CN106709455A - Display screen for supporting full screen optical fingerprint sensor and manufacturing method thereof - Google Patents
Display screen for supporting full screen optical fingerprint sensor and manufacturing method thereof Download PDFInfo
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- CN106709455A CN106709455A CN201611213874.0A CN201611213874A CN106709455A CN 106709455 A CN106709455 A CN 106709455A CN 201611213874 A CN201611213874 A CN 201611213874A CN 106709455 A CN106709455 A CN 106709455A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention relates to a display screen for supporting a full screen optical fingerprint sensor and a manufacturing method thereof. The display screen comprises a display module and an optical fingerprint sensor module which are mounted in a superimposed manner; fingerprint information collection is carried out in a fixed region or all regions of the display screen by use of an optical fingerprint sensor, and is not limited to a capacitive fingerprint sensor. The capacitive fingerprint sensor can only be set in a non-display region, influences a screen ratio and cannot realize full screen display. Compared with the existing optical fingerprint sensor, the display screen does not need an independent lighting source, reduces the complexity and the integration difficulty of a sensor, does not need to modify a manufacturing process of the display screen or periodically lighten a lighting circuit, is convenient to implement, saves power, can be arranged at any position of the display screen or completely covers the display region of the display screen, can realize fingerprint identification of the full screen and contributes to fingerprint identification of electronic equipment in full screen display.
Description
Technical field
The present invention relates to technical field, and in particular to a kind of
Background technology
Current fingerprint recognition mainly has three kinds of modes：Capacitance type sensor, optical image sensor, ultrasonic sensor.
Three kinds of modes are each advantageous, also respectively there is limitation.
Electronic equipment is emphasized to shield accounting, and capacitive fingerprint sensing device and ultrasonic fingerprint sensor, because technology is realized
The problem of mode, can only be set at the front of electronic equipment, side or the back side at present, general to set when front is arranged on
In the lower section of display screen, the positive area of electronic equipment is occupied, it is impossible to accomplish full frame.
The advantage of capacitance type sensor is with low cost, reliability is high, recognition speed is fast, and problem one is current resolution ratio
Relatively low (500-600pi), influences the precision of identification of fingerprint, is out-tricked sensor easily by fraud mode, and two is to wear
Saturating display screen is laid in side and the back side, it is necessary to positive area outside taking electronic equipment screen, influence screen accounting
Capacitive fingerprint sensing device, with the identification problem that area is small, man-machine interaction experience is poor.The patent US9460332 of Apple Inc.
B1 " electrostatic lenses capacitive fingerprint sensing device ", purpose is just attempt to solve to lay penetrating for fingerprint sensor under display screen
And precision problem.But, there is change display in the method that the capacitive fingerprint sensing device that Apple Inc.'s patent is described penetrates screen
Screen technique and structure, enforcement difficulty is high, high cost, exist and cannot cover that a series of influence scales such as whole screen are practical to ask
Topic.
The advantage of ultrasonic sensor is that can create fingerprint image and In vivo detection comprising fine details, it is ensured that high
Resolution and security.But ultrasonic fingerprint sensor also has the shortcomings that volume greatly and high cost, and ultrasonic wave also cannot be effective
Penetrate the display screen module being made up of multiple layers of different materials, it is impossible in the terminal of full screen display, as front fingerprint recognition
Scheme.
Conventional optical fingerprint sensor needs to be focused with modes such as condenser lens and Amici prisms and is adjusted with light path, this
A little optics volumes are big, it is impossible to apply in mobile terminal device.
The content of the invention
For above-mentioned technical problem, the technical problems to be solved by the invention are to provide
The technical scheme that the present invention solves above-mentioned technical problem is as follows：
It is a kind of to support the display screen of full frame optical fingerprint sensor, including overlap the display module installed and optical finger print biography
Sensor module；Characterized in that, the optical fingerprint sensor module covering display module bottom surface；
The display module includes cover-plate glass (111), and the bottom surface of the cover-plate glass (111) installs touch sensor
(112), the bottom surface of the touch sensor (112) installs polaroid (113), and the lower surface of the polaroid (113) is installed
Image element circuit (115)；
The optical fingerprint sensor module includes substrate (116), and the bottom surface of the substrate (116) is installed optical imagery and passed
Sensor (122), is provided with optics pinhole difiration plate (121), on the optics pinhole difiration plate (121) on the substrate (116)
It is evenly equipped with imaging aperture (124).
Beneficial effect：Optical image sensor used by large area, big pixel, the collection fingerprint of low cost, it is possible to achieve
Finger print information collection is carried out in the FX or Zone Full of display screen, is no longer limited to by capacitive fingerprint sensing device.
Capacitive fingerprint sensing device can only set capacitive fingerprint sensing device, influence screen accounting, it is impossible to realize full frame in non-display area
Display.
Compared with existing optical fingerprint sensor, the present invention need not individually set up lighting source, reduce sensor
Complexity and integrated difficulty, it is not necessary to the making technology of display screen is changed, it is not necessary to periodically light lighting circuit, with reality
Apply convenience, power saving, the optional position that display screen can be arranged in or the viewing area that display screen is completely covered, it is possible to achieve complete
Screen fingerprint recognition, contributes to the electronic equipment for realizing being displayed in full screen.From from the point of view of user, the display screen of the electronic equipment
The accounting of the viewing area of curtain is maximized, and display effect is splendid, and user has extremely strong immersion sense when watching, and product is attractive in appearance big
Side.And fingerprint recognition, including fingerprint or personal recognition, be to be carried out in the front of electronic equipment, it is to avoid in side or
The back side carries out the inconvenient operation of fingerprint recognition.
Further, the optics pinhole difiration plate (121) is made up of black light-absorbing material.
Using the beneficial effect of further technical scheme：The generally black light-absorbing material of optics pinhole difiration plate 121, prevents
Reflected light multiple reflections in LED modules cause imaging effect not good.Optics pinhole difiration plate 121 should block wavelength and exist
The electromagnetic wave (and visible-range is general in 380-780nm) of 300-800nm.For convenience of making, optics pinhole difiration plate can be with
With black ink silk-screen mode, silk-screen is carried out in the middle of the single layer substrate top surface or double layer substrate of LED modules, while on silk-screen
Imaging aperture.Imaging aperture is made by technologies such as laser borings.
Further, also including support frame (123), support frame as described above (123) is wrapped in the optical fingerprint sensor module
Bottom surface.
Using the beneficial effect of further technical scheme：Support frame is made up of metal material, plays a protective role.
Further, the substrate (116) is single layer substrate, and the optics pinhole difiration plate (121) is installed in the substrate
(116) upper surface.
Using the beneficial effect of further technical scheme：Using single layer substrate, display screen integral thickness is small, thickness ultrathin,
It is easily manufactured, low cost.
Further, the substrate (116) is double layer substrate, and the optics pinhole difiration plate (121) is installed in the bilayer
Between substrate.
Using the beneficial effect of further technical scheme：Using double layer substrate, display module makes after an integrated laminar substrate
Process is simple.
A kind of preparation method of the single layer substrate display screen for supporting full frame optical fingerprint sensor, it is characterised in that including
Back side making step, top surface making step, foreboard section making step and module set section making step；
Back side making step is：
S1：Substrate (116) bottom surface plated film；
S2：Substrate (116) bottom-surface coated photoresist；
S3：Bottom surface is exposed by the way of optical illumination, the pattern on light shield is transferred to plated film by photoresistance
On substrate (116) afterwards；
S4：The film below figure that will not covered by photoresistance on substrate (116) is etched away；
S5：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left, and carries out semiconductor doping process；
S6：Repeat step S1-S5 several times after, make substrate bottom surface all of optical image sensor back-side circuit layer；
S7：Substrate (116) back side carries out thin-film package；
Top surface making step includes：
S11：Optics optics pinhole difiration plate (121) with imaging aperture (124) is produced on substrate top surface, Ran Hou
Substrate top surface plated film；
S12：The top surface coating photoresist of substrate；
S13：Exposed in substrate top surface by the way of optical illumination, the pattern on light shield is transferred to plated film by photoresistance
On substrate afterwards；
S14：Pattern is developed；
S15：The film below figure that will not covered by photoresistance on substrate is etched away；
S16：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
S17：Repeat step S11-S16 several times, makes the thin-film transistor circuit layers having on substrate top surface more；
Foreboard section making step includes：
S21：Thin-film transistor circuit layer cleaning, the dirt and impurity left in removal top surface making step；
S22：High-precision metal mask plate is made, and the high-precision metal mask plate is pin-pointed on metal framework；
S23：Organic material is deposited with onto substrate through high-precision metal mask plate, organic pixel layer is formed；
S24：By thin-film package, protective substrate positive thin-film transistor circuit layer and organic pixel layer；
S25：After cover plate cleaning, coated using packaging plastic；
S26：Under vacuum conditions, cover plate is carried out into encapsulation of fitting with substrate with the high-effect glass cement for blocking steam；
Module set section making step includes：
S31：Cutting：Packaged LED-baseplate is cut into panel；
S32：Panel test：Carry out panel and light inspection；
S33：Paste partially：LED panel is attached into upper Polarizer；
S34：Panel is overturn；
S35：Back side of panel binds driving chip；
S36：Back side of panel binds flexible print circuit board；
S37：Module is tested：Carry out the burn-in test of module and light inspection, complete manufacturing process.
Cleaned before the plated film of substrate (116) bottom surface in the back side making step.
The number of times of the step S6 repeat steps S1-S5 is 12 times.
A kind of preparation method of the double layer substrate display screen for supporting full frame optical fingerprint sensor, including first substrate
(116 ') making step, second substrate (118) making step and module set section making step；Characterized in that,
Second substrate (118) making step is：
S41：Second substrate (118) clean dirt；
S42：Second substrate (118) top surface makes optics pinhole difiration version (121)；
S43：Second substrate (118) bottom surface plated film；
S44：Second substrate (118) bottom-surface coated photoresist；
S45：Second substrate (118) is exposed by the way of optical illumination in substrate top surface, and the pattern on light shield is passed through
Photoresistance is transferred on the substrate after plated film；
S46：Pattern is developed；
S47：The film below figure that will not covered by photoresistance on second substrate is etched away；
S48：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
S49：Repeat step S43-S48 several times, makes the back side of all of optical image sensor in second substrate bottom surface
Circuit layer；
S50：Second substrate bottom surface thin-film package.
Module making step is：
S51：Cutting：Packaged LED-baseplate is cut into LED display panel, packaged optical image sensor substrate
Also it is cut into sensor panel；
S52：Panel test：Carry out panel and light inspection；
S53：Paste partially：LED panel is attached into upper Polarizer；
S54：Display panel and image sensing panel attachment；
S55：Back side of panel binds driving chip；
S56：Back side of panel binds flexible print circuit board；
S57：Module is tested：Carry out the burn-in test of module and light inspection, complete manufacturing process.
The number of times of repeat step S43-S48 is 12 times in the S49.
Brief description of the drawings
Fig. 1 is the structural representation of the single layer substrate display screen for supporting full frame optical fingerprint sensor；
Fig. 2 is the structural representation of the double layer substrate display screen for supporting full frame optical fingerprint sensor；
Fig. 3 is the structural representation of optics pinhole difiration plate (121)；
Fig. 4 is based on the single layer substrate display screen collection fingerprint image schematic diagram for supporting full frame optical fingerprint sensor；
Fig. 5 is based on the double layer substrate display screen collection fingerprint image schematic diagram for supporting full frame optical fingerprint sensor；
Fig. 6 is the backboard section back side Making programme figure of the single layer substrate display screen for supporting full frame optical fingerprint sensor；
Fig. 7 is the backboard section top surface Making programme figure of the single layer substrate display screen for supporting full frame optical fingerprint sensor；
Fig. 8 is the module set section Making programme figure of the single layer substrate display screen for supporting full frame optical fingerprint sensor；
Fig. 9 is the foreboard section Making programme figure of the single layer substrate display screen for supporting full frame optical fingerprint sensor；
Figure 10 supports the backboard section Making programme of the second substrate of the double layer substrate display screen of full frame optical fingerprint sensor
Figure；
Figure 11 supports the module set section Making programme of the second substrate of the double layer substrate display screen of full frame optical fingerprint sensor
Figure.
Specific embodiment
Principle of the invention and feature are described below in conjunction with accompanying drawing, example is served only for explaining the present invention, and
It is non-for limiting the scope of the present invention.
Fig. 1 is a kind of structural representation of the single layer substrate display screen for supporting full frame optical fingerprint sensor, and its technique is
Single layer substrate technique.
LED display modules 110 (i.e. display module) include that cover-plate glass 111, CTP capacitive touch screens 112 (are touched
Sensor 112), polaroid 113, encapsulation cover plate 114, LED pixel circuit 115, substrate 116.And CTP capacitance touch screens are integrated in
In display screen, it is also possible to plug-in mode, under cover-plate glass.Bonded by optical cement OCA between each layer, lift printing opacity
Rate.
Substrate 116 can use transparent glass substrate or flexible and transparent PI substrates to support high transmission rate.Meanwhile,
In order to further lift light transmittance, the minute surface for reducing thin-film transistor circuit layer is reflective, it is necessary to the structure that increase transparency sets
Meter.
Optical fingerprint sensor module 120, including LED-baseplate top or centre optics pinhole difiration plate 121 and be located at
The optical image sensor 122 of the bottom of substrate 116.There is imaging aperture 124 on optics pinhole difiration plate 121.Display screen is by supporting
Frame 123 is protected.
The generally black light-absorbing material of optics pinhole difiration plate 121, prevents reflected light multiple reflections in LED modules from causing
Imaging effect is not good.Optics pinhole difiration plate 121 should block electromagnetic wave (and visible ray model of the wavelength in 300-800nm
Enclose general in 380-780nm).For convenience of making, optics pinhole difiration plate can use black ink silk-screen mode, in LED modules
Single layer substrate top surface, carry out silk-screen in the middle of double layer substrate, while being imaged aperture 124 on silk-screen, imaging aperture 124 is uniformly constituted
Imaging array of orifices.Imaging aperture 124 can also be made by technologies such as laser borings.The top surface of optical image sensor 122
Space D 1 (i.e. the image distance of pinhole imaging system principle), the hole diameter of imaging aperture 124 with the top surface of optics pinhole difiration plate 121
The parameters such as d, top surface according to the top surface of cover-plate glass 111 to optics pinhole difiration plate 121 apart from D2 (namely LED modules thickness,
That is the object distance of pinhole imaging system principle), LED monochrome emission wavelength v and the data such as light path parameter needed for pinhole imaging system determine, form
As the pitch of holes s of aperture 124, the requirement of the subgraph automatic Mosaic of optical image sensor requirement is met.Object distance D2 is really
It is fixed：First surface (top surface of cover-plate glass 111) arrives the top surface of optics pinhole difiration plate 121 apart from D2, i.e. pinhole imaging system principle
Object distance, is come by the process characteristic of different cover-plate glass thickness, LED-baseplate thickness, LED process materials, processing procedure and manufacturer
Determined etc. factor, typically between 0.3-1.5mm, as a example by taking 1mm herein.Second surface (top surface of optical image sensor 122)
With the space D 1 of the top surface of optics pinhole difiration plate 121, the i.e. determination of the image distance of pinhole imaging system principle：It is former according to pinhole imaging system
Reason, object distance D2 is 1.5-3 times of image distance D1, in order to the thickness for ensureing this optical fingerprint sensor 120 is as far as possible thin, is conveniently integrated into
In electronic equipment 100 (such as intelligent terminal etc.), while can be by by the shape of imaging aperture 124 of optics pinhole difiration plate 121
Into subgraph automatic Mosaic, the ratio of object distance and image distance should be 1: 1, then D2=1mm.Object distance and the consequence that image distance is not 1: 1, will
It is that subgraph image is overlapped or subgraph needs the later stage to splice, is worthless mode.
Minimum resolution requirement according to fingerprint recognition is calculated for 500ppi, in order to meet the requirement of fingerprint recognition, is needed
500 data points of collection to be analyzed in 1 inch of (25.4mm) length, its resolution ratio is 25.4/500=0.0508mm.
According to the resolution formula of pinhole imaging system：Resolution ratio=hole diameter d* (object distance D2/ image distance D1+1), then be imaged aperture 124
Hole diameter d=0.0508/ (object distance D2/ image distance D1+1).In this example, D2/D1=1, then hole diameter is d=
0.0508/2=0.0254mm, i.e. 25.4um.
In order to further improve resolution ratio, such as more than 500ppi, then can further dwindle into the aperture as aperture 124
Diameter d.In order to the resolution ratio for coordinating the resolution ratio of pinhole imaging system, optical image sensor should be greater than 500ppi, i.e., using CCD or
The resolution ratio of person's CMOS optical image sensors is greater than 500ppi, according to current LED display (panel) production-line technique
Level, this standard should be easily reached, i.e., each sensor pixel size is less than 25.4um.
As shown in figure 3, the determination of the array configuration, hole shape and aperture distance s of imaging aperture 124：This example is referring to
As a example by line pickup area 117 and the size of optical image sensor 122, can be in monochromatic LED pixel electricity in order to meet imaging aperture
Under the monochromatic illumination that road sends, the imaging of object is successfully carried out with pinhole imaging system principle, and automatic Mosaic is into complete
Whole target object image, then advise that effect aperture is arranged with the cellular fashion of Fig. 2,6 adjacent with periphery of each small hole center
The centre distance s of aperture is equal, apart from s=D2/ (D1+D2)=0.5mm.In order to meet imaging requirements, can be according to reality apart from s
Border effect is adjusted flexibly, such as s=0.1mm, 1mm etc..
Suggestion hole shape is circle, reduces other shapes, such as the diffraction effect that the interior angle part of square aperture produces,
Influence image quality.
For cost-effective, optics pinhole difiration plate 121 and optical image sensor 122 can be arranged at LED display modules
In 110 FX, the optical ftngetpnnt acquisidon under the display screen of FX is formed.
It is pointed out that the optical fingerprint sensor module 120 integrated with LED display modules 110, it is not necessary to individually set
The parts such as illuminating device and light guide plate are put, but utilizes the image element circuit luminous lighting of display screen 110 to be collected fingerprint target, its
Implement simple structure, thickness ultrathin is easily manufactured, with low cost.
During collection fingerprint image, required illumination perceives touching in screen arbitrary region by CTP capacitive touch screens 112
Touch, and then respective regions illumination is lighted by display screen and provide.
CTP capacitive touch screens 112 are applied in combination with optical fingerprint sensor module 120, only when CTP capacitance touch
Sensor 112 is perceived after the touch action of the arbitrary region of LED display (panel), restarts the pixel electricity of corresponding region
Road 115 luminous lighting, it is to avoid conventional optical image sensor needs periodicity luminous lighting to detect that the power consumption of target is big to ask
Topic.
Fig. 2 is a kind of display screen schematic diagram for supporting full frame optical fingerprint sensor, and its technique is double layer substrate technique.
Support that the specific fingerprint image of the display screen (single layer substrate technique) of full frame optical fingerprint sensor is adopted with reference to Fig. 4
Collection schematic flow sheet.When needing to be unlocked or during the operation such as payment verification, the collected target 140 of the user of electronic equipment
During the fingerprint collecting region 117 of (finger or palm) Touch screen, CTP capacitive touch screens 112 perceive touch action and
Touch location, so by processor light corresponding to corresponding fingerprint collecting region 117 LED pixel circuit 115 (i.e. pixel electricity
Road 115), monochromatic illumination light is sent, it is similar to the flash lamp effect of camera.The time that LED pixel circuit 115 is lighted, with can
It is unsuitable long for the purpose of clearly photographing target pattern, it is to avoid the display effect of influence display screen.The light for sending is worn upwards
Encapsulation cover plate 114, polaroid 113, CTP capacitive touch screens 112, cover-plate glass 111 are crossed, are irradiated in collected target,
Reflection light is again via cover-plate glass 111, CTP capacitive touch screens 112, polaroid 113, encapsulation cover plate 114, LED pixel
Circuit 115, substrate 116, reach optical fingerprint sensor module 120.The invalid diffusion light of which part is by positioned at LED-baseplate top
The optics pinhole difiration plate 121 of portion or centre is blocked, and effective reflection light is then through the imaging of optics pinhole difiration plate 121
Aperture 124, reaches optical image sensor 122, forms the optical imagery 141 of collected target 140.The image 141 for collecting,
Due to the inhomogeneities that the manufacturing process of transparent display screen 110 is caused, light through when can cause distortion, while formed it is each
The edge of subgraph, needs image flame detection the problems such as have the overlap that splicing causes.
Such as referring specifically to for Fig. 5 is a kind of single layer substrate display screen (the double layer substrate technique) of supporting full frame optical fingerprint sensor
Print image collecting flowchart schematic diagram.
When needing to be unlocked or during the operation such as payment verification, (the finger of collected target 140 of the user of electronic equipment
Or palm) Touch screen fingerprint collecting region 117 when, CTP capacitive touch screens 112 perceive touch action and touch position
Put, and then the LED pixel circuit 115 corresponding to corresponding fingerprint collecting region 117 is lighted by respective processor, send monochromatic photograph
Mingguang City, is similar to the flash lamp effect of camera.The time that LED pixel circuit 115 is lighted, can clearly photograph target figure
It is unsuitable long for the purpose of case, it is to avoid the display effect of influence display screen.The light for sending is upward through encapsulation cover plate 114, polarisation
Piece 113, CTP capacitive touch screens 112, cover-plate glass 111, are irradiated in collected target 200, and reflection light is again via lid
Glass sheet 111, CTP capacitive touch screens 112, polaroid 113, encapsulation cover plate 114, LED pixel circuit 115, first substrate
116 ', optics pinhole difiration plate 121 and imaging aperture 124, second substrate 118, reach optical fingerprint sensor 120.Its middle part
Invalid diffusion light is divided to be blocked by the optics pinhole difiration plate 121 positioned at LED-baseplate top or centre, and effective reflection light
Then through the imaging aperture 124 of optics pinhole difiration plate 121, optical image sensor 122 is reached, form collected target 140
Optical imagery 141.The image 141 for collecting, due to the inhomogeneities that the manufacturing process of transparent display screen 110 is caused, light
Through when can cause distortion, need image to rectify while the edge of each subgraph for being formed, the problems such as have the overlap that splicing causes
Just.
The back-side circuit of the single layer substrate of the display screen of large-sized support optical fingerprint sensor is introduced below in conjunction with Fig. 6
Making programme P110~P470, this flow makes the image sensor circuit of substrate bottom surface first.
Step P110, the two-sided clean dirt of substrate, in this embodiment, the substrate can include glass substrate, gather
Imide resin (polyimide abbreviation PI), PEN (PEN), polyethylene terephthalate (terylene
Resin PET), at least one of the transparency carrier such as various kinds of resin lamination.It may be noted here that in order to ensure object distance and image distance are 1: 1,
Substrate thickness will ensure the consistency of thickness with the first plane to substrate top surface.
Step P120, it is punched in substrate relevant position, it is punched in the correspondence position of substrate using laser drilling device
VIA.In this embodiment, via can make the back side electricity of substrate top surface thin film transistor (TFT) (TFT) circuit layer and bottom surface
Made before road (carry out laser boring in plant substrate), it is also possible to making the back side electricity of substrate top surface TFT circuit and bottom surface
Made behind road.Which kind of, using mode, carried out according to the specific technique adjustment requirement of panel factory.It is optional step,
If necessary to the partial circuit of substrate top surface is deployed into substrate bottom surface, then this step is carried out.In this embodiment, with skill
The resolution ratio of art progress and display panel rises, basic display pixel element circuit it is upper and lower and less and less every between left and right,
The punching size of punch device is caused, has exceeded the scope that the interval between pixel is allowed, now should be by biserial or multiple row
Via, or sawtooth pattern arranges the modes such as via, corresponding via is made, to support the via work of high-resolution display panel
Skill.
Step P130, substrate bottom surface coating process is to use filming equipment, with mode physically or chemically by required material
Deposit in substrate bottom surface, while the inwall of via is coated into conductive material, form conductive via.Substrate wall thickness and via diameter
Ratio, should be greater than certain proportion, to ensure that via inwall can continuously coat conductive material, prevent from causing broken string.
The photoresist coating of step P140 bottom surfaces, photoresist is coated in bottom surface.In this step, using high precision optical alignment
Equipment, connection is directed at by the photoresist position via VIA corresponding with substrate for making related circuit.
Step P150, bottom surface exposure technology is by the way of optical illumination, the pattern on light shield to be transferred by photoresistance
On substrate after to plated film；
Step P160, is developed using developing process；
Step P170, etch process：Etch process is the mode using chemistry or physics, will not covered by photoresistance on substrate
Film below the figure of lid is etched away.
Step P180, stripping technology：Finally the photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；For
The semiconducting behavior of lifting imageing sensor, lifts the indexs such as photosensitive quality, it is necessary to carry out semiconductor doping (doping) work
Skill.
P130 to P180 operations are repeated multiple times (usual 12 times), make all of imageing sensor back-side circuit layer in bottom surface
(photosensitive circuit, ranks read and drive circuit, adc circuit, FPC bindings bits etc.), finally touches protecting each bindings bit projection
On the premise of point, thin-film package (ThinFilm Encapsulation), protection back-side circuit layer are overleaf carried out.Should be noted
, because the imageing sensor at the back side is worked in the way of upside-down mounting, i.e., incident ray is entered from the top surface of imageing sensor
Enter, but imageing sensor counted through substrate from substrate back, thus need not install the CCD of traditional silicon substrate mode,
The structures such as the colored filter and lenticule of the top surface setting of cmos sensor.
After back side image sensor circuit layer completes, substrate is overturn, enter into substrate top surface technological process.
The top surface circuit of the single layer substrate of the optical image sensor of large-sized optical signature sensor is introduced with reference to Fig. 7
Making programme P200, this flow makes the image element circuit of substrate top surface.
The substrate segment top surface flow is comprised the following steps：
Step P210, substrate top surface coating process is to use filming equipment, with mode physically or chemically by required material
Deposit on substrate top surface；, it is necessary to the optics pinhole difiration plate 121 with imaging aperture 124 is produced on into substrate before plated film
Top surface, preparation method can be the modes such as silk-screen printing or plated film.This optics pinhole difiration plate is plated with substrate top surface
Membrane process should not repel, and the performance of plated film is not influenceed.
Step P220 top surfaces photoresist is coated with, and photoresist is coated in top surface.In this step, using high precision optical alignment
Equipment, connection is directed at by the photoresist position for making related circuit with the corresponding via on substrate.
Step P230, top surface exposure technology is by the way of optical illumination, the pattern on light shield to be transferred by photoresistance
On substrate after to plated film；
Step P240, developing process；
Step P250, etch process：Etch process is the mode using chemistry or physics, will not covered by photoresistance on substrate
Film below the figure of lid is etched away.
Step P260, stripping technology：Finally the photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
P210 to P220 operations are repeated multiple times (usual 12 times), make all of thin-film transistor circuit layer of substrate top surface；
Flow process requirement according to panel factory, P100 backboard top surface techniques and P200 backboards bottom surface technique can be exchanged,
Substrate bottom surface image sensor circuit can be first manufactured, then inverts making substrate top surface display pixel circuits.
With reference to Fig. 8：After completing, foreboard segment process flow P300 is entered into, foreboard section flow is comprised the following steps：
In this embodiment, foreboard segment process by high-precision metal mask plate (FMM) by luminous organic material and
The materials such as negative electrode are deposited with backboard, and luminescent device is combined to form with drive circuit, then are packaged to rise in oxygen-free environment
To protective effect.The aligning accuracy of evaporation and the air-tightness of encapsulation are all the challenge places of foreboard segment process.Other techniques are also wrapped
Include and organic light emissive pixels are formed by modes such as printing, inkjet printings
The layer cleaning of P310 thin-film transistor circuits, the dirt impurity that removal previous process may be remained；
P320 metal masks are thrown the net：High-precision metal mask plate (FMM) is mainly using the material with extremely low thermal deformation coefficient
Material makes, and is the key for defining pixel precision.High-precision metal mask plate after completing by screen-tensioning machine by it accurately
It is positioned on the metal framework in production equipment and delivers to P330 evaporation sections.
P330 is deposited with：Organic material is arrived LTPS substrate limited areas by evaporator under ultrahigh vacuum through FMM evaporations
On；
P340 thin-film packages are protected：By thin-film package, protective substrate positive TFT circuit layer and there is computer room pixel layer；
P350 cover plates clean gluing：After cover plate cleaning, packaging plastic (glass cement) is coated in relevant position；Packaging plastic
The selection of (glass cement) and its application in manufacture craft, will directly affect the life-span of OLED.Ensureing packaging effect premise
Under, the width of glass frit and sealant is reduced, it is ensured that narrow frame effect by technology and process implementing as possible；In this reality
Apply in example, cover plate can be one kind of glass, PI, PEN, PET or other cover plate materials；
P360 substrates are encapsulated with cover plate：Under vacuum conditions, with the high-effect glass cement for blocking steam by itself and protection board
Carry out laminating encapsulation.
With reference to Fig. 9：After the completion of encapsulation, module set section P400 technological processes are entered into.
P400 modules segment process will encapsulate the panel for finishing and cut into actual product size, carry out polaroid patch again afterwards
Attached, control circuit such as is fitted at every technique with chip, and carries out burn-in test and product packaging.
The module set section P400 flows are comprised the following steps：
P410 cutting techniques：Packaged LED-baseplate is cut into panel (panel)；
P420 panel tests：Carry out panel and light inspection and aging (aging)；
P430 pastes technique partially：LED panel is attached into upper Polarizer (circular polarisation piece)
P440 panels overturn.
P450 back side of panel IC binds：By power supply chip (Power IC), touch chip, display driver chip, or touch
Control display drives integrated chip, imageing sensor driving chip etc. to be tied to the respective regions at the LED panel back side.According to typesetting
Specific arrangement, display driver chip or touch chip, touch-control display integrated chip etc. can be tied to the phase of substrate front side
Answer position.
P460 back side of panel flexible print circuit board is bound：It is with anisotropic conductive film that the flexible printing of pre-production is electric
Road plate flexible print circuit board (with passive device and connector etc.) is tied to substrate back or positive corresponding contacts region；
FPC (flexible print circuit board) can unify to support display, touch-control, imageing sensor, it is also possible to be split up into different FPC.
P470 modules are tested：Carry out the burn-in test of module and light inspection, pack shipment.
The double layer substrate technique that the display screen of large-sized support optical fingerprint sensor is introduced below in conjunction with Figure 10 makes
Flow, because the technological process of the LED display (panel) in this flow is well-known technological process (first substrate 116 '
Flow), positive and negative (being commonly called as backboard section) Making programme of the substrate (second substrate 118) of imageing sensor is only described herein.
Step P510, the two-sided clean dirt of second substrate 118, in this embodiment, the substrate can include glass
Substrate, polyimide resin (polyimide abbreviation PI), PEN (PEN), polyethylene terephthalate
At least one of the transparency carriers such as ester (polyester resin PET), various kinds of resin lamination.It is described to ensure object distance and image distance holding 1: 1
Second substrate thickness should be equal with the thickness at first surface to the first substrate back side.
Step P520, the optics pinhole difiration plate 121 with imaging aperture 124, making side are made in second substrate top surface
Method can be the mode such as silk-screen printing or physics, plated film.
Step P530, second substrate bottom surface coating process, is to use filming equipment, will be required with mode physically or chemically
Material is deposited on second substrate bottom surface.
The photoresist coating of step P440 bottom surfaces, photoresist is coated in bottom surface.
Step P550, bottom surface exposure technology is by the way of optical illumination, the pattern on light shield to be transferred by photoresistance
On substrate after to plated film；
Step P560, developing process；
Step P570, etch process：Etch process is the mode using chemistry or physics, will not covered by photoresistance on substrate
Film below the figure of lid is etched away.
Step P580, stripping technology：Finally the photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；For
The semiconducting behavior of lifting imageing sensor, lifts the indexs such as photosensitive quality and, it is necessary to carry out semiconductor mixes technique (doping
Technique).
P530 to P580 operations are repeated multiple times (usual 12 times), make all of imageing sensor back-side circuit layer in bottom surface
(photosensitive circuit, ranks read and drive circuit, adc circuit, FPC bindings bits etc.), finally touches protecting each bindings bit projection
On the premise of point, overleaf it is packaged, protection back-side circuit layer.Because the imageing sensor at back side work in the way of upside-down mounting
Make, i.e., incident ray is entered from the top surface of imageing sensor, but counts imageing sensor through substrate from substrate back,
So the CCD of traditional silicon substrate mode, the colored filter and lenticule of the top surface setting of cmos sensor need not be installed
Etc. structure.
With reference to Figure 11：After second substrate 18 completes, module set section P600 technological processes are entered into.
P600 modules segment process will encapsulate the panel for finishing and cut into actual product size, carry out polaroid patch again afterwards
Attached, control circuit such as is fitted at every technique with chip, and carries out burn-in test and product packaging.
The module set section P600 flows are comprised the following steps：
P610 cutting techniques：Packaged LED-baseplate is cut into LED display panel (panel)；Packaged image sensing
Device substrate is also cut into the sensor panel of corresponding size.
P620 panel tests：Carry out LED display panel and light inspection and aging (aging)；
P630 pastes technique partially：LED display panel is attached into upper Polarizer (circular polarisation piece)；
P640LED display panels and imageing sensor panel attachment：With the transparent adhesive material such as OCA optical cements, LED is shown
Show that panel is brought into close contact with imageing sensor panel；
P650IC binds：Power supply chip (Power IC), touch chip, display driver chip, or touch-control display are driven
Movement and motor-driven integrative chip (TDDI IC), imageing sensor driving chip etc. are tied to the respective regions of LED panel.According to typesetting
Specific arrangement, display driver chip or touch chip, touch-control display integrated chip etc. can be tied to the corresponding of substrate front side
Position, it is also possible to be tied to the relevant position (if first substrate and second substrate are connected by modes such as via VIA) at the back side.
P660FPC binds：With ACF (anisotropic conductive film), by the flexible printed circuit board FPC of pre-production, (band whether there is
Source device and connector etc.) it is tied to substrate back or positive corresponding contacts region；FPC can unify support display, touch-control,
Imageing sensor, it is also possible to be split up into different FPC.
P670 modules are tested：Carry out the burn-in test of module and light inspection, pack shipment.
Finally, these are only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all it is of the invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (10)
1. it is a kind of to support the display screen of full frame optical fingerprint sensor, including overlap the display module installed and optical finger print sensing
Device module；Characterized in that, the optical fingerprint sensor module covering display module bottom surface；
The display module includes cover-plate glass (111), and the bottom surface of the cover-plate glass (111) installs touch sensor
(112), the bottom surface of the touch sensor (112) installs polaroid (113), and the lower surface of the polaroid (113) is installed
Image element circuit (115)；
The optical fingerprint sensor module includes substrate (116), and optical image sensor is installed in the bottom surface of the substrate (116)
(122) optics pinhole difiration plate (121), is installed on the substrate (116), it is uniform on the optics pinhole difiration plate (121)
There is imaging aperture (124).
2. the display screen for supporting full frame optical fingerprint sensor according to claim 1, it is characterised in that the optics is small
Diffraction by aperture plate (121) is made up of black light-absorbing material.
3. the display screen for supporting full frame optical fingerprint sensor according to claim 1, it is characterised in that also including support
Frame (123), support frame as described above (123) is wrapped in the optical fingerprint sensor module bottom surface.
4. the display screen for supporting full frame optical fingerprint sensor according to claim 1, it is characterised in that the substrate
(116) it is single layer substrate, upper surface of the optics pinhole difiration plate (121) installed in the substrate (116).
5. the display screen for supporting full frame optical fingerprint sensor according to claim 1, it is characterised in that the substrate
(116) it is double layer substrate, the optics pinhole difiration plate (121) is between the double layer substrate.
6. a kind of preparation method of the single layer substrate display screen for supporting full frame optical fingerprint sensor, it is characterised in that including the back of the body
Face making step, top surface making step, foreboard section making step and module set section making step；
Back side making step is：
S1：Substrate (116) bottom surface plated film；
S2：Substrate (116) bottom-surface coated photoresist；
S3：Bottom surface is exposed by the way of optical illumination, by the pattern on light shield after photoresistance is transferred to plated film
On substrate (116)；
S4：The film below figure that will not covered by photoresistance on substrate (116) is etched away；
S5：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left, and carries out semiconductor doping process；
S6：Repeat step S1-S5 several times after, make substrate bottom surface all of optical image sensor back-side circuit layer；
S7：Substrate (116) back side carries out thin-film package；
Top surface making step includes：
S11：Optics optics pinhole difiration plate (121) with imaging aperture (124) is produced on substrate top surface, then in substrate
Top surface plated film；
S12：The top surface coating photoresist of substrate；
S13：Exposed in substrate top surface by the way of optical illumination, by the pattern on light shield after photoresistance is transferred to plated film
On substrate；
S14：Pattern is developed；
S15：The film below figure that will not covered by photoresistance on substrate is etched away；
S16：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
S17：Repeat step S11-S16 several times, makes the thin-film transistor circuit layers having on substrate top surface more；
Foreboard section making step includes：
S21：Thin-film transistor circuit layer cleaning, the dirt and impurity left in removal top surface making step；
S22：High-precision metal mask plate is made, and the high-precision metal mask plate is pin-pointed on metal framework；
S23：Organic material is deposited with onto substrate through high-precision metal mask plate, organic pixel layer is formed；
S24：By thin-film package, protective substrate positive thin-film transistor circuit layer and organic pixel layer；
S25：After cover plate cleaning, coated using packaging plastic；
S26：Under vacuum conditions, cover plate is carried out into encapsulation of fitting with substrate with the high-effect glass cement for blocking steam；
Module set section making step includes：
S31：Cutting：Packaged LED-baseplate is cut into panel；
S32：Panel test：Carry out panel and light inspection；
S33：Paste partially：LED panel is attached into upper Polarizer；
S34：Panel is overturn；
S35：Back side of panel binds driving chip；
S36：Back side of panel binds flexible print circuit board；
S37：Module is tested：Carry out the burn-in test of module and light inspection, complete manufacturing process.
7. the preparation method of single layer substrate display screen according to claim 6, it is characterised in that the back side making step
Cleaned before the plated film of middle substrate (116) bottom surface.
8. the preparation method of single layer substrate display screen according to claim 6, it is characterised in that the step S6 repeats to walk
The number of times of rapid S1-S5 is 12 times.
9. a kind of preparation method of the double layer substrate display screen for supporting full frame optical fingerprint sensor, including first substrate (116 ')
Making step, second substrate (118) making step and module set section making step；Characterized in that,
Second substrate (118) making step is：
S41：Second substrate (118) clean dirt；
S42：Second substrate (118) top surface makes optics pinhole difiration version (121)；
S43：Second substrate (118) bottom surface plated film；
S44：Second substrate (118) bottom-surface coated photoresist；
S45：Second substrate (118) is exposed by the way of optical illumination in substrate top surface, and the pattern on light shield is passed through into photoresistance
It is transferred on the substrate after plated film；
S46：Pattern is developed；
S47：The film below figure that will not covered by photoresistance on second substrate is etched away；
S48：Photoresistance on cover layer is washed off, the film layer of the figure with needed for is left；
S49：Repeat step S43-S48 several times, makes the back-side circuit of all of optical image sensor in second substrate bottom surface
Layer；
S50：Second substrate bottom surface thin-film package.
Module making step is：
S51：Cutting：Packaged LED-baseplate is cut into LED display panel, and packaged optical image sensor substrate is also cut
It is segmented into sensor panel；
S52：Panel test：Carry out panel and light inspection；
S53：Paste partially：LED panel is attached into upper Polarizer；
S54：Display panel and image sensing panel attachment；
S55：Back side of panel binds driving chip；
S56：Back side of panel binds flexible print circuit board；
S57：Module is tested：Carry out the burn-in test of module and light inspection, complete manufacturing process.
10. the preparation method of double layer substrate display screen according to claim 9, it is characterised in that the S49：Repeat to walk
The number of times of rapid S43-S48 is 12 times.
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