging structure |
| CN103606614A (en) * | 2013-12-03 | 2014-02-26 | 南京琦光光电科技有限公司 | Fluorescent plate used for white-light LED and preparation process of fluorescent plate |
| CN103872227A (en) * | 2014-03-27 | 2014-06-18 | 广州市爱易迪新材料科技有限公司 | Method for manufacturing LED lamp filament light source capable of illuminating by 360 degrees |
| CN105097999A (en) * | 2014-05-06 | 2015-11-25 | 四川新力光源股份有限公司 | LED light-emitting device and manufacturing method thereof |
| CN104037276A (en) * | 2014-06-24 | 2014-09-10 | 合肥工业大学 | Multi-layer white light LED (Light Emitting Diode) device with gradient refractive indexes and packaging method thereof |
| CN105304772A (en) * | 2015-10-29 | 2016-02-03 | 弗洛里光电材料（苏州）有限公司 | Improved led packaging method and packaging structure |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946435A (en) * | 2017-11-27 | 2018-04-20 | 广州硅能照明有限公司 | L ED COB powder dispensing device and processing method thereof |
| CN109817789A (en) * | 2018-12-25 | 2019-05-28 | 广州硅能照明有限公司 | A kind of COB encapsulation and preparation method thereof |
| CN109782461A (en) * | 2019-02-22 | 2019-05-21 | 信利光电股份有限公司 | A kind of the dispensing filling attaching process shielded comprehensively, comprehensively screen and electronic equipment |
| CN110444647A (en) * | 2019-07-26 | 2019-11-12 | 深圳市华尔威光电科技有限公司 | A kind of LED encapsulation method based on COB technology |
| CN114464608A (en) * | 2022-02-16 | 2022-05-10 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
| CN114464608B (en) * | 2022-02-16 | 2022-11-15 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
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Application publication date: 20170531 |