CN110366730A

CN110366730A - Optical path modulation device and preparation method thereof, fingerprint identification device and terminal device

Info

Publication number: CN110366730A
Application number: CN201880000145.8A
Authority: CN
Inventors: 王红超; 沈健
Original assignee: Shenzhen Weitongbo Technology Co Ltd
Current assignee: Shenzhen Weitongbo Technology Co Ltd
Priority date: 2018-02-09
Filing date: 2018-02-09
Publication date: 2019-10-22
Also published as: WO2019153219A1

Abstract

A kind of optical path modulation device (300) and preparation method thereof, fingerprint identification device and terminal device, the optical path modulation device (300) include substrate, through the through-hole array that forms of multiple through-holes of the substrate and positioned at the sealing film of the substrate upper surface.Wherein, which seal the through-hole array in the upper surface of the substrate, which is used to carry out face paste conjunction with display screen (120).Since the upper surface of optical path modulation device (300) has sealing film, so that the through-hole array in optical path modulation device (300) is sealed in the upper surface of the optical path modulation device (300), to during being bonded with display screen (120), it can be realized face paste conjunction between the sealing film and display screen (120), avoid the through-hole that glue during being bonded enters optical path modulation device (300), and it ensure that the accuracy of the relative position of optical path modulation device (300) and display screen (120), while improving fitting intensity.

Description

Optical path modulation device and preparation method thereof, fingerprint identification device and terminal device

Technical field

This application involves technical field of biometric identification, more particularly, to a kind of optical path modulation device and preparation method thereof, fingerprint identification device and terminal device.

Background technique

With the extensive use shielded with large-size screen monitors accounting comprehensively, mobile terminal is more and more to the design requirement for shielding lower fingerprint recognition；Conventional condenser fingerprint identification technology faces the limitation of penetration capacity, it is difficult to the fingerprint recognition system under screen is applied, and optical fingerprint identification technology can preferably breach the limitation of display screen and thickness of glass, therefore with good application prospect.

Optical fingerprint identification system generallys use optical path modulator (back abbreviation optical path modulation device) and guides to the light transmitted downwards, it realizes and the reflected light that finger reflects is directed to optical detection unit, to which optical detection unit arrives fingerprint image using finger lines is available to the reflection differences of light, and verified according to the matching to fingerprint feature point, fingerprint recognition is realized on terminal device such as mobile phone.However, optical path modulation device is when carrying out note conjunction with display screen, glue is easily accessible in the through-hole in optical path modulation device, and not can guarantee the relative position between optical path modulation device and display screen during being bonded, and it is also weaker to be bonded intensity.

Summary of the invention

The embodiment of the present application provides a kind of optical path modulation device and preparation method thereof, fingerprint identification device and terminal device, it can be realized progress face paste conjunction between optical path modulation device and display screen, to avoid glue during fitting from entering in the through-hole of optical path modulation device, guarantee the accuracy of the relative position of optical path modulation device and display screen, while improving fitting intensity.

In a first aspect, provide a kind of optical path modulation device, the optical path modulation device includes: substrate, through the through-hole array that forms of multiple through-holes of the substrate and positioned at the sealing film of the substrate upper surface.Wherein, the sealing film seals the through-hole array in the upper surface of the substrate, and the sealing film is used to carry out face paste conjunction with display screen.

Therefore, the upper surface of the optical path modulation device of the embodiment of the present application is due to sealing film, so that the through-hole array in optical path modulation device is sealed in the upper surface of the optical path modulation device, to can be realized face paste conjunction between the sealing film and display screen during being bonded with display screen.

The mode being bonded due to the mode of using face fitting instead of original frame, therefore during optical path modulation device is bonded with display screen, it can be avoided the through-hole that glue caused by original frame fitting in the process enters optical path modulation device, and guarantee the accuracy of the relative position of optical path modulation device and display screen, at the same avoid frame fitting during optical path modulation device upper surface and display screen between gap that may be present.And, it is improved in such a way that the sealing film carries out face paste conjunction with display screen and is bonded intensity, or the connection between thinner glue-line realization optical path modulation device and display screen is able to use under conditions of guaranteeing identical fitting intensity, to obtain thinner optical path modulation device.

Optical path modulation device described in the embodiment of the present application can be applied to fingerprint identification device, for will emit from display screen and be directed to the optical detection unit being arranged in below the optical path modulation device in the reflected reflected light of finger surface, the optical detection unit is for detecting the reflected light received.

In some possible implementations, the sealing film is silica membrane or organic film.

In some possible implementations, the sealing film is greater than or equal to 85% to the transmitance of wave band used in fingerprint identification device.

In some possible implementations, the sealing film is used to carry out face paste conjunction by thermosetting process with the display screen.

In some possible implementations, the optical path modulation device further include: the coating between the substrate upper surface and the sealing film, the coating are used to inhibit the noise signal into the optical signal of the optical path modulation device.

In some possible implementations, the material of the coating is black glue or titanium.

In some possible implementations, the black glue material is less than or equal to 10% to the transmitance of wave band used in fingerprint identification device.

In some possible implementations, through-hole in the through-hole array is vertical through hole or inclined via-hole, wherein, the tilt angle of the inclined via-hole is greater than 0 °, for the tilt angle for the axis direction of the inclined via-hole and perpendicular to the angle between the optical path modulation device normal to a surface direction, the tilt angle of the vertical through hole is equal to 0 °.

Second aspect provides a kind of production method of optical path modulation device, which comprises makes sealing film in the first surface of etching piece, the sealing film is used to carry out face paste conjunction with display screen；The etching piece with the sealing film is inverted；According to etched features, mask layer is made in the second surface of the etching piece, the second surface is the upper surface of the etching piece after being inverted；The etching piece is performed etching using the mask layer, to produce the through-hole array with multiple through-holes in the etching on piece, wherein the sealing film seals the through-hole array in the second surface of the etching piece；Based on the etching piece with the through-hole array, the optical path modulation device is formed.

Therefore, in the production method of the optical path modulation device of the embodiment of the present application, sealing film is made in the first surface of etching piece, and the etching piece with the sealing film is inverted, mask layer is made on upper surface, that is, second surface of the etching piece after inversion, the etching piece is performed etching using the mask layer and stops etching when being etched to the sealing film, to produce the through-hole array with multiple through-holes in the etching on piece, and seal the through-hole array by the sealing film in the second surface of the etching piece, so that between optical path modulation device and display screen face paste conjunction can be carried out by sealing film.

In some possible implementations, the method also includes: before the upper surface of the etching piece makes the sealing film, reduction processing is carried out to the etching piece, so that the thickness of the etching piece is equal with the target thickness of the optical path modulation device to be produced.

In some possible implementations, the method also includes: before the first surface of the etching piece makes the sealing film, coating is made in the first surface, the coating is used to inhibit the noise signal into the optical signal of the optical path modulation device；Wherein, the sealing film is made in the first surface of the etching piece, comprising: the sealing film is made on the coating；Wherein, the etching piece is performed etching using the mask layer, comprising: the etching piece and the coating are performed etching using the mask layer.

In some possible implementations, the material of the coating is black glue, described to make coating in the first surface, comprising: makes the coating in the first surface by way of spraying.

In some possible implementations, the material of the coating is titanium, described to make coating in the first surface, comprising: makes the coating in the first surface by way of metal sputtering.

It is described that the etching piece is performed etching using the mask layer in some possible implementations, comprising: anisotropic etching is carried out to the etching piece using the mask layer.

The third aspect provides a kind of production method of optical path modulation device, which comprises according to etched features, makes mask layer in the upper surface of etching piece；The etching piece is performed etching using the mask layer, to produce the through-hole array with multiple through-holes in the etching on piece；Sealing film is made in the upper surface of etching piece, wherein the sealing film seals the through-hole array in the upper surface of the etching piece, and the sealing film is used to carry out face paste conjunction with display screen；Based on the etching piece with the through-hole array, the optical path modulation device is formed.

Therefore, in the production method of the optical path modulation device of the embodiment of the present application, the etching piece is performed etching using the mask layer, and the upper surface of etching piece after etching makes sealing film, to produce the through-hole array with multiple through-holes in the etching on piece, so that the through-hole array is sealed in the upper surface of the etching piece by the sealing film, to can carry out face paste conjunction by sealing film between optical path modulation device and display screen.

In some possible implementations, it is described that the etching piece is performed etching using the mask layer, to produce the through-hole array with multiple through-holes in the etching on piece, it include: to be performed etching using the mask layer to the etching piece and carry out reduction processing, to produce the through-hole array with multiple through-holes in the etching on piece, wherein, the thickness of the etching piece after being thinned is equal with the target thickness of the optical path modulation device.

In some possible implementations, the method also includes: before the upper surface of the etching piece makes the sealing film, non-through porose area in the upper surface of the etching piece makes coating, and the coating is used to inhibit the noise signal into the optical signal of the optical path modulation device；Wherein, the sealing film is made in the upper surface of the etching piece, comprising: the sealing film is made on the coating.

It is described that the etching piece is performed etching using the mask layer in some possible implementations, comprising: the etching piece to be fixed on to the tipper of slide glass, the inclined surface of the tipper has pre-determined tilt angle relative to the surface of the slide glass；The etching piece is performed etching using the mask layer, so that the through-hole in the through-hole array that the etching on piece is produced is inclined via-hole, wherein the tilt angle of each inclined via-hole is identical as the pre-determined tilt angle of the inclined surface, and the tilt angle is for the axis direction of the inclined via-hole and perpendicular to the angle between the optical path modulation device normal to a surface direction.

In some possible implementations, the tipper that the etching piece is fixed on to slide glass, comprising: by way of being temporarily bonded or silicone oil bonds, the etching piece is fixed on to the inclined surface of the tipper.

Fourth aspect provides a kind of fingerprint identification device, the optical path modulation device in any possible implementation including above-mentioned first aspect or first aspect, and the optical detection unit below the optical path modulation device is arranged in.

5th aspect, provide a kind of terminal device, the terminal device includes the fingerprint identification device in any possible implementation of display screen and above-mentioned fourth aspect or fourth aspect, wherein, the lower section of the display screen is arranged in the fingerprint identification device, and the sealing film on the optical path modulation device surface in the fingerprint identification device and the display screen face paste are closed.

In some possible implementations, the sealing film carries out face paste conjunction by thermosetting process with the display screen.

Detailed description of the invention

Fig. 1 is the structural schematic diagram for the terminal device that the embodiment of the present application can be applicable in.

Fig. 2 is a specific schematic diagram of the optical finger print device in Fig. 1.

Fig. 3 a and Fig. 3 b are the schematic diagrams according to the optical path modulation device of the embodiment of the present application.

Fig. 4 a and Fig. 4 b are the schematic diagram of the vertical through hole and inclined via-hole according to the embodiment of the present application respectively.

Fig. 5 is that the optical path modulation device and display screen of the embodiment of the present application is bonded schematic diagram.

Fig. 6 is the schematic flow chart of the production method of the optical path modulation device of the application one embodiment.

Fig. 7 a to Fig. 7 g is the schematic diagram of the production method of the optical path modulation device of the application one embodiment.

Fig. 8 is the schematic flow chart of the production method of the optical path modulation device of the application another embodiment.

Fig. 9 a to Fig. 9 g is the schematic diagram of the production method of the optical path modulation device of another embodiment of the application.

Figure 10 is the schematic diagram of the production inclined via-hole of the embodiment of the present application.

Figure 11 is the schematic block diagram of the fingerprint identification device of the embodiment of the present application.

Specific embodiment

Below in conjunction with attached drawing, technical solutions in the embodiments of the present application is described.

It should be understood that, the embodiment of the present application can be applied to optical fingerprint systems, including but not limited to optical fingerprint identification system and the medical diagnostic products etc. based on optical finger print imaging, the embodiment of the present application is only illustrated by taking optical fingerprint systems as an example, but any restriction should not be constituted to the embodiment of the present application, the embodiment of the present application is equally applicable to other systems etc. for using optical image technology.

As a kind of common application scenarios, the invention relates to fingerprint identification method, fingerprint identification device and fingerprint recognition chip can apply smart phone, tablet computer and other with the mobile terminal of display screen or other terminal devices；More specifically, fingerprint recognition system can be specially optical fingerprint systems in above-mentioned terminal device, regional area or whole region below display screen can be set, to form (Under-display) optical fingerprint systems under screen.

The structural schematic diagram for the terminal device that can be applicable in for the embodiment of the present application as shown in Figure 1, the optical fingerprint systems of the terminal device 100 include display screen 120 and optical finger print device 130, wherein, the optical finger print device 130 is arranged at the regional area of 120 lower section of display screen.The optical finger print device 130 can be specially optical fingerprint sensor comprising the induction arrays with multiple optical sensor units, the induction arrays region are the fingerprint identification region 103 of the optical finger print device 130.As shown in Figure 1, the fingerprint identification region 103 is located among the display area 102 of the display screen 120, therefore, user is when needing to be unlocked the terminal device or other fingerprint authentications, it only needs to press finger in the fingerprint identification region 103 for being located at the display screen 120, can realize that fingerprint inputs.Since fingerprint detection can be realized in screen, therefore fingerprint key (such as Home key) is arranged without the special reserved space in its front in terminal device 100 using the above structure, so as to which using screen scheme comprehensively, i.e., the display area 102 of the described display screen 120 can extend substantially to the front of entire terminal device 100.

In embodiment as one preferred, the display screen 120 can be self light emitting display panel, it uses the conduct display pixel with spontaneous light display unit, such as Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen or micro-led (Micro-LED) display screen.For using OLED display screen, the optical finger print device 130 can use the OLED display screen 120 and be located at the excitation light source that the OLED display unit (i.e. OLED light source) of the fingerprint identification region 103 detects as optical finger print.Also, the induction arrays of the optical finger print device 130 are specially optical detector (Photo detector) array comprising multiple optical detectors in array distribution, the optical detector can be used as optical sensor unit as described above.When finger touch, pressing or close to (for ease of description, the application is referred to as touching) in the fingerprint identification region 103, the light that the display unit of the fingerprint identification region 103 issues occurs to reflect and forms reflected light in the fingerprint of finger surface, wherein the reflected light of the wrinkle ridge of the finger print and line paddy is different, reflected light is received and converted to corresponding electric signal, i.e. fingerprint detection signal from the display screen 120 and by the photodetector array.Fingerprint image data can be obtained based on the fingerprint detection signal, and can be verified with further progress fingerprint matching, to realize optical finger print identification function in the terminal device 100.

In other alternate embodiments, the whole region below the display screen 120 also can be set in the optical finger print device 130, to which the fingerprint identification region 103 to be expanded to the entire display area 102 of the entire display screen 120, full frame fingerprint detection is realized.Or, the presumptive area inside the terminal device 100 also can be set in the optical finger print device 130, such as the fringe region of the terminal device 100, and the reflected light of finger surface is directed into the induction arrays of the optical finger print device 130 by setting light guide structure below the display screen 120.

It should be understood that; in specific implementation, the terminal device 100 further includes transparency protected cover board 110, and the cover board 110 can be specially transparent cover plate; such as glass cover-plate or sapphire cover board, it is located at the top of the display screen 120 and covers the front of the terminal device 100.Therefore, in the embodiment of the present application, so-called finger touch, pressing or the close protective layer for actually referring to finger touch, pressing or close cover board 110 or the covering cover board 110 above the display screen 120 in the display screen 120.In addition, the terminal device 100 can also include touch sensor, and the touch sensor can be specially touch panel, can be set on 120 surface of display screen, it can also partially or wholly be integrated into inside the display screen 120, i.e., the described display screen 120 is specially touching display screen.

As a kind of optional implementation, as shown in Figure 1, the optical finger print device 130 includes optical detection unit 134 and optical module 132, the optical detection unit 134 includes the induction arrays and reading circuit and other auxiliary circuits with induction arrays electric connection, can be produced on a chip (Die) by semiconductor technology；The optical module 132 can be set in the top of the induction arrays of the optical detection unit 134, it can specifically include optical filter (Filter), optical path modulation device and other optical elements, the optical filter can be used for filtering out the environment light for penetrating finger, and the optical path modulation device can be using the through-hole array with high-aspect-ratio, it is mainly used for that the light propagated downwards is collimated and modulated, realizes that being directed to the induction arrays from the reflected reflected light of finger surface carries out optical detection.

Fig. 2 shows a kind of possible structures in the optical finger print device 130 in Fig. 1, wherein, the optical finger print device 130 may include optical module 132 and optical detection unit 134, optical module 132 includes optical path modulation device and optical filter, to be detected finger surface of the light that display screen issues above the display screen reflects, the optical path modulation device is collimated and is modulated to from the reflected reflected light of finger surface by its through-hole array, and reflected light is directed to optical filter, the reflected light is received after the filtering of optical filter by optical detection unit 134, optical detection unit 134 can further detect the reflected light received, to realize fingerprint recognition.

In specific implementation, the optical module 132 can be encapsulated in the same optical finger print chip with the optical detection unit 134, be also possible to be mounted on optical finger print module internal as the component relatively independent with optical detection unit 134.Wherein, the optical path modulation device can be specially collimator (Collimator) layer or lens (Lens) layer being made in semi-conductor silicon chip or Si oxide (such as silica) or nitride (such as silicon nitride), it is with multiple collimation units or lens unit, the collimation unit or lens unit can be used as the modulation unit of optical path modulation device, specifically, the modulation unit can be specially the aperture with high-aspect-ratio, from the reflected reflected light of finger, the light for being incident on the modulation unit can be passed through and be received by optical sensor unit below, the aperture that each optical sensor unit can substantially receive above it is guided over the reflected light of the fingerprint lines come, to which the induction arrays can detect the fingerprint image of finger.

In the optical finger print device 130, each modulation unit of optical path modulation device can respectively correspond one of optical sensor unit of the induction arrays；Alternatively, the modulation unit generates Moire fringe interference with that can also reduce using non-one-to-one relationship between the optical sensor unit of the induction arrays, for example an optical sensor unit can correspond to multiple modulation units, alternatively, the modulation unit can also be realized by the way of irregular alignment does not have specific corresponding relationship between the optical sensor unit with the induction arrays.When the modulation unit of the optical path modulation device uses irregular alignment mode, the optical finger print device 130 can be corrected by later period software algorithm come the reflection light detected to each sensing unit.

It is respectively the sectional view and bottom view of the optical path modulation device 300 of the embodiment of the present application shown in Fig. 3 a and Fig. 3 b, the optical path modulation device 300 can be applied to fingerprint identification device such as Fig. 1 and optical finger print device 130 shown in Fig. 2, as the optical path modulation device between display screen 120 and optical detection unit 134.The optical path modulation device 300 is used to emit and being directed to from the reflected reflected light of finger surface the optical detection unit 134 being arranged in below the optical path modulation device 300 from display screen 120, and the optical detection unit 134 is for detecting to obtain the fingerprint image of finger the reflected light received.

Wherein, as shown in the bottom view of the sectional view of Fig. 3 a and Fig. 3 b, the optical path modulation device 300 include substrate, through the substrate multiple through-holes form through-hole array and positioned at the sealing film of the substrate upper surface.Wherein, which seal the through-hole array in the upper surface of the substrate, which is used to carry out face paste conjunction with display screen.

The material of the substrate is opaque to corresponding wave band used in the fingerprint identification device, such as the material of the substrate can be silicon, the carbide of silicon, the oxide of silicon or nitride etc..

In the through-hole array of optical path modulation device 300, each through-hole can be used as a modulation unit of the optical path modulation device 300, and the reflected light that the optical detection unit for opposite 300 lower section of optical path modulation device is propagated is collimated and modulated.

Optionally, the through-hole in the through-hole array can be vertical through hole or inclined via-hole.

Specifically, if the through-hole in the through-hole array is vertical through hole, such as sectional view shown in Fig. 4 a, then the axis direction of the inclined via-hole is identical as perpendicular to the optical path modulation device normal to a surface direction.

If the through-hole in the through-hole array is inclined via-hole, such as sectional view shown in Fig. 4 b, then the tilt angle a of the inclined via-hole is greater than 0 °, and the tilt angle is for the axis direction of the inclined via-hole and perpendicular to the angle between the optical path modulation device normal to a surface direction.At this time, it should be understood that, above-mentioned collimation, which actually refers to, is guided light reflected light (the i.e. above-mentioned tilt angle a at a predetermined angle so that each through-hole by the optical path modulation device 300, preferably, 0 ° of 40 ° of < a <) obliquely it is incident on the induction arrays of the optical detection unit.

In addition, the inclined via-hole in the through-hole array of the optical path modulation device 300 can be circular through hole, ellipse hole or square through hole；Or the through-hole of other any shapes, the application are not construed as limiting this.

The upper surface of the optical path modulation device 300 has sealing film, which makes the through-hole array be sealed to form a plane in the upper surface of the optical path modulation device 300, to make to be able to carry out face paste conjunction between the optical path modulation device and display screen.Such as, the sealing film can be bonded by thermosetting process with the display screen, during being bonded using thermosetting process, need to control thermoset temperature so that the sealing film and the display screen fit closely and guarantee that the sealing film will not soften into above-mentioned through-hole.

Such as optical finger print device shown in fig. 5, it is arranged between the sealing film and display screen of optical path modulation device upper surface and fits closely.The upper surface of the optical path modulation device can carry out face paste conjunction by the sealing film between optical path modulation device and display screen due to being covered with sealing film.And original mode is only to be bonded between the non-through bore region and display screen of optical path modulation device upper surface by the bonding of glue, the mode of this frame fitting easilys lead to the through-hole that glue enters optical path modulation device, and if pasting out-of-flatness, there is likely to be gap and then influence to be imaged between certain non-through bore regions and display screen.In addition, the fitting intensity of the mode of this frame fitting is lower, it is difficult to ensure that the accuracy of the relative position of optical path modulation device and display screen, it may cause between through-hole and sensing unit below that there are position deviations.

The upper surface of the optical path modulation device of the embodiment of the present application is due to sealing film, so that the through-hole array in optical path modulation device is sealed in the upper surface of the optical path modulation device, to during being bonded with display screen, can be realized face paste conjunction between the sealing film and display screen.The mode being bonded due to the mode of using face fitting instead of original frame, therefore during optical path modulation device is bonded with display screen, it can be avoided the through-hole that glue caused by original frame fitting in the process enters optical path modulation device, and guarantee the accuracy of the relative position of optical path modulation device and display screen, at the same avoid frame fitting during optical path modulation device upper surface and display screen between gap that may be present.And, it is improved in such a way that the sealing film carries out face paste conjunction with display screen and is bonded intensity, or the connection between thinner glue-line realization optical path modulation device and display screen is able to use under conditions of guaranteeing identical fitting intensity, to obtain thinner optical path modulation device.

Wherein, which can be for example inorganic thin film such as silica membrane, or can be organic film.

The sealing film should have good transmitance to wave band used in fingerprint identification device, such as the sealing film is greater than or equal to 85% to the transmitance of wave band used in fingerprint identification device.

Optionally, the upper surface of the substrate further includes coating, which is located between the substrate and the sealing film, which is used to inhibit the noise signal into the optical signal of the optical path modulation device.

Optionally, the material of the coating is black glue or titanium.When the coating is black glue layer, the black glue of substrate upper surface can absorb the light for being incident to the non-through porose area on the optical path modulation device surface, to improve the signal-to-noise ratio of the optical signal into the optical path modulation device, black glue should have lower transmitance to wave band used in fingerprint identification device, such as the black glue material is less than or equal to 10% to the transmitance of wave band used in fingerprint identification device.When the coating is titanium layer, the titanium layer of substrate upper surface can reflect away the light for being incident to the non-through porose area on the optical path modulation device surface, equally can be improved the signal-to-noise ratio of the optical signal into the optical path modulation device.

For above-mentioned optical path modulation device, the method for making the optical path modulation device the embodiment of the present application also provides two kinds is detailed below.

Method 1

Fig. 6 shows the schematic flow chart of the production method 600 of the optical path modulation device according to the embodiment of the present application, this method can make optical path modulation device 300 shown in Fig. 3 a and Fig. 3 b, wherein the optical path modulation device 300 include substrate, through the substrate multiple through-holes form through-hole array and positioned at the sealing film of the substrate upper surface.The sealing film seals the through-hole array in the upper surface of the substrate, which is used to carry out face paste conjunction with display screen.Fingerprint identification device, such as Fig. 1 and optical finger print device 130 shown in Fig. 2 can be applied to using the optical path modulation device 300 that method 600 provided by the embodiments of the present application makes.

Specifically, as shown in fig. 6, the production method 600 of the optical path modulation device may include:

Step 610, sealing film is made in the first surface of etching piece, which is used to carry out face paste conjunction with display screen.

Specifically, prepare an etching piece first, which is the substrate for making optical path modulation device, such as can be to etch piece shown in Fig. 7 a.Optionally, the material of the etching piece can be silicon, silicon carbide, silica or silicon nitride etc..

Later, one layer of sealing film is made in the upper surface (i.e. first surface) of the etching piece, which is used to carry out face paste conjunction with display screen.For example, the sealing film can be bonded by thermosetting process with the display screen, during being bonded using thermosetting process, need to control thermoset temperature so that the sealing film is fitted closely with the display screen.

Optionally, in step 610, before the first surface of the etching piece makes the sealing film, reduction processing can be carried out to the etching piece, so that the thickness of the etching piece is equal with the target thickness of the optical path modulation device to be produced, such as obtain the etching piece after reduction processing as shown in Figure 7b.Later, the sealing film can be made in the etching on piece after being thinned.

Optionally, in step 610, before the first surface of the etching piece makes the sealing film, one layer of coating can be made in the first surface, then the sealing film is made on the coating layer, such as shown in Fig. 7 c, the coating is formed on the first surface of the etching piece, and forms the sealing film on the coating layer.The coating can inhibit into the noise signal in the optical signal of the optical path modulation device.

The material of the coating for example can be black glue or titanium.

When the coating is black glue layer, the black glue of the first surface of the etching piece can absorb the light for being incident to the non-through porose area on the optical path modulation device surface, to improve the signal-to-noise ratio of the optical signal into the optical path modulation device, black glue should have lower transmitance to wave band used in fingerprint identification device, such as the black glue material is less than or equal to 10% to the transmitance of wave band used in fingerprint identification device.The black glue layer can for example be formed in the first surface of the etching piece by way of spraying.

When the coating is titanium layer, the titanium layer of the first surface of the etching piece can reflect away the light for being incident to the non-through porose area on the optical path modulation device surface, equally can be improved the signal-to-noise ratio of the optical signal into the optical path modulation device.The titanium layer can for example be formed in the first surface of the etching piece by way of metal sputtering.

Step 620, the etching piece with the sealing film is inverted.

Specifically, the etching piece obtained in step 610 with sealing film is inverted, make its first surface downward and second surface upward, which be the upper surface of the etching piece after inversion, such as shown in Fig. 7 d.

Step 630, according to etched features, mask layer is made in the second surface of the etching piece.

The etched features can specifically refer to planar graph corresponding with through-hole array to be produced, such as via hole image shown in Fig. 3 b.

Such as shown in Fig. 7 e, which could be formed with multiple etching openings, and multiple etching opening is distributed in array, each etching opening respectively corresponds the one of through-hole for needing the through-hole array made in the etching piece.The etching opening of the etching barrier layer can be the through-hole perpendicular to the exposure mask layer surface.The etching opening etched features corresponding in the open area that the etching piece surface is formed are consistent.

Optionally, which can be silicon wafer, and the mask layer can be silicon dioxide layer or silicon nitride layer made of the growth of the etching piece surface, and the silicon dioxide layer or silicon nitride layer form above-mentioned etching opening by etching technics.

Step 640, the etching piece is performed etching using the mask layer, to produce the through-hole array with multiple through-holes in the etching on piece.

Wherein, which seal the through-hole array etched in the second surface of the etching piece, and for carrying out face paste conjunction between display screen.

Specifically, such as shown in Fig. 7 f, from the second surface of the etching piece, the etching piece is performed etching, and stop etching when carrying out the etching process to the sealing film, to produce the through-hole array with multiple through-holes in the etching on piece, and it is not etched the sealing film on the etching piece surface.Such as shown in Fig. 7 g, the coating of the etching piece and its first surface is etched, and sealing film is not etched.In this way, the sealing film can make the through-hole array be sealed to form a plane in the second surface of the etching piece, to make that face paste conjunction can be carried out by the sealing film between optical path modulation device and display screen.

When the sealing film is bonded by thermosetting process with the display screen, during being bonded using thermosetting process, it needs to control thermoset temperature, fits closely the sealing film with the display screen, and guarantee that the sealing film will not soften into above-mentioned through-hole.

The etching piece can be performed etching using anisotropic etching mode, and etching direction can be specially the direction perpendicular to the etching piece surface.

Using the mask layer and when being performed etching with the direction perpendicular to the slide surface to the etching piece, the etching piece can't be etched by the part of region blocks other than the etching opening of the mask layer, and the open area (via hole image as shown in Figure 3b) only formed with the etching opening on the etching piece surface can be just etched into.Therefore, under the blocking of mask layer, piece is etched after over etching, can form through-hole corresponding with the etched features, such as through-hole shown in Fig. 4 a.

In step 640, during being performed etching using the mask layer to the etching piece, it is preferable that etch through-hole in the etching piece using anisotropic etching mode.The anisotropic etching refers to, is greater than the etching technics of horizontal direction etch rate in the etch rate of vertical direction, which includes but is not limited to dry plasma etch.Using the etching precision for the inclined via-hole that the etching mode of the anisotropic can guarantee to be formed in the etching piece, avoid influencing optical property due to lateral etching inside the inclined via-hole.

It should be understood that the step of production optical path modulation device of Fig. 7 a to Fig. 7 g sequence is only example.In the embodiment, in the step of making optical path modulation device, position the step of to reduction processing is not limited in any way.For example, reduction processing can be carried out to the etching piece at the beginning, the etching piece after being thinned shown in Fig. 7 b is obtained, and etching on piece production coating and sealing film after being thinned；Alternatively, coating and sealing film first can also be made in the etching piece, reduction processing is then carried out again, to obtain etching piece shown in Fig. 7 c.The application is not limited in any way this, as long as the thickness for the optical path modulation device finally produced can satisfy required target thickness.

Step 650, based on the etching piece with the through-hole array, the optical path modulation device is formed.

Specifically, after the etching piece etches and forms the through-hole array with multiple through-holes, the mask layer on its surface can be removed, obtains optical path modulation device shown in such as Fig. 7 g；Also, it is alternatively possible to can further be cut to the etching piece, to obtain the optical path modulation device for meeting size and shape requirement.

In the production method of the optical path modulation device of the embodiment of the present application, sealing film is made in the first surface of etching piece, and the etching piece with the sealing film is inverted, mask layer is made on upper surface, that is, second surface of the etching piece after inversion, the etching piece is performed etching using the mask layer and stops etching when being etched to the sealing film, to produce the through-hole array with multiple through-holes in the etching on piece, and seal the through-hole array by the sealing film in the second surface of the etching piece, so that between optical path modulation device and display screen face paste conjunction can be carried out by sealing film.

Method 2

Fig. 8 shows the schematic flow chart of the production method 800 of the optical path modulation device according to the embodiment of the present application, this method can make optical path modulation device 300 shown in Fig. 3 a and Fig. 3 b, wherein the optical path modulation device 300 include substrate, through the substrate multiple through-holes form through-hole array and positioned at the sealing film of the substrate upper surface.The sealing film seals the through-hole array in the upper surface of the substrate, which is used to carry out face paste conjunction with display screen.Fingerprint identification device, such as Fig. 1 and optical finger print device 130 shown in Fig. 2 can be applied to using the optical path modulation device 300 that method 800 provided by the embodiments of the present application makes.

Step 810, according to etched features, mask layer is made in the upper surface of etching piece.

Specifically, prepare an etching piece first, which is the substrate for making optical path modulation device, such as can be to etch piece shown in Fig. 9 a.Optionally, the material of the etching piece can be silicon, silicon carbide, silica or silicon nitride etc..

Then, mask layer is made in the etching on piece, such as shown in Fig. 9 b, which could be formed with multiple etching openings, multiple etching opening is distributed in array, each etching opening respectively corresponds the one of through-hole for needing the through-hole array made in the etching piece.The etching opening of the etching barrier layer can be the through-hole perpendicular to the exposure mask layer surface.The etching opening etched features corresponding in the open area that the etching piece surface is formed are consistent.

If the through-hole in the through-hole array of the optical path modulation device to be produced is inclined via-hole, the opening shape of the etching opening of the mask layer can be designed to: when the etching piece is placed with tilt angle a, the etching opening etched features corresponding in the effective vent region of the floor projection on the etching piece surface are consistent.

Step 820, the etching piece is performed etching using the mask layer, to produce the through-hole array with multiple through-holes in the etching on piece.

Specifically, such as shown in Fig. 9 c, which can be performed etching using anisotropic etching mode, and etching direction can be specially the direction perpendicular to the etching piece surface.Using the mask layer and when being performed etching with the direction perpendicular to the slide surface to the etching piece, the etching piece can't be etched by the part of region blocks other than the etching opening of the mask layer, and the open area (via hole image as shown in Figure 3b) only formed with the etching opening on the etching piece surface can be just etched into.Therefore, under the blocking of mask layer, piece is etched after over etching, can form through-hole corresponding with the etched features, such as through-hole shown in Fig. 4 a.

If the through-hole in the through-hole array of the optical path modulation device to be produced is inclined via-hole, in step 820, the slide glass with tipper can be provided, the inclined surface of the tipper has pre-determined tilt angle a relative to the surface of the slide glass.The etching piece with mask layer is fixed on to the tipper of the slide glass, so that the etching piece is able to maintain heeling condition in etching process, to make to etch the through-hole inclined via-hole come.

Such as the slide glass shown in Fig. 10 for carrying tipper, which is fixed in the tipper of the slide glass, for example the etching piece is fixed on to the inclined surface of the tipper by way of being temporarily bonded or silicone oil bonds.Later, the etching piece is performed etching using the mask layer, so that through-hole in the through-hole array that the etching on piece is produced is inclined via-hole, wherein the axis direction of each inclined via-hole and perpendicular to having angle a identical with the tilt angle a of the inclined surface between the etching piece normal to a surface direction.

As shown in Figure 10, using the mask layer and when being performed etching with the direction perpendicular to the slide surface to the etching piece, the etching piece can't be etched by the part of region blocks other than the etching opening of the mask layer, and since the mask layer is in heeling condition, the opening direction of the etching opening of the mask layer and non-perpendicular to the slide surface, therefore the edge of the etching opening and sections inner side wall will cause centainly to stop to the vertical etch of the etching piece, only can just it be etched into the etching opening in the effective open area of the floor projection on the etching piece surface.Therefore, under the blocking of the mask layer, the etching piece of tipper is fixed on after over etching, can form inclined via-hole corresponding with the etched features.

In step 820, during being performed etching using the mask layer to the etching piece, it is preferable that etch through-hole in the etching piece using anisotropic etching mode.Using the etching precision for the inclined via-hole that the etching mode of the anisotropic can guarantee to be formed in the etching piece, avoid influencing optical property due to lateral etching inside the inclined via-hole.

In step 820, optionally, during being performed etching the etching piece to produce the through-hole array with multiple through-holes in the etching on piece using the mask layer, can through-hole directly be produced in the etching on piece, the etching piece is performed etching using the mask layer until penetrating etching piece to form through-hole, other operations are carried out later and for example carry out reduction processing, so that the thickness of the etching piece after being thinned is equal to the target thickness of the optical path modulation device to be produced；Or, it can use the mask layer to perform etching the etching piece and carry out reduction processing, to form the through-hole array with multiple through-holes in the etching on piece, such as shown in Fig. 9 d, the etching piece is performed etching using the mask layer and reaches certain depth, the depth should be greater than or equal to optical path modulation device to be produced target thickness, reduction processing is carried out to the etching piece after etching later, obtain the etching piece shown in such as Fig. 9 f with through-hole, due to being removed by reduction processing by the part not being etched in piece is etched, the hole with certain depth come to make the etching on piece etch becomes through-hole, the thickness of the etching piece after being thinned is equal with the target thickness of the optical path modulation device.

Step 830, sealing film is made in the upper surface of etching piece.

Specifically, it performs etching, is formed after the through-hole array with multiple through-holes to the etching piece, the mask layer on its surface can be removed, and make sealing film in the etching on piece.Wherein, which seal the through-hole array in the upper surface of the etching piece, which is used to carry out face paste conjunction with display screen.

Such as, the sealing film can be bonded by thermosetting process with the display screen, during being bonded using thermosetting process, need to control thermoset temperature so that the sealing film is fitted closely with the display screen, and guarantees that the sealing film will not soften into above-mentioned through-hole.

Optionally, in step 830, before the upper surface of the etching piece makes the sealing film, one layer of coating can be made in the non-through porose area of the upper surface of the etching piece, obtain that there is the coating etching piece shown in such as Fig. 9 e, and the sealing film is made on the coating layer, obtain that there is sealing film optical path modulation device shown in such as Fig. 9 g.As can be seen that the upper surface of the etching piece forms one layer of coating, the sealing film is formed on the coating.Wherein, which can inhibit into the noise signal in the optical signal of the optical path modulation device.

The material of the coating for example can be black glue or titanium.

When the coating is black glue layer, the black glue of the upper surface of the etching piece can absorb the light for being incident to the non-through porose area on the optical path modulation device surface, to improve the signal-to-noise ratio of the optical signal into the optical path modulation device, black glue should have lower transmitance to wave band used in fingerprint identification device, such as the black glue material is less than or equal to 10% to the transmitance of wave band used in fingerprint identification device.The black glue layer can for example be formed in the upper surface of the etching piece by way of spraying.

When the coating is titanium layer, the titanium layer of the upper surface of the etching piece can reflect away the light for being incident to the non-through porose area on the optical path modulation device surface, equally can be improved the signal-to-noise ratio of the optical signal into the optical path modulation device.The titanium layer can for example be formed in the upper surface of the etching piece by way of metal sputtering.

It should be understood that the step of production optical path modulation device of Fig. 9 a to Fig. 9 g only example.In the embodiment, in the step of making optical path modulation device, position the step of to reduction processing is not limited in any way.For example, reduction processing can be carried out to the etching piece after etching shown in Fig. 9 d, and etching piece production coating and sealing film after reduction processing；Or, etching on piece after can also first etching shown in Fig. 9 d makes coating, obtain cated etching piece of tool shown in Fig. 9 e, and thinning operation is carried out to having the cated etching piece, piece is etched shown in Fig. 9 f to be formed, finally the etching on piece shown in Fig. 9 f makes the sealing film；Alternatively, etching on piece production coating and sealing film after can also etching shown in Fig. 9 d, finally carry out thinning operation again；Alternatively, thinning operation can also be carried out before carrying out etch step shown in Fig. 9 c.The application is not limited in any way this, as long as the thickness for the optical path modulation device finally produced can satisfy required target thickness.

Step 840, based on the etching piece with the through-hole array, the optical path modulation device is formed.

It is alternatively possible to can further be cut to the etching piece, to obtain the optical path modulation device for meeting size and shape requirement.

In the production method of the optical path modulation device of the embodiment of the present application, the etching piece is performed etching using the mask layer, and the upper surface of etching piece after etching makes sealing film, to produce the through-hole array with multiple through-holes in the etching on piece, so that the through-hole array is sealed in the upper surface of the etching piece by the sealing film, to can carry out face paste conjunction by sealing film between optical path modulation device and display screen.

Figure 11 shows the schematic block diagram of the fingerprint identification device 1100 of the embodiment of the present application.The fingerprint identification device 1100 can be applied to mobile terminal device as shown in Figure 1 or 2, and as shown in figure 11, which includes optical path modulation device 1110 and the optical detection unit 1120 being arranged in below the optical path modulation device 1110.The optical path modulation device 1110 can be optical path modulation device 300 shown in earlier figures 3a and Fig. 3 b.

The optical path modulation device 1110 from the reflected reflected light of finger surface for will be directed to the optical detection unit 1120 being arranged in below the optical path modulation device 1110, the optical detection unit 1120 is for detecting the reflected light received, wherein, which includes: substrate；The through-hole array formed through multiple through-holes of the substrate；And the sealing film positioned at the substrate upper surface, wherein the sealing film seals the through-hole array in the upper surface of the substrate, which is used to carry out face paste conjunction with display screen.

It should be understood that the fingerprint identification device in the embodiment of the present application may include fingerprint recognition chip, which can be push type fingerprint recognition chip, scratch type fingerprint recognition chip or touch fingerprint recognition chip etc., and the embodiment of the present application is not limited to this.The fingerprint identification device can be applied to the mobile terminal devices such as terminal device, such as smart phone, tablet computer, laptop.

The embodiment of the present application also provides a kind of terminal device, which may include any one fingerprint identification device in display screen and above-mentioned the embodiment of the present application, wherein the lower section of the display screen is arranged in the fingerprint identification device.

It it should be understood that the terminal device in the embodiment of the present application can be equipped with the electronic equipment of fingerprint identification device for mobile phone, tablet computer, laptop etc., such as can be the mobile phone for being equipped with fingerprint recognition chip.

Those of ordinary skill in the art may be aware that unit described in conjunction with the examples disclosed in the embodiments of the present disclosure and algorithm steps, can be realized with the combination of electronic hardware or computer software and electronic hardware.These functions are implemented in hardware or software actually, the specific application and design constraint depending on technical solution.Professional technician can use different methods to achieve the described function each specific application, but this realization is it is not considered that exceed scope of the present application.

It is apparent to those skilled in the art that for convenience and simplicity of description, system, the specific work process of device and unit of foregoing description can refer to corresponding processes in the foregoing method embodiment, details are not described herein.

In several embodiments provided herein, it should be understood that disclosed systems, devices and methods may be implemented in other ways.Such as, the apparatus embodiments described above are merely exemplary, such as, the division of the unit, only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units or components can be combined or can be integrated into another system, or some features can be ignored or not executed.Another point, shown or discussed mutual coupling, direct-coupling or communication connection can be through some interfaces, the indirect coupling or communication connection of device or unit, can be electrical property, mechanical or other forms.

Unit may or may not be physically separated as illustrated by the separation member for this, and component shown as a unit may or may not be physical unit, it can and it is in one place, or may be distributed over multiple network units.It can some or all of the units may be selected to achieve the purpose of the solution of this embodiment according to the actual needs.

In addition, can integrate in a detection unit in each functional unit in each embodiment of the application, it is also possible to each unit and physically exists alone, can also be integrated in one unit with two or more units.

More than; the only specific embodiment of the application; but the protection scope of the embodiment of the present application is not limited thereto; anyone skilled in the art is in the technical scope that the embodiment of the present application discloses; it can easily think of the change or the replacement, should all cover within the protection scope that the application is suitble to private interests.Therefore, the protection scope of the embodiment of the present application should be subject to the protection scope in claims.

Claims

A kind of optical path modulation device, which is characterized in that the optical path modulation device includes:

Substrate；

The through-hole array formed through multiple through-holes of the substrate；And

Positioned at the sealing film of the substrate upper surface, wherein the sealing film seals the through-hole array in the upper surface of the substrate, and the sealing film is used to carry out face paste conjunction with display screen.
Optical path modulation device according to claim 1, which is characterized in that the sealing film is silica membrane or organic film.
Optical path modulation device according to claim 1 or 2, which is characterized in that the sealing film is greater than or equal to 85% to the transmitance of wave band used in fingerprint identification device.
Optical path modulation device according to any one of claim 1 to 3, which is characterized in that the sealing film is used to carry out face paste conjunction by thermosetting process with the display screen.
Optical path modulation device according to any one of claim 1 to 4, the optical path modulation device further include:

Coating between the substrate upper surface and the sealing film, the coating are used to inhibit the noise signal into the optical signal of the optical path modulation device.
Optical path modulation device according to claim 5, which is characterized in that the material of the coating is black glue or titanium.
Optical path modulation device according to claim 6, which is characterized in that the black glue material is less than or equal to 10% to the transmitance of wave band used in fingerprint identification device.
Optical path modulation device according to any one of claim 1 to 7, it is characterized in that, through-hole in the through-hole array is vertical through hole or inclined via-hole, wherein, the tilt angle of the inclined via-hole is greater than 0 °, for the tilt angle for the axis direction of the inclined via-hole and perpendicular to the angle between the optical path modulation device normal to a surface direction, the tilt angle of the vertical through hole is equal to 0 °.
Optical path modulation device according to any one of claim 1 to 8, it is characterized in that, the optical path modulation device is applied to fingerprint identification device, for will emit from display screen and be directed to the optical detection unit being arranged in below the optical path modulation device in the reflected reflected light of finger surface, the optical detection unit is for detecting the reflected light received.
A kind of fingerprint identification device, which is characterized in that the fingerprint identification device includes such as optical path modulation device described in any item of the claim 1 to 8 and the optical detection unit being arranged in below the optical path modulation device.
A kind of terminal device, it is characterised in that it includes display screen and fingerprint identification device as claimed in claim 9, wherein, the lower section of the display screen is arranged in the fingerprint identification device, and the sealing film on the optical path modulation device surface in the fingerprint identification device and the display screen face paste are closed.
Terminal device according to claim 11, which is characterized in that the sealing film carries out face paste conjunction by thermosetting process with the display screen.
A kind of production method of optical path modulation device, which is characterized in that the described method includes:

Sealing film is made in the first surface of etching piece, the sealing film is used to carry out face paste conjunction with display screen；

The etching piece with the sealing film is inverted；

According to etched features, mask layer is made in the second surface of the etching piece, the second surface is the upper surface of the etching piece after being inverted；

The etching piece is performed etching using the mask layer, to produce the through-hole array with multiple through-holes in the etching on piece, wherein the sealing film seals the through-hole array in the second surface of the etching piece；

Based on the etching piece with the through-hole array, the optical path modulation device is formed.
According to the method for claim 13, which is characterized in that the sealing film is silica membrane or organic film.
Method described in 3 or 14 according to claim 1, which is characterized in that the sealing film is greater than or equal to 85% to the transmitance of wave band used in fingerprint identification device.
Method described in any one of 3 to 15 according to claim 1, which is characterized in that the sealing film is used to carry out face paste conjunction by thermosetting process with the display screen.
Method described in any one of 3 to 16 according to claim 1, which is characterized in that the method also includes:

Before the upper surface of the etching piece makes the sealing film, reduction processing is carried out to the etching piece, so that the thickness of the etching piece is equal with the target thickness of the optical path modulation device to be produced.
Method described in any one of 3 to 17 according to claim 1, which is characterized in that the method also includes:

Before the first surface of the etching piece makes the sealing film, coating is made in the first surface, the coating is used to inhibit the noise signal into the optical signal of the optical path modulation device；

Wherein, the sealing film is made in the first surface of the etching piece, comprising:

The sealing film is made on the coating；

Wherein, the etching piece is performed etching using the mask layer, comprising:

The etching piece and the coating are performed etching using the mask layer.
Method described in any one of 3 to 18 according to claim 1, which is characterized in that the material of the coating is black glue or titanium.
According to the method for claim 19, which is characterized in that the black glue material is less than or equal to 10% to the transmitance of wave band used in fingerprint identification device.
Method described in 9 or 20 according to claim 1, which is characterized in that the material of the coating is black glue, described to make coating in the first surface, comprising:

The coating is made in the first surface by way of spraying.
According to the method for claim 19, which is characterized in that the material of the coating is titanium, described to make coating in the first surface, comprising:

The coating is made in the first surface by way of metal sputtering.
Method described in any one of 3 to 22 according to claim 1, which is characterized in that described that the etching piece is performed etching using the mask layer, comprising:

Anisotropic etching is carried out to the etching piece using the mask layer.
A kind of production method of optical path modulation device, which is characterized in that the described method includes:

According to etched features, mask layer is made in the upper surface of etching piece；

The etching piece is performed etching using the mask layer, to produce the through-hole array with multiple through-holes in the etching on piece；

Sealing film is made in the upper surface of etching piece, wherein the sealing film seals the through-hole array in the upper surface of the etching piece, and the sealing film is used to carry out face paste conjunction with display screen；

Based on the etching piece with the through-hole array, the optical path modulation device is formed.
According to the method for claim 24, which is characterized in that the sealing film is silica membrane or organic film.
The method according to claim 24 or 25, which is characterized in that the sealing film is greater than or equal to 85% to the transmitance of wave band used in fingerprint identification device.
The method according to any one of claim 24 to 26, which is characterized in that the sealing film is used to carry out face paste conjunction by thermosetting process with the display screen.
The method according to any one of claim 24 to 27, which is characterized in that it is described that the etching piece is performed etching using the mask layer, to produce the through-hole array with multiple through-holes in the etching on piece, comprising:

Reduction processing is performed etching and carries out to the etching piece using the mask layer, to produce the through-hole array with multiple through-holes in the etching on piece, wherein the thickness of the etching piece after being thinned is equal with the target thickness of the optical path modulation device.
The method according to any one of claim 24 to 28, which is characterized in that the method also includes:

Before the upper surface of the etching piece makes the sealing film, the non-through porose area in the upper surface of the etching piece makes coating, and the coating is used to inhibit the noise signal into the optical signal of the optical path modulation device；

Wherein, the sealing film is made in the upper surface of the etching piece, comprising:

The sealing film is made on the coating.
According to the method for claim 29, which is characterized in that the material of the coating is black glue or titanium.
According to the method for claim 30, which is characterized in that the material of the coating is black glue, described to make coating in the first surface, comprising:

The coating is made in the first surface by way of spraying.
The method according to claim 30 or 31, which is characterized in that the black glue material is less than or equal to 10% to the transmitance of wave band used in fingerprint identification device.
According to the method for claim 30, which is characterized in that the material of the coating is titanium, described to make coating in the first surface, comprising:

The coating is made in the first surface by way of metal sputtering.
The method according to any one of claim 24 to 33, which is characterized in that described that the etching piece is performed etching using the mask layer, comprising:

The etching piece is fixed on to the tipper of slide glass, the inclined surface of the tipper has pre-determined tilt angle relative to the surface of the slide glass；

The etching piece is performed etching using the mask layer, so that the through-hole in the through-hole array that the etching on piece is produced is inclined via-hole, wherein the tilt angle of each inclined via-hole is identical as the pre-determined tilt angle of the inclined surface, and the tilt angle is for the axis direction of the inclined via-hole and perpendicular to the angle between the optical path modulation device normal to a surface direction.
According to the method for claim 34, which is characterized in that the tipper that the etching piece is fixed on to slide glass, comprising:

By way of being temporarily bonded or silicone oil bonds, the etching piece is fixed on to the inclined surface of the tipper.
The method according to any one of claim 24 to 35, which is characterized in that described that the etching piece is performed etching using the mask layer, comprising:

Anisotropic etching is carried out to the etching piece using the mask layer.