CN106757288A - Printed circuit board electroplating system and electro-plating method - Google Patents
Printed circuit board electroplating system and electro-plating method Download PDFInfo
- Publication number
- CN106757288A CN106757288A CN201611264063.3A CN201611264063A CN106757288A CN 106757288 A CN106757288 A CN 106757288A CN 201611264063 A CN201611264063 A CN 201611264063A CN 106757288 A CN106757288 A CN 106757288A
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- China
- Prior art keywords
- circuit board
- electroplating
- plating
- grabbing assembly
- electroplated
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention is printed circuit board electroplating system, including the first grabbing assembly for being correspondingly arranged on circulating conveyor and the second grabbing assembly and be from left to right arranged at below circulating conveyor and circuit board conveying assembly after the circuit board conveying assembly to be electroplated, electroplating pool, the plating that are used in combination with the first grabbing assembly and the second grabbing assembly；Circuit board conveying assembly to be electroplated is provided with conveying induction installation and the adjustable height induction installation being used in combination with the first grabbing assembly and the second grabbing assembly, and circulating conveyor lower section is provided with the plating control device being used in combination with conveying induction installation, adjustable height induction installation and the first grabbing assembly and the second grabbing assembly.Printed circuit board electroplating system of the invention and electro-plating method can carry out automatic electroplating to circuit board, and ensure that the uniformity of circuit board electroplating, it is ensured that electroplating efficiency simultaneously, improves the final product quality of circuit board.
Description
Technical field
The present invention relates to circuit board technology of preparing and circuit board Preparation equipment technical field, specifically, a kind of print of its displaying
Circuit board electroplating system processed, while it also shows that the electricity that circuit board automatic electroplating is carried out using a kind of printed circuit board electroplating system
Electroplating method.
Background technology
With economic and science and technology development, the application of electronic product is also more and more extensive, the weight of electronic product on circuit board
One of building block is wanted, various electronic equipments are small to civilian calculator, it is greatly to industrial electronic computer and growing
Communication electronic device, Defensive Avionics System, it is electric between them in order to realize as long as there is the electronic components such as integrated circuit
Interconnection, can all use printed circuit board；The design of printed circuit board and workmanship directly influence whole product quality and
Cost, while also having influence on the reliability of various electronic equipments.
In printed circuit board preparation process, plating step is one of important processing step, its direct decision-making circuit plate
Quality；
Circuit board electroplating at this stage, typically using artificial clamping circuit board after, fixture drive circuit board in electroplating pool
Carry out plating and do industry；
There is following defect in electro-plating method at this stage
1) by artificial clamping circuit board, clamping efficiency is low, while there is the situations such as electroplate liquid residual on electroplating clamp, holds
Easily cause to damage to being industry personnel；
2), using traditional electroplating pool, it is impossible to ensure electroplating quality, there is the uneven, electricity of plating in electro-plating method at this stage
Plating purity is low and surface has quality problems etc..
Therefore, it is necessary to provide a kind of printed circuit board electroplating system and electro-plating method to solve the above problems.
The content of the invention
An object of the present invention is to provide a kind of printed circuit board electroplating system, and it can carry out automatic electric to circuit board
Plating, and ensure that the uniformity of circuit board electroplating, it is ensured that electroplating efficiency simultaneously, improves the final product quality of circuit board.
The present invention is achieved through the following technical solutions above-mentioned purpose：
A kind of printed circuit board electroplating system, including it is correspondingly arranged in the first grabbing assembly on circulating conveyor and
Two grabbing assemblies and be from left to right arranged at below the circulating conveyor and with the first grabbing assembly and described second
Circuit board conveying assembly after circuit board conveying assembly to be electroplated, electroplating pool, plating that grabbing assembly is used in combination；It is described to treat
Electroplating circuit board conveying assembly is provided with conveying induction installation and equal with first grabbing assembly and second grabbing assembly
The adjustable height induction installation being used in combination, the circulating conveyor lower section is provided with and the conveying induction installation, institute
State the plating control that adjustable height induction installation and first grabbing assembly and second grabbing assembly are used in combination
Device processed.
Further, circuit board is provided with after the plating on circuit board assemblies and is loaded into induction installation.
Induction installation is loaded into by setting circuit board, circuit board is loaded into induction installation sense after inserting by the circuit board
Should, the conveying of circuit board after circuit board assemblies are electroplated after the plating.
Further, circuit board is provided with the electroplating pool and accesses piece, and the electroplating pool outer end is additionally provided with and institute
State circuit board and access the dual-pulse power supply that piece is connected and is used in combination.
Further, the plating control device is PLC control system.
Further, the circulating conveyor is circulation material-strap structure, and first grabbing assembly and described second is grabbed
Taking component includes the fixed block being fixedly installed on the circulating conveyor, the rotation driving for being connected to the fixed block
Part, the lifting actuator for being connected to the rotary drive, be connected to it is described lifting actuator adsorption plate and be arranged at institute
State the adsorbent equipment of adsorption plate lower end.
Further, second grabbing assembly is fixedly installed on the circulating conveyor by stretching out plate, described
Lifting actuator is arranged on the swivel plate of the rotary drive connection.
Further, the rotary drive is made up of rotary cylinder, and the lifting actuator is made up of lift cylinder；Institute
Adsorbent equipment is stated to be made up of sucker or vacuum suction head.
Further, the circulating conveyor is arranged in installation riser, the circuit board conveying assembly to be electroplated, institute
Circuit board conveying assembly may be contained within the installation transverse slat of the installation riser connection after stating electroplating pool, the plating.
Further, it is provided with circuit board conveying assembly after the circuit board conveying assembly to be electroplated and the plating
Circuit board carrier.
The second object of the present invention is to provide a kind of electro-plating method, and it utilizes above-mentioned printed circuit board electroplating system to electricity
Road plate carries out automatic electroplating, and plating step is as follows：
1) circuit board to be electroplated is conveyed on circuit board conveying assembly to be electroplated, is reached and is stopped at conveying induction installation
Only；
2) the conveying induction installation transmits signal and is conveyed to control device, the plating control device driving cycle is electroplated
Device drives the first grabbing assembly to reach circuit board to be electroplated；
3) the first grabbing assembly drives, and carries out downwards and after adjustable height induction installation reaches corresponding height to be electroplated
Circuit board is captured；
4) the plating control device drives the circulating conveyor to drive first grabbing assembly to reach electroplating pool
Top；
5) first grabbing assembly drives circuit board to be electroplated to be electroplated into electroplating pool；
6) after the completion of electroplating, circuit board is above-mentioned after the first grabbing device crawl plating and controls dress by the plating
Driving is put, the circulating conveyor drives electricity after the plating that first grabbing assembly and first grabbing assembly are captured
Road plate reaches the placement of circuit board after being electroplated at circuit board conveying assembly after electroplating, and now the second grabbing assembly is reached and treats electricity
The actions such as plating circuit board, circulation crawl, plating and placement.
Compared with prior art, the beneficial effect of printed circuit board electroplating system of the invention and electro-plating method is：
1) filled by setting circuit board conveying assembly to be electroplated, conveying induction installation, plating control device, circulation conveying
Put, the first grabbing assembly, the second grabbing assembly, electroplating pool and plating after circuit board conveying assembly, its coordinate complete circuit board
Automatic electroplating, plating step is：Circuit board to be electroplated is conveyed on circuit board conveying assembly to be electroplated, reaches conveying sense
Answer and stop at device；Conveying induction installation transmits signal to control device is electroplated, and electroplates control device driving cycle conveying device
The first grabbing assembly is driven to reach circuit board to be electroplated；First grabbing assembly drives, and senses downwards and by adjustable height
Device carries out circuit board crawl to be electroplated after reaching corresponding height；Plating control device driving cycle conveying device drives first to grab
Take component and reach electroplating pool top；First grabbing assembly drives circuit board to be electroplated to be electroplated into electroplating pool；Plating is completed
Afterwards, circuit board is above-mentioned after the first grabbing device crawl plating and is driven by electroplating control device, and circulating conveyor drives the
One grabbing assembly and the first grabbing assembly reach the placement of circuit board after being electroplated at circuit board conveying assembly after electroplating, this
When the second grabbing assembly reach circuit board to be electroplated, circulation crawl, plating and the action such as place.
2) piece is accessed by setting circuit board in electroplating pool, and electroplating pool outer end is additionally provided with and circuit board accesses piece phase
The dual-pulse power supply for connecting and being used in combination, circuit board to be electroplated is accessed after piece accesses by circuit board, in entering in electroplating pool
Row plating；The anodization dissolving of the reverse impulse of dual-pulse power supply simultaneously makes cathode surface concentration of metal ions go up rapidly, this
Subsequent cathode deposition period is conducive to use pulse current density high, thus plated layer compact, light, porosity are low；Dipulse electricity
The anode of the reverse impulse in source is peeled off and makes that the folder of organic impurities (containing brightener) in coating is attached to be greatly reduced, and makes tint uniform
Unanimously, good brightness, corrosion resistance is strong.
Brief description of the drawings
Fig. 1 is the front view of embodiments of the invention；
Fig. 2 is the left view of embodiments of the invention；
Numeral is represented in figure：
1 installation riser, 11 install transverse slat, 12 plating control devices；
2 circulating conveyors；
3 first grabbing devices, 31 stretch out plate；
4 second grabbing devices, 41 fixed blocks, 42 rotary drives, 43 swivel plates, 44 lifting actuators, 44 adsorption plates, 45
Adsorbent equipment；
5 circuit board conveying assemblies to be electroplated, 51 circuit board carriers；
6 conveying induction installations；
7 adjustable height induction installations；
8 electroplating pools, 81 circuit boards access piece, 82 dual-pulse power supplies；
Circuit board conveying assembly after 9 plating, 91 circuit boards are loaded into induction installation.
Specific embodiment
Embodiment：
The present embodiment shows a kind of automatic electroplating method, and it is carried out automatically using printed circuit board electroplating system to circuit board
Plating；
Printed circuit board electroplating system includes the first grabbing assembly 3 and second being correspondingly arranged on circulating conveyor 2
Grabbing assembly 4 and be from left to right arranged at the lower section of circulating conveyor 2 and with the first grabbing assembly 3 and the second crawl group
Circuit board conveying assembly 9 after circuit board conveying assembly 5 to be electroplated, electroplating pool 8, plating that part 4 is used in combination；
Circuit board conveying assembly 5 to be electroplated be provided with conveying induction installation 6 and with the first grabbing assembly 3 and the second crawl group
The adjustable height induction installation 7 that part 4 is used in combination；
The lower section of circulating conveyor 2 is provided with and is captured with conveying induction installation 6, adjustable height induction installation 7 and first
The plating control device 12 that the grabbing assembly 4 of component 3 and second is used in combination；
Automatic electroplating step is as follows：
1) circuit board to be electroplated is conveyed on circuit board conveying assembly 5 to be electroplated, is reached and is stopped at conveying induction installation 6
Only；Now, conveying induction installation 6 is used to sense the position of circuit board to be electroplated, and reaches relevant position in circuit board to be electroplated
When, make circuit board to be electroplated in stopping conveying on circuit board conveying assembly 5 to be electroplated by electroplating control device 12；
2) conveying induction installation 6 transmission signal electroplates the driving cycle of control device 12 conveying dress to control device 12 is electroplated
Put 2 the first grabbing assemblies of drive 3 and reach circuit board to be electroplated；
3) the first grabbing assembly 3 drives, and carries out treating electricity downwards and after adjustable height induction installation 7 reaches corresponding height
Plating circuit board crawl；
4) 12 driving cycle conveying device of plating control device 2 drives the first grabbing assembly 3 to reach the top of electroplating pool 8；
5) the first grabbing assembly 4 drives circuit board to be electroplated to be electroplated into electroplating pool 8；
6) after the completion of electroplating, circuit board is above-mentioned after the crawl plating of the first grabbing device 3 and is driven by electroplating control device 12
Dynamic, circuit board reaches plating after circulating conveyor 2 drives the plating that the first grabbing assembly 3 and the first grabbing assembly 3 are captured
The placement of circuit board after being electroplated at circuit board conveying assembly 9 afterwards, now the second grabbing assembly 4 reach on circuit board to be electroplated
The actions such as side, circulation crawl, plating and placement.
Wherein：
Circuit board is provided with after plating on circuit board assemblies 9 and is loaded into induction installation 91.
Induction installation 91 is loaded into by setting circuit board, circuit board is loaded into induction installation 91 and senses after inserting by circuit board
Sensed, the conveying of circuit board after circuit board assemblies 9 are electroplated after plating.
Circuit board is provided with electroplating pool 8 and accesses piece 81, and the outer end of electroplating pool 8 is additionally provided with and accesses the phase of piece 81 with circuit board
The dual-pulse power supply 82 for connecting and being used in combination.
Circuit board to be electroplated is electroplated after circuit board accesses 81 accesses in electroplating pool 8；Dipulse is electric simultaneously
The anodization dissolving of the reverse impulse in source 82 makes cathode surface concentration of metal ions go up rapidly, and this is conducive to subsequent negative electrode week
Phase uses pulse current density high, thus plated layer compact, light, porosity are low；The anode of the reverse impulse of dual-pulse power supply
Stripping makes that the folder of organic impurities in coating (containing brightener) is attached to be greatly reduced, and makes tint uniformity, good brightness, corrosion resistance
By force.
Plating control device 12 is PLC control system.
Circulating conveyor 2 is circulation material-strap structure, and the first grabbing assembly 3 and the second grabbing assembly 4 include that fixation sets
The fixed block 41 being placed on circulating conveyor, the rotary drive 42 for being connected to fixed block 41, it is connected to rotary drive 42
Lifting actuator 44, be connected to the adsorption plate 45 of lifting actuator 44 and be arranged at the adsorbent equipment of the lower end of adsorption plate 45
46。
Second grabbing assembly 4 is fixedly installed on circulating conveyor 2 by stretching out plate 31, and lifting actuator 44 is arranged at
On the swivel plate 43 of the connection of rotary drive 42.
Rotary drive 42 is made up of rotary cylinder, and lifting actuator 44 is made up of lift cylinder；Adsorbent equipment 46 is by inhaling
Disk is constituted；
Meanwhile, it is capable to complete the vacuum suction head of efficacy of adsorption same with sucker, also sucker is used as in alternative the present embodiment
Adsorbent equipment 46.
Circulating conveyor 2 is arranged in installation riser 1, electricity after circuit board conveying assembly 5 to be electroplated, electroplating pool 8, plating
Road plate conveying assembly 9 may be contained within the installation transverse slat 11 of installation riser connection.
After circuit board conveying assembly 5 to be electroplated and plating circuit board carrier 51 is provided with circuit board conveying assembly 9.
Compared with prior art, the automatic electroplating method of the present embodiment, it can carry out automatic electroplating to circuit board, and can
Ensure the uniformity of circuit board electroplating, it is ensured that electroplating efficiency simultaneously, improves the final product quality of circuit board.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, not
On the premise of departing from the invention design, various modifications and improvements can be made, these belong to protection model of the invention
Enclose.
Claims (10)
1. a kind of printed circuit board electroplating system, it is characterised in that：Including being correspondingly arranged on circulating conveyor first grabs
Take component and the second grabbing assembly and be from left to right arranged at below the circulating conveyor and with the first grabbing assembly
Circuit board conveying after the circuit board conveying assembly to be electroplated, electroplating pool, the plating that are used in combination with second grabbing assembly
Component；The circuit board conveying assembly to be electroplated be provided with conveying induction installation and with first grabbing assembly and described second
The adjustable height induction installation that grabbing assembly is used in combination, the circulating conveyor lower section is provided with and the conveying sense
Device, the adjustable height induction installation and first grabbing assembly and second grabbing assembly is answered to be engaged and make
Plating control device.
2. a kind of printed circuit board electroplating system according to claim 1, it is characterised in that：Circuit board group after the plating
Circuit board is provided with part and is loaded into induction installation.
3. a kind of printed circuit board electroplating system according to claim 1, it is characterised in that：It is provided with the electroplating pool
Circuit board accesses piece, and the electroplating pool outer end be additionally provided with it is double with what the circuit board accessed that piece is connected and is used in combination
The pulse power.
4. a kind of printed circuit board electroplating system according to claim 1, it is characterised in that：It is described plating control device be
PLC control system.
5. a kind of printed circuit board electroplating system according to claim 1-4 any one, it is characterised in that：The circulation
Conveying device is circulation material-strap structure, and first grabbing assembly and second grabbing assembly are described including being fixedly installed on
Fixed block on circulating conveyor, it is connected to the rotary drive of the fixed block, is connected to the liter of the rotary drive
Drop actuator, the adsorption plate for being connected to the lifting actuator and the adsorbent equipment for being arranged at the adsorption plate lower end.
6. a kind of printed circuit board electroplating system according to claim 5, it is characterised in that：Second grabbing assembly leads to
Hyperextension ejecting plate is fixedly installed on the circulating conveyor, and the lifting actuator is arranged at the rotary drive connection
On swivel plate.
7. a kind of printed circuit board electroplating system according to claim 6, it is characterised in that：The rotary drive is by revolving
Rotaring cylinder is constituted, and the lifting actuator is made up of lift cylinder；The adsorbent equipment is made up of sucker or vacuum suction head.
8. a kind of printed circuit board electroplating system according to claim 6 or 7, it is characterised in that：The circulation conveying dress
Install and be placed in installation riser, circuit board conveying group after the circuit board conveying assembly to be electroplated, the electroplating pool, the plating
Part may be contained within the installation transverse slat of the installation riser connection.
9. a kind of printed circuit board electroplating system according to claim 8, it is characterised in that：The circuit board to be electroplated is defeated
After sending component and the plating circuit board carrier is provided with circuit board conveying assembly.
10. a kind of electro-plating method, it is characterised in that：It utilizes a kind of printed circuit board electroplating system pair described in claim 1
Circuit board carries out automatic electroplating, and plating step is as follows：
1) circuit board to be electroplated is conveyed on circuit board conveying assembly to be electroplated, is reached and is stopped at conveying induction installation；
2) the conveying induction installation transmits signal to electroplating control device, the plating control device driving cycle conveying device
The first grabbing assembly is driven to reach circuit board to be electroplated；
3) the first grabbing assembly drives, and carries out circuit to be electroplated downwards and after adjustable height induction installation reaches corresponding height
Plate is captured；
4) the plating control device drives the circulating conveyor to drive first grabbing assembly to reach electroplating pool top；
5) first grabbing assembly drives circuit board to be electroplated to be electroplated into electroplating pool；
6) after the completion of electroplating, circuit board is above-mentioned after the first grabbing device crawl plating and is driven by the plating control device
Dynamic, the circulating conveyor drives circuit board after the plating that first grabbing assembly and first grabbing assembly are captured
The placement of circuit board after being electroplated at circuit board conveying assembly after electroplating is reached, now the second grabbing assembly reaches electricity to be electroplated
The actions such as road plate top, circulation crawl, plating and placement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611264063.3A CN106757288A (en) | 2016-12-30 | 2016-12-30 | Printed circuit board electroplating system and electro-plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611264063.3A CN106757288A (en) | 2016-12-30 | 2016-12-30 | Printed circuit board electroplating system and electro-plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106757288A true CN106757288A (en) | 2017-05-31 |
Family
ID=58951330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611264063.3A Pending CN106757288A (en) | 2016-12-30 | 2016-12-30 | Printed circuit board electroplating system and electro-plating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106757288A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113584565A (en) * | 2021-08-18 | 2021-11-02 | 深圳市晶三力电子有限公司 | PCB electroplating equipment |
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|---|---|---|---|---|
| CN86106250A (en) * | 1985-08-14 | 1987-03-18 | 舍林股份公司 | The automatics of conveying and treatment product, particularly circuit board |
| CN203112956U (en) * | 2013-02-06 | 2013-08-07 | 鹤山四海电路板有限公司 | PLC (Programmable Logic Controller) current control based circuit board electroplating system |
| CN104911681A (en) * | 2015-01-15 | 2015-09-16 | 东莞宇宙电路板设备有限公司 | Flexible circuit board double-row continuous electroplating production line |
| CN105668228A (en) * | 2016-02-01 | 2016-06-15 | 东莞市奥海电源科技有限公司 | Automatic board feeding machine for printed circuit board (PCB) and automatic board feeding method of automatic board feeding machine |
| CN206359640U (en) * | 2016-12-30 | 2017-07-28 | 昆山元茂电子科技有限公司 | Printed circuit board electroplating system |
-
2016
- 2016-12-30 CN CN201611264063.3A patent/CN106757288A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86106250A (en) * | 1985-08-14 | 1987-03-18 | 舍林股份公司 | The automatics of conveying and treatment product, particularly circuit board |
| CN203112956U (en) * | 2013-02-06 | 2013-08-07 | 鹤山四海电路板有限公司 | PLC (Programmable Logic Controller) current control based circuit board electroplating system |
| CN104911681A (en) * | 2015-01-15 | 2015-09-16 | 东莞宇宙电路板设备有限公司 | Flexible circuit board double-row continuous electroplating production line |
| CN105668228A (en) * | 2016-02-01 | 2016-06-15 | 东莞市奥海电源科技有限公司 | Automatic board feeding machine for printed circuit board (PCB) and automatic board feeding method of automatic board feeding machine |
| CN206359640U (en) * | 2016-12-30 | 2017-07-28 | 昆山元茂电子科技有限公司 | Printed circuit board electroplating system |
Non-Patent Citations (1)
| Title |
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| 郭忠诚等: "《脉冲复合电沉积的理论与工艺》", 30 June 2009, 冶金工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113584565A (en) * | 2021-08-18 | 2021-11-02 | 深圳市晶三力电子有限公司 | PCB electroplating equipment |
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Application publication date: 20170531 |