CN113584565A - PCB electroplating equipment - Google Patents
PCB electroplating equipment Download PDFInfo
- Publication number
- CN113584565A CN113584565A CN202110946941.4A CN202110946941A CN113584565A CN 113584565 A CN113584565 A CN 113584565A CN 202110946941 A CN202110946941 A CN 202110946941A CN 113584565 A CN113584565 A CN 113584565A
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- installation
- push rod
- electric push
- plate
- servo motor
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- 238000009713 electroplating Methods 0.000 title claims abstract description 26
- 238000009434 installation Methods 0.000 claims abstract description 59
- 230000007246 mechanism Effects 0.000 claims abstract description 59
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims description 10
- 230000001502 supplementing effect Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 abstract description 2
- 230000009897 systematic effect Effects 0.000 abstract description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 5
- 230000008602 contraction Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001802 infusion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- -1 and thus Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to electroplating equipment, in particular to PCB (printed circuit board) electroplating equipment. The technical problem of the invention is that: the PCB electroplating equipment can realize systematic PCB electroplating and automatically transport the PCB. PCB board electroplating device, including installation pond, inlet channel, slide rail, starting switch, snatch mechanism and circular telegram mechanism, installation pond one side is equipped with the inlet channel, and installation pond top both sides all are connected with the slide rail, are equipped with starting switch on the slide rail of one side, are equipped with on the installation pond to be used for snatching the mechanism of snatching of PCB board, are equipped with on the installation pond to be used for the circular telegram mechanism to water. Under level sensor's detection effect, can be through the height of water level, and then drive fourth electric putter and carry out work for the piston moves backward, with Cu2+ automatic addition of solution in the installation pond, need not artifical manual the interpolation like this.
Description
Technical Field
The invention relates to electroplating equipment, in particular to PCB (printed circuit board) electroplating equipment.
Background
Along with social economy's constantly emergence, science and technology is more and more developed, and electronic product has become an indispensable part in our life gradually, and the PCB board is electronic product's basic component, and the structure of PCB board is formed by multilayer conductor material and insulating material stack, and conductor material adopts the copper and attaches to on the PCB board through the mode of electroplating for the PCB board can electrically conduct.
In the existing PCB electroplating operation process, water is usually poured into a working pool, then Cu2+ solution is dripped, then the water is electrified, and then a clamp is used for clamping the PCB into the water, so that the electroplating operation can be realized.
In order to solve the above problems, a PCB plating apparatus capable of systematically plating PCBs and automatically transporting PCBs is now developed.
Disclosure of Invention
In order to overcome the defects that systematization is difficult to realize and uneven electroplating is easy to cause in the prior operation process, the invention has the technical problems that: the PCB electroplating equipment can realize systematic PCB electroplating and automatically transport the PCB.
PCB board electroplating device, including installation pond, inlet channel, slide rail, starting switch, snatch mechanism and circular telegram mechanism, installation pond one side is equipped with the inlet channel, and installation pond top both sides all are connected with the slide rail, are equipped with starting switch on the slide rail of one side, are equipped with on the installation pond to be used for snatching the mechanism of snatching of PCB board, are equipped with on the installation pond to be used for the circular telegram mechanism to water.
Further, the grabbing mechanism comprises a sliding frame, a first fixed disc, a first electric push rod, a movable plate, a second fixed disc, a second electric push rod, a first clamping plate, a second clamping plate, a third fixed disc, a third electric push rod, a first distance sensor, a second distance sensor and a third distance sensor, the sliding frame is connected between the upper parts of the sliding rails in a sliding manner, the first fixed disc is arranged on one side of the top of the sliding frame, the first electric push rod is arranged on the first fixed disc, the movable plate is arranged at the bottom of a telescopic rod of the first electric push rod, the second fixed disc is arranged on one side of the top of the movable plate, the second electric push rod is arranged on the upper part of the second fixed disc, the first clamping plate is arranged on one side of the movable plate, which is far away from the first electric push rod, the second clamping plate is arranged on one side of a telescopic rod of the second electric push rod, the third fixed disc is arranged on one side of the mounting pool, which is close to the water inlet pipeline, and the third electric push rod is arranged on the third fixed disc, and a first distance sensor is arranged on the sliding frame, a second distance sensor is arranged on one side of the second clamping plate, and a third distance sensor is arranged on one side of the third fixed plate.
Further explaining, the electrifying mechanism comprises a support frame, a first servo motor, a rotating shaft, a rotating disc, an electrifying device and a pressure sensor, the support frame is arranged on one side of the mounting pool, the first servo motor is arranged on the support frame, the rotating shaft is arranged on one side of an output shaft of the first servo motor, the rotating disc is connected to the two sides of the rotating shaft, the electrifying device used for electrifying is arranged on the top of the rotating disc, and the pressure sensor is arranged on one side of the sliding frame.
Further explain, still including Cu2+ solution interpolation mechanism, Cu2+ solution interpolation mechanism is including the connection pad, fourth electric putter, the hollow tube, a piston, the transfer line, check valve and level sensor, installation pond one side is equipped with two connection pads, be equipped with fourth electric putter between two connection pads, fourth electric putter telescopic link one side is equipped with the piston, installation pond one side all is equipped with the hollow tube that is used for adorning Cu2+ solution, evenly be connected with 4 transfer lines between hollow tube top and the installation pond, transfer line one side all is equipped with the check valve, installation pond inner wall one side is equipped with level sensor.
Further explain, still including protection mechanism, protection mechanism is including the trompil board, solid fixed ring, second servo motor, the rotation post, rotor plate and safety cover, the installation pond both sides all are connected with two trompil boards, the installation pond both sides all are connected with solid fixed ring, gu all be equipped with second servo motor on the fixed ring, second servo motor output shaft all is equipped with the rotation post, rotation post and trompil board rotary type are connected, all be equipped with the rotor plate on the rotation post, rotor plate upper portion all is equipped with the safety cover that is used for the protection.
Further explaining, still including material placement mechanism, material placement mechanism is including backup pad, mounting disc, bolt and the board that advances, and installation pond one side transversely evenly is equipped with the backup pad, and the installation pond both sides all are connected with the mounting disc, and equal rotary type is connected with the bolt on the mounting disc, and the screw thread formula is connected with the board that advances between the bolt.
Further explaining, the device also comprises a supplementing mechanism, wherein the supplementing mechanism comprises an L-shaped plate, a perforated box and a conveying pipe, the L-shaped plate is arranged on one side of the top of the mounting pool, the perforated box is arranged on the top of the L-shaped plate, and the conveying pipe is arranged between one side of the perforated box and the hollow pipe.
The device further comprises a control box, the control box is arranged in the middle of the rear side of the installation pool, a switching power supply is installed in the control box, the control module and a power module, the switching power supply supplies power for the whole device, the output end of the switching power supply is electrically connected with the power module, the power module is connected with a power master switch through a circuit, the control module is electrically connected with the power module, the control module is connected with a DS1302 clock circuit and a 24C02 circuit, a starting switch, a first distance sensor, a second distance sensor, a third distance sensor, a pressure sensor and a liquid level sensor are connected through the electrical property and the control module, the first electric push rod, the second electric push rod, the third electric push rod, the fourth electric push rod, the first servo motor and the second servo motor are connected with the control module through a peripheral circuit.
The invention has the beneficial effects that: 1. pressing the starting switch through people, to the elongated power of first electric putter drive, and then making first chucking board and second chucking board move down and press from both sides tightly the PCB board, the PCB board can be along with first chucking board and second chucking board remove to aquatic afterwards, under the effect of circular telegram ware for water is switched on, and the PCB board then can be electroplated.
2. Under level sensor's detection effect, can be through the height of water level, and then drive fourth electric putter and carry out work for the piston moves backward, with Cu2+ automatic addition of solution in the installation pond, need not artifical manual the interpolation like this.
3. Under the effect of second servo motor drive power for the rotation post rotates, drives rotor plate and safety cover and rotates, and then makes at PCB board electroplating in-process, and the safety cover plays the effect of protection, avoids people to electrocute.
Drawings
Fig. 1 is a schematic perspective view of a first embodiment of the present invention.
Fig. 2 is a schematic perspective view of a second embodiment of the present invention.
Fig. 3 is a third perspective view of the present invention.
Fig. 4 is a schematic diagram of a fourth three-dimensional structure according to the present invention.
Fig. 5 is a schematic perspective view of a fifth embodiment of the present invention.
Fig. 6 is a schematic perspective view of a first grasping mechanism according to the present invention.
Fig. 7 is a schematic perspective view of a second grasping mechanism according to the present invention.
Fig. 8 is a schematic perspective view of a first energizing mechanism according to the present invention.
Fig. 9 is a schematic perspective view of a second energizing mechanism according to the present invention.
Fig. 10 is a perspective view of a third energizing mechanism according to the present invention.
Fig. 11 is a schematic perspective structure view of a first Cu2+ solution adding mechanism according to the present invention.
Fig. 12 is a schematic perspective view of a second Cu2+ solution adding mechanism according to the present invention.
Fig. 13 is a schematic perspective view of a first protection mechanism according to the present invention.
Fig. 14 is a schematic perspective view of a second protection mechanism according to the present invention.
Fig. 15 is a schematic perspective view of the material placement mechanism of the present invention.
Fig. 16 is a schematic perspective view of the complementary mechanism of the present invention.
FIG. 17 is a block diagram of the circuit of the present invention.
Fig. 18 is a schematic diagram of the circuit of the present invention.
Reference numbers in the drawings: 1: installation pool, 2: control box, 3: water inlet pipe, 4: slide rail, 41: starting a switch, 5: grasping mechanism, 50: sliding frame, 51: first fixed disk, 52: first electric putter, 53: moving plate, 54: second fixed disk, 55: second electric putter, 56: first chucking plate, 57: second chucking plate, 58: third fixed disk, 59: third electric putter, 510: first distance sensor, 511: second distance sensor, 512: third distance sensor, 6: energization mechanism, 60: support frame, 61: first servo motor, 62: rotating shaft, 63: rotating disk, 64: electrical apparatus, 65: pressure sensor, 7: cu2+ solution addition mechanism, 70: land, 71: fourth electric push rod, 72: hollow tube, 73: piston, 74: infusion tube, 75: check valve, 76: level sensor, 8: protection mechanism, 80: apertured plate, 81: fixing ring, 82: second servo motor, 83: rotating column, 84: rotating plate, 85: protective cover, 9: mechanism is placed to material, 90: support plate, 91: mounting plate, 92: bolt, 93: advancing plate, 10: replenishment mechanism, 101: l-shaped plate, 102: open-cell box, 103: a delivery pipe.
Detailed Description
The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which presently preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for completeness and fully convey the scope of the invention to the skilled person.
Example 1
PCB board electroplating equipment, as shown in fig. 1-18, including installation pond 1, inlet channel 3, slide rail 4, starting switch 41, snatch mechanism 5 and circular telegram mechanism 6, the downside in the middle of the 1 rear side in installation pond is equipped with inlet channel 3, and the 1 top left and right sides in installation pond all is connected with slide rail 4, and left slide rail 4 front side is equipped with starting switch 41, is equipped with on the installation pond 1 and snatchs mechanism 5, is equipped with circular telegram mechanism 6 on the installation pond 1.
The grabbing mechanism 5 comprises a sliding frame 50, a first fixed disc 51, a first electric push rod 52, a movable plate 53, a second fixed disc 54, a second electric push rod 55, a first clamping plate 56, a second clamping plate 57, a third fixed disc 58, a third electric push rod 59, a first distance sensor 510, a second distance sensor 511 and a third distance sensor 512, the sliding frame 50 is connected between the upper parts of the sliding rails 4 in a sliding way, the rear side of the top of the sliding frame 50 is provided with the first fixed disc 51, the first fixed disc 51 is provided with the first electric push rod 52, the bottom of a telescopic rod of the first electric push rod 52 is provided with the movable plate 53, the front side of the top of the movable plate 53 is provided with the second fixed disc 54, the upper part of the second fixed disc 54 is provided with the second electric push rod 55, the front side of the movable plate 53 is provided with the first clamping plate 56, the front side of the second electric push rod 55 is provided with the second clamping plate 57, the middle of the rear part of the mounting pool 1 is provided with the third fixed disc 58, a third electric push rod 59 is arranged on the third fixed disc 58, the front side of a telescopic rod of the third electric push rod 59 is connected with the rear side of the sliding frame 50, a first distance sensor 510 is arranged on the rear side of the lower part of the sliding frame 50, a second distance sensor 511 is arranged on the rear side of the upper part of the second clamping plate 57, and a third distance sensor 512 is arranged on the front side of the upper part of the third fixed disc 58.
The electrifying mechanism 6 comprises a support frame 60, a first servo motor 61, a rotating shaft 62, a rotating disc 63, an electrifying device 64 and a pressure sensor 65, the support frame 60 is arranged on the left rear side of the installation pool 1, the first servo motor 61 is arranged on the support frame 60, the rotating shaft 62 is arranged on the right side of an output shaft of the first servo motor 61, the rotating disc 63 is connected to the left side and the right side of the rotating shaft 62, the electrifying device 64 is arranged at the top of the rotating disc 63, and the pressure sensor 65 is arranged in the middle of the lower portion of the sliding frame 50.
When people need to electroplate the PCB, firstly electrifying the electrifying device 64, then adding water into the installation pool 1 through the water inlet pipeline 3, pouring a Cu2+ solution into the installation pool 1, then pressing the starting switch 41, controlling the telescopic rod of the first electric push rod 52 to perform extension motion by the control module, enabling the moving plate 53 to move downwards, driving the first clamping plate 56, the second fixed plate 54 and the second electric push rod 55 to move downwards by the moving plate 53, driving the second clamping plate 57 to move downwards by the second electric push rod 55 to move downwards, controlling the telescopic rod of the first electric push rod 52 to stop working when the distance value between the first distance sensor 510 and the moving plate 53 is detected to be smaller than a rated value, stopping moving the moving plate 53, when the moving plate 53 is firstly contacted with the pressure sensor 65, and when the pressure sensor 65 detects that the pressure value is larger than the rated value, the control module controls the telescopic rod of the second electric push rod 55 to perform retraction movement for 2 seconds and then stops working, so as to drive the second clamping plate 57 and the second distance sensor 511 to move backwards, so that 5 PCBs can be placed between the first clamping plate 56 and the second clamping plate 57, the second clamping plate 57 moves backwards to clamp the 5 PCBs, when the second distance sensor 511 detects that the distance value between the second clamping plate 511 and the second fixed plate 54 is smaller than a rated value, the control module simultaneously controls the telescopic rod of the first electric push rod 52 to perform retraction movement, so that the movable plate 53 and the components above the movable plate 53 move upwards, when the movable plate 53 contacts the pressure sensor 65 for the second time, the pressure sensor 65 does not send a signal, the movable plate 53 moves upwards to further move the PCBs upwards, and when the distance value between the first movable plate 510 and the movable plate 53 is larger than the rated value, the control module controls the telescopic rod of the first electric push rod 52 to stop working, and simultaneously controls the telescopic rod of the third electric push rod 59 to perform contraction movement, so as to drive the sliding frame 50 and the components thereon to move backwards, and further drive the PCB to move backwards, when the third distance sensor 512 detects that the distance value between the third distance sensor and the first electric push rod 52 is smaller than a rated value, the control module controls the third electric push rod 59 to stop working, and simultaneously controls the telescopic rod of the first electric push rod 52 to perform second extension movement, at the moment, the extension movement is performed for 2 seconds, then the extension movement is performed for 3 seconds, then the automatic contraction movement is performed for 2 seconds, and then the working is stopped, so that the moving plate 53 moves downwards, and further drives the PCB to move downwards and immerse in water, when the moving plate 53 moves downwards for the third time and is in contact with the pressure sensor 65, the control module controls the first servo motor 61 to operate for 1 second and then stop working for 1 minute, then, the reverse operation is performed for 1 second, and then the operation is stopped, the output shaft of the first servo motor 61 rotates to drive the rotating shaft 62 to rotate, the rotating shaft 62 rotates to drive the rotating disc 63 and the electrical apparatus 64 to rotate, so that the electrical apparatus 64 is immersed in water, and thus, water can be conducted through the Cu2+ solution, so that when a PCB is immersed in water, the PCB can be electroplated, the output shaft of the first servo motor 61 rotates reversely to drive the rotating shaft 62 to rotate reversely, and further drive the rotating disc 63 and the electrical apparatus 64 to rotate and reset, the telescopic rod of the first electric push rod 52 performs the second contraction motion, and further the PCB can move upwards along with the moving plate 53 to reset, when the moving plate 53 contacts with the pressure sensor 65 for the fourth time, the pressure sensor 65 does not send a signal, when the telescopic rod of the first electric push rod 52 performs the second contraction motion and then stops operating, the control module controls the telescopic rod of the third electric push rod 59 to perform the stretching motion, the sliding frame 50 and the components on the sliding frame are driven to move forwards, so that the PCB is driven to move forwards, when the third distance sensor 512 detects that the distance value between the third distance sensor and the first electric push rod 52 is larger than a rated value, the control module controls the third electric push rod 59 to stop working, and simultaneously controls the telescopic rod of the second electric push rod 55 to perform stretching movement for 2 seconds and then stop working, so that the second clamping plate 57 and the second distance sensor 511 are driven to move forwards for resetting, so that the PCB can be loosened, and people can collect the PCB after the electric conduction is finished; the PCB can be automatically conveyed and electroplated by repeating the above operations.
Still add mechanism 7 including Cu2+ solution, Cu2+ solution adds mechanism 7 including connection pad 70, fourth electric putter 71, hollow tube 72, piston 73, the transfer line 74, check valve 75 and level sensor 76, installation 1 left side front side in pond is equipped with two connection pads 70, be equipped with fourth electric putter 71 between two connection pads 70, fourth electric putter 71 telescopic link rear side is equipped with piston 73, 1 left side rear side in installation pond all is equipped with hollow tube 72, hollow tube 72 and piston 73 sliding type are connected, evenly be connected with 4 transfer lines 74 between hollow tube 72 top and the installation pond 1, transfer line 74 right side all is equipped with check valve 75, upside is equipped with level sensor 76 behind the 1 inner wall in installation pond.
When people need to add Cu2+ solution, the Cu2+ solution can be poured into the hollow tube 72, when the water level in the installation pool 1 slowly rises, and the liquid level sensor 76 detects that the water level value is higher than the rated value, the control module controls the telescopic rod of the fourth electric push rod 71 to extend for 1 second and then to stop working after shortening for 1 second, and the piston 73 is driven to move backwards, so that the Cu2+ solution flows into the installation pool 1 through the infusion tube 74 and the one-way valve 75, under the action of the one-way valve 75, water can be prevented from flowing back into the infusion tube 74, and then the telescopic rod of the fourth electric push rod 71 is shortened to drive the piston 73 to move forwards to reset, and the effect of automatically adding the Cu2+ solution can be realized by repeating the above operations.
Still including protection mechanism 8, protection mechanism 8 is including trompil board 80, gu fixed ring 81, second servo motor 82, the rotation post 83, rotor plate 84 and safety cover 85, the intermediate position of the both sides all is connected with two trompil boards 80 about installation pool 1, the anterior left and right sides in installation pool all is connected with solid fixed ring 81, gu all be equipped with second servo motor 82 on the ring 81, second servo motor 82 output shaft all is equipped with the rotation post 83, the rotation post 83 is connected with homonymy trompil board 80 rotary type, all be equipped with rotor plate 84 on the rotation post 83, rotor plate 84 upper portion all is equipped with safety cover 85.
When the first servo motor 61 works in the forward direction, the control module controls the second servo motor 82 to work for 1 second and then stop working, and the output shaft of the second servo motor 82 rotates to drive the rotating column 83, the rotating plate 84 and the protective cover 85 to rotate, so that the protective cover 85 rotates towards the inner side to cover the top of the installation pool 1, liquid can be prevented from splashing on the body of people, and people are prevented from getting an electric shock; when the first servo motor 61 works in the reverse direction, the control module controls the second servo motor 82 to work in the reverse direction for 1 second and then stops working, and further drives the protection cover 85 to rotate and reset.
Still including material placement machine structure 9, material placement machine structure 9 is including backup pad 90, mounting disc 91, bolt 92 and the board 93 that advances, and 1 front side in installation pond transversely evenly is equipped with backup pad 90, and the left and right sides of 1 front portion in installation pond all is connected with mounting disc 91, and equal rotary type is connected with bolt 92 on the mounting disc 91, and threaded connection has the board 93 that advances between the bolt 92.
When the PCB needs to be collected, the amount of the PCB is placed as required, the position of the advancing plate 93 is limited, the advancing plate 93 can be driven to move back and forth by rotating the bolt 92, and then a proper amount of the PCB is placed on the supporting plate 90, so that the PCB is convenient to collect.
The device is characterized by further comprising a supplementing mechanism 10, wherein the supplementing mechanism 10 comprises an L-shaped plate 101, a perforated box 102 and a conveying pipe 103, the L-shaped plate 101 is arranged in the middle of the rear side of the top of the installation pool 1, the perforated box 102 is arranged at the top of the L-shaped plate 101, and the conveying pipe 103 is arranged between the left side of the perforated box 102 and the hollow pipe 72.
When the Cu2+ solution needs to be supplemented, the perforated box 102 can be opened, then the Cu2+ solution is poured into the perforated box 102, and the Cu2+ solution flows into the hollow tube 72 through the conveying tube 103, so that the Cu2+ solution is supplemented.
Still including control box 2, be equipped with control box 2 in the middle of the installation pond 1 rear side, install switching power supply in the control box 2, control module and power module, switching power supply is the power supply of whole device, switching power supply's output and power module pass through electric connection, there is the power master switch through the line connection on the power module, control module and power module pass through electric connection, the last DS1302 clock circuit and the 24C02 circuit of being connected with of control module, starting switch 41, first distance sensor 510, second distance sensor 511, third distance sensor 512, pressure sensor 65 and level sensor 76 are connected through electric and control module, first electric putter 52, second electric putter 55, third electric putter 59, fourth electric putter 71, first servo motor 61 and second servo motor 82 are connected through peripheral circuit and control module.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
Claims (8)
- PCB board electroplating equipment, characterized by: the automatic water supply device comprises an installation pool (1), a water inlet pipeline (3), a sliding rail (4), a starting switch (41), a grabbing mechanism (5) and a power-on mechanism (6), wherein the water inlet pipeline (3) is arranged on one side of the installation pool (1), the sliding rail (4) is connected to the two sides of the top of the installation pool (1), the starting switch (41) is arranged on the sliding rail (4) on one side, the grabbing mechanism (5) for grabbing a PCB is arranged on the installation pool (1), and the power-on mechanism (6) for powering on water is arranged on the installation pool (1).
- 2. The PCB board electroplating apparatus of claim 1, wherein: the grabbing mechanism (5) comprises a sliding frame (50), a first fixed disc (51), a first electric push rod (52), a moving plate (53), a second fixed disc (54), a second electric push rod (55), a first clamping plate (56), a second clamping plate (57), a third fixed disc (58), a third electric push rod (59), a first distance sensor (510), a second distance sensor (511) and a third distance sensor (512), the sliding frame (50) is connected between the upper parts of the sliding rails (4) in a sliding manner, the first fixed disc (51) is arranged on one side of the top of the sliding frame (50), the first electric push rod (52) is arranged on the first fixed disc (51), the moving plate (53) is arranged at the bottom of a telescopic rod of the first electric push rod (52), the second fixed disc (54) is arranged on one side of the top of the moving plate (53), the second electric push rod (55) is arranged on the upper part of the second fixed disc (54), one side, far away from first electric putter (52), of moving plate (53) is equipped with first chucking plate (56), one side, near first chucking plate (56), of second electric putter (55) telescopic link is equipped with second chucking plate (57), one side, near water inlet pipe (3), of installation pond (1) is equipped with third fixed disk (58), be equipped with third electric putter (59) on third fixed disk (58), be equipped with first distance sensor (510) on carriage (50), second chucking plate (57) one side is equipped with second distance sensor (511), third fixed disk (58) one side is equipped with third distance sensor (512).
- 3. The PCB board electroplating apparatus as set forth in claim 2, wherein: the electrifying mechanism (6) comprises a support frame (60), a first servo motor (61), a rotating shaft (62), a rotating disc (63), an electrifying device (64) and a pressure sensor (65), the support frame (60) is arranged on one side of the installation pool (1), the first servo motor (61) is arranged on the support frame (60), the rotating shaft (62) is arranged on one side of an output shaft of the first servo motor (61), the rotating disc (63) is connected to the two sides of the rotating shaft (62), the electrifying device (64) used for electrifying is arranged at the top of the rotating disc (63), and the pressure sensor (65) is arranged on one side of the sliding frame (50).
- 4. The PCB board electroplating apparatus as set forth in claim 3, wherein: still add mechanism (7) including Cu2+ solution, Cu2+ solution adds mechanism (7) including connection pad (70), fourth electric putter (71), hollow tube (72), piston (73), transfer line (74), check valve (75) and level sensor (76), installation pond (1) one side is equipped with two connection pads (70), be equipped with fourth electric putter (71) between two connection pads (70), fourth electric putter (71) telescopic link one side is equipped with piston (73), installation pond (1) one side all is equipped with hollow tube (72) that are used for adorning Cu2+ solution, evenly be connected with 4 transfer line (74) between hollow tube (72) top and the installation pond (1), transfer line (74) one side all is equipped with check valve (75), installation pond (1) inner wall one side is equipped with level sensor (76).
- 5. The PCB board electroplating apparatus of claim 4, wherein: still including protection mechanism (8), protection mechanism (8) are including trompil board (80), gu fixed ring (81), second servo motor (82), rotation post (83), rotor plate (84) and safety cover (85), installation pond (1) both sides all are connected with two trompil boards (80), installation pond (1) both sides all are connected with solid fixed ring (81), gu all be equipped with second servo motor (82) on fixed ring (81), second servo motor (82) output shaft all is equipped with rotation post (83), rotor plate (83) and trompil board (80) rotary type are connected, all be equipped with rotor plate (84) on rotation post (83), rotor plate (84) upper portion all is equipped with safety cover (85) that are used for the protection.
- 6. The PCB board electroplating apparatus of claim 5, wherein: still including material placement machine structure (9), material placement machine constructs (9) including backup pad (90), mounting disc (91), bolt (92) and board (93) of advancing, and installation pond (1) one side transversely evenly is equipped with backup pad (90), and installation pond (1) both sides all are connected with mounting disc (91), and equal rotary type is connected with bolt (92) on mounting disc (91), and threaded connection has between bolt (92) board (93) of advancing.
- 7. The PCB board electroplating apparatus of claim 6, wherein: the device is characterized by further comprising a supplementing mechanism (10), wherein the supplementing mechanism (10) comprises an L-shaped plate (101), a perforated box (102) and a conveying pipe (103), the L-shaped plate (101) is arranged on one side of the top of the mounting pool (1), the perforated box (102) is arranged on the top of the L-shaped plate (101), and the conveying pipe (103) is arranged between one side of the perforated box (102) and the hollow pipe (72).
- 8. The PCB board electroplating apparatus of claim 7, wherein: the device is characterized by further comprising a control box (2), the control box (2) is arranged in the middle of the rear side of the installation pool (1), a switching power supply, a control module and a power module are installed in the control box (2), the switching power supply supplies power to the whole device, the output end of the switching power supply is electrically connected with the power module, the power module is connected with a power main switch through a circuit, the control module is electrically connected with the power module, the control module is connected with a DS1302 clock circuit and a 24C02 circuit, a starting switch (41), a first distance sensor (510), a second distance sensor (511), a third distance sensor (512), a pressure sensor (65) and a liquid level sensor (76) are electrically connected with the control module, the first electric push rod (52), the second electric push rod (55), the third electric push rod (59), the fourth electric push rod (71), the first servo motor (61) and the second servo motor (82) are connected with the control module through a peripheral circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110946941.4A CN113584565A (en) | 2021-08-18 | 2021-08-18 | PCB electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110946941.4A CN113584565A (en) | 2021-08-18 | 2021-08-18 | PCB electroplating equipment |
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| Publication Number | Publication Date |
|---|---|
| CN113584565A true CN113584565A (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110946941.4A Withdrawn CN113584565A (en) | 2021-08-18 | 2021-08-18 | PCB electroplating equipment |
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| CN (1) | CN113584565A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114622255A (en) * | 2022-03-12 | 2022-06-14 | 张荣光 | Electroplating equipment for open-circuit short-circuit test board of chip |
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| CN106757288A (en) * | 2016-12-30 | 2017-05-31 | 昆山元茂电子科技有限公司 | Printed circuit board electroplating system and electro-plating method |
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| CN207047354U (en) * | 2017-06-15 | 2018-02-27 | 科惠(佛冈)电路有限公司 | A kind of electroplanting device for board production |
| CN111893544A (en) * | 2020-07-20 | 2020-11-06 | 昆山蕴鼎自动化科技有限公司 | Electroplating device |
| CN112680768A (en) * | 2020-12-30 | 2021-04-20 | 广东成功自动化设备有限公司 | VCP production is with electroplating PCB board fixing device |
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|---|---|---|---|---|
| CN202786488U (en) * | 2012-08-22 | 2013-03-13 | 深圳崇达多层线路板有限公司 | Automatic liquid adding device for PCB plating |
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| CN206721387U (en) * | 2017-03-28 | 2017-12-08 | 江门市高智电子科技有限公司 | Chemical liquid adding apparatus for BT plate electroplating processes |
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Application publication date: 20211102 |