CN102832316B - Method and device for improving color temperature consistency of white light LED (Light Emitting Diode) lighting device - Google Patents
Method and device for improving color temperature consistency of white light LED (Light Emitting Diode) lighting device Download PDFInfo
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- CN102832316B CN102832316B CN201210277437.0A CN201210277437A CN102832316B CN 102832316 B CN102832316 B CN 102832316B CN 201210277437 A CN201210277437 A CN 201210277437A CN 102832316 B CN102832316 B CN 102832316B
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- light
- colour temperature
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- silica gel
- color temperature
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- 238000000034 method Methods 0.000 title claims abstract description 43
- 239000000843 powder Substances 0.000 claims abstract description 21
- 239000000741 silica gel Substances 0.000 claims abstract description 20
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000005507 spraying Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000000523 sample Substances 0.000 claims abstract description 6
- 238000005286 illumination Methods 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 26
- 239000007921 spray Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Led Device Packages (AREA)
Abstract
The invention discloses a method and a device for improving the color temperature consistency of a white light LED (Light Emitting Diode) lighting device. The method comprises the following steps: step 1, firstly covering a light transmitting lens on an LED chip fixed on a substrate and spraying a layer of silica gel on the light transmitting lens, wherein the thickness of the silica gel is 10-1000 micron, and the LED chip is a blue light chip; step 2, spraying and fixing a layer of yellow fluorescent powder on the silica gel; step 3, supplying power to the LED chip so that the LED chip emits light, and detecting the color temperature of the light which transmits through the transmitting lens, the silica gel and the fluorescent powder by using a probe of color temperature detecting equipment; and if a preset light wave length range or a color temperature range is achieved, stopping the fluorescent powder spraying process and carrying out a next step, or else turning back to the step 2. By adoption of the method and the device for improving the color temperature consistency of the white light LED lighting device, the color temperature of the LED lighting device can be regulated on line, and the precision is high.
Description
Technical field
The present invention relates to the conforming method and apparatus of a kind of raising White-light LED illumination device colour temperature.
Background technology
Produce to make LED and can be used for illuminating white light, traditional method is the silica gel put on blue chip containing yellow fluorescent powder, after solidification, and blue-light excited yellow fluorescent powder, colour mixture and produce white light.But the method is difficult to the definitely consistent of control point glue amount and fluorescent material amount, and can only LED point glue one by one, therefore, consistency, speed are all poor, seriously constrain the development of LED illumination.
In order to raise the efficiency, Chinese patent CN101295755A, 101521257A, 101533882A, 101101946A, 200910026812.2 propose colloid and fluorescent material to mix, then preparation large area fluorescent powder film cuts into fritter as required, and be arranged on single or multiple blue-light LED chip, produce the method for white illumination light.Said method have employed thick-film technique, method for printing screen, prepares above-mentioned fluorescent powder film.Such method, compared with traditional dispensing method, avoids the inconsistency that gluing process brings, and has the advantage of low cost, high speed.
But, due to blue-light LED chip batch with batch between wavelength not identical with colour temperature, fine distinction needs the content of meticulous adjustment fluorescent material because chip is different.Therefore, need the wavelength measuring different chip, and determine the thickness of content for fluorescent material and glued membrane accordingly.Obviously, the method of above-mentioned performed thin film, be difficult to the thickness of the fluorescent material regulated in array needed for each LED chip, the emission wavelength of LED illumination device can not be controlled by real-time online in the fabrication process, the light emission color temperature consistency in enormous quantities, high of array LED device illumination, the demand of low cost cannot be met.
For solving the problem, be necessary to propose a kind of newly, can the method for on-line control LED illumination device colour temperature and device, to meet the needs of high-performance, white-light illuminating in enormous quantities.
Summary of the invention
Technical problem to be solved by this invention is to provide the conforming method and apparatus of a kind of raising White-light LED illumination device colour temperature, the colour temperature of this raising White-light LED illumination device colour temperature conforming method and apparatus energy on-line control LED illumination device, and precision is high.
The technical solution of invention is as follows:
A kind of conforming method of raising White-light LED illumination device colour temperature, is characterized in that, comprise the following steps:
Step 1: to the LED chip be fixed on substrate, first covers transmissive mirror and in transmissive mirror, sprays the silica gel that a layer thickness is 10-1000 micron; LED chip is blue chip;
Step 2: spray on silica gel and fixing one deck yellow fluorescent powder, thickness is between 50 microns-5000 microns again;
Step 3: LED chip is powered, make it luminous, and detected by the colour temperature of probe to the light through transmissive mirror, silica gel and fluorescent material for colour temperature checkout equipment, if reach default optical wavelength scope or reference color temperature, then stop fluorescent powder jet printing process, enter next step; Otherwise return and continue step 2.
The described conforming method of raising White-light LED illumination device colour temperature also comprises step 4: be cured and mounting cover mirror layer of silica gel.
Colour temperature checkout equipment is optical fiber type colour temperature checkout equipment.
Described LED chip is single-chip LED illumination device or array-type LED illuminating device.
In step 2, employing is dusted or Electrostatic Absorption method sprays yellow fluorescent powder and fixes.
In step 2, spraying and fixed thickness are the yellow fluorescent powder of 10-100 micron each time.
Based on a device for the described conforming method of raising White-light LED illumination device colour temperature, comprise for the shower nozzle of silicone spray, for the equipment of spraying on silica gel and solidification yellow fluorescent powder, for detecting the checkout equipment of transmissive mirror emergent light colour temperature.
Because colour temperature and wavelength have relevance, therefore, also can direct-detection wavelength (namely with the detection of wavelength and judge that whether colour temperature is qualified and replace the detection of colour temperature and judge that whether colour temperature is qualified) in testing process.
Beneficial effect:
The conforming method and apparatus of raising White-light LED illumination device colour temperature of the present invention, the blue light that sends of LED chip and yellow fluorescent powder color blending effect can be detected by real-time online, and control fluorescent material coating procedure accordingly, thus control in real time wavelengths of white light that LED component sends or colour temperature, to meet the needs with the encapsulation of different wave length blue-light LED chip, improve colour temperature (or wavelength) consistency of the rear White-light LED illumination device of encapsulation.
Beneficial effect of the present invention is adopted to have:
1) first apply glue, then apply fluorescent material, fixedly securing of fluorescent material can be realized, movement or the loss of fluorescent material can not be caused in subsequent handling; Otherwise, then not there is such advantage.
2) adopt dust, the method such as Electrostatic Absorption, the thin layer with any fluorescent material thickness can be prepared easily;
3) by the closed-loop control of real-time online, for the LED blue chip of different-colour, can prepare and there is identical colour temperature, high conforming white light LED part.
4) structure with lid mirror can protect fluorescent material in use not by the impact of external environment.
Accompanying drawing explanation
Fig. 1 is schematic diagram when operating for single-chip LED illumination device;
Fig. 2 is schematic diagram when operating for array-type LED illuminating device.
Label declaration: 1-silica gel/yellow fluorescence bisque, 2-transmissive mirror, 3-support, 4-substrate, 5-LED chip, 6-gold thread, the probe of 7-Gai Jing, 8-optical fiber type colour temperature checkout equipment.
Embodiment
Below with reference to the drawings and specific embodiments, the present invention is described in further details:
Embodiment 1: improve single-chip LED illumination device colour temperature conforming fluorescent material painting method embodiment
As shown in Figure 1, suppose that the manufacturing objective of LED illumination device is: reference color temperature is K
0± Δ k.Such as: positive white light LEDs: 6250 ± 250k.(adopt the White-light LED illumination device that conventional method manufactures, its reference color temperature within the scope of 3200-7000k, and relies on follow-up sorting, by the device classification of various colour temperature, could obtain the device of particular range reference color temperature, such as: 6250 ± 250k.But such method rate of finished products is low, cost is high.Adopt method of the present invention, without sorting, can directly obtain the LED illumination device of colour temperature 6250 ± 250k.）
To the LED chip be fixed on substrate, cover transmissive mirror and in transmissive mirror silicone spray, adopt the method such as glue spraying, roller coating, spin coating, thickness is 500 microns, to ensure that the fluorescent material of follow-up spraying can cling completely; Be the fluorescent material of 50 microns to transmissive mirror coating thickness; The type of glue can change according to the difference of practical application, such as: silica gel, epoxy resin etc., to ensure that fluorescent material can be fixed in glue, ensures that LED illumination device has enough application life simultaneously.
The methods such as employing is dusted, Electrostatic Absorption, are the phosphor powder layer even application of 50 microns by thickness, are fixed on above-mentioned silica gel glue layer.
Then, to the LED chip energising be fixed on substrate; Utilize the removable probe of optical fiber type colour temperature or wavelength detecting equipment, light wave colour temperature through transmissive mirror and fluorescent material is detected, if 1. testing result is not at the setting reference color temperature of manufacturing objective, be then the fluorescent material of 10-100 micron to transmissive mirror coating thickness, after spraying, again detect the optical wavelength through transmissive mirror and fluorescent material; If the optical wavelength 2. through transmissive mirror fall into predetermined scope, then stop fluorescent powder jet printing.
Finally, solidify silica gel and (such as: by the LED illumination device with glue/fluorescent coating, put into vacuum furnace solidification; Or illumination curing is carried out to optic-solidified adhesive), the shape of mounting cover mirror lid mirror, except illustrated level crossing, also can be required other forms of lens.Complete the manufacture of LED illumination device.
Perform identical reference color temperature to all LED illumination devices to detect, to the LED blue chip of different wave length, the white light LED part with phase co-wavelength can be prepared.
The method of this closed-loop control can detect the thickness of optical wavelength and colour temperature, in real time precise controlling fluorescent material in real time, therefore, to the LED blue chip of different wave length, can prepare the white light LED part with phase co-wavelength.
Embodiment 2: improve array chip LED illumination device colour temperature conforming fluorescent material painting method embodiment
Suppose that the manufacturing objective of LED illumination device is: light wave reference color temperature is K
0± Δ k.Such as: positive white light LEDs: 6250 ± 250k.
As shown in Figure 2, to the LED array chip be fixed on substrate, first, cover transmissive mirror and in transmissive mirror even application silica gel, thickness is 500 microns, is then the fluorescent material of 50 microns to transmissive mirror even application thickness.
1. detect: after spraying, to the LED chip energising be fixed on substrate; Utilize the removable probe of optical fiber type colour temperature or wavelength detecting equipment, the light wave colour temperature of each LED chip through transmissive mirror and fluorescent material is detected, and testing result is recorded in control software design;
2. judge: according to testing result, each LED chip is judged: if fall into predetermined scope through the light wave colour temperature of transmissive mirror and fluorescent material, then it is qualified to be labeled as in control software design, otherwise is labeled as defective.
3. revise: mobile shower nozzle, to the position be labeled as corresponding to underproof LED chip, even application thickness is the fluorescent material of 50 microns;
Above-mentioned detection, judgement, correction step is re-started to being labeled as underproof LED chip.By the circulation of number wheel, all LED can be made all to be labeled as qualified.
By said method, the array be made up of different blue light wavelength LED chip can be made, send the white light of identical colour temperature, realize the White-light LED illumination device colour temperature high consistency manufacture of array chip.
After completing fluorescent powder jet printing, solidification silica gel, mounting cover mirror, completes the manufacture of LED illumination device.
Claims (3)
1. improve the conforming method of White-light LED illumination device colour temperature, it is characterized in that, comprise the following steps:
Step 1: to the LED chip be fixed on substrate, first covers transmissive mirror and in transmissive mirror, sprays the silica gel that a layer thickness is 10-1000 micron; LED chip is blue chip;
Step 2: spray on silica gel and fixing one deck yellow fluorescent powder, the gross thickness of final yellow fluorescent powder is between 50 microns-5000 microns again;
Step 3: LED chip is powered, make it luminous, and detected by the colour temperature of probe to the light through transmissive mirror, silica gel and fluorescent material for colour temperature checkout equipment, if reach default optical wavelength scope or reference color temperature, then stop fluorescent powder jet printing process, enter next step; Otherwise return and continue step 2;
Step 4: layer of silica gel is cured and mounting cover mirror;
Described LED chip is single-chip LED illumination device or array-type LED illuminating device;
In described step 2, spraying and fixed thickness are the yellow fluorescent powder of 10-100 micron each time.
2. the conforming method of raising White-light LED illumination device colour temperature according to claim 1, is characterized in that, colour temperature checkout equipment is optical fiber type colour temperature checkout equipment.
3. the conforming method of raising White-light LED illumination device colour temperature according to claim 1, is characterized in that, in step 2, employing is dusted or Electrostatic Absorption method sprays yellow fluorescent powder and fixes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210277437.0A CN102832316B (en) | 2012-08-06 | 2012-08-06 | Method and device for improving color temperature consistency of white light LED (Light Emitting Diode) lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210277437.0A CN102832316B (en) | 2012-08-06 | 2012-08-06 | Method and device for improving color temperature consistency of white light LED (Light Emitting Diode) lighting device |
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| Publication Number | Publication Date |
|---|---|
| CN102832316A CN102832316A (en) | 2012-12-19 |
| CN102832316B true CN102832316B (en) | 2015-07-15 |
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| CN201210277437.0A Expired - Fee Related CN102832316B (en) | 2012-08-06 | 2012-08-06 | Method and device for improving color temperature consistency of white light LED (Light Emitting Diode) lighting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103794706B (en) * | 2013-12-31 | 2017-01-11 | 鸿利智汇集团股份有限公司 | LED surface glue coarsening method |
| CN106299082B (en) * | 2016-08-19 | 2019-05-03 | 鸿利智汇集团股份有限公司 | A kind of LED spraying powder method |
| CN111050452B (en) * | 2019-12-06 | 2021-11-30 | 广州星迪智能光电科技有限公司 | Color temperature consistency matching method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201134438Y (en) * | 2007-07-16 | 2008-10-15 | 杭州中宙科技有限公司 | High power light-emitting diode |
| CN101452985A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for white light emitting diode device |
| CN101807654A (en) * | 2009-02-13 | 2010-08-18 | 夏普株式会社 | The manufacture method of light-emitting device and light-emitting device |
| CN102487061A (en) * | 2010-12-04 | 2012-06-06 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode packaging structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3546650B2 (en) * | 1997-07-28 | 2004-07-28 | 日亜化学工業株式会社 | Method of forming light emitting diode |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201134438Y (en) * | 2007-07-16 | 2008-10-15 | 杭州中宙科技有限公司 | High power light-emitting diode |
| CN101452985A (en) * | 2008-12-31 | 2009-06-10 | 广东昭信光电科技有限公司 | Encapsulation structure and method for white light emitting diode device |
| CN101807654A (en) * | 2009-02-13 | 2010-08-18 | 夏普株式会社 | The manufacture method of light-emitting device and light-emitting device |
| CN102487061A (en) * | 2010-12-04 | 2012-06-06 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode packaging structure |
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| CN102832316A (en) | 2012-12-19 |
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Granted publication date: 20150715 |