CN106407967B - A kind of fingerprint mould group and its applying method and application - Google Patents
A kind of fingerprint mould group and its applying method and application Download PDFInfo
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- CN106407967B CN106407967B CN201611096160.6A CN201611096160A CN106407967B CN 106407967 B CN106407967 B CN 106407967B CN 201611096160 A CN201611096160 A CN 201611096160A CN 106407967 B CN106407967 B CN 106407967B
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- mould group
- fingerprint
- glue
- dent
- fingerprint mould
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Abstract
The invention discloses a kind of applying methods for solving fingerprint mould group appearance dent comprising following steps: providing a fingerprint sensor, surface to be fit has plastic packaging area and non-plastic packaging area；UV glue is provided, is covered in the non-plastic packaging area, UV solidification is carried out；Fitting glue is provided, is covered on the surface to be fit, fitting opposite with cover board, solidification.The invention also discloses a kind of fingerprint mould group and its applications.The applying method of this solution fingerprint mould group appearance dent makes fingerprint mould group appearance can't see any dent, very good solution mould group is bonded problem of appearance, promotes user experience, is more advantageous to the popularization of fingerprint mould group by putting adhesive curing twice.
Description
Technical field
The present invention relates to fingerprint identification technology fields, more particularly to a kind of fingerprint mould group and its applying method and answer
With.
Background technique
Currently on the market fingerprint mould group using more and more extensive.Fingerprint mould group under the prior art is many kinds of, such as: living
Body fingerprint recognition mould group, optical fingerprint identification mould group etc..But surface fingerprint sensor (IC) of these fingerprint recognition mould groups
Capsulation material is not fully consistent, such as: as shown in Figure 1, there are LED2 ' and PD3 in the 1 ' surface IC of living body finger print identification mould group '
When, 1 ' the entire surface capsulation material 11 ' of capsulation material and IC of LED2 ' and PD3 ' itself is not identical, and thermal expansion coefficient is not yet
Together, it is bonded cover board 5 ' (LENS) through liquid glue 4 ' in fingerprint mould group production process, will cause after being heating and curing on mould group surface
LED2 ' and the position PD3 ' there is obvious dent 6 ', seriously affect beauty, poor user experience.
Summary of the invention
Technical problem to be solved by the invention is to provide it is a kind of solve fingerprint mould group appearance dent applying method,
By putting adhesive curing twice, living body finger print mould group appearance is made to can't see any dent, very good solution mould group is bonded problem of appearance,
User experience is promoted, the popularization of fingerprint mould group is more advantageous to.
The present invention also provides a kind of fingerprint mould group and its applications.
The technical problems to be solved by the invention are achieved by the following technical programs:
A kind of applying method solving fingerprint mould group appearance dent comprising following steps: providing a fingerprint sensor,
Surface to be fit has plastic packaging area and non-plastic packaging area；UV glue is provided, is covered in the non-plastic packaging area, UV solidification is carried out；
Fitting glue is provided, is covered on the surface to be fit, fitting opposite with cover board, solidification.
As a kind of improvement of the applying method provided by the invention for solving fingerprint mould group appearance dent, the UV adhesive curing
Thickness≤fitting glue curing thickness 1/2.
As a kind of improvement of the applying method provided by the invention for solving fingerprint mould group appearance dent, the fitting glue
For liquid resin glue.
As a kind of improvement of the applying method provided by the invention for solving fingerprint mould group appearance dent, the fingerprint sensing
Device is living body finger print sensor and optical fingerprint sensor.
As a kind of improvement of the applying method provided by the invention for solving fingerprint mould group appearance dent, the fingerprint sensing
The non-plastic packaging area of device is respectively optical transmitting set and optical sensor, and the optical transmitting set is for emitting light into finger, the light sensing
Device is used to receive the light for handling digital reflex time and is converted into electric signal.
As a kind of improvement of the applying method provided by the invention for solving fingerprint mould group appearance dent, the optical transmitting set
With optical sensor it is symmetric about the axis arrange.
As a kind of improvement of the applying method provided by the invention for solving fingerprint mould group appearance dent, the optical transmitting set
For light emitting diode.
As a kind of improvement of the applying method provided by the invention for solving fingerprint mould group appearance dent, the optical sensor
For photodiode.
A kind of fingerprint mould group is bonded by above-mentioned applying method and is made.
A kind of application of the fingerprint mould group on door lock, safety cabinet, vehicle-mounted, intelligent mobile terminal and/or computer.
It the invention has the following beneficial effects: this fingerprint mould group applying method is produced by putting adhesive curing twice
Fingerprint mould group appearance can't see any dent, and very good solution mould group is bonded problem of appearance, promotes user experience, is more advantageous to work
The popularization of body fingerprint；Simple process, it is easy to operate, it is conducive to industrialization, there is preferable economic benefit.
Detailed description of the invention
Fig. 1 is the structural schematic diagram (section) of existing living body finger print mould group；
Fig. 2 is the flow diagram of applying method of the present invention；
Fig. 3 is the structural schematic diagram of living body finger print mould group of the present invention.
Specific embodiment
The present invention will now be described in detail with reference to examples, and the examples are only preferred embodiments of the present invention,
It is not limitation of the invention.
Liquid is needed to be bonded cover board in existing fingerprint mould group (such as living body finger print mould group, optical finger print mould group) production process
(LENS), easily there is obvious dent in the position that but after being heating and curing will cause the non-plastic packaging area on mould group surface, as shown in Figure 1,
Beauty is seriously affected, product quality is seriously reduced.
In order to solve the problems, such as above-mentioned appearance dent, the present invention provides a kind of fitting sides for solving fingerprint mould group appearance dent
Method, as shown in Fig. 2, it is the following steps are included: provide a fingerprint sensor, surface to be fit has plastic packaging area 11 and non-plastic packaging
Area 12；UV glue 4 is provided, is covered in the non-plastic packaging area 12, UV solidification is carried out；Fitting glue 5 is provided, is covered on
It on the surface to be fit, is bonded relatively with cover board 6, solidification, structure is as shown in Figure 3.Point UV glue 4 does not put joint adhesive directly
When water 5 is bonded cover board 6, because the plastic packaging area 11 of the upper surface of fingerprint mould group is different with the thermal expansion coefficient in non-plastic packaging area 12, add
After heat cure, the convergent force of 12 position of cooling procedure Zhong Fei plastic packaging area to be bonded glue 5 for the past drop-down of cover board 6, forms dent.
And the present invention is when first point UV glue 4 puts fitting glue 5 again because UV glue 4 solidify after be in g., jelly-like, UV glue 4 be bonded glue 5 and not
Compatible, after being heating and curing, UV glue 4 can offset power of the fitting glue 5 by cover board 6 toward drop-down in cooling procedure, then after being bonded not
Have dent generation.
Specifically, by taking living body finger print mould group as an example, a kind of applying method solving fingerprint mould group appearance dent comprising with
Lower step:
Step 1 provides a living body finger print sensor, has an identification chip 1, is located at 1 upper surface of identification chip
On optical transmitting set 2 and optical sensor 3, plastic packaging 1 upper surface of identification chip plastic packaging layer, the plastic packaging layer have plastic packaging
Area 11 and non-plastic packaging area 12, the non-plastic packaging area 12 are correspondingly arranged with the optical transmitting set 2 and optical sensor 3, with emit light and
Receive light.
When specific implementation, after the completion of plastic packaging, the upper surface of the living body finger print sensor is preferably in same level, benefit
In subsequent horizontal abutment technique.The i.e. described optical transmitting set 2 and optical sensor 3 are connected electrically in 1 upper surface of identification chip, so
Carry out surface plastic packaging again afterwards, the upper surface of plastic packaging layer is preferably concordant with the upper surface of the optical transmitting set 2 and optical sensor 3.Institute
Stating optical transmitting set 2 is preferably LED light, and the optical sensor 3 is preferably photodiode, but not limited to this.
Step 2 provides UV glue 4, is covered in the non-plastic packaging area 12, and UV solidification is carried out.
When specific implementation, UV glue 4 is put respectively on the surface of the optical transmitting set 2 and optical sensor 3, it is necessary to cover completely
Lid, then progress UV solidification, 40 ~ 70 DEG C of solidification temperature, light accumulated amount >=3500mj/cm2.
Step 3 provides fitting glue 5, is covered on the surface to be fit, and opposite with cover board 6 to be bonded, solidification is
It can.
It when specific implementation, by liquid resin glue spots in the upper surface of the identification chip 1, is completely covered, with 6 phase of cover board
After fitting, heat cure is carried out, solidification temperature is 100 ~ 140 DEG C, and curing time is 30 ~ 60min, is bonded 5 cured thickness of glue
It is 15 ~ 35 μm.
In order to realize preferably fitting effect, when specific implementation, the UV glue 4 must all cover in non-plastic packaging area 12,
It notes also and glue thickness is managed, be bonded cover board 6 not influence to be bonded glue 5, the cured thickness of UV glue 4 is no more than (≤) patch
Close the 1/2 of 5 cured thickness of glue.
The fingerprint mould group appearance that applying method through the invention is produced can't see any dent, very good solution mould group
It is bonded problem of appearance, user experience is promoted, is more advantageous to the popularization of fingerprint mould group；Simple process, it is easy to operate, it is conducive to industry
Change, there is preferable economic benefit.
It should be noted that the UV glue 4 is shadowless glue, also known as light-sensitive emulsion, ultraviolet cured adhesive, shadowless glue are that one kind must
Must be by the curable a kind of adhesive of ultraviolet light irradiation, it can be used as bonding agent use, also can be used as paint, applies
The sizing material of material, ink etc. uses.UV is the abbreviation of English Ultraviolet Rays, i.e. ultraviolet light.Ultraviolet light (UV) is meat
It can not see, be one section of electromagnetic radiation other than visible light, range of the wavelength in 110 ~ 400nm.The shadowless glue principle of solidification is
Photoinitiator (or photosensitizer) in UV curing materials absorbed under ultraviolet irradiation generate after ultraviolet light living radical or
Cation causes monomer polymerization, cross-linking chemistry reaction, adhesive is made to be converted into solid-state by liquid within the several seconds.Institute of the present invention
Conventional UV glue 4 and fitting glue 5 can be used in the UV glue 4 and fitting glue 5 being related to.
It is worth noting that, this can be applicable in if the capsulation material on the surface to be fit of fingerprint sensor has difference
Applying method.The fingerprint sensor of the invention is the sensor of traditional living body finger print mould group or optical finger print mould group,
Be easy to get technology known in being in those skilled in the art.Under normal circumstances, the living body finger print sensor or optical fingerprint sensor
Optical transmitting set 2 and optical sensor 3 with an identification chip 1 and on the same surface of chip；The identification chip 1 respectively with
The optical transmitting set 2 and optical sensor 3 connect, and carry out for driving the optical transmitting set 2 and receiving the electric signal of optical sensor 3
Spectral information detection, to realize spectral fingerprint identification function.The optical transmitting set 2 and optical sensor 3 are preferably symmetric about the axis
Ground arrangement, comparably to carry out multiple measurements in different positions.The present invention is not to the living body finger print sensor or light
It learns fingerprint sensor to improve, the living body finger print sensor or optical fingerprint sensor of existing structure, different fingers can be used
Its identification chip 1 of line mould group can be variant, and recognition principle is different, but fingerprint sensor and recognition principle are the prior art, In
This does not repartition detailed description.
It should be noted that monochrome or quasi-monochromatic light transmitter 2 of the optical transmitting set 2 as spectral matching factor, can be
Common light emitting diode (LED) is also possible to that any kind of optical transmitting set 2(such as laser of the measurement, band is suitble to filter
White light of device etc.), present invention preferably employs Light-emitting diode LED, the light emitted is preferably in feux rouges and close to infrared light model
It encloses, for the range, not only light can penetrate into skin well, but also generate good response from blood and make to adopt
Enough sensibility is generated with the detector that silicon manufactures.If desired multiple color is used, then uses multiple LED.Optical sensor 3 is
Received optical signal is converted into electric signal, preferably photodiode (PD).
The present invention also provides a kind of fingerprint mould groups, as shown in Figure 3 comprising fingerprint sensor, UV glue 4, fitting glue 5
With cover board 6；The fingerprint sensor includes identification chip 1,2 and of optical transmitting set on the same surface of the identification chip 1
Optical sensor 3, the optical transmitting set 2 and optical sensor 3 are connect with the identification chip 1 respectively；The UV glue 4 is respectively overlay in
On the optical transmitting set 2 and optical sensor 3；The fitting glue 5 is covered on the overall surface of the fingerprint sensor, will
The fingerprint sensor and the opposite fitting of cover board 6 are fixed.Wherein, the fitting glue 5 encases the UV glue 4.
In order to realize preferably fitting effect, when specific implementation, the UV glue 4 must be by optical transmitting set 2 and optical sensor 3
All coverings, note also and manage to glue thickness, are bonded cover board 6 not influence to be bonded glue 5, the cured thickness of UV glue 4 is not
More than the 1/2 of (≤) fitting 5 cured thickness of glue.
It is worth noting that, the fingerprint sensor be traditional living body finger print sensor or optical fingerprint sensor, in
Those skilled in the art are the known technology that is easy to get, and the fingerprint sensor, identification chip 1 and recognition principle are the prior art,
This will not be detailed here.
It should be noted that monochrome or quasi-monochromatic light transmitter 2 of the optical transmitting set 2 as spectral matching factor, can be
Common light emitting diode (LED) is also possible to that any kind of optical transmitting set 2(such as laser of the measurement, band is suitble to filter
White light of device etc.), present invention preferably employs Light-emitting diode LED, the light emitted is preferably in feux rouges and close to infrared light model
It encloses, for the range, not only light can penetrate into skin well, but also generate good response from blood and make to adopt
Enough sensibility is generated with the detector that silicon manufactures.If desired multiple color is used, then uses multiple LED.Optical sensor 3 is
Received optical signal is converted into electric signal, preferably photodiode (PD).
Compared with existing living body finger print mould group or optical finger print mould group, fingerprint mould group of the invention is solid by dispensing twice
Change, appearance can't see any dent, and very good solution mould group is bonded problem of appearance, promotes user experience, is more advantageous to living body
The popularization of fingerprint；Structure is simple, is conducive to industrialization, has preferable economic benefit.
The present invention also provides a kind of fingerprint mould groups in door lock, safety cabinet, vehicle-mounted, intelligent mobile terminal and/or electricity
Application on brain on equal electronic product.
Embodiments of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but can not
Therefore limitations on the scope of the patent of the present invention are interpreted as, as long as skill obtained in the form of equivalent substitutions or equivalent transformations
Art scheme should all be fallen within the scope and spirit of the invention.
Claims (7)
1. a kind of applying method for solving fingerprint mould group appearance dent comprising following steps: providing a fingerprint sensor, wait for
Coating surface has plastic packaging area and non-plastic packaging area；UV glue is provided, is covered in the non-plastic packaging area, UV solidification is carried out；It mentions
For being bonded glue, it is covered on the surface to be fit, fitting opposite with cover board, solidification；Wherein, the fingerprint passes
Sensor is living body finger print sensor and optical fingerprint sensor；The non-plastic packaging area of the fingerprint sensor be respectively optical transmitting set and
Optical sensor, for the optical transmitting set for emitting light into finger, the optical sensor, which is used to receive, handles the light of digital reflex time simultaneously
It is converted into electric signal；The optical transmitting set and optical sensor it is symmetric about the axis arrange.
2. the applying method according to claim 1 for solving fingerprint mould group appearance dent, which is characterized in that the UV glue is solid
Change thickness≤fitting glue curing thickness 1/2.
3. the applying method according to claim 1 or 2 for solving fingerprint mould group appearance dent, which is characterized in that the patch
Conjunction glue is liquid resin glue.
4. the applying method according to claim 1 for solving fingerprint mould group appearance dent, which is characterized in that the light emitting
Device is light emitting diode.
5. the applying method according to claim 1 for solving fingerprint mould group appearance dent, which is characterized in that the light sensing
Device is photodiode.
6. a kind of fingerprint mould group, which is characterized in that it is made by any applying method fitting of claim 1 to 5.
7. a kind of fingerprint mould group as claimed in claim 6 is on door lock, safety cabinet, vehicle-mounted, intelligent mobile terminal and/or computer
Application.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611096160.6A CN106407967B (en) | 2016-12-02 | 2016-12-02 | A kind of fingerprint mould group and its applying method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611096160.6A CN106407967B (en) | 2016-12-02 | 2016-12-02 | A kind of fingerprint mould group and its applying method and application |
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| Publication Number | Publication Date |
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| CN106407967A CN106407967A (en) | 2017-02-15 |
| CN106407967B true CN106407967B (en) | 2019-11-08 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109508617A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲生物识别技术有限公司 | The manufacturing method of optical finger print recognizer component |
| CN109753845B (en) * | 2017-11-02 | 2024-04-26 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
| CN110390233A (en) * | 2018-04-20 | 2019-10-29 | 上海箩箕技术有限公司 | Fingerprint imaging mould group and electronic equipment |
| CN109460731B (en) | 2018-11-05 | 2021-04-20 | 京东方科技集团股份有限公司 | Display device and fingerprint module attaching method |
| CN111415578A (en) * | 2020-03-05 | 2020-07-14 | 深圳全息界科技有限公司 | Display device attaching process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI394299B (en) * | 2009-11-06 | 2013-04-21 | Semileds Optoelectronics Co | Vertical light emitting diode having an outwardly relocated eletrode |
| US9385091B2 (en) * | 2013-03-08 | 2016-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reinforcement structure and method for controlling warpage of chip mounted on substrate |
| CN104182736B (en) * | 2014-08-26 | 2017-08-25 | 南昌欧菲生物识别技术有限公司 | Fingerprint Identification sensor encapsulating structure and method for packing |
| US10008659B2 (en) * | 2014-12-09 | 2018-06-26 | Lg Innotek Co., Ltd. | Fingerprint sensor |
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Effective date of registration: 20201208 Address after: 1 / F, building 23, Xinli industrial town, Industrial Avenue, Shanwei City, Guangdong Province Patentee after: Xinli photoelectric technology (Shanwei) Co., Ltd Address before: 516600, 15 industrial zone, Xinli Industrial Road, Shanwei City, Guangdong, Shanwei Patentee before: TRULY OPTO-ELECTRONICS Ltd. |
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