CN106653708A - Fingerprint identification module and packaging method thereof - Google Patents

Fingerprint identification module and packaging method thereof Download PDF

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Publication number
CN106653708A
CN106653708A CN201611139155.9A CN201611139155A CN106653708A CN 106653708 A CN106653708 A CN 106653708A CN 201611139155 A CN201611139155 A CN 201611139155A CN 106653708 A CN106653708 A CN 106653708A
Authority
CN
China
Prior art keywords
fingerprint recognition
ink
matrix
chip
recognition module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611139155.9A
Other languages
Chinese (zh)
Inventor
朱文辉
赖芳奇
吕军
沙长青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU KEYANG PHOTOELECTRIC TECHNOLOGY Co Ltd
Original Assignee
SUZHOU KEYANG PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU KEYANG PHOTOELECTRIC TECHNOLOGY Co Ltd filed Critical SUZHOU KEYANG PHOTOELECTRIC TECHNOLOGY Co Ltd
Priority to CN201611139155.9A priority Critical patent/CN106653708A/en
Publication of CN106653708A publication Critical patent/CN106653708A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K9/00Methods or arrangements for reading or recognising printed or written characters or for recognising patterns, e.g. fingerprints
    • G06K9/00006Acquiring or recognising fingerprints or palmprints
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3171Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer

Abstract

The invention discloses a fingerprint identification module and a packaging method thereof, and relates to the technical field of fingerprint identification module packaging. The method comprises the steps of providing a glass substrate and fully filling the glass substrate with ink to form an ink cover plate; providing a fingerprint identification chip matrix and pasting the fingerprint identification chip matrix on the surface of an ink substrate; injecting filling into the surface of the ink cover plate around a fingerprint identification chip in the fingerprint identification chip matrix, controlling the filling to be flush to or lower than the fingerprint identification chip and exposing an induction area of the fingerprint identification chip to obtain a fingerprint identification module matrix; and cutting the fingerprint identification module matrix to obtain the fingerprint identification module. By adopting the technical scheme, the filling is located around the fingerprint identification chip, no filling is located in the induction area of the fingerprint identification chip, and the induction area of the fingerprint identification chip is exposed, so that the sensitivity of fingerprint identification can be strengthened.

Description

A kind of fingerprint recognition module and its method for packing
Technical field
The present invention relates to fingerprint recognition module packaging technical field, more particularly to a kind of fingerprint recognition module and its encapsulation side Method.
Background technology
With the fast development of mobile intelligent terminal technology, user is increasing to the demand of mobile terminal, while to moving The requirement of dynamic intelligent terminal experience also more and more higher.Biological identification technology is also constantly being applied to mobile intelligent terminal.Its In, fingerprint identification technology is one of technology that most ripe and consumer most pays close attention to, and with mobile payment security requirement Improve constantly, fingerprint recognition module will become the indispensable device of the equipment such as mobile intelligent terminal, Mobile payment terminal, and, refer to The sensitivity of line identification day by day becomes the research emphasis of fingerprint recognition module.
The principle of fingerprint recognition is substantially:Fingerprint recognition module reads finger print data, then transmits finger print data Module sensor is given, finally by fingerprint reading systems somatic fingerprint image is read.
But, in prior art, fingerprint recognition module is in encapsulation process in the chip induction region of fingerprint recognition module Plastic packaging defines the plastic packaging glue of thickness about 100um thickness, because the dielectric constant of plastic packaging glue is low, therefore causes the spirit of fingerprint recognition Sensitivity is limited.
The content of the invention
In view of this, the embodiment of the present invention provides a kind of fingerprint recognition module and its method for packing, to solve existing fingerprint The relatively low technical problem of fingerprint recognition sensitivity is caused during identification module packaging due to forming thicker packaging plastic.
In a first aspect, one kind is embodiments provided, the method for packing of fingerprint recognition module, including:
One glass substrate, and the full-filling ink on the glass substrate are provided, ink cover plate is formed;
One fingerprint recognition chip matrix is provided, the fingerprint recognition chip matrix is pasted onto into the table of the ink substrate Face;
Ink lid surface injection inserts in the fingerprint recognition chip matrix around fingerprint identification chip, Control the inserts to flush or less than the fingerprint recognition chip, expose the induction zone of the fingerprint recognition chip, obtain To fingerprint recognition module matrix;
The fingerprint recognition module matrix is cut, fingerprint recognition module is obtained.
Optionally, it is described to obtain after fingerprint recognition module matrix, also including:
The fingerprint recognition module matrix is placed and is heated in a mold, until the inserts is fully cured.
Optionally, the inserts is plastic packaging glue.
Optionally, the full-filling ink on the glass substrate, forms ink cover plate, including:
By the way of rotation full-filling, the full-filling ink on the glass substrate forms ink cover plate.
Optionally, the fingerprint recognition chip matrix is pasted onto after the surface of the ink substrate, is also included:
The ink cover plate for being pasted with the fingerprint recognition chip matrix is carried out into whole face pressure conjunction, until glue used when pasting Water-setting is consolidated.
Optionally, inserts is injected into the ink cover plate, including:
The ink cover plate is fixed using fixing mould, and set amount is injected into the ink cover plate using injection machine Inserts.
Optionally, it is described to obtain after fingerprint recognition module, also including:
Surface mount is carried out to the fingerprint recognition module using surface mounting technology.
Second aspect, the embodiment of the present invention additionally provides a kind of fingerprint recognition module, using the fingerprint described in first aspect The method for packing encapsulation of identification module is obtained, including:
Glass substrate;
Positioned at the ink of the glass baseplate surface;
Fingerprint recognition chip above the ink;
Positioned at the inserts of the fingerprint recognition chip circumference, the inserts is flushed or less than the fingerprint recognition core Piece, the induction zone of the fingerprint chip exposes outside.
Optionally, the thickness of the ink is 2-15um.
Optionally, the shape of the fingerprint recognition module includes following at least one:
Circular, rectangle or ellipse.
Fingerprint recognition module provided in an embodiment of the present invention and its method for packing, by providing a glass substrate, and in glass Full-filling ink on glass substrate, forms ink cover plate, there is provided a fingerprint recognition chip matrix, and fingerprint recognition chip matrix is pasted onto The surface of ink substrate, the ink lid surface injection in the fingerprint recognition chip matrix around fingerprint identification chip Inserts, control inserts is flushed or less than fingerprint recognition chip, exposes the induction zone of fingerprint recognition chip, obtains fingerprint Identification module matrix, cuts to the fingerprint recognition module matrix, obtains fingerprint recognition module.Using above-mentioned technical side Case, inserts is located at around fingerprint recognition chip, without inserts on the induction zone of fingerprint recognition chip, exposes fingerprint knowledge The induction zone of other chip, can strengthen the sensitivity of fingerprint recognition, can solve during existing fingerprint recognition module packaging by The relatively low technical problem of fingerprint recognition sensitivity is caused in the packaging plastic for forming thicker.
Description of the drawings
In order to clearly illustrate the technical scheme of exemplary embodiment of the present, below to describing needed for embodiment The accompanying drawing to be used does a simple introduction.Obviously, the accompanying drawing introduced is the present invention a part of embodiment to be described Accompanying drawing, rather than the accompanying drawing of whole, for those of ordinary skill in the art, on the premise of not paying creative work, may be used also To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is a kind of schematic flow sheet of the method for packing of fingerprint recognition module provided in an embodiment of the present invention;
Fig. 2 a are a kind of schematic top plan views of glass substrate provided in an embodiment of the present invention;
Fig. 2 b are a kind of schematic cross-sections of glass substrate provided in an embodiment of the present invention;
Fig. 3 a are a kind of schematic top plan views for forming ink on the glass substrate provided in an embodiment of the present invention;
Fig. 3 b are a kind of schematic cross-sections for forming ink on the glass substrate provided in an embodiment of the present invention;
Fig. 4 a are that a kind of vertical view that fingerprint recognition chip matrix is pasted on ink cover plate provided in an embodiment of the present invention is shown It is intended to;
Fig. 4 b are that a kind of section that fingerprint recognition chip matrix is pasted on ink cover plate provided in an embodiment of the present invention shows It is intended to;
Fig. 5 a are a kind of schematic top plan views that inserts is injected in ink lid surface provided in an embodiment of the present invention;
Fig. 5 b are a kind of schematic cross-sections that inserts is injected in ink lid surface provided in an embodiment of the present invention;
Fig. 6 a are a kind of amplification schematic top plan views of the fingerprint recognition module in Fig. 5 a shown in part A;
Fig. 6 b are a kind of amplification schematic cross-sections of the fingerprint recognition module in Fig. 5 a shown in part A.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below with reference to the embodiment of the present invention in it is attached Figure, by specific embodiment, is fully described by technical scheme.Obviously, described embodiment is of the invention A part of embodiment, rather than the embodiment of whole, based on embodiments of the invention, those of ordinary skill in the art are not doing The every other embodiment obtained on the premise of going out creative work, each falls within protection scope of the present invention.
Embodiment
Fig. 1 is a kind of schematic flow sheet of the method for packing of fingerprint recognition module provided in an embodiment of the present invention, the present invention Embodiment provides a kind of method for packing of fingerprint recognition module.Refer to Fig. 1, fingerprint recognition module provided in an embodiment of the present invention Method for packing may comprise steps of:
S110, one glass substrate of offer, and the full-filling ink on the glass substrate, form ink cover plate.
Exemplary, Fig. 2 a are a kind of schematic top plan views of glass substrate provided in an embodiment of the present invention, as shown in Figure 2 a, The shape of glass substrate 10 can be circle, optionally, the shape of glass substrate 10 can also for rectangle, triangle or other Shape, is not defined to the shape of glass substrate 10 in the embodiment of the present invention, is only explained with circular glass substrate. Fig. 2 b are a kind of schematic cross-section of glass substrate provided in an embodiment of the present invention, as shown in Figure 2 b, the thickness of glass substrate 10 Can be selected according to actual conditions, the embodiment of the present invention is not equally defined to the thickness of glass substrate 10.
Further, full-filling ink 20 on the glass substrate 10, forms ink cover plate, as shown in Figure 3 a and Figure 3 b shows.It is optional , can be so that by the way of rotation full-filling, on the glass substrate 10 full-filling ink 20, forms ink cover plate, specifically, using rotation The mode for turning full-filling forms ink cover plate and can use the equipment of rotating serial and mixing apparatus etc. of color ink, by glass base Plate 10 is positioned on the equipment of rotation at a high speed, is set drive glass substrate 10 by rotation and is rotated at a high speed, and ink 20 is uniform Full-filling is on the glass substrate 10.Optionally, the thickness range for adopting the ink that the mode of rotary filling inking formed can be 2- 15um, the uniformity of ink 20 can accomplish within ± 2um, if ink thickness fails to reach demand and can also be filled out again Apply to increase thickness, fully achieve any thickness requirement.
To sum up, on the glass substrate using rotation full-filling by the way of form ink cover plate, ink cover plate not only can be ensured Being uniformly distributed for curing ink, can also realize any ink thickness requirement, it is ensured that ink cover plate prepares yield, lift ink cover plate Preparation efficiency.
S120, one fingerprint recognition chip matrix of offer, by the fingerprint recognition chip matrix ink substrate is pasted onto Surface.
Exemplary, Fig. 4 a are that one kind provided in an embodiment of the present invention pastes fingerprint recognition chip matrix on ink cover plate Schematic top plan view, Fig. 4 b be it is provided in an embodiment of the present invention it is a kind of on ink cover plate paste fingerprint recognition chip matrix cut Face schematic diagram, as shown in figures 4 a and 4b, the meaning of the fingerprint recognition chip matrix of offer one described in the embodiment of the present invention can be with It is interpreted as providing multiple fingerprint recognition chips 30, multiple fingerprint recognition chips 30 are pasted onto the surface of ink cover plate, specifically, glues The multiple fingerprint recognition chips 30 for being attached to ink lid surface can be with matrix arrangement on the ink cover plate.Optionally, fingerprint Identification chip 30 can include the induction zone for being located at upper surface and the lower surface being oppositely arranged with the upper surface, the sensing Area is used to sense fingerprint signal, and the lower surface is used to be pasted with ink cover plate.Optionally, there is provided fingerprint recognition chip square After battle array, dispensing and laminating are carried out to fingerprint recognition chip matrix, can use glue or double faced adhesive tape by fingerprint recognition chip Matrix is pasted onto the surface of ink cover plate.Optionally, it can refer to fingerprint recognition chip matrix to be pasted onto on ink cover plate The contraposition of line identification chip is pasted onto the chip mounting location of ink cover plate, such as center, it is ensured that fingerprint recognition chip matrix After the completion of stickup, the surface surrounding of ink cover plate leaves vacant position.
Further, the fingerprint recognition chip matrix is pasted onto after the surface of the ink substrate, is also included:
The ink cover plate for being pasted with the fingerprint recognition chip matrix is carried out into whole face pressure conjunction, until glue used when pasting Water-setting is consolidated.
Exemplary, it is possible to use the ink cover plate for being pasted with fingerprint recognition chip matrix is carried out whole face pressure by press equipment Close, it is ensured that the multiple fingerprint recognition chips 30 in fingerprint recognition chip matrix with ink cover plate firm pasting.If using glue Fingerprint recognition chip matrix is pasted onto on ink cover plate, during whole face pressure is closed, needs to ensure glue used when pasting Solidify completely, it is to avoid because glue causes to be pasted not strongly without solidification completely, the problem that fingerprint recognition chip comes off.
S130, to around fingerprint identification chip in the fingerprint recognition chip matrix the ink lid surface injection fill out Charge, controls the inserts and flushes or less than the fingerprint recognition chip, expose the sensing of the fingerprint recognition chip Area, obtains fingerprint recognition module matrix.
Exemplary, Fig. 5 a are that a kind of vertical view for injecting inserts in ink lid surface provided in an embodiment of the present invention is shown Be intended to, Fig. 5 b be it is provided in an embodiment of the present invention it is a kind of ink lid surface inject inserts schematic cross-section, such as Fig. 5 a With the ink lid surface injection inserts 40 shown in Fig. 5 b, in fingerprint recognition chip matrix around fingerprint identification chip 30 When, need to ensure that inserts 40 is flushed or less than fingerprint recognition chip 30, it is ensured that positioned at the sense of the upper surface of fingerprint recognition chip 30 Area is answered to be completely exposed.Specifically, can be according to the queueing discipline of fingerprint identification chip 30 in fingerprint recognition chip matrix, to ink Lid surface injects inserts 40, i.e., inserts 40 is injected in the gap of multiple fingerprint recognition chips 30.Optionally, can be with head First the ink cover plate is fixed using fixing mould, then using injection machine to the ink cover plate table around fingerprint recognition chip 30 The inserts 40 of set amount is injected in face, and control inserts 40 is flushed or less than fingerprint recognition chip 30, so obtains fingerprint knowledge Other module matrix.Optionally, the inserts 40 of set amount, the set amount can according to the quantity of fingerprint recognition chip 30 and Spacing between fingerprint recognition chip 30 determines.It is understood that only flushing fingerprint recognition chip with inserts 40 in Fig. 5 b 30 are explained explanation, and inserts 40 can also be less than fingerprint recognition chip 30 in the embodiment of the present invention, for example, ensureing to refer to Under the premise of line identification chip 30 is firm, the 90%-100% of the height for the height of fingerprint recognition chip 30 of inserts 40 is set.
Optionally, inserts 40 can be plastic packaging glue or other capsulation materials, and the embodiment of the present invention is not equally to filling The type of material 40 is defined.
In sum, control inserts to flush or less than fingerprint recognition chip, it is ensured that the sense of fingerprint recognition chip surface Area is answered to be completely exposed, it is ensured that induction zone with fingerprint signal directly contact, can lift the identification sensitivity of fingerprint signal, can keep away Exempt from weakening of the inserts for fingerprint signal.
Further, it is described to obtain after fingerprint recognition module matrix, also including:
The fingerprint recognition module matrix is placed and is heated in a mold, until inserts 40 is fully cured.
Exemplary, fingerprint recognition module matrix can be placed in heating mould and be heated, it is ensured that inserts 40 It is fully cured, it is ensured that fingerprint recognition module matrix is consolidated.
S140, the fingerprint recognition module matrix is cut, obtain fingerprint recognition module.
Exemplary, the fingerprint recognition module matrix is corresponding with the fingerprint recognition chip matrix, the fingerprint recognition Module matrix includes multiple fingerprint recognition modules, can the fingerprint recognition module matrix cut, obtain fingerprint knowledge Other module.Optionally, it is possible to use cutting tool cuts to fingerprint recognition module matrix, multiple fingerprint recognition moulds are obtained Group, for example, can be cut using glass cutter to fingerprint recognition module matrix, obtain fingerprint recognition module, it is also possible to make Fingerprint recognition module matrix is cut with the method for laser cutting, obtains fingerprint recognition module, it is preferred that can be using sharp The method of light cutting obtains fingerprint recognition module, and fingerprint recognition module matrix is cut using laser, it is ensured that cutting Precision.Specifically, Fig. 6 a are a kind of amplification schematic top plan views of the fingerprint recognition module in Fig. 5 a shown in part A, and Fig. 6 b are A kind of amplification schematic cross-section of the fingerprint recognition module in Fig. 5 a shown in part A, as shown in figures 6 a and 6b, the fingerprint is known The shape of other module can be matrix, and optionally, the shape of the fingerprint recognition module can also be circular, ellipse or three It is angular, the shape of fingerprint recognition module is not defined in the embodiment of the present invention, only solved with matrix fingerprint identification module Release explanation.
Further, after obtaining fingerprint recognition module, can also include that carrying out edge to the fingerprint recognition module grinds Mill, can be specifically that the edge to the ink cover plate in fingerprint recognition module is ground, and obtain entire fingerprint recognition Module.
Further, it is described to obtain after fingerprint recognition module, to include:
Surface mount is carried out to the fingerprint recognition module using surface mounting technology.
Exemplary, surface mounting technology (Surface Mounting Technology, SMT) is a kind of Electronic Assemblies Technology, after fingerprint recognition module is obtained, surface mount is carried out using SMT flow processs to fingerprint recognition module.
Fingerprint recognition module provided in an embodiment of the present invention and its method for packing, by providing a glass substrate, and in glass Full-filling ink on glass substrate, forms ink cover plate, there is provided a fingerprint recognition chip matrix, and fingerprint recognition chip matrix is pasted onto The surface of ink substrate, the ink lid surface injection in the fingerprint recognition chip matrix around fingerprint identification chip Inserts, control inserts is flushed or less than fingerprint recognition chip, exposes the induction zone of fingerprint recognition chip, obtains fingerprint Identification module matrix, cuts to the fingerprint recognition module matrix, obtains fingerprint recognition module.Using above-mentioned technical side Case, inserts is located at around fingerprint recognition chip, without inserts on the induction zone of fingerprint recognition chip, exposes fingerprint knowledge The induction zone of other chip, can strengthen the sensitivity of fingerprint recognition, can solve during existing fingerprint recognition module packaging by The relatively low technical problem of fingerprint recognition sensitivity is caused in the packaging plastic for forming thicker.Also, encapsulated using above-mentioned technical proposal The fingerprint recognition module for obtaining, module thickness can be reduced a lot, meet the frivolous development trend of fingerprint class product, also, Using above-mentioned method for packing, packaging technology is simple, and once encapsulation can form multiple fingerprint recognition modules, improve fingerprint recognition Packaging efficiency.
The embodiment of the present invention also provides a kind of fingerprint recognition module, equally may be referred to Fig. 6 b, and the embodiment of the present invention is provided Fingerprint recognition module can include:
Glass substrate 10;
Positioned at the ink 20 on the surface of glass substrate 10;
Positioned at the fingerprint recognition chip 30 of the top of ink 20;
Inserts 40 around fingerprint recognition chip 30, inserts 40 is flushed or less than fingerprint recognition chip 30, The induction zone of fingerprint recognition chip 30 exposes outside.
Optionally, the thickness of the ink is 2-15um.
Optionally, the shape of the fingerprint recognition module includes following at least one:
Circular, rectangle or ellipse.
Fingerprint recognition module provided in an embodiment of the present invention can adopt fingerprint recognition module provided in an embodiment of the present invention Method for packing encapsulation obtain, fingerprint recognition module provided in an embodiment of the present invention does not have on the induction zone of fingerprint recognition chip Inserts, inserts is only positioned at around fingerprint recognition chip, it is ensured that expose the induction zone of fingerprint recognition chip, fingerprint recognition The induction zone of chip with directly contact, can strengthen the sensitivity of fingerprint recognition with fingerprint signal, it is to avoid inserts is believed for fingerprint Number weakening.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious changes, Readjust and substitute without departing from protection scope of the present invention.Therefore, although the present invention is carried out by above example It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also More other Equivalent embodiments can be included, and the scope of the present invention is determined by scope of the appended claims.

Claims (10)

1. a kind of method for packing of fingerprint recognition module, it is characterised in that include:
One glass substrate, and the full-filling ink on the glass substrate are provided, ink cover plate is formed;
One fingerprint recognition chip matrix is provided, the fingerprint recognition chip matrix is pasted onto into the surface of the ink substrate;
Ink lid surface injection inserts in the fingerprint recognition chip matrix around fingerprint identification chip, control The inserts is flushed or less than the fingerprint recognition chip, exposes the induction zone of the fingerprint recognition chip, is referred to Line recognizes module matrix;
The fingerprint recognition module matrix is cut, fingerprint recognition module is obtained.
2. method according to claim 1, it is characterised in that described to obtain after fingerprint recognition module matrix, also including:
The fingerprint recognition module matrix is placed and is heated in a mold, until the inserts is fully cured.
3. method according to claim 2, it is characterised in that the inserts is plastic packaging glue.
4. method according to claim 1, it is characterised in that the full-filling ink on the glass substrate, forms ink lid Plate, including:
By the way of rotation full-filling, the full-filling ink on the glass substrate forms ink cover plate.
5. method according to claim 1, it is characterised in that the fingerprint recognition chip matrix is pasted onto into the ink After the surface of substrate, also include:
The ink cover plate for being pasted with the fingerprint recognition chip matrix is carried out into whole face pressure conjunction, until glue used when pasting coagulates Gu.
6. method according to claim 1, it is characterised in that inject inserts into the ink cover plate, including:
The ink cover plate is fixed using fixing mould, and injects the filling of set amount into the ink cover plate using injection machine Material.
7. the method according to any one of claim 1-6, described to obtain after fingerprint recognition module, also including:
Surface mount is carried out to the fingerprint recognition module using surface mounting technology.
8. a kind of fingerprint recognition module, is encapsulated using the method for packing of the fingerprint recognition module described in any one of claim 1-7 Obtain, it is characterised in that include:
Glass substrate;
Positioned at the ink of the glass baseplate surface;
Fingerprint recognition chip above the ink;
Positioned at the inserts of the fingerprint recognition chip circumference, the inserts is flushed or less than the fingerprint recognition chip, The induction zone of the fingerprint recognition chip exposes outside.
9. fingerprint recognition module according to claim 8, it is characterised in that the thickness of the ink is 2-15um.
10. fingerprint identification module according to claim 8, it is characterised in that the shape of the fingerprint recognition module includes Following at least one:
Circular, rectangle or ellipse.
CN201611139155.9A 2016-12-12 2016-12-12 Fingerprint identification module and packaging method thereof Pending CN106653708A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108460373A (en) * 2018-05-02 2018-08-28 厦门天马微电子有限公司 A kind of fingerprint sensor and display panel
CN108962842A (en) * 2017-05-26 2018-12-07 南茂科技股份有限公司 The encapsulating structure and its manufacturing method of fingerprint recognition chip

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104201116A (en) * 2014-09-12 2014-12-10 苏州晶方半导体科技股份有限公司 Fingerprint identification chip packaging method and fingerprint identification chip packaging structure
CN104966700A (en) * 2015-06-04 2015-10-07 南昌欧菲生物识别技术有限公司 Chip module cover plate, chip module package structure and electronic device
CN105551985A (en) * 2016-01-21 2016-05-04 昆山紫芯微电子科技有限公司 Packaging method for fingerprint identification module, and fingerprint identification module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104201116A (en) * 2014-09-12 2014-12-10 苏州晶方半导体科技股份有限公司 Fingerprint identification chip packaging method and fingerprint identification chip packaging structure
CN104966700A (en) * 2015-06-04 2015-10-07 南昌欧菲生物识别技术有限公司 Chip module cover plate, chip module package structure and electronic device
CN105551985A (en) * 2016-01-21 2016-05-04 昆山紫芯微电子科技有限公司 Packaging method for fingerprint identification module, and fingerprint identification module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108962842A (en) * 2017-05-26 2018-12-07 南茂科技股份有限公司 The encapsulating structure and its manufacturing method of fingerprint recognition chip
CN108460373A (en) * 2018-05-02 2018-08-28 厦门天马微电子有限公司 A kind of fingerprint sensor and display panel

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