CN106783724A - 基板承载装置 - Google Patents

基板承载装置 Download PDF

Info

Publication number
CN106783724A
CN106783724A CN201710017763.0A CN201710017763A CN106783724A CN 106783724 A CN106783724 A CN 106783724A CN 201710017763 A CN201710017763 A CN 201710017763A CN 106783724 A CN106783724 A CN 106783724A
Authority
CN
China
Prior art keywords
substrate
bearing device
electric conductor
substrate bearing
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710017763.0A
Other languages
English (en)
Inventor
蔡佳仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Original Assignee
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HKC Co Ltd, Chongqing HKC Optoelectronics Technology Co Ltd filed Critical HKC Co Ltd
Priority to CN201710017763.0A priority Critical patent/CN106783724A/zh
Publication of CN106783724A publication Critical patent/CN106783724A/zh
Priority to US15/578,604 priority patent/US10766713B2/en
Priority to PCT/CN2017/092146 priority patent/WO2018129881A1/zh
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22Devices influencing the relative position or the attitude of articles during transit by conveyors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05FSTATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F3/00Carrying-off electrostatic charges
    • H05F3/02Carrying-off electrostatic charges by means of earthing connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/535Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/07Structure, shape, material or disposition of the bonding areas after the connecting process
    • H01L24/09Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0255Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/866Zener diodes
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H3/00Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
    • H02H3/20Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess voltage
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/045Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere
    • H02H9/046Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage adapted to a particular application and not provided for elsewhere responsive to excess voltage appearing at terminals of integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Elimination Of Static Electricity (AREA)
  • Theoretical Computer Science (AREA)
  • Liquid Crystal (AREA)

Abstract

本发明是有关于一种基板承载装置,适用于液晶显示器制造,所述基板承载装置,包括:一承载台,用以承载一基板;一导电体,具有一受电端及一接地端,所述受电端电性连接所述基板,所述接地端接地。藉此即可随时导离或中和电性,消除基板传送中跟空气摩擦或是外来所产生的静电,以避免静电问题产生,本发明的效益更包括可免除已知所用的静电中和器或静电消除器,因此可不需要额外电力,节省成本,上述之外,本发明的效益更包括本发明利用导电体电性连接位于所述承载台上的基板,安装简易,可有效地节省时间,上述之外,本发明的效益更包括本发明利用除静电绳为导电体,具有不会酸化、不会生锈的特点,所以不会造成污染。

Description

基板承载装置
技术领域
本发明涉及一种承载装置,特别是涉及一种基板承载装置,适用于显示器制造。
背景技术
液晶显示器(Liquid Crystal Display,LCD)制造业的发展技术目前已达到较高水平上,质量的严格要求与良率的提升,则有赖检验的机制与高超的技术水准提升。液晶显示器制程上降低不良品的发生,是液晶显示器制造工程师责无旁贷的责任。然而静电的发生是目前制造中常见的缺陷,举如液晶显示器静电击穿、静电吸着尘埃造成的面板内污污染。
上述中,静电击穿引起的元器件击穿损坏是电子工业中,特别是电子产品制造中最普遍、最严重的危害。静电放电可能造成器件硬击穿或软击穿。硬击穿是一次性造成器件的永久性失效,如器件的输出与输入开路或短路。软击穿则可使器件的性能劣化,并使其指标参数降低而造成故障隐患。由于软击穿可使电路时好时坏(指标参数降低所致),且不易被发现,给整机运行和查找故障造成很大麻烦。软击穿时设备仍能工作,性能未发生根本变化,很可能通过出厂检验,但随时可能造成再次失效。多次软击穿就能造成硬击穿,使设备运行不正常,既给用户造成损失,也影响厂家声誉和产品的销售。
另外,上述中,静电吸着主要是在绝缘度很高时,在使用过程中一些不可避免的摩擦可造成其表面电荷不断积聚,且电位愈来愈高。由于静电的力学效应,在这种情况下,很容易使工作场所的浮游尘埃吸附于组件表面,而很小的尘埃吸附都有可能影响组件器件的良好性能。所以电子产品的生产必须在清洁环境中操作,并且操作人员、器具及环境必须采取一系列的防静电措施,以防止和降低静电危害的形成。
就目前现况而言,移除静电有两种常见方法:第一为经由接地而使静电放电(即:接地方法),第二为经由产生离子在大气中而中和静电(即:离子中和方法)。
就已知技艺揭示使用绝缘物质其排除使用接地的方法而言,日本特许公开未经审查专利No 9-36207号中揭示使用含有聚酰亚胺聚合物形成一种指状物(将基板放置在其上)的技术。另外实例包括,日本公告第10-509747号其中揭示抗磨蚀的复合物材料的载体包括选自聚烯烃和聚酰胺的基本聚合物及具有特别平均纤维直径的研磨碳纤维填料。此外,日本特许公开未经审查的专利案第11-106665号中揭示由具有预定表面电阻率的热塑性聚合物和具有预定体积电阻率的纤维状导电填料所形成的转移构件。
在经由一种绝缘体例如塑料和陶瓷的转移构件所支持并转移的组件中,不能使用接地方法。因此,移除经由转移构件例如CFRP所转移组件的静电,只可应用离子中和方法。然而,离子中和方法亦可能有问题。电磁噪音、细粒子和臭氧有时自使用以产生用于中和离子的装置而产生,创造成所述项可能性:此等所产生的要素对于制造程序可能具有负面影响。又如在离子中和的方法中,有时产生由阳离子和阴离子的数量所组成的偏压,且亦有一种可能性,即另外静电可能产生。
更进一步地,随着玻璃尺寸越来越大,设备玻璃承载载台与玻璃接触面积也来越大,所衍生出静电问题,导致基板击伤事件也层出不穷。
大多数静电问题防治方式为使用静电消除器,但静电消除效果多数不具成效,不然就需使用成本较高的静电消除装置。
一般的静电中和器(IONIZER),其只能吹基板的表面,对于基板下方表面,因静电中和器无法吹到而导致静电去除没有效果,因此易有静电放电(ESD)问题或是黏片的状况。
已知技艺中,如美国专利号2008259236揭示一种生产一液晶显示器(LCD)的方法,所述方法包括在一平台上放置一基板,以及使所述基板经受用于在所述基板上形成电子装置阵列的多个处理操作中的至少一处理操作。所述平台为ESD消散型且具有一表面部分,所述表面具有在约1E 5Ωcm与约1E 11Ωcm之间范围的体积电阻率(R v);且根据另一态样,本发明揭示一种液晶显示器平台,其包括具有一表面部分的一主体,所述表面部分为静电放电(ESD)消散材料,其具有在约1E 5Ωcm与约1E 11Ωcm之间范围的体积电阻率(R v)。
然而上述技艺仅揭示于平台上静电放电,此方法须要完整确定基板接触平台才可放电。
综合上述,仍需要基板运送机台的改良对象与方法,以提高液晶显示器面板的生产效率、产量及质量。
发明内容
为了解决上述技术问题,本发明的目的在于,提供一种基板承载装置,特别是涉及一种基板承载装置,藉由导电体电性连接位于所述承载台上的基板,藉此即可随时导离或中和电性,消除基板传送中跟空气摩擦或是外来所产生的静电,以避免静电问题产生。
上述之外,本发明的效益更包括可免除已知所用的静电中和器或静电消除器,因此可不需要额外电力,以节省成本。
上述之外,本发明的效益更包括本发明利用导电体电性连接位于所述承载台上的基板,安装简易,可有效地节省时间。
上述之外,本发明的效益更包括本发明利用除静电绳为导电体,具有不会酸化、不会生锈的特点,所以不会造成污染。
依据本发明提出的一种用以承载基板的基板承载装置,包括:一承载台,用以承载一基板;一导电体,具有一受电端及一接地端,所述受电端电性连接所述基板,所述接地端接地。
本发明的目的及解决其技术问题还可采用以下技术措施进一步实现。
在本发明的一实施例中,所述导电体位于所述基板与所述承载台之间。
在本发明的一实施例中,所述导电体为微软性导电材料。
在本发明的一实施例中,所述导电体为导线。
在本发明的一实施例中,所述导电体为一除静电绳。
在本发明的一实施例中,所述除静电绳的直径约为1毫米。
在本发明的一实施例中,所述除静电绳与所述基板之间小于3公分。
在本发明的一实施例中,所述导电体电性连接于所述基板边缘。
在本发明的一实施例中,所述导电体为多个导电体,分别电性连接于所述基板边缘。
本发明另一目的提出一种液晶显示器制造设备,包括一基板承载装置,所述基板承载装置,包括:一承载台,用以承载一基板;一导电体,具有一受电端及一接地端,所述受电端电性连接所述基板,所述接地端接地。
本发明的目的及解决其技术问题还可采用以下技术措施进一步实现。
在本发明的一实施例中,所述导电体位于所述基板与所述承载台之间。
在本发明的一实施例中,所述导电体微软性导电材料。
在本发明的一实施例中,所述导电体为导线。
在本发明的一实施例中,所述导电体为一除静电绳。
在本发明的一实施例中,所述除静电绳的直径约为1毫米。
在本发明的一实施例中,所述除静电绳与所述基板之间小于3公分。
在本发明的一实施例中,所述导电体电性连接于所述基板边缘。
在本发明的一实施例中,所述导电体为多个导电体,分别电性连接于所述基板边缘。
本发明的有益效果在于藉由导电体电性连接位于所述承载台上的基板,藉此即可随时导离或中和电性,消除基板传送中跟空气摩擦或是外来所产生的静电,以避免静电问题产生。
上述之外,本发明的效益更包括可免除已知所用的静电中和器或静电消除器,因此可不需要额外电力,以节省成本。
上述之外,本发明的效益更包括本发明利用导电体电性连接位于所述承载台上的基板,安装简易,可有效地节省时间。
上述之外,本发明的效益更包括本发明利用除静电绳为导电体,具有不会酸化、不会生锈的特点,所以不会造成污染。
附图说明
图1是本发明一实施例的基板承载装置的示意图。
图2是本发明一实施例的基板承载装置的导电体电性连接所述基板与接地局部示意图。
图3是本发明一实施例的基板承载装置的导电体与基板之间距离的示意图。
图4是本发明一实施例的基板承载装置的多个导电体分别电性连接所述基板角落部示意图。
具体实施方式
以下各实施例的说明是参考附加的图式,用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语,例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。
附图和说明被认为在本质上是示出性的,而不是限制性的。在图中,结构相似的单元是以相同标号表示。另外,为了理解和便于描述,附图中示出的每个组件的尺寸和厚度是任意示出的,但是本发明不限于此。
在附图中,为了清晰起见,夸大了层、膜、面板、区域等的厚度。在附图中,为了理解和便于描述,夸大了一些层和区域的厚度。将理解的是,当例如层、膜、区域或基底的组件被称作“在”另一组件“上”时,所述组件可以直接在所述另一组件上,或者也可以存在中间组件。
另外,在说明书中,除非明确地描述为相反的,否则词语“包括”将被理解为意指包括所述组件,但是不排除任何其它组件。此外,在说明书中,“在......上”意指位于目标组件上方或者下方,而不意指必须位于基于重力方向的顶部上。
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效,以下结合附图及较佳实施例,对依据本发明提出的一种用以承载基板的基板承载装置,其具体实施方式、结构、特征及其功效,详细说明如后。
请参阅图1至图4,图1是本发明一实施例的基板承载装置的示意图,图2是本发明一实施例的基板承载装置的导电体电性连接所述基板与接地局部示意图,图3是本发明一实施例的基板承载装置的导电体与基板之间距离的示意图,图4是本发明一实施例的基板承载装置的多个导电体分别电性连接所述基板角落部示意图,依据图1及图2,本发明提出的一种用以承载基板的基板承载装置100,包括:一承载台110,用以承载一基板120;一导电体130,具有一受电端131及一接地端132,所述受电端131电性连接所述基板120,所述接地端132接地。
本发明的目的及解决其技术问题还可采用以下技术措施进一步实现。
在本发明的一实施例中,所述导电体130位于所述基板120与所述承载台110之间,更详细而言,所述导电体130的所述受电端131位于所述基板120与所述承载台110之间。
在本发明的一实施例中,所述导电体130为微软性导电材料。
在本发明的一实施例中,所述导电体130为导线。
在本发明的一实施例中,所述导电体130为一除静电绳。所述除静电绳的直径约为1毫米。
在本发明的一实施例中,图3中,所述除静电绳与所述基板之间距离H小于3公分。
在本发明的一实施例中,图4中,所述导电体130电性连接于所述基板边缘120。更进一步地,所述导电体130为多个导电体,分别电性连接于所述基板120边缘。当所述基板120为矩形或方形形状,所述导电体130为多个导电体,分别电性连接于所述基板角落处。
如同上述,本发明另一目的提出一种液晶显示器制造设备,包括一基板承载装置,请再参阅图1至图4,图1是本发明一实施例的基板承载装置的示意图,图2是本发明一实施例的基板承载装置的导电体电性连接所述基板与接地局部示意图,图3是本发明一实施例的基板承载装置的导电体与基板之间距离的示意图,图4是本发明一实施例的基板承载装置的多个导电体分别电性连接所述基板角落部示意图,依据图1及图2,本发明提出的一种用以承载基板的基板承载装置100,包括:一承载台110,用以承载一基板120;一导电体130,具有一受电端131及一接地端132,所述受电端131电性连接所述基板120,所述接地端132接地。
本发明的目的及解决其技术问题还可采用以下技术措施进一步实现。
在本发明的一实施例中,所述导电体130位于所述基板120与所述承载台110之间,更详细而言,所述导电体130的所述受电端131位于所述基板120与所述承载台110之间。
在本发明的一实施例中,所述导电体130微软性导电材料。
在本发明的一实施例中,所述导电体130为导线。
在本发明的一实施例中,所述导电体130为一除静电绳,所述除静电绳的直径约为1毫米。
在本发明的一实施例中,图3中,所述除静电绳与所述基板之间距离H小于3公分。
在本发明的一实施例中,图4中,所述导电体130电性连接于所述基板边缘120。更进一步地,所述导电体130为多个导电体,分别电性连接于所述基板120边缘。当所述基板120为矩形或方形形状,所述导电体130为多个导电体,分别电性连接于所述基板角落处。
本发明的有益效果在于藉由导电体电性连接位于所述承载台上的基板,藉此即可随时导离或中和电性,消除基板传送中跟空气摩擦或是外来所产生的静电,以避免静电问题产生。
上述之外,本发明的效益更包括可免除已知所用的静电中和器或静电消除器,因此可不需要额外电力,以节省成本。
上述之外,本发明的效益更包括本发明利用导电体电性连接位于所述承载台上的基板,安装简易,可有效地节省时间。
上述之外,本发明的效益更包括本发明利用除静电绳为导电体,具有不会酸化、不会生锈的特点,所以不会造成污染。
“在一些实施例中”及“在各种实施例中”等用语被重复地使用。所述用语通常不是指相同的实施例;但它亦可以是指相同的实施例。“包含”、“具有”及“包括”等用词是同义词,除非其前后文意显示出其它意思。
以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。

Claims (10)

1.一种用基板承载装置,适用于显示器制造,包括:
一承载台,用以承载一基板;
一导电体,具有一受电端及一接地端,所述受电端电性连接所述基板,所述接地端接地。
2.如权利要求1所述的基板承载装置,其特征在于,所述导电体位于所述基板与所述承载台之间。
3.如权利要求1所述的基板承载装置,其特征在于,所述导电体为微软性导电材料。
4.如权利要求1所述的基板承载装置,其特征在于,所述导电体为导线。
5.如权利要求1所述的基板承载装置,其特征在于,所述导电体为一除静电绳。
6.如权利要求5所述的基板承载装置,其特征在于,所述除静电绳的直径约为1毫米。
7.如权利要求5所述的基板承载装置,其特征在于,所述除静电绳与所述基板之间距离小于3公分。
8.如权利要求1所述的基板承载装置,其特征在于,所述导电体电性连接于所述基板边缘。
9.如权利要求8所述的基板承载装置,其特征在于,所述导电体为多个导电体,分别电性连接于所述基板边缘。
10.一种液晶显示器制造设备,包括一基板承载装置,所述基板承载装置,包括:
一承载台,用以承载一基板;
一导电体,具有一受电端及一接地端,所述受电端电性连接所述基板,所述接地端接地。
CN201710017763.0A 2017-01-11 2017-01-11 基板承载装置 Pending CN106783724A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201710017763.0A CN106783724A (zh) 2017-01-11 2017-01-11 基板承载装置
US15/578,604 US10766713B2 (en) 2017-01-11 2017-07-07 Substrate carrier apparatus and liquid crystal display manufacturing device
PCT/CN2017/092146 WO2018129881A1 (zh) 2017-01-11 2017-07-07 基板承载装置及液晶显示器制造设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710017763.0A CN106783724A (zh) 2017-01-11 2017-01-11 基板承载装置

Publications (1)

Publication Number Publication Date
CN106783724A true CN106783724A (zh) 2017-05-31

Family

ID=58948920

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710017763.0A Pending CN106783724A (zh) 2017-01-11 2017-01-11 基板承载装置

Country Status (3)

Country Link
US (1) US10766713B2 (zh)
CN (1) CN106783724A (zh)
WO (1) WO2018129881A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018129881A1 (zh) * 2017-01-11 2018-07-19 惠科股份有限公司 基板承载装置及液晶显示器制造设备
CN110620077A (zh) * 2019-08-22 2019-12-27 武汉华星光电半导体显示技术有限公司 载台和传送装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1702495A (zh) * 2004-05-24 2005-11-30 统宝光电股份有限公司 静电消除装置及其机台
CN101071785A (zh) * 2006-05-11 2007-11-14 中华映管股份有限公司 可消除静电的基板载具
CN203455557U (zh) * 2013-09-26 2014-02-26 京东方科技集团股份有限公司 液晶面板传送装置
CN204966523U (zh) * 2015-08-21 2016-01-13 合肥中南光电有限公司 太阳能电池板除尘防静电装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US102330A (en) * 1870-04-26 Improved machine for mixing paint, soap, and other materials
US8164176B2 (en) * 2006-10-20 2012-04-24 Infineon Technologies Ag Semiconductor module arrangement
US8039289B2 (en) * 2009-04-16 2011-10-18 Tp Solar, Inc. Diffusion furnaces employing ultra low mass transport systems and methods of wafer rapid diffusion processing
KR101319347B1 (ko) * 2010-06-10 2013-10-16 엘지디스플레이 주식회사 터치 패널 일체형 액정 표시 장치
JP6301056B2 (ja) * 2012-12-21 2018-03-28 三菱電機株式会社 電子機器
US20180102330A1 (en) * 2016-10-12 2018-04-12 Sunasic Technologies, Inc. Sensing chip package having esd protection and method making the same
CN106783724A (zh) * 2017-01-11 2017-05-31 惠科股份有限公司 基板承载装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1702495A (zh) * 2004-05-24 2005-11-30 统宝光电股份有限公司 静电消除装置及其机台
CN101071785A (zh) * 2006-05-11 2007-11-14 中华映管股份有限公司 可消除静电的基板载具
CN203455557U (zh) * 2013-09-26 2014-02-26 京东方科技集团股份有限公司 液晶面板传送装置
CN204966523U (zh) * 2015-08-21 2016-01-13 合肥中南光电有限公司 太阳能电池板除尘防静电装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
除静电绳: "URL:http://baike.21cp.com/doc-view-7485.html", 《中塑百科》 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018129881A1 (zh) * 2017-01-11 2018-07-19 惠科股份有限公司 基板承载装置及液晶显示器制造设备
US10766713B2 (en) 2017-01-11 2020-09-08 HKC Corporation Limited Substrate carrier apparatus and liquid crystal display manufacturing device
CN110620077A (zh) * 2019-08-22 2019-12-27 武汉华星光电半导体显示技术有限公司 载台和传送装置
CN110620077B (zh) * 2019-08-22 2022-04-05 武汉华星光电半导体显示技术有限公司 载台和传送装置

Also Published As

Publication number Publication date
WO2018129881A1 (zh) 2018-07-19
US20180339866A1 (en) 2018-11-29
US10766713B2 (en) 2020-09-08

Similar Documents

Publication Publication Date Title
CN109375442B (zh) 显示面板及显示装置
CN105607332A (zh) 彩膜基板、显示面板和显示装置
CN106783724A (zh) 基板承载装置
CN113161401B (zh) 显示面板和显示装置
CN105808012A (zh) 一种显示模组、显示装置
CN105824461A (zh) 一种触控装置及触控显示装置
CN103676255A (zh) 阵列基板的防静电结构
US7995156B2 (en) Method of manufacturing a display substrate using a laser to remove test lines from the substrate without cutting the substrate
CN106200180A (zh) 一种阵列基板静电释放防护装置及方法
CN105619352A (zh) 防静电效果较好的工作台
CN101616536A (zh) 具静电放电防护的电路板及应用其的液晶模块与电子装置
US20160310999A1 (en) Method for cleansing glass substrate and device for performing the method
JPH07225393A (ja) アクティブマトリクス方式液晶表示装置
CN1298201C (zh) 电路板上的静电防护结构及其方法
CN108153449A (zh) 一种盖板及其制作方法、触摸屏
CN104701313A (zh) 阵列基板及制作方法、显示装置
CN103309526B (zh) 窄线路的制作方法
CN107491225A (zh) 触控显示装置及其触控面板
CN100407032C (zh) 有源矩阵基板及其修补方法
CN109950280B (zh) 具有静电防护结构的装置及其制备方法
CN208045140U (zh) 扁平线缆
CN206524314U (zh) 用于传输显示基板的传输系统和显示基板的生产设备
CN211014924U (zh) 一种超薄抗静电lcd液晶显示屏
US20160327990A1 (en) Electronic device
CN211197576U (zh) 一种抗静电防滑传送带

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170531