CN107004119A - Fingerprint recognition system and forming method thereof - Google Patents
Fingerprint recognition system and forming method thereof Download PDFInfo
- Publication number
- CN107004119A CN107004119A CN201580007290.5A CN201580007290A CN107004119A CN 107004119 A CN107004119 A CN 107004119A CN 201580007290 A CN201580007290 A CN 201580007290A CN 107004119 A CN107004119 A CN 107004119A
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- plate
- glass cover
- blind hole
- mucigel
- sensor layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention provides a kind of fingerprint recognition system and forming method thereof.Methods described includes：Glass cover-plate (100) is provided, the glass cover-plate (100) includes first surface (100a) and the second surface (100b) relative with the first surface (100a)；Blind hole (110) is formed on the first surface (100a) of the glass cover-plate (100)；The first mucigel (410) is formed on the first surface (100a) or second surface (100b) of the glass cover-plate (100), the position of first mucigel (410) is corresponding with the position of the blind hole (110)；Fingerprint identification module (300) is provided；And be combined together the fingerprint identification module (300) by first mucigel (410) with the glass cover-plate (100).The accuracy of the fingerprint recognition system of methods described formation is high.
Description
Technology neighborhood
The present invention relates to photoelectric field, more particularly to a kind of fingerprint recognition system and the side for forming the fingerprint recognition system
Method.
Background technology
Fingerprint in a narrow sense refers to the marking that the friction ridge (friction ridges) of finger leaves.Mankind's fingerprint has
Have it is fine, unique and be difficult to change it is specific, and because fingerprint can be consequently adapted to as the mankind along with everyone all one's life
The long term identification of individual.Therefore, fingerprint can be used as identification personal identification by police or other offices.
Fingerprint recognition is to compare two parts of processes from finger or toe skin friction ridge marking sample, so that really
Whether these fixed samples may be from same individual.The fingerprint identification process can automatically be held by fingerprint recognition system
OK.In optical fingerprint identification system, finger surface is irradiated using light source.From finger reflect light through glass cover-plate to
Up to photodiode array, the photodiode array is used for the visual image for capturing fingerprint.
But, the sensitivity of existing fingerprint recognition system is relatively low.
The content of the invention
The embodiments of the invention provide a kind of forming method of fingerprint recognition system, methods described includes：Glass cover is provided
Plate, the glass cover-plate includes first surface and the second surface relative with the first surface；The of the glass cover-plate
Blind hole is formed on one surface；The first mucigel, described are formed on the first surface or second surface of the glass cover-plate
The position of one mucigel is corresponding with the position of the blind hole；Fingerprint identification module is provided；And by the fingerprint identification module with
The glass cover-plate is combined together by first mucigel.
In certain embodiments, part of the glass cover-plate under the blind hole is than the portion around the blind hole
Divide thinner.
In certain embodiments, the glass cover-plate is located at the thickness of the part under the blind hole between 0.1mm to 0.8mm
Between.
In certain embodiments, the blind hole is circular, square or track type.
In certain embodiments, the angle between the side wall and basal surface of the blind hole is more than or equal to 90 degree.
In certain embodiments, chamfering is carried out to the side wall of the blind hole and the coupling part of basal surface using chamfer angle technique
Processing.
In certain embodiments, include in the first surface formation blind hole of the glass cover-plate：Lapping device is provided, it is described
Lapping device includes grinding head；And the first surface formation blind hole of the grinding glass cover-plate.
In certain embodiments, the rotary speed of the lapping device is between 30000 to 50000 rev/min.
In certain embodiments, include in the first surface formation blind hole of the glass cover-plate：In the glass cover-plate
First surface and second surface form the first anti-etching film and the second anti-etching film respectively, wherein described first is anti-etching thin
Film has the opening for exposing the part first surface；The etching glass cover-plate exposed that is open forms the blind hole.
In certain embodiments, the glass cover-plate is etched using hydrofluoric acid solution.
In certain embodiments, the fingerprint identification module includes：Protective layer, the protective layer passes through first viscose
Layer is combined with the glass cover-plate；Sensor layer under the protective layer, the sensor layer is suitable to obtain fingerprint signal,
And combined with the protective layer by the second mucigel；Light guide plate under the sensor layer, the light guide plate with it is described
Sensor layer is combined by the 3rd mucigel；The light source of described light guide plate one end is arranged at, the light guide plate is suitable to the light
The light that source is launched is guided to the sensor layer；And the IC chip being electrically connected with the sensor layer, the IC cores
Piece is suitable to handle the fingerprint signal that the sensor layer is got.
In certain embodiments, the fingerprint identification module includes：Protective layer, the protective layer passes through first viscose
Layer is combined with the glass cover-plate；Sensor layer under the protective layer, the sensor layer is suitable to obtain fingerprint signal,
And combined with the protective layer by the second mucigel；It is arranged at the light source of described sensor layer one end；And with the sensing
The IC chip that device layer is electrically connected, the IC chip is suitable to handle the fingerprint signal that the sensor layer is got.
In certain embodiments, first mucigel is formed on the basal surface of the blind hole, the fingerprint recognition mould
A part for block is arranged in the blind hole.
In certain embodiments, form fluted on the second surface of the glass cover-plate, the position of the groove with
The position correspondence of the blind hole.
In certain embodiments, first mucigel includes shadowless glue.
In certain embodiments, methods described also includes：The fingerprint identification module is encapsulated into shell mechanism.
Accordingly, the embodiment of the present invention additionally provides a kind of fingerprint recognition system, and the fingerprint recognition system is using above
The method of description is formed.
Brief description of the drawings
With reference to accompanying drawing, above and other feature of the invention will become more abundant from the following description and the appended claims book
Substantially.It should be understood that these accompanying drawings are described according only to some embodiments of the present invention, and therefore it is not construed as to the present invention
The limitation of scope, the present invention will by using accompanying drawing come more clearly and be more fully described.
Fig. 1-14 schematically shows the intermediate structure in the forming method of the fingerprint recognition system of the embodiment of the present invention
Schematic diagram；
Figure 15 schematically shows the structural representation of the mobile phone of the fingerprint recognition system with the embodiment of the present invention
Figure.
Embodiment
In the following detailed description, refer to the attached drawing, the part that the accompanying drawing formation is described in detail.In the accompanying drawings, it is similar
Symbol generally identifies like, unless context dictates otherwise.Showing described in detailed description, drawings and claims
Example property embodiment is not intended to limit.In the case where not departing from the spirit or scope for the theme that the present invention is presented, it can make
With other embodiments and other changes can be made.It will be readily understood that, as described by the present invention substantially and in each figure
Shown each aspect of the present invention can be arranged, replaced, combined and designed with a variety of different configurations, all these differences
Configuration all clearly covered and as the present invention a part.
The embodiments of the invention provide a kind of forming method of fingerprint recognition system.Methods described can reduce fingerprint recognition
The thickness of glass cover-plate in system on touch area, so as to improve the sensitivity of fingerprint recognition system.Below to described
The step of method, is described in detail.
First, with reference to Fig. 1 there is provided glass cover-plate 100, wherein, the glass cover-plate 100 include first surface 100a and with
Second surface 100b relative the first surface 100a.
In certain embodiments, the thickness of the glass cover-plate 100 is between 0.15mm to 0.9mm.In some implementations
In example, the glass cover-plate 100 can be used as the touch-screen of mobile phone, computer or finger print authentication mechanism.
Then, with reference to Fig. 2, blind hole 110 is formed on the first surface 100a of the glass cover-plate 100.
In certain embodiments, the blind hole 110 can be formed by mechanical processing technique.Below in conjunction with 2-4 pairs of accompanying drawing
The mechanical processing technique is described.
There is provided lapping device 200 as shown in Figure 2.The lapping device 200 has grinding head 210.By the grinding head
210 are put on the first surface 100a of the glass cover-plate 100, and the grinding head 210 is rotated to the glass cover-plate 100
First surface 100a is ground, so as to form the blind hole 110.After the blind hole 110 is formed, the blind hole 110
Side wall is vertical with the first surface 100a of the glass cover-plate 100.In certain embodiments, the rotation speed of the grinding head 210
Spend for 30000 to 50000 rev/min (rpm).It should be noted that the rotary speed of the grinding head 210 is implemented different
Can be different in mode, the invention is not limited in this regard.For example, the rotary speed of the grinding head 210 be likely to be dependent on it is described
The material of glass cover-plate 100.
In certain embodiments, as shown in figure 3, the grinding head 210 may have protuberance 211.If use this grind
Bistrique 210 forms the blind hole 110, between the side wall of the blind hole 110 and the first surface 100a of the glass cover-plate 100
Coupling part 115 have arcuate structure.The arcuate structure can reduce the internal stress of the glass cover-plate 100.
It should be noted that the size of the grinding head 210 can be determined based on the size of the blind hole 110.For example,
As shown in figure 4, the size of the grinding head 210 is identical with the size of the blind hole (not indicating).
In certain embodiments, the blind hole 110 can be formed using etching technics.Below in conjunction with the accompanying drawings 5 and 6 pairs of accompanying drawing
The etching technics is described.
With reference to Fig. 5, the first anti-etching film 130a is formed on the first surface 100a of the glass cover-plate 100, and
The second anti-etching film 130b is formed on the second surface 100b of the glass cover-plate 100.The first anti-etching film
130a has the opening 131 for exposing the part first surface 100a.
In certain embodiments, the described first anti-etching film 130a and second anti-etching film 130b is acidproof thin
Film.For example, the first anti-etching film 130a and the second anti-etching film 130b can be poly terephthalic acid second two
Alcohol ester (PET) film.Then, the opening 131 is formed in the acid-resistant disintegration using mechanical cutting processes.In ensuing step
In rapid, the blind hole 110 will be formed on the part that the opening 131 exposes.
In other embodiments, the described first anti-etching film 130a and second anti-etching film 130b is photosensitive thin
Film.The photo-conductive film can be high-molecular compound, for example, polyimides, epoxy resin, benzocyclobutene etc..The light
Opening 131 in sensitive film can be formed by photoetching process.
With reference to Fig. 6, by using the photo-conductive film with the opening 131 as mask, the glass cover-plate 100 is entered
Row etching forms the blind hole 110.In certain embodiments, the blind hole 110 can be formed using wet-etching technology.Example
Such as, the glass cover-plate 100 with the described first anti-etching anti-etching film 130b of film 130a and second can be immersed into HF molten
In liquid.In other embodiments, the blind hole 110 can also be formed by dry etch process.
Formed on the first surface 100a of the glass cover-plate 100 after blind hole 110, the position of the glass cover-plate 100
Part under the blind hole 110 is thinner than the part around the blind hole 110.In certain embodiments, the glass cover
The thickness of the part being located under the blind hole 110 of plate 100 is 0.1mm to 0.8mm.For example, the glass cover-plate 100 is located at
The thickness of part under the blind hole 110 is 0.2mm, 0.26mm, or 0.3mm.In certain embodiments, the blind hole
110 can be circular, square or track type in a top view.
It should be noted that the blind hole 110 on the first surface 100a of the glass cover-plate 100 can have it is a variety of
Different shape.In certain embodiments, the angle between the side wall and basal surface of the blind hole 110 is 90 degree.In some implementations
In example, chamfering can be carried out to the side wall of the blind hole 110 and the coupling part of basal surface using chamfer angle technique, so as to incite somebody to action
The smooth corners of the blind hole 110.For example, as shown in Fig. 7 (a), the connection between the side wall and basal surface of the blind hole 110
Part has arcuate structure, or, such as shown in Fig. 7 (b), the coupling part tool between the side wall and basal surface of the blind hole 110
There is ramp structure.In certain embodiments, the angle between the side wall and basal surface of the blind hole 110 is more than 90 degree.For example, figure
Shown in 7 (c), the side wall of the blind hole 110 is inclined-plane, and the coupling part between the side wall and basal surface has arcuate structure.
Due to turning being smoothed, therefore at mechanical processing technique before this or quarter of the blind hole 110 described in said structure
The defect formed in etching technique or pollution can be removed, and the internal stress of the glass cover-plate 100 can also be subtracted
It is small.Therefore, the structural strength of the blind hole 110 is improved.
Then, formed on the first surface 100a of the glass cover-plate 100 after blind hole 110, in the glass cover-plate
Form the first mucigel on 100 first surface 100a or second surface 100b, wherein, the position of first mucigel with
The position correspondence of the blind hole 110.
In certain embodiments, with reference to Fig. 8, first mucigel 410 is formed at the first table of the glass cover-plate 100
On the 100a of face.Specifically, first mucigel 410 is formed on the basal surface of the blind hole 110.
In certain embodiments, with reference to Fig. 9, first mucigel 410 is formed at the second table of the glass cover-plate 100
On the 100b of face.The position of first mucigel 410 is corresponding with the position of the blind hole 110.
First mucigel 410 can include shadowless glue (UV glue), optical adhesive tape, two-sided tape or other optics
Glue.In certain embodiments, the refractive index of first mucigel 410 it is equal with the refractive index of the glass cover-plate 100 or
It is close.
Then there is provided fingerprint identification module.Figure 10 shows the structural representation of a fingerprint identification module 300.As schemed
Shown in 10, the fingerprint identification module 300 includes protective layer 310, sensor layer 320, light guide plate 330, light source 340 and IC chip
350。
The protective layer 310 can be combined with the glass cover-plate 100 in subsequent step.In certain embodiments, institute
It can be fibre optic plate (fibre-optic plate) to state protective layer 310.The fibre optic plate has high transmission rate, low interstage coupling
The advantages of loss.In other embodiments, the protective layer 310 can be glassy layer, sapphire layer or clarity plastic layer.
The sensor layer 320 is configured to be located under the protective layer 310, and passes through second with the protective layer 310
Mucigel 420 is combined.The sensor layer 320 is suitable to obtain fingerprint signal.Specifically, the sensor layer 320 includes multiple
Photodiode.The multiple photodiode can receive the optical signalling through the protective layer 310, and by the optics
Signal is converted into electrical signal.
The light guide plate 330 is set under the sensor layer 320, and by the 3rd mucigel 430 with it is described
Sensor layer is combined.The light source 340 is set positioned at one end of the light guide plate 330.The light guide plate 330 is suitable to will be from institute
The light for stating the transmitting of light source 340 is guided to the sensor layer 320.In the present embodiment, the light source 340 is light emitting diode
(LED)。
The IC chip 350 is electrically connected with the sensor layer 320, therefore, and the IC chip 350 can be obtained and located
Manage the fingerprint signal transmitted from the sensor layer 320.In the present embodiment, the IC chip 350 is set passes positioned at described
On sensor layer 320.
In the present embodiment, the fingerprint identification module 300 also includes flexible PCB (FPC) 360.The flexible PCB
360 are set under the light guide plate 330, and are combined by the 4th mucigel 440 with the light guide plate 330.It is described
Flexible PCB 360 is electrically connected with the sensor layer 320 and/or the IC chip 350.It should be pointed out that described
Two mucigels 420, the 3rd mucigel 430 and the 4th mucigel 440 can be identical with first mucigel 410,
Or can also be different from first mucigel 410.
The operation principle of the fingerprint identification module 300 is shown by Figure 11.For simplicity, the IC chip 350
Omitted in fig. 11 with the flexible PCB 360.With reference to Figure 11, in the course of the work, launch from the light source 340
Light enter the light guide plate 330.The light guide plate 330 can be converted to the incident ray area source, and guide institute
Incident ray is stated towards the sensor layer 320.The incident ray penetrates the sensor layer 320 and the protective layer 310,
And irradiate finger 380.Because the friction ridge (friction ridges) of finger 380 has different height, from the finger
The light of 380 reflections may have different intensity.These reflection lights can be by the pole of photoelectricity two in the sensor layer 320
Pipe is detected.Therefore, the fingerprint signal of the finger 380 can just be obtained by the sensor layer 320.
In other embodiments, the fingerprint identification module can also have other different structures.As shown in figure 12, institute
Stating fingerprint identification module 300 includes protective layer 310, sensor layer 320, light source 340, IC chip 350 and flexible circuit board layer
360.In subsequent step, the protective layer 310 can be combined with the glass cover-plate 100.The sensor layer 320 is set
Combined under the protective layer 310, and by the second mucigel 420 with the protective layer 310.The light source 340 is set
It is placed in one end of the sensor layer 320.The flexible PCB 360 is arranged under the sensor layer 320, and is passed through
3rd mucigel 430 is combined with the sensor layer 320.The IC chip 350 is arranged on the sensor layer 320,
And be electrically connected with the sensor layer 320.The IC chip 350 is suitable to handle the fingerprint that the sensor layer 320 is got
Signal.The distinctive points of the fingerprint identification module shown in fingerprint identification module and Figure 10 shown in Figure 12 are, in Figure 12
Sensor layer 320, which has, guides the light that light source 340 is launched to the function of sensor layer.Fingerprint recognition mould shown in Figure 12
The operation principle of block is similar to the operation principle of the fingerprint identification module shown in Figure 10, and here is omitted.
Then, the fingerprint identification module is bound to by the glass cover-plate by the first mucigel.
In certain embodiments, as shown in figure 8, first mucigel 410 is formed at the first of the glass cover-plate 100
On the 100a of surface, the fingerprint identification module 300 is also arranged on the first surface 100a of the glass cover-plate 100.Specifically
Ground, first mucigel 410 is formed on the basal surface of the blind hole 410, and a part for the fingerprint identification module 300
It is arranged within the blind hole 410.In certain embodiments, as shown in figure 9, first mucigel 410 be formed at it is described
On the second surface 100b of glass cover-plate 100, and the fingerprint identification module 300 is also arranged at the glass cover-plate 100
Second surface 100b on.
In the embodiment of the present invention, first mucigel 410 is used for reference to the glass cover-plate 100 and the fingerprint recognition
Module 300.Because first mucigel 410 has the protection with the glass cover-plate 100 and the fingerprint identification module 300
Layer identical refractive index, it is possible to reduce the interface between the glass cover-plate 100 and the fingerprint identification module 300 occurs
The light of scattering.Therefore, the precision of the fingerprint recognition system is improved.
Further, in embodiments of the present invention, part of the glass cover-plate 100 under the blind hole 110 is than other
Part is thinner.The thickness of glass between touch area and fingerprint identification module 300 is reduced such that in the glass cover
Scattering light in plate 100 is reduced.Therefore, the precision of the fingerprint recognition system is further improved.
In certain embodiments, if first mucigel 410 is formed at the first surface of the glass cover-plate 100
On 100a, and the fingerprint identification module 300 is also disposed on the first surface 100a of the glass cover-plate 100, Ke Yi
Groove, and the position of the groove and the position phase of the blind hole are formed on the second surface 100b of the glass cover-plate 100
Correspondence.
In one embodiment, as shown in figure 13, groove is formed on the second surface 100b of the glass cover-plate 100
120, the groove 120 has arcuate shape.In another embodiment, as shown in figure 14, the groove 120 can also have
Rectangular shape.The groove 120 can further reduce the glass between the touch area and the fingerprint identification module 300
Thickness.Therefore, the precision of the fingerprint recognition system can be further enhanced.
In certain embodiments, the groove 120 can be formed by grinding technics or etching technics.The manufacture work
Skill has been described in the step of being previously formed the blind hole, therefore repeats no more here.In certain embodiments, it is described blind
Hole 110 and the groove 120 are of different sizes, and are not mutually aligned, so as to increase the knot of the glass cover-plate
Structure intensity.
Finally, the fingerprint identification module can be encapsulated in shell mechanism.
As shown in Fig. 8, Fig. 9, Figure 13 or Figure 14, the shell mechanism includes middle shell structure 510 and back shell structure
520.In certain embodiments, the fingerprint identification module 300 can be encapsulated in the middle shell structure 510, and with print
Printed circuit board (PCB) 530 is electrically connected.Then, the printed circuit board (PCB) 530 and institute are covered using the back shell structure 520
State fingerprint identification module 300.
Accordingly, present invention also offers a kind of fingerprint recognition system.The fingerprint recognition system is using above-described
Method is formed.The fingerprint recognition system of the present invention can apply in mobile phone, computer or finger print authentication mechanism.
With reference to Figure 15, fingerprint recognition system 20 of the invention is applied to mobile phone 10.For example, the fingerprint recognition system
20 can be used to recognize the distinctive fingerprint of user to unlock the mobile phone 10.The edge of fingerprint recognition system 20 in Figure 15
The profile in A-A1 directions is as shown in Fig. 8, Fig. 9, Figure 13 or Figure 14.
The many aspects and embodiment of the present invention have been disclosed, so that other side and embodiment are to art technology
It will be apparent for personnel.Various aspects and embodiment disclosed by the invention are in order at illustration purpose, and unexpectedly
Figure is restricted, and its real scope and spirit is indicated by claims below.
Claims (17)
1. a kind of method for forming fingerprint recognition system, it is characterised in that including：
Glass cover-plate is provided, the glass cover-plate includes first surface and the second surface relative with the first surface；
Blind hole is formed on the first surface of the glass cover-plate；
The first mucigel, the position of first mucigel are formed on the first surface or second surface of the glass cover-plate
Position with the blind hole is corresponding；
Fingerprint identification module is provided；And
The fingerprint identification module is combined together with the glass cover-plate by first mucigel.
2. the method as described in claim 1, it is characterised in that the part that the glass cover-plate is located under the blind hole, which is compared, to be located at
Part around the blind hole is thinner.
3. method as claimed in claim 2, it is characterised in that the glass cover-plate is located at the thickness of the part under the blind hole
Between 0.1mm between 0.8mm.
4. the method as described in claim 1, it is characterised in that the blind hole is circular, square or track type.
5. the method as described in claim 1, it is characterised in that the angle between the side wall and basal surface of the blind hole be more than or
Equal to 90 degree.
6. the method as described in claim 1, it is characterised in that using chamfer angle technique to the side wall of the blind hole and basal surface
Coupling part carries out chamfered.
7. the method as described in claim 1, it is characterised in that include in the first surface formation blind hole of the glass cover-plate：
Lapping device is provided, the lapping device includes grinding head；And
Grind the first surface formation blind hole of the glass cover-plate.
8. method as claimed in claim 7, it is characterised in that the rotary speed of the lapping device is between 30000 to 50000
Rev/min.
9. the method as described in claim 1, it is characterised in that include in the first surface formation blind hole of the glass cover-plate：
The first anti-etching film and the second anti-etching film are formed respectively in the first surface and second surface of the glass cover-plate,
Wherein described first anti-etching film has the opening for exposing the part first surface；
The etching glass cover-plate exposed that is open forms the blind hole.
10. method as claimed in claim 9, it is characterised in that the glass cover-plate is etched using hydrofluoric acid solution.
11. the method as described in claim 1, it is characterised in that the fingerprint identification module includes：
Protective layer, the protective layer is combined by first mucigel with the glass cover-plate；
Sensor layer under the protective layer, the sensor layer is suitable to obtain fingerprint signal, and logical with the protective layer
Cross the combination of the second mucigel；
Light guide plate under the sensor layer, the light guide plate is combined with the sensor layer by the 3rd mucigel；
The light source of described light guide plate one end is arranged at, the light guide plate is suitable to guide the light that the light source is launched to described
Sensor layer；And
The IC chip being electrically connected with the sensor layer, the IC chip is suitable to handle the fingerprint that the sensor layer is got
Signal.
12. the method as described in claim 1, it is characterised in that the fingerprint identification module includes：
Protective layer, the protective layer is combined by first mucigel with the glass cover-plate；
Sensor layer under the protective layer, the sensor layer is suitable to obtain fingerprint signal, and logical with the protective layer
Cross the combination of the second mucigel；
It is arranged at the light source of described sensor layer one end；And
The IC chip being electrically connected with the sensor layer, the IC chip is suitable to handle the fingerprint that the sensor layer is got
Signal.
13. the method as described in claim 1, it is characterised in that first mucigel is formed at the basal surface of the blind hole
On, a part for the fingerprint identification module is arranged in the blind hole.
14. method as claimed in claim 13, it is characterised in that be formed with the second surface of the glass cover-plate recessed
Groove, the position of the groove is corresponding with the position of the blind hole.
15. the method as described in claim 1, it is characterised in that first mucigel includes shadowless glue.
16. the method as described in claim 1, it is characterised in that also include：The fingerprint identification module is encapsulated into shell knot
In structure.
17. a kind of fingerprint recognition system, it is characterised in that the fingerprint recognition system is using any one of claim 1-16
Described method is formed.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/086342 WO2017024436A1 (en) | 2015-08-07 | 2015-08-07 | Fingerprint system and method for forming the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107004119A true CN107004119A (en) | 2017-08-01 |
Family
ID=57982943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580007290.5A Pending CN107004119A (en) | 2015-08-07 | 2015-08-07 | Fingerprint recognition system and forming method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107004119A (en) |
| WO (1) | WO2017024436A1 (en) |
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| CN108615004A (en) * | 2018-04-20 | 2018-10-02 | Oppo广东移动通信有限公司 | Fingerprint recognition component, display device and electronic device |
| CN109062325A (en) * | 2018-06-25 | 2018-12-21 | 宇龙计算机通信科技(深圳)有限公司 | Postposition fingerprint recognition component and electronic device |
| CN109460692A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor, terminal device and optical fingerprint sensor processing technology |
| CN110225169A (en) * | 2019-07-23 | 2019-09-10 | Oppo广东移动通信有限公司 | Shell and terminal device |
| CN110366730A (en) * | 2018-02-09 | 2019-10-22 | 深圳市为通博科技有限责任公司 | Optical path modulation device and preparation method thereof, fingerprint identification device and terminal device |
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| CN107800826A (en) * | 2017-10-31 | 2018-03-13 | 信利光电股份有限公司 | A kind of touch panel unit, electronic equipment and assembly method |
| CN112165767B (en) * | 2020-10-27 | 2021-12-07 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board and mobile communication device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109460692A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor, terminal device and optical fingerprint sensor processing technology |
| CN109460692B (en) * | 2017-09-06 | 2024-04-02 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor, terminal equipment and optical fingerprint sensor processing technology |
| CN110366730A (en) * | 2018-02-09 | 2019-10-22 | 深圳市为通博科技有限责任公司 | Optical path modulation device and preparation method thereof, fingerprint identification device and terminal device |
| CN108615004A (en) * | 2018-04-20 | 2018-10-02 | Oppo广东移动通信有限公司 | Fingerprint recognition component, display device and electronic device |
| CN109062325A (en) * | 2018-06-25 | 2018-12-21 | 宇龙计算机通信科技(深圳)有限公司 | Postposition fingerprint recognition component and electronic device |
| CN110225169A (en) * | 2019-07-23 | 2019-09-10 | Oppo广东移动通信有限公司 | Shell and terminal device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017024436A1 (en) | 2017-02-16 |
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