CN106711060A - Fluid collection device of rotary etching and cleaning machine - Google Patents
Fluid collection device of rotary etching and cleaning machine Download PDFInfo
- Publication number
- CN106711060A CN106711060A CN201510783139.2A CN201510783139A CN106711060A CN 106711060 A CN106711060 A CN 106711060A CN 201510783139 A CN201510783139 A CN 201510783139A CN 106711060 A CN106711060 A CN 106711060A
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- Prior art keywords
- ring
- contact
- collection device
- fluid
- fluid collection
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
The invention provides a fluid collection device of a rotary etching and cleaning machine. The fluid collection device is used for collecting fluid splashed from the surface of a substrate, and comprises a plurality of collecting units and a plurality of driving devices, wherein the plurality of collecting units are arranged on the periphery of the substrate; the plurality of driving devices are connected to the plurality of collecting units separately, are used for controlling the ascending and descending of the corresponding collecting units independently, so that the plurality of collecting units can collect different fluids respectively; and the number of the plurality of driving devices is equal to that of the plurality of collecting units. The fluid collection device overcomes the existing problems that a plurality of pneumatic cylinders are adopted and lifting components are asynchronous.
Description
【Technical field】
It is more particularly to a kind of suitable for substrate the present invention relates to a kind of fluid collection device
The fluid collection device of spin etch cleaning machine.
【Background technology】
In the work of semiconductor crystal wafer, display base plate, solar base plate, LED-baseplate etc.
In skill, it is required for processing substrate, for example the surface to substrate supplies treatment fluid (example
Such as chemicals or deionized water) processing routine such as it is etched, cleans, and described
In processing substrate, then used treatment fluid must be directed to by a fluid treating device
Be collected, discharge opeing, the subsequent treatment such as recovery.However, the waste liquid that etching process is produced
Mostly toxic liquid, it is necessary to treatment with caution.Therefore, even recycling how is collected
Different waste liquids is an important topic.
Existing spin etch cleaning machine refers to TaiWan, China new patent number
M505052U, it is used to carry and fixed disclosed in a microscope carrier is provided with spin etch groove
Wafer, the rotating shaft below microscope carrier can be rotated at a high speed, and etching solution is then supplied by the liquid of top
Under unit stream.Fluid collection device its use including multiple collect rings collection ring modules with
Different liquid are collected, when rotating shaft rotates at a high speed, waste liquid centrifugation collection ring can be thrown to.
The multiple collection ring must be driven using outside elevating mechanism (such as lifting pneumatic cylinder)
Lifting start is carried out with relative.When different liquids collection is carried out, can lift in advance specific
Collect ring, make liquid runs down it is each it is described collect ring guiding by it is each it is described collection ring below
Discharging tube is discharged.
However, being lifted to drive one to collect ring, typically set many around collection ring
Individual lifting pneumatic cylinder collects the lifting of ring with stable control, but also because using multiple air pressure
Cylinder, asynchronous if any doing for a certain pneumatic cylinder, system is to be shut down there may be alarm,
And then cause etching solution may to undue substrate corrode and need to scrap the substrate, or because
Maintenance reduction equipment capacity is shut down, causes production cost to improve and product yield decline.
【The content of the invention】
In view of this, for the reliability of lifting fluid collection device, the purpose of the present invention
It is that a kind of fluid collection device of spin etch cleaning machine is provided, it passes through each receipts
Collection ring one drive device of correspondence, is overcome and is risen using multiple pneumatic cylinders in the prior art
Drop one is collected ring and easily causes the nonsynchronous problem of lift component.
To reach above-mentioned purpose, the fluid of the spin etch cleaning machine that the present invention is provided is received
Acquisition means are used to collect the fluid splashed by a substrate surface, the fluid collection device bag
Include multiple collector units and multiple drive devices.The multiple collector unit is located on described
Around substrate.The multiple drive device is connected to the multiple collector unit,
For the lifting of each collector unit of independent control so that the multiple collector unit can be each
From different fluids are collected, wherein the quantity of the multiple drive device is equal to the multiple
The quantity of collector unit.
In a preferred embodiment, the multiple collector unit includes multiple collection rings, institute
Multiple rings of collecting are stated sequentially to be radially arranged.
In a preferred embodiment, each drive device includes linking mechanism, the connection
Mechanism is used to stably drive the lifting of the collection ring, it is to avoid lift component is asynchronous.
Specifically, it is described to link the first contact that mechanism is coupled on the outer peripheral edge of the collection ring
And second contact.
In this preferred embodiment, first contact and second contact are in the receipts
A radian is defined on the outer peripheral edge for collecting ring, the radian is between pi/2 to π.
In this preferred embodiment, it is described to collect the company that ring is included on the outer peripheral edge
It is connected to the stiffener of first contact and second contact.
In another preferred embodiment, the link mechanism includes that being connected to described first touches
Point and the support member of second contact, the support member are arranged at the institute of the collection ring
State the bottom of outer peripheral edge.
In a preferred embodiment, the drive device includes a slide rail, the connection machine
Structure include being connected on the slide rail do linear movement encircle arm, the arm of encircling has
First end point and the second end points.
In this preferred embodiment, the link mechanism also includes：First fore-set, coupling
In the first end point for encircling arm；Second fore-set, is coupled to and described encircles arm
Second end points；First davit, is coupled to first contact of the collection ring；
Second davit, is coupled to second contact of the collection ring；First closure, uses
In sealed first fore-set and first davit；And second closure, it is used for
Sealed second fore-set and second davit.
In this preferred embodiment, first closure and second closure have
There is an at least adjusted leveling screws, the level for finely tuning the collection ring.
Compared to prior art, fluid collection device of the invention, it passes through drive device
The multiple collection ring is connected one to one, and is overcome existing using multiple pneumatic cylinders
There is nonsynchronous problem.In addition, the horizontal stability of ring is collected during lifting in order to strengthen,
Arm is encircled to first on the collection ring outer peripheral edge through link mechanism of the invention
Contact and the second contact and smoothly can smoothly be lifted as the fulcrum of lifting.
It is that above-mentioned and other purposes, feature and the advantage of the present invention can be become apparent,
Coordinate institute's accompanying drawings, be described in detail below：
【Brief description of the drawings】
Fig. 1 is the section of the spin etch cleaning machine of one of present invention preferred embodiment
Schematic diagram；
Fig. 2 is the schematic perspective view of the fluid collection device of this preferred embodiment；
Fig. 3 shows for the section when fluid collection device of the present embodiment collects first fluid
It is intended to；
Fig. 4 shows for the section when fluid collection device of the present embodiment collects second fluid
It is intended to；
Fig. 5 is the three-dimensional view of the fluid collection device of corresponding diagram 3；
Fig. 6 is the schematic top plan view of the fluid collection device of the present embodiment.
【Specific embodiment】
Several preferred embodiments of the invention make detailed by institute's accompanying drawings and following explanation
Thin description, in different schemas, identical component symbol represents same or analogous unit
Part.
Refer to Fig. 1 and the rotation that Fig. 2, Fig. 1 are one of present invention preferred embodiment erosion
The generalized section of etching cleaning platform, Fig. 2 is the fluid collection device of this preferred embodiment
Schematic perspective view.As illustrated, the spin etch cleaning machine 100 of the present embodiment
Fluid collection device 120 is used to collect the fluid splashed by the surface of a substrate 10.In detail
For, spin etch cleaning machine 100 is provided with a microscope carrier 11, and the lower section of microscope carrier 11 then connects
If a rotating shaft 12, can carry and rotary plate 10, wherein the substrate 10 can be partly to lead
Body wafer, display base plate, solar base plate, LED-baseplate etc..The fluid collection
Device 120 includes multiple collector units 20 and multiple drive devices 30.
The multiple collector unit 20 is located on around the substrate 10, specifically,
The multiple collector unit 20 includes that multiple rings 22 of collecting are connected with collection ring 22 bottom
Drainage pipe 21, it is the multiple collection ring 22 be sequentially radially arranged, in this embodiment,
The multiple collection ring 22 includes that first collects the collection ring 224 of ring 222 and second, the
One collect ring 222 and second to collect ring 224 be concentric annular, wherein positioned at the of outside
One collects ring 222 is also referred to as knocker.The fluid collection device 120 of the present embodiment is in figure
During 1 state, the substrate 10 is exposed to outside whole collector unit 20, can now be added
Carry or unload carried base board 10..It is noted that collector unit of the invention 20 can be
The form such as ring-type or tubulose, and visually collected type of fluid is outwards set up, such as three receipts
Collect ring or four are collected ring etc..
Fig. 3 to Fig. 4 is refer to, Fig. 3 is received for the fluid collection device 120 of the present embodiment
Generalized section during collection first fluid, Fig. 4 is the fluid collection device of the present embodiment
120 collect generalized section during second fluid.As shown in figure 3, first collects ring 222
Rise, and first fluid is collected by the first collection ring 222.As shown in figure 4, when second
When collection ring 224 also rises, and second fluid is collected by the second collection ring 224.Below
Will be explained in driving the drive device 30 of collector unit 20.
As shown in Fig. 2 the multiple drive device 30 is connected to the multiple receipts
Collection unit 20 (i.e. first collects ring 222 and second collects ring 224), for independent control
Make the lifting of each collector unit 20 so that the multiple collector unit 20 can be received each
The different fluid of collection, wherein the quantity of the multiple drive device 30 is equal to the multiple
The quantity of collector unit 20.In this embodiment, the quantity of collector unit 20 is two,
The quantity of drive device 30 is also two.Will be detailed below doing for drive device 30
Dynamic principle.
As shown in figure 5, stereopsis of the Fig. 5 for the fluid collection device 120 of corresponding diagram 3
Figure, in Figure 5, drive device 30 drives the first collection ring 222 to rise.As schemed
Show, each drive device 30 includes that one links mechanism 32 and driving source 34, driving source
34 link mechanism 32 with for driving.For example, driving source 34 include pneumatic cylinder,
Oil hydraulic cylinder, linear motor etc. linearly come and go driving source, in the present embodiment by taking pneumatic cylinder as an example,
Only the invention is not restricted to this.The bindiny mechanism 32 is used to stably drive the collection
The lifting of ring 22.
Fig. 6 is refer to, Fig. 6 shows for the vertical view of the fluid collection device 120 of the present embodiment
It is intended to.Specifically, it is described to link the outer peripheral edge that mechanism 32 is coupled to the collection ring 22
First contact 24 and one second contact 25 one of on 23.In schema, is shown respectively
One collects the first contact 24 and the second contact 25 that ring 222 and second collects ring 224.
It is noted that the first contact 24 and the second contact 25 are not as being located at bolt in schema
On, schema only shows the relative position on outer peripheral edge 23.Specifically, described
One contact 24 and second contact 25 are in the outer peripheral edge 23 of the collection ring 22
On define a radian, the radian between pi/2 to π, that is, 90 degree to 180
Degree.In this embodiment, as illustrated, first collects the first contact 24 of ring 222
And second contact 25 define radian r1, second collects the first contact 24 of ring 224
And second contact 25 define radian r2, first collects the radian r1 of ring 222 more than the
The two radian r2 for collecting ring 224.
As shown in Figures 2 and 6, the stability of the lifting of ring 22, institute are collected to strengthen
State and collect ring 22 also including being connected to first contact on the outer peripheral edge 23
24 and the stiffener 225 of second contact 25.In this embodiment, stiffener 225
On the first outer peripheral edge 23 for collecting ring 222.As shown in figures 2 and 5, except this
Outside, the link mechanism 32 may also include and be connected to first contact 24 and described
The support member 37 of the second contact 25, the support member 37 is arranged at the collection ring 22
The outer peripheral edge 23 bottom.In this embodiment, support member 37 is used to support the
Two collect ring 224, to consolidate the second lifting for collecting ring 224.
Hereinafter illustrate the concrete structure of the bindiny mechanism 32 of this embodiment.As shown in figure 5,
The drive device 30 includes a slide rail 31, and the bindiny mechanism 32 includes being connected to
One of linear movement is done on the slide rail 31 and encircles arm 33, the arm 33 of encircling has
One first end point 332 and one second end points 333.In this embodiment, first is driven to receive
The slide rail 31 for collecting ring 222 is arranged on both second slide rails 31 for collecting ring 224 are driven
The both sides of one pillar 50, its corresponding driving source 34 is also disposed at the both sides of pillar 50,
To save the space under collector unit 20.Please with reference to Fig. 2, herein with connection
As a example by the first link mechanism 32 for collecting ring 222, linking mechanism 32 also includes the first top
Post 334, the second fore-set 335, the first davit 336, the second davit 337, first are sealed
The closure 339 of part 338 and second.Specifically, the first fore-set 334 is coupled to the ring
The first end point 332 of arm 33；Second fore-set 335 encircles arm described in being coupled to
33 second end points 333；First davit 336 is coupled to the collection ring 22
First contact 24；Second davit 337 is coupled to described the of the collection ring 22
Two contacts 25；First closure 338 is used for sealed first fore-set 334 and institute
State the first davit 336；Second closure 339 be used for sealed second fore-set 335 with
And second davit 337.It is noted that the link of ring 224 is collected in connection second
Mechanism 32 is same as described above, and this is not repeated.
As shown in figures 2 and 5, first closure 338 and described second sealed
Part 339 has an at least adjusted leveling screws 340, and adjusted leveling screws 340 is used for micro-
Adjust the level for collecting ring 22.Specifically, the first closure 338 and described
Second closure 339 respectively has the first locking block 342 and the second locking block 344 staggeredly.
First locking block 342 and the second locking block 344 are locked together in the first/the through bolt respectively
Two fore-sets 334,335 and first/second davit 336,337, treat adjusted leveling screws
After 340 adjustment levels, two the first locking blocks 342 and second staggeredly is just combined by bolt
Locking block 344, and then complete to link the fixation of mechanism 32.It is noted that above-mentioned
The concrete structure for linking mechanism 32 is only one embodiment, in other embodiments, even
Knot mechanism may also be arranged on the top of collector unit 20 and be not take up the lower section of collector unit 20
Space.
In sum, fluid collection device of the invention 120 passes through drive device 30 1
To the multiple collection ring 22 of ground connection, and overcome existing using multiple pneumatic cylinders
And have the nonsynchronous problem of lift component.In addition, in order to strengthen single drive device 30
Horizontality when collecting the lifting of ring 22 is driven, through the ring of link mechanism 32 of the invention
First contact 24 and the second contact collected on the outer peripheral edge 23 of ring 22 of arm 33 pairs
25 as lifting fulcrum, and smoothly can smoothly be lifted.From the foregoing, it will be observed that this
The reliability of the greatly improved fluid collection device running of invention, and then reduction equipment stops
The probability of machine and generation waste material.
Although the present invention is disclosed above with preferred embodiment, above preferred embodiment is simultaneously
The limitation present invention is not used to, one of ordinary skill in the art is of the invention not departing from
In spirit and scope, can make various changes and retouching, therefore protection scope of the present invention
It is defined by the scope that claim is defined.
Claims (10)
1. a kind of fluid collection device of spin etch cleaning machine, for collecting by a substrate
The fluid that surface is splashed, it is characterised in that including：
Multiple collector units, are located on around the substrate；And
Multiple drive devices, are connected to the multiple collector unit, for independent control
Make the lifting of each collector unit so that the multiple collector unit can be collected each not
Same fluid, wherein the quantity of the multiple drive device is equal to the multiple collection list
The quantity of unit.
2. fluid collection device according to claim 1, it is characterised in that described many
Individual collector unit includes multiple collection rings, and the multiple collection ring sequentially radially sets
Put.
3. fluid collection device according to claim 2, it is characterised in that each drive
Dynamic device includes linking mechanism, and the bindiny mechanism is used to drive the collection ring
Lifting.
4. fluid collection device according to claim 3, it is characterised in that the company
The first contact and second that knot mechanism is coupled on the outer peripheral edge of the collection ring are touched
Point.
5. fluid collection device according to claim 4, it is characterised in that described
One contact and second contact define on the outer peripheral edge of the collection ring
Go out a radian, the radian is between pi/2 to π.
6. fluid collection device according to claim 4, it is characterised in that the receipts
Collection ring includes being connected to first contact and described on the outer peripheral edge
The stiffener of the second contact.
7. fluid collection device according to claim 4, it is characterised in that the company
Knot mechanism includes being connected to the support member of first contact and second contact,
The support member is arranged at the bottom of the outer peripheral edge of the collection ring.
8. fluid collection device according to claim 4, it is characterised in that the drive
Dynamic device includes a slide rail, and the bindiny mechanism includes being connected on the slide rail doing
Arm is encircled in linear movement, and the arm of encircling has first end point and the second end points.
9. fluid collection device according to claim 8, it is characterised in that the company
Knot mechanism also includes：
First fore-set, is coupled to the first end point for encircling arm；
Second fore-set, is coupled to second end points for encircling arm；
First davit, is coupled to first contact of the collection ring；
Second davit, is coupled to second contact of the collection ring；
First closure, for sealed first fore-set and first davit；With
And
Second closure, for sealed second fore-set and second davit.
10. fluid collection device according to claim 8, it is characterised in that described
First closure and second closure have an at least adjusted leveling screws,
Level for finely tuning the collection ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510783139.2A CN106711060B (en) | 2015-11-16 | 2015-11-16 | The fluid collection device of spin etch cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510783139.2A CN106711060B (en) | 2015-11-16 | 2015-11-16 | The fluid collection device of spin etch cleaning machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106711060A true CN106711060A (en) | 2017-05-24 |
| CN106711060B CN106711060B (en) | 2019-07-26 |
Family
ID=58931893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510783139.2A Active CN106711060B (en) | 2015-11-16 | 2015-11-16 | The fluid collection device of spin etch cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106711060B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111211066A (en) * | 2018-11-22 | 2020-05-29 | 辛耘企业股份有限公司 | Fluid collecting device |
| CN113467199A (en) * | 2021-09-06 | 2021-10-01 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
| TWI747580B (en) * | 2020-10-28 | 2021-11-21 | 辛耘企業股份有限公司 | Etching device |
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| US20070254098A1 (en) * | 2006-04-28 | 2007-11-01 | Applied Materials, Inc. | Apparatus for single-substrate processing with multiple chemicals and method of use |
| CN104064500A (en) * | 2014-06-24 | 2014-09-24 | 北京七星华创电子股份有限公司 | Cleaning device and method for slice disc-shaped object |
| TWM505052U (en) * | 2015-01-22 | 2015-07-11 | Scientech Corp | Fluid process processing apparatus |
| CN205081101U (en) * | 2015-11-16 | 2016-03-09 | 弘塑科技股份有限公司 | Fluid collection device of board is rinsed in rotatory etching |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070254098A1 (en) * | 2006-04-28 | 2007-11-01 | Applied Materials, Inc. | Apparatus for single-substrate processing with multiple chemicals and method of use |
| CN104064500A (en) * | 2014-06-24 | 2014-09-24 | 北京七星华创电子股份有限公司 | Cleaning device and method for slice disc-shaped object |
| TWM505052U (en) * | 2015-01-22 | 2015-07-11 | Scientech Corp | Fluid process processing apparatus |
| CN205081101U (en) * | 2015-11-16 | 2016-03-09 | 弘塑科技股份有限公司 | Fluid collection device of board is rinsed in rotatory etching |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111211066A (en) * | 2018-11-22 | 2020-05-29 | 辛耘企业股份有限公司 | Fluid collecting device |
| TWI747580B (en) * | 2020-10-28 | 2021-11-21 | 辛耘企業股份有限公司 | Etching device |
| CN113467199A (en) * | 2021-09-06 | 2021-10-01 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
| CN113467199B (en) * | 2021-09-06 | 2021-11-12 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106711060B (en) | 2019-07-26 |
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