CN106407967A - Fingerprint module and the applying method and application thereof - Google Patents
Fingerprint module and the applying method and application thereof Download PDFInfo
- Publication number
- CN106407967A CN106407967A CN201611096160.6A CN201611096160A CN106407967A CN 106407967 A CN106407967 A CN 106407967A CN 201611096160 A CN201611096160 A CN 201611096160A CN 106407967 A CN106407967 A CN 106407967A
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- Prior art keywords
- glue
- applying method
- fingerprint module
- fingerprint
- outward appearance
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
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Abstract
The invention discloses an applying method to solve the appearance dent of a fingerprint module. The method comprises the following steps: providing a fingerprint sensor whose to-be-applied surface is provided with a plastic packaging area and a non-plastic packaging area; providing UV glue and coating it on the non-plastic packaging area for UV solidification; and providing applying glue and coating it onto the to-be-applied surface to have the surface applied with a cover plate and then solidifying the surface and the cover plate. The method also discloses a fingerprint module and its application. According to the fingerprint module appearance dent applying method of the invention, through two times of dispensing and solidification, any dent on the fingerprint module appearance can be removed to solve the problem associated with the appearance of module applying, bring a user increased user's experience and facilitate the promotion of the fingerprint module.
Description
Technical field
The present invention relates to fingerprint identification technology field, more particularly to a kind of fingerprint module and its applying method and should
With.
Background technology
The application of fingerprint module is more and more extensive in the market.Fingerprint module species under prior art is various, such as：Live
Body fingerprint recognition module, optical fingerprint identification module etc..But the fingerprint sensor of these fingerprint recognition modules（IC）Surface
Capsulation material is simultaneously not quite identical, such as：As shown in figure 1, living body finger print identifies that there is LED2 ' and PD3 ' on the IC 1 ' surface of module
When, the capsulation material of LED2 ' and PD3 ' itself and IC 1 ' surface entirety capsulation material 11 ' differ, and its thermal coefficient of expansion is not yet
With through liquid glue 4 ' laminating cover plate 5 ' in fingerprint module production process（LENS）, can cause on module surface after being heating and curing
LED2 ' and PD3 ' position occur obvious indenture 6 ', have a strong impact on attractive in appearance, poor user experience.
Content of the invention
The technical problem to be solved there is provided a kind of applying method solving fingerprint module outward appearance indenture, its
By putting adhesive curing twice, make living body finger print module outward appearance can't see any indenture, solve module laminating problem of appearance well,
Lifting Consumer's Experience, is more beneficial for the popularization of fingerprint module.
Present invention also offers a kind of fingerprint module and its application.
The technical problem to be solved is achieved by the following technical programs：
A kind of applying method solving fingerprint module outward appearance indenture, it comprises the following steps：There is provided a fingerprint sensor, it waits to paste
Close surface and there is plastic packaging area and non-plastic packaging area；UV glue is provided, is covered in described non-plastic packaging area, carry out UV solidification；There is provided
Laminating glue, is covered on described surface to be fit, laminating relative with cover plate, solidifies.
A kind of improvement of the applying method of the solution fingerprint module outward appearance indenture providing as the present invention, described UV adhesive curing
The 1/2 of thickness≤described laminating glue curing thickness.
A kind of improvement of the applying method of the solution fingerprint module outward appearance indenture providing as the present invention, described laminating glue
For liquid resin glue.
A kind of improvement of the applying method of the solution fingerprint module outward appearance indenture providing as the present invention, described fingerprint sensing
Device is living body finger print sensor and optical fingerprint sensor.
A kind of improvement of the applying method of the solution fingerprint module outward appearance indenture providing as the present invention, described fingerprint sensing
The non-plastic packaging area of device is respectively optical transmitting set and optical sensor, and described optical transmitting set is used for emitting light into finger, described light sensing
Device is used for receiving to be handled the light that digital reflex returns and is converted into electric signal.
A kind of improvement of the applying method of the solution fingerprint module outward appearance indenture providing as the present invention, described optical transmitting set
Arrange symmetric about the axisly with optical sensor.
A kind of improvement of the applying method of the solution fingerprint module outward appearance indenture providing as the present invention, described optical transmitting set
For light emitting diode.
A kind of improvement of the applying method of the solution fingerprint module outward appearance indenture providing as the present invention, described optical sensor
For photodiode.
A kind of fingerprint module, is obtained by above-mentioned applying method laminating.
A kind of application on door lock, safety cabinet, vehicle-mounted, intelligent mobile terminal and/or computer for described fingerprint module.
The present invention has the advantages that：This fingerprint module applying method is by putting adhesive curing twice, producing
Fingerprint module outward appearance can't see any indenture, solves module laminating problem of appearance well, lifts Consumer's Experience, is more beneficial for living
The popularization of body fingerprint；Process is simple, easy to operate, beneficial to industrialization, there is preferable economic benefit.
Brief description
Fig. 1 is the structural representation of existing living body finger print module（Section）；
Fig. 2 is the schematic flow sheet of applying method of the present invention；
Fig. 3 is the structural representation of living body finger print module of the present invention.
Specific embodiment
With reference to embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention,
It is not limitation of the invention.
Existing fingerprint module（As living body finger print module, optical finger print module etc.）Liquid laminating cover plate is needed in production process
（LENS）, but the position in the non-plastic packaging area on module surface after being heating and curing, can be caused easily obvious indenture to occur, as shown in figure 1,
Have a strong impact on attractive in appearance, seriously reduce product quality.
In order to solve the problems, such as above-mentioned outward appearance indenture, the invention provides a kind of laminating side solving fingerprint module outward appearance indenture
Method, as shown in Fig. 2 it comprises the following steps：There is provided a fingerprint sensor, its surface to be fit has plastic packaging area 11 and non-plastic packaging
Area 12；UV glue 4 is provided, is covered in described non-plastic packaging area 12, carry out UV solidification；Laminating glue 5 is provided, is covered
On described surface to be fit, laminating relative with cover plate 6, solidify, structure is as shown in Figure 3.Glue directly put by point UV glue 4
During water 5 laminating cover plate 6, because the plastic packaging area 11 of the upper surface of fingerprint module is different with the thermal coefficient of expansion in non-plastic packaging area 12, plus
After heat cure, the convergent force of cooling procedure Zhong Fei plastic packaging area 12 position makes laminating glue 5 by cover plate 6 toward drop-down, forms indenture.
And the present invention is when first laminating glue 5 put again by point UV glue 4, because being in g., jelly-like after UV glue 4 solidification, UV glue 4 with fit glue 5 and not
Compatible, after being heating and curing, in cooling procedure, UV glue 4 can offset laminating glue 5 by cover plate 6 toward drop-down power, then after fitting not
Have indenture to produce.
Specifically, taking living body finger print module as a example, a kind of solve fingerprint module outward appearance indenture applying method, it include with
Lower step：
Step 1, offer one living body finger print sensor, it has an identification chip 1, is located on described identification chip 1 upper surface
Optical transmitting set 2 and optical sensor 3, the plastic packaging plastic packaging layer in described identification chip 1 upper surface, described plastic packaging floor has plastic packaging area 11
With non-plastic packaging area 12, described non-plastic packaging area 12 and described optical transmitting set 2 and optical sensor 3 are correspondingly arranged, with launching light and reception
Light.
When implementing, after the completion of plastic packaging, the upper surface of described living body finger print sensor is preferably in same level, profit
In follow-up horizontal abutment technique.I.e. described optical transmitting set 2 and optical sensor 3 are connected electrically in described identification chip 1 upper surface, so
Carry out surface plastic packaging afterwards again, the upper surface of plastic packaging layer is preferably concordant with the upper surface of described optical transmitting set 2 and optical sensor 3.Institute
State optical transmitting set 2 and be preferably LED, described optical sensor 3 is preferably photodiode, but is not limited to this.
Step 2, offer UV glue 4, are covered in described non-plastic packaging area 12, are carried out UV solidification.
When implementing, UV glue 4 is put on the surface of described optical transmitting set 2 and optical sensor 3 respectively it is necessary to cover completely
Lid, then carries out UV solidification, 40 ~ 70 DEG C of solidification temperature, light accumulated amount >=3500mj/cm.
Step 3, offer laminating glue 5, are covered on described surface to be fit, laminating relative with cover plate 6, and solidification is
Can.
When implementing, by liquid resin glue spots in the upper surface of described identification chip 1, it is completely covered, with cover plate 6 phase
After laminating, carry out heat cure, solidification temperature is 100 ~ 140 DEG C, hardening time is 30 ~ 60min, glue 5 cured thickness of fitting
For 15 ~ 35 μm.
For effect of realizing preferably fitting, when implementing, non-plastic packaging area 12 must all be covered by described UV glue 4,
Note also and management and control is carried out to glue thickness, for not affecting glue 5 laminating cover plate 6 of fitting, the cured thickness of UV glue 4 is less than（≤）Patch
The 1/2 of rubber alloy water 5 cured thickness.
The fingerprint module outward appearance produced by the applying method of the present invention can't see any indenture, solves module well
Laminating problem of appearance, lifts Consumer's Experience, is more beneficial for the popularization of fingerprint module；Process is simple, easy to operate, beneficial to industry
Change, there is preferable economic benefit.
It should be noted that described UV glue 4 is no shadow glue, also known as light-sensitive emulsion, ultraviolet cured adhesive, no shadow glue is that one kind must
Must be by a ultraviolet light irradiation just curable class adhesive, it can use as bonding agent, also can be used as paint, painting
The sizing material of material, ink etc. uses.UV is the abbreviation of English Ultraviolet Rays, i.e. ultraviolet light.Ultraviolet（UV）It is meat
Can not see, be one section of electromagnetic radiation beyond visible ray, wavelength is in the scope of 110 ~ 400nm.No shadow adhesive curing principle is
Light trigger in UV curing materials（Or sensitising agent）Under ultraviolet irradiation absorb ultraviolet light after produce living radical or
Cation, trigger monomer polymerization, cross-linking chemistry reaction, make adhesive be converted into solid-state by liquid within the several seconds.Institute of the present invention
The UV glue 4 being related to and laminating glue 5 all can be using conventional UV glue 4 and laminating glue 5.
It should be noted that can be suitable for this if the capsulation material on the surface to be fit of fingerprint sensor has difference
Applying method.The described fingerprint sensor of the present invention is the sensor of traditional living body finger print module or optical finger print module,
It is the known technology that is easy to get in those skilled in the art.Generally, described living body finger print sensor or optical fingerprint sensor
There is an identification chip 1 and the optical transmitting set 2 being located on the same surface of chip and optical sensor 3；Described identification chip 1 respectively with
Described optical transmitting set 2 and optical sensor 3 connect, for driving described optical transmitting set 2 and the electric signal of reception optical sensor 3 to carry out
Spectral information detects, to realize spectral fingerprint identification function.Described optical transmitting set 2 and optical sensor 3 are preferably symmetric about the axis
Ground arrangement, comparably to carry out multiple measurements in different positions.The present invention is not to described living body finger print sensor or light
Learn fingerprint sensor to improve, can adopt the living body finger print sensor of existing structure or optical fingerprint sensor, different finger
Its identification chip 1 of line module can be variant, and recognition principle is different, but fingerprint sensor and recognition principle are prior art,
This does not repartition detailed description.
It should be noted that described optical transmitting set 2 is as the monochrome of spectral matching factor or quasi-monochromatic light transmitter 2, Ke Yishi
Common light emitting diode（LED）Or it is suitable for any kind of optical transmitting set 2 of this measurement（As laser instrument, band filter
White light of device etc.）, present invention preferably employs LED, the light launched is preferably in ruddiness with close to infrared light model
Enclose, for this scope, not only light can penetrate into skin well, and produces good responding and make to adopt from blood
Produce enough sensitiveness with the detector that silicon manufactures.If desired using multiple color, then multiple LED are adopted.Optical sensor 3 is
The optical signal of reception is converted into electric signal, preferably photodiode（PD）.
Present invention also offers a kind of fingerprint module, as shown in figure 3, it includes fingerprint sensor, UV glue 4, laminating glue 5
With cover plate 6；Described fingerprint sensor includes identification chip 1, optical transmitting set 2 and being located on the same surface of described identification chip 1
Optical sensor 3, described optical transmitting set 2 and optical sensor 3 are connected with described identification chip 1 respectively；Described UV glue 4 is respectively overlay in
On described optical transmitting set 2 and optical sensor 3；Described laminating glue 5 covers on the integral surface of described fingerprint sensor, will
The laminating relative with cover plate 6 of described fingerprint sensor is fixed.Wherein, described laminating glue 5 encases described UV glue 4.
For effect of realizing preferably fitting, when implementing, described UV glue 4 must be by optical transmitting set 2 and optical sensor 3
All cover, note also and management and control is carried out to glue thickness, for not affecting glue 5 laminating cover plate 6 of fitting, the cured thickness of UV glue 4 is not
Exceed（≤）The 1/2 of laminating glue 5 cured thickness.
It should be noted that described fingerprint sensor is traditional living body finger print sensor or optical fingerprint sensor, in
Those skilled in the art are the known technology that is easy to get, and described fingerprint sensor, identification chip 1 and recognition principle are prior art,
Will not be described in detail herein.
It should be noted that described optical transmitting set 2 is as the monochrome of spectral matching factor or quasi-monochromatic light transmitter 2, Ke Yishi
Common light emitting diode（LED）Or it is suitable for any kind of optical transmitting set 2 of this measurement（As laser instrument, band filter
White light of device etc.）, present invention preferably employs LED, the light launched is preferably in ruddiness with close to infrared light model
Enclose, for this scope, not only light can penetrate into skin well, and produces good responding and make to adopt from blood
Produce enough sensitiveness with the detector that silicon manufactures.If desired using multiple color, then multiple LED are adopted.Optical sensor 3 is
The optical signal of reception is converted into electric signal, preferably photodiode（PD）.
Compared with existing living body finger print module or optical finger print module, the fingerprint module of the present invention passes through dispensing twice admittedly
Change, its outward appearance can't see any indenture, solve module laminating problem of appearance well, lift Consumer's Experience, be more beneficial for live body
The popularization of fingerprint；Structure is simple, beneficial to industrialization, has preferable economic benefit.
Present invention also offers a kind of described fingerprint module is in door lock, safety cabinet, vehicle-mounted, intelligent mobile terminal and/or electricity
Application on the first-class electronic product of brain.
Embodiment described above only have expressed embodiments of the present invention, and its description is more concrete and detailed, but can not
Therefore it is interpreted as the restriction to the scope of the claims of the present invention, as long as the skill being obtained in the form of equivalent or equivalent transformation
Art scheme, all should fall within the scope and spirit of the invention.
Claims (10)
1. a kind of applying method solving fingerprint module outward appearance indenture, it comprises the following steps：There is provided a fingerprint sensor, it is treated
Coating surface has plastic packaging area and non-plastic packaging area；UV glue is provided, is covered in described non-plastic packaging area, carry out UV solidification；Carry
For glue of fitting, covered on described surface to be fit, laminating relative with cover plate, solidify.
2. the applying method solving fingerprint module outward appearance indenture according to claim 1 is it is characterised in that described UV glue is solid
Change the 1/2 of thickness≤described laminating glue curing thickness.
3. the applying method solving fingerprint module outward appearance indenture according to claim 1 and 2 is it is characterised in that described patch
Rubber alloy water is liquid resin glue.
4. the applying method solving fingerprint module outward appearance indenture according to claim 3 is it is characterised in that described fingerprint passes
Sensor is living body finger print sensor and optical fingerprint sensor.
5. the applying method of the solution fingerprint module outward appearance indenture according to claim 1 or 4 is it is characterised in that described finger
The non-plastic packaging area of line sensor is respectively optical transmitting set and optical sensor, and described optical transmitting set is used for emitting light into finger, described
Optical sensor is used for receiving to be handled the light that digital reflex returns and is converted into electric signal.
6. the applying method solving living body finger print outward appearance indenture according to claim 5 is it is characterised in that described light is launched
Device and optical sensor are arranged symmetric about the axisly.
7. the applying method solving living body finger print outward appearance indenture according to claim 5 is it is characterised in that described light is launched
Device is light emitting diode.
8. the applying method solving living body finger print outward appearance indenture according to claim 5 is it is characterised in that described light sensing
Device is photodiode.
9. a kind of fingerprint module is it is characterised in that it is obtained by the arbitrary described applying method laminating of claim 1 to 8.
10. a kind of fingerprint module as claimed in claim 9 is in door lock, safety cabinet, vehicle-mounted, intelligent mobile terminal and/or computer
On application.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611096160.6A CN106407967B (en) | 2016-12-02 | 2016-12-02 | A kind of fingerprint mould group and its applying method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611096160.6A CN106407967B (en) | 2016-12-02 | 2016-12-02 | A kind of fingerprint mould group and its applying method and application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106407967A true CN106407967A (en) | 2017-02-15 |
| CN106407967B CN106407967B (en) | 2019-11-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611096160.6A Active CN106407967B (en) | 2016-12-02 | 2016-12-02 | A kind of fingerprint mould group and its applying method and application |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109508617A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲生物识别技术有限公司 | The manufacturing method of optical finger print recognizer component |
| CN109753845A (en) * | 2017-11-02 | 2019-05-14 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
| CN110390233A (en) * | 2018-04-20 | 2019-10-29 | 上海箩箕技术有限公司 | Fingerprint imaging mould group and electronic equipment |
| CN111415578A (en) * | 2020-03-05 | 2020-07-14 | 深圳全息界科技有限公司 | Display device attaching process |
| US11068683B2 (en) | 2018-11-05 | 2021-07-20 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display device and method for attaching fingerprint module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110108851A1 (en) * | 2009-11-06 | 2011-05-12 | Semileds Optoelectronics Co., Ltd., a Taiwan Corporation | Vertical light emitting diode having an outwardly disposed electrode |
| CN104037136A (en) * | 2013-03-08 | 2014-09-10 | 台湾积体电路制造股份有限公司 | Reinforcement Structure And Method For Controlling Warpage Of Chip Mounted On Substrate |
| CN104182736A (en) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification sensor packaging structure and method |
| CN205281517U (en) * | 2014-12-09 | 2016-06-01 | Lg伊诺特有限公司 | Fingerprint sensor |
-
2016
- 2016-12-02 CN CN201611096160.6A patent/CN106407967B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110108851A1 (en) * | 2009-11-06 | 2011-05-12 | Semileds Optoelectronics Co., Ltd., a Taiwan Corporation | Vertical light emitting diode having an outwardly disposed electrode |
| CN104037136A (en) * | 2013-03-08 | 2014-09-10 | 台湾积体电路制造股份有限公司 | Reinforcement Structure And Method For Controlling Warpage Of Chip Mounted On Substrate |
| CN104182736A (en) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification sensor packaging structure and method |
| CN205281517U (en) * | 2014-12-09 | 2016-06-01 | Lg伊诺特有限公司 | Fingerprint sensor |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109508617A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲生物识别技术有限公司 | The manufacturing method of optical finger print recognizer component |
| CN109753845A (en) * | 2017-11-02 | 2019-05-14 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
| CN109753845B (en) * | 2017-11-02 | 2024-04-26 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
| CN110390233A (en) * | 2018-04-20 | 2019-10-29 | 上海箩箕技术有限公司 | Fingerprint imaging mould group and electronic equipment |
| US11068683B2 (en) | 2018-11-05 | 2021-07-20 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display device and method for attaching fingerprint module |
| CN111415578A (en) * | 2020-03-05 | 2020-07-14 | 深圳全息界科技有限公司 | Display device attaching process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106407967B (en) | 2019-11-08 |
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Effective date of registration: 20201208 Address after: 1 / F, building 23, Xinli industrial town, Industrial Avenue, Shanwei City, Guangdong Province Patentee after: Xinli photoelectric technology (Shanwei) Co., Ltd Address before: 516600, 15 industrial zone, Xinli Industrial Road, Shanwei City, Guangdong, Shanwei Patentee before: TRULY OPTO-ELECTRONICS Ltd. |
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