CN109753845A - Optical fingerprint sensor structure and electronic equipment - Google Patents
Optical fingerprint sensor structure and electronic equipment Download PDFInfo
- Publication number
- CN109753845A CN109753845A CN201711062886.2A CN201711062886A CN109753845A CN 109753845 A CN109753845 A CN 109753845A CN 201711062886 A CN201711062886 A CN 201711062886A CN 109753845 A CN109753845 A CN 109753845A
- Authority
- CN
- China
- Prior art keywords
- glue
- line
- fingerprint sensor
- optical fingerprint
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 123
- 239000003292 glue Substances 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 23
- 239000011521 glass Substances 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004568 cement Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000009156 water cure Methods 0.000 description 1
Landscapes
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention relates to optical sensor technology fields, more particularly to a kind of optical fingerprint sensor structure and electronic equipment, the optical fingerprint sensor structure includes optical fingerprint sensor, light-sensitive surface, the first glue-line and the second glue-line, first glue-line is set between the optical fingerprint sensor and the light-sensitive surface, the optical fingerprint sensor is Nian Jie with the light-sensitive surface by first glue-line, second glue-line is set to first glue-line periphery, and first glue-line is isolated with outside air.To which when being heating and curing, the first glue-line can be fully cured, and will not generate mark, improve the accuracy of optical fingerprint sensor, the fraction defective of optical fingerprint sensor structure is reduced, on the other hand, also improves the appearance looks elegant degree of optical fingerprint sensor structure.
Description
Technical field
The present invention relates to optical fingerprint sensor technical fields, in particular to a kind of optical fingerprint sensor structure
And electronic equipment.
Background technique
Fingerprint sensor be realize fingerprint automatic collection Primary Component, fingerprint sensor press sensing principle, i.e., fingerprint at
As principle and technology, optical fingerprint sensor, semicoductor capacitor sensor, semiconductor heat dependent sensor, semiconductor can be divided into
Pressure sensor, ultrasonic sensor and radio frequency sensor etc..The manufacturing technology of fingerprint sensor is a comprehensive strong, skill
The new and high technology of art complexity height, manufacturing process hardly possible.
Wherein, optical fingerprint sensor is mainly to utilize the refraction and principle of reflection of light, light from bottom directive prism, and
It is projected through prism, the light angle reflected on the rough strain line of finger surface fingerprint of injection and the light reflected back
Light and shade will be different.The optical device of CMOS or CCD will be collected into the pictorial information of different bright-dark degrees, with regard to completing to refer to
The acquisition of line.
Existing optical fingerprint sensor in terms of the combination of each component there are defective, for example, sensor passes through
Glue is bonded on light-sensitive surface, since the glue of bonding can be cured incomplete when being heating and curing, leads to glue
Mark can be generated after water cure, influence the bright-dark degree that sensor receives light, fingerprint collecting is caused to go wrong.
Summary of the invention
In view of this, the embodiment of the present invention is designed to provide a kind of optical fingerprint sensor structure, to improve glue
Mark can be led to the problem of after solidification.
Another object of the present invention also resides in offer a kind of electronic equipment, to improve above-mentioned problem.
The technical solution adopted by the invention is as follows:
The embodiment of the invention provides a kind of optical fingerprint sensor structure, the optical fingerprint sensor structure includes light
It learns fingerprint sensor, light-sensitive surface, the first glue-line and the second glue-line, first glue-line and is set to the optical fingerprint sensor
Between the light-sensitive surface, the optical fingerprint sensor is Nian Jie with the light-sensitive surface by first glue-line, and described second
Glue-line is set to first glue-line periphery, and first glue-line is isolated with outside air.
Further, first glue-line is that optical profile type is bonded glue.
Further, second glue-line is non-anaerobic structure glue.
Further, the optical fingerprint sensor structure further includes substrate, and the light-sensitive surface is bonded with the substrate.
Further, the substrate is glass substrate.
Further, the light-sensitive surface is bonded by OCA glue with the glass substrate.
Further, the light-sensitive surface is film membrane.
A kind of electronic equipment, the electronic equipment include electronic equipment ontology and optical fingerprint sensor structure, the light
Learning fingerprint sensor structure includes optical fingerprint sensor, light-sensitive surface, the first glue-line and the second glue-line, and first glue-line is set
It is placed between the optical fingerprint sensor and the light-sensitive surface, the optical fingerprint sensor passes through first glue-line and institute
State light-sensitive surface bonding, second glue-line is set to first glue-line periphery, by first glue-line and outside air every
From.
Further, first glue-line is that optical profile type is bonded glue.
Further, second glue-line is non-anaerobic structure glue.
Compared with the prior art, the invention has the following advantages:
A kind of optical fingerprint sensor structure provided by the invention and electronic equipment, the optical fingerprint sensor structure packet
Optical fingerprint sensor, light-sensitive surface, the first glue-line and the second glue-line are included, first glue-line is set to the optical finger print and passes
Between sensor and the light-sensitive surface, the optical fingerprint sensor is Nian Jie with the light-sensitive surface by first glue-line, described
Second glue-line is set to first glue-line periphery, and first glue-line is isolated with outside air.It is heating and curing to work as
When, the first glue-line can be fully cured, and will not generate mark, the accuracy of optical fingerprint sensor is improved, on the other hand,
Keep the appearance of optical fingerprint sensor structure more beautiful.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.Therefore, below to the reality of the invention provided in the accompanying drawings
The detailed description for applying example is not intended to limit the range of claimed invention, but is merely representative of selected implementation of the invention
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall within the protection scope of the present invention.
Fig. 1 shows the schematic diagram of a kind of electronic equipment provided by the present invention.
Fig. 2 shows the schematic diagrames of optical fingerprint sensor structure.
Fig. 3 shows the schematic diagram of the optical fingerprint sensor structure provided with the second glue-line.
Fig. 4 shows a kind of optical fingerprint sensor structure fabrication processes flow chart.
Icon: 10- electronic equipment；100- electronic equipment ontology；200- optical fingerprint sensor structure；210- optical finger print
Sensor；The first glue-line of 230-；231- excessive glue area；240- light-sensitive surface；The second glue-line of 250-；260- third glue-line；270- substrate.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be arranged and be designed with a variety of different configurations herein.Cause
This, is not intended to limit claimed invention to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
Range, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that the instruction such as term " on ", "lower", "left", "right", "inner", "outside"
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings or the invention product using when usually put
Orientation or positional relationship, be merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning
Or element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be indirect by intermediary
It is connected, can be the connection inside two elements.
In the description of the present invention, it is also necessary to explanation, herein, such as first and second or the like relationship art
Language is only used to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying this
There are any actual relationship or orders between a little entities or operation.The terms such as term "horizontal", "vertical", " pendency "
It is not offered as requiring component abswolute level or pendency, but can be slightly tilted.As "horizontal" only refers to that its direction is opposite " perpendicular
It is more horizontal for directly ", it is not to indicate that the structure is had to fully horizontally, but can be slightly tilted.Term " includes ",
"comprising" or any other variant thereof is intended to cover non-exclusive inclusion so that include a series of elements process,
Method, article or equipment not only include those elements, but also including other elements that are not explicitly listed, or are also wrapped
It includes as elements inherent to such a process, method, article, or device.In the absence of more restrictions, by sentence " including
One ... " limit element, it is not excluded that there is also another in the process, method, article or apparatus that includes the element
Outer identical element.For the ordinary skill in the art, above-mentioned term can be understood in the present invention with concrete condition
Concrete meaning.
With reference to the accompanying drawing, it elaborates to some embodiments of the present invention.In the absence of conflict, following
Feature in embodiment and embodiment can be combined with each other.
First embodiment
Referring to Fig. 1, present embodiments providing a kind of electronic equipment 10, the electronic equipment 10 includes electronic equipment ontology
100 and optical fingerprint sensor structure 200, the optical fingerprint sensor structure 200 be set to the electronic equipment ontology
100。
The electronic equipment 10 can be any equipment that can support optical fingerprint sensor structure 200, for example, described
Electronic equipment 10 can be mobile phone, tablet computer, laptop or remaining electronic equipment 10, in the present embodiment, the electricity
Sub- equipment 10 can be mobile phone, but not limited to this.
Optical fingerprint sensor structure 200 includes optical fingerprint sensor 210, the first glue-line 230, light-sensitive surface 240, second
Glue-line 250, third glue-line 260 and substrate 270.Referring to Fig. 2, Fig. 2 shows optical fingerprint sensors provided by the invention
The structural schematic diagram of structure 200.
Optical fingerprint sensor 210 is fitted on the light-sensitive surface 240 by the first glue-line 230, second glue-line 250
Apply the periphery for being set to first glue-line 230.The light-sensitive surface 240 is viscous by the third glue-line 260 and the substrate 270
It connects.
Optical fingerprint sensor 210 is the component that fingerprint collecting is carried out using the refraction and principle of reflection of light.Generally
Ground, optical fingerprint sensor 210 receive light and are radiated at the angle reflected on the rough strain line of finger surface fingerprint and anti-
The bright-dark degree for penetrating light is different, the different degrees of light information of the optical device mobile phone built in optical fingerprint sensor 210, and
It is translated into electric signal, that is, completes the acquisition of fingerprint.
The first glue-line 230 is coated on the light-sensitive surface 240, the optical fingerprint sensor 210 is placed in described first
Glue-line 230, so that the optical fingerprint sensor 210 is be bonded with the light-sensitive surface 240.
First glue-line 230 is that optical profile type is bonded glue, for example, first glue-line 230 can be high transparency heat
Solidity is bonded glue.Generally, the optical profile type fitting glue is anaerobic glue, and there is colorless and transparent, light transmission rate to exist for it
90% or more, high adhesion, high durable, water resistance, high temperature resistant, uvioresistant, cementing strength are good, can be under room temperature or medium temperature
Solidification, and have the features such as cure shrinkage is small.
Generally, the region for being coated with optical profile type fitting glue is located at the lower section of optical fingerprint sensor 210, this results in working as
The optical fingerprint sensor 210 is placed with when first glue-line 230 under the action of mechanical pressure head, the first glue-line 230
Glue can diffuse to form excessive glue area 231 under the effect of the pressure, and the optical profile type of the first glue-line 230 is bonded glue and passes from optical finger print
The lower section of sensor 210, which is spread, overflows, and since optical profile type fitting glue is anaerobic glue, the glue in excessive glue area 231 can be due to contact
Air and be not easy to solidify, solidifying not exclusively causes the fit area of light-sensitive surface 240 that can generate mark, affect optical finger print biography
The aesthetic measure of sensor structure 200 also affects the precision of the identification of optical fingerprint sensor 210.
Second glue-line 250 applies the periphery for being set to first glue-line 230, by the first glue-line 230 and outside air
Isolation.
Specifically, referring to Fig. 3, second glue-line 250 selects non-anaerobic structure glue, when the optical finger print senses
Device 210 is detested by first glue-line 230 fitting and the light-sensitive surface 240 along the periphery setting of first glue-line 230 is non-
Oxygen structure glue forms the second glue-line 250, and the anaerobic optical profile type of first glue-line 230 is bonded glue and outside air
Isolation, even if first glue-line 230 occurs excessive glue and generates excessive glue area 231, the excessive glue area 231 is still by the second glue-line
250 and air exclusion, it can be complete when the glue of first glue-line 230 and the second glue-line 250 is heating and curing
Solidification will not generate mark in fit area.
The light-sensitive surface 240 fits in the substrate 270.Specifically, the light-sensitive surface 240 is contacted with the substrate 270
One side on be coated with third glue-line 260, the light-sensitive surface 240 is placed in the substrate 270, and the light-sensitive surface 240 passes through institute
It is Nian Jie with the substrate 270 to state third glue-line 260.
In this present embodiment, the third glue-line 260 can be OCA optical cement, for example, solid-state OCA optical cement or liquid
OCA optical cement.
In this present embodiment, the light-sensitive surface 240 is film membrane, but not limited to this.
The substrate 270 can be glass substrate, plastic or metal substrate, in this present embodiment, the substrate 270
Glass substrate is selected, glass substrate has preferable light transmission rate, is more suitable a kind of for optical fingerprint sensor structure 200
Optical device.
The optical fingerprint sensor structure 200 provided in the present embodiment, by being provided with second in 230 periphery of the first glue-line
Glue-line 250, by the non-anaerobic structure glue of the second glue-line 250 by the anaerobic optical profile type of the first glue-line 230 be bonded glue with
Outside air isolation is come, so that the anaerobic optical profile type joint adhesive water energy of the first glue-line 230 is enough in the condition with air insulated
Under be fully cured, will not because solidify not exclusively due to generate mark, reduce the fraction defective of optical fingerprint sensor structure 200, mention
The high aesthetic measure of optical fingerprint sensor structure 200.
Second embodiment
Present embodiments provide a kind of optical fingerprint sensor structure fabrication processes.The technique is implemented for making first
Optical fingerprint sensor structure 200 described in example.
Referring to Fig. 4, the technique includes step S10~S40.
S10: draw glue in the appropriate area of light-sensitive surface 240 using gluing process to form the first glue-line 230.
Optical profile type fitting glue is coated in the appropriate area of light-sensitive surface 240 and forms the first glue-line 230, and the appropriate area is
What is be pre-designed is used to be bonded the region of optical fingerprint sensor 210, and generally, the optical profile type fitting glue is anaerobic
Glue, it have colorless and transparent, light transmission rate 90% or more, high adhesion, high durable, water resistance, high temperature resistant, uvioresistant,
Cementing strength is good, can solidify under room temperature or medium temperature, and have the features such as cure shrinkage is small.
Optical profile type fitting glue is coated in the light-sensitive surface 240, with installation optical fingerprint sensor 210 to be fit.
S20: optical fingerprint sensor 210 is placed in first glue-line 230.
First glue-line 230, which applies, to be set on light-sensitive surface 240, and in this present embodiment, the first glue-line 230 is anaerobic optical profile type
Be bonded glue, optical fingerprint sensor 210 is placed with it is waterborne in optical profile type joint adhesive, with realize optical fingerprint sensor 210 with
The fitting of light-sensitive surface 240.
Step S30: non-anaerobic structure glue is set to form the second glue-line 250 in the periphery of the first glue-line 230.
Specifically, it can use gluing process (but not limited to this) and non-anaerobism be set in the periphery of first glue-line 230
Property structure glue, the second glue-line 250 that the non-anaerobic structure glue is formed pastes the anaerobic optical profile type of first glue-line 230
It closes glue to be limited in the encirclement that second glue-line 250 is formed, the anaerobic optical profile type of first glue-line 230 is bonded
Glue comes with extraneous air exclusion, even if first glue-line 230 occurs excessive glue and forms excessive glue area 231, the excessive glue area
231 are still isolated with air, avoid anaerobic optical profile type fitting glue and contact with extraneous air, cause to solidify endless
Entirely.
S40: the first glue-line 230 of solidification and the second glue-line 250.
The first glue-line 230, the second glue-line 250 are placed in oven under 80 DEG C of environment temperature, it is more than hour to toast 1,
So that the anaerobic optical profile type fitting glue of first glue-line 230 and the non-anaerobic structure glue of second glue-line 250 are complete
All solidstate.
The first glue-line 230 and the second glue-line 250 after being fully cured will not generate mark, to reduce the bad of product
Rate additionally improves the aesthetic measure of optical fingerprint sensor structure 200.
In conclusion the present invention provides a kind of optical fingerprint sensor structure and electronic equipment, the electronic equipment packet
Electronic equipment ontology and optical fingerprint sensor structure are included, the optical fingerprint sensor structure setting is in the electronic equipment sheet
Body, the optical fingerprint sensor structure include optical fingerprint sensor, light-sensitive surface, the first glue-line and the second glue-line, described
First glue-line is set between the optical fingerprint sensor and the light-sensitive surface, and the optical fingerprint sensor passes through described the
One glue-line is Nian Jie with the light-sensitive surface, and second glue-line is set to first glue-line periphery, by first glue-line with
Outside air isolation, so that the anaerobic optical profile type joint adhesive water energy of the first glue-line is enough fully cured when being heating and curing, it will not
Mark is generated, the accuracy of optical fingerprint sensor is improved, reduces the fraction defective of optical fingerprint sensor structure, another party
Face also improves the aesthetic measure of optical fingerprint sensor structure.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of optical fingerprint sensor structure, which is characterized in that the optical fingerprint sensor structure includes that optical finger print passes
Sensor, light-sensitive surface, the first glue-line and the second glue-line, first glue-line are set to the optical fingerprint sensor and the sense
Between light film, the optical fingerprint sensor is Nian Jie with the light-sensitive surface by first glue-line, the second glue-line setting
In first glue-line periphery, first glue-line is isolated with outside air.
2. optical fingerprint sensor structure as described in claim 1, which is characterized in that first glue-line is optical profile type fitting
Glue.
3. optical fingerprint sensor structure as described in claim 1, which is characterized in that second glue-line is non-anaerobic knot
Structure glue.
4. optical fingerprint sensor structure as described in claim 1, which is characterized in that the optical fingerprint sensor structure is also
Including substrate, the light-sensitive surface is bonded with the substrate.
5. optical fingerprint sensor structure as claimed in claim 4, which is characterized in that the substrate is glass substrate.
6. optical fingerprint sensor structure as claimed in claim 4, which is characterized in that the light-sensitive surface passes through OCA glue and institute
State substrate fitting.
7. optical fingerprint sensor structure as described in claim 1, which is characterized in that the light-sensitive surface is film membrane.
8. a kind of electronic equipment, which is characterized in that the electronic equipment includes electronic equipment ontology and optical fingerprint sensor knot
Structure, for the optical fingerprint sensor structure setting in the electronic equipment ontology, the optical fingerprint sensor structure includes light
It learns fingerprint sensor, light-sensitive surface, the first glue-line and the second glue-line, first glue-line and is set to the optical fingerprint sensor
Between the light-sensitive surface, the optical fingerprint sensor is Nian Jie with the light-sensitive surface by first glue-line, and described second
Glue-line is set to first glue-line periphery, and first glue-line is isolated with outside air.
9. electronic equipment as claimed in claim 8, which is characterized in that first glue-line is that optical profile type is bonded glue.
10. electronic equipment as claimed in claim 8, which is characterized in that second glue-line is non-anaerobic structure glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711062886.2A CN109753845B (en) | 2017-11-02 | 2017-11-02 | Optical fingerprint sensor structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711062886.2A CN109753845B (en) | 2017-11-02 | 2017-11-02 | Optical fingerprint sensor structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109753845A true CN109753845A (en) | 2019-05-14 |
| CN109753845B CN109753845B (en) | 2024-04-26 |
Family
ID=66398685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711062886.2A Active CN109753845B (en) | 2017-11-02 | 2017-11-02 | Optical fingerprint sensor structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109753845B (en) |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007249927A (en) * | 2006-03-14 | 2007-09-27 | Dyna Image Corp | Optical fingerprint pickup device with finger contact detecting function, and its method |
| CN201083840Y (en) * | 2007-08-03 | 2008-07-09 | 宸鸿光电科技股份有限公司 | Composite stacked optical plate structure |
| CN203433492U (en) * | 2013-08-30 | 2014-02-12 | 江西合力泰科技股份有限公司 | Touch screen of G+F structure |
| CN104779257A (en) * | 2015-04-14 | 2015-07-15 | 深圳市华星光电技术有限公司 | TFT layout structure |
| CN204740599U (en) * | 2015-05-28 | 2015-11-04 | 华天科技（昆山）电子有限公司 | Slim optical profile type fingerprint identification information acquisition structure |
| CN105259737A (en) * | 2015-09-01 | 2016-01-20 | 苏州市贝特利高分子材料股份有限公司 | Transfer processing method for glass base material of cover board |
| CN205375426U (en) * | 2015-12-31 | 2016-07-06 | 东莞市平波电子有限公司 | Touch -sensitive screen with SCA is glued to be constructed |
| CN205899509U (en) * | 2016-06-07 | 2017-01-18 | 深圳市镭科电子科技有限公司 | Touch round indication screen and electronic equipment thereof |
| CN106412166A (en) * | 2016-11-23 | 2017-02-15 | 广东欧珀移动通信有限公司 | Terminal and casing assembly thereof |
| CN106407967A (en) * | 2016-12-02 | 2017-02-15 | 信利光电股份有限公司 | Fingerprint module and the applying method and application thereof |
| CN106709455A (en) * | 2016-12-23 | 2017-05-24 | 张帆 | Display screen for supporting full screen optical fingerprint sensor and manufacturing method thereof |
| CN206331451U (en) * | 2016-12-27 | 2017-07-14 | 广东欧珀移动通信有限公司 | Fingerprint identification module and terminal |
| CN106980427A (en) * | 2017-05-04 | 2017-07-25 | 广东欧珀移动通信有限公司 | Display device and electronic equipment and touch screen and display screen |
| CN106991366A (en) * | 2016-01-21 | 2017-07-28 | 上海箩箕技术有限公司 | Optical fingerprint sensor |
| CN107045407A (en) * | 2017-02-08 | 2017-08-15 | 维沃移动通信有限公司 | A kind of touch-screen and mobile terminal |
| CN207489036U (en) * | 2017-11-02 | 2018-06-12 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
-
2017
- 2017-11-02 CN CN201711062886.2A patent/CN109753845B/en active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007249927A (en) * | 2006-03-14 | 2007-09-27 | Dyna Image Corp | Optical fingerprint pickup device with finger contact detecting function, and its method |
| CN201083840Y (en) * | 2007-08-03 | 2008-07-09 | 宸鸿光电科技股份有限公司 | Composite stacked optical plate structure |
| CN203433492U (en) * | 2013-08-30 | 2014-02-12 | 江西合力泰科技股份有限公司 | Touch screen of G+F structure |
| CN104779257A (en) * | 2015-04-14 | 2015-07-15 | 深圳市华星光电技术有限公司 | TFT layout structure |
| CN204740599U (en) * | 2015-05-28 | 2015-11-04 | 华天科技（昆山）电子有限公司 | Slim optical profile type fingerprint identification information acquisition structure |
| CN105259737A (en) * | 2015-09-01 | 2016-01-20 | 苏州市贝特利高分子材料股份有限公司 | Transfer processing method for glass base material of cover board |
| CN205375426U (en) * | 2015-12-31 | 2016-07-06 | 东莞市平波电子有限公司 | Touch -sensitive screen with SCA is glued to be constructed |
| CN106991366A (en) * | 2016-01-21 | 2017-07-28 | 上海箩箕技术有限公司 | Optical fingerprint sensor |
| CN205899509U (en) * | 2016-06-07 | 2017-01-18 | 深圳市镭科电子科技有限公司 | Touch round indication screen and electronic equipment thereof |
| CN106412166A (en) * | 2016-11-23 | 2017-02-15 | 广东欧珀移动通信有限公司 | Terminal and casing assembly thereof |
| CN106407967A (en) * | 2016-12-02 | 2017-02-15 | 信利光电股份有限公司 | Fingerprint module and the applying method and application thereof |
| CN106709455A (en) * | 2016-12-23 | 2017-05-24 | 张帆 | Display screen for supporting full screen optical fingerprint sensor and manufacturing method thereof |
| CN206331451U (en) * | 2016-12-27 | 2017-07-14 | 广东欧珀移动通信有限公司 | Fingerprint identification module and terminal |
| CN107045407A (en) * | 2017-02-08 | 2017-08-15 | 维沃移动通信有限公司 | A kind of touch-screen and mobile terminal |
| CN106980427A (en) * | 2017-05-04 | 2017-07-25 | 广东欧珀移动通信有限公司 | Display device and electronic equipment and touch screen and display screen |
| CN207489036U (en) * | 2017-11-02 | 2018-06-12 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109753845B (en) | 2024-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204557433U (en) | Contactor control device | |
| US20160224178A1 (en) | Touch control device | |
| CN103699257B (en) | Touch control display device | |
| CN103365459B (en) | Frame structure and combinations thereof method | |
| CN106383549B (en) | Electronic product | |
| US20130257791A1 (en) | Capacitive touch screen and manufacturing method thereof | |
| CN204480268U (en) | Fingerprint recognition module and the touch screen based on fingerprint recognition | |
| CN105679753A (en) | Optical module, fabrication method thereof and electronic device | |
| CN105955549A (en) | Curved surface touch display module, manufacturing method thereof and electronic equipment | |
| DE602004009614D1 (en) | POLARIZATION RADIANT WITH A RESIN ADHESIVE SURFACE | |
| CN108690517A (en) | A kind of high light transmittance screen protecting film | |
| US10754460B2 (en) | Portable electronic device | |
| CN106201080A (en) | A kind of curved touch screen and manufacture method and electronic equipment | |
| CN106407967B (en) | A kind of fingerprint mould group and its applying method and application | |
| CN110423570A (en) | Tempered glass protective film suitable for ultrasonic fingerprint identification function | |
| CN204640974U (en) | Safety glass diaphragm | |
| CN104275907A (en) | Machining method for 3D ON CELL full-lamination module | |
| CN207489036U (en) | Optical fingerprint sensor structure and electronic equipment | |
| CN207571757U (en) | Optical fingerprint sensor structure and electronic equipment | |
| CN104007877A (en) | High adhesive force laminating structure for touch control display equipment | |
| CN207148866U (en) | Fingerprint recognition component and intelligent terminal | |
| CN202829924U (en) | Touch screen optic transparent glue film | |
| CN109753845A (en) | Optical fingerprint sensor structure and electronic equipment | |
| CN109254703A (en) | A kind of thickness cover board capacitive touch screen | |
| CN109634463A (en) | Touch control display apparatus and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |