CN107273787A - The optical fingerprint sensing device further and its manufacture method that infrared can be penetrated - Google Patents
The optical fingerprint sensing device further and its manufacture method that infrared can be penetrated Download PDFInfo
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- CN107273787A CN107273787A CN201710194836.3A CN201710194836A CN107273787A CN 107273787 A CN107273787 A CN 107273787A CN 201710194836 A CN201710194836 A CN 201710194836A CN 107273787 A CN107273787 A CN 107273787A
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- infrared
- penetrated
- fingerprint sensing
- device further
- sensing device
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
A kind of optical fingerprint sensing device further and its manufacture method that infrared can be penetrated, is that ultraviolet light photopolymerization layer is initially formed on leaded light component, then by ultraviolet light photopolymerization layer can and infrared light penetrated bed carry out good combination；By the above method, infrared light penetrated bed can be strengthened in the laminating intensity on leaded light component, it is not easy to peel off, can effectively block the light of necessarily wavelength, and then sensitivity and the accuracy of fingerprint sensing can be lifted.
Description
Technical field
The invention relates to a kind of optical fingerprint sensing device further, particularly a kind of optical fingerprint that infrared can be penetrated
Sensing device further and its manufacture method.
Background technology
Fingerprint identification technology is one kind in biometrics identification technology, and it senses fingerprint characteristic exclusive on human finger
To be recognized, it is widely applied with its advantage in terms of security and convenience.Optical fingerprint sensing device further is
Reflection is produced in finger contact surface using the light sent in light source, and collects the light that reflects to form fingermark image,
, penetration power shorter compared to the wavelength of visible ray is weaker, it is not easy to obtain clearly fingermark image, infrared light because its wavelength compared with
Long, penetration power is strong, is gradually used as carrying out the light source of optical fingerprint sensing so that the sensing of fingermark image and interpretation are more smart
It is accurate.Even if however, being illuminated using infrared light light source, inevitably, capture process still can be by visible ray in environment
Interference.
Known have a kind of infrared light and penetrate piece (IR pass), can will be seen that light reflection or absorb, allow infrared light to penetrate,
The surface of laminating glass baseplate is commonly available to, the engagement with other materials is then easier to cause peeling；But current light
Leaded light component used in formula fingerprint acquisition apparatus, its material is the makrolon (PC) or poly- methyl-prop using the high grade of transparency
The plastics such as e pioic acid methyl ester (PMMA) shape, and can not penetrate piece with infrared light and reach good splicing results, and are difficult to light
The function of wavelength filtering is integrated into optical fingerprint sensing device further.
In view of this, the present invention is a kind of optical fingerprint sensing device further and its manufacture method that infrared can be penetrated, and is made red
Splicing results between outer penetrable material and leaded light component make moderate progress, to avoid the interference of visible ray, to lift capture quality, more
The various missings present in prior art can be overcome.
The content of the invention
It is a primary object of the present invention to provide a kind of optical fingerprint sensing device further that infrared can be penetrated and its manufacturer
Method, using ultraviolet light photopolymerization layer is pre-formed, enables leaded light component and infrared light penetrated bed to carry out good combination, to exclude
Influence of the visible ray to imaging in environment, so that the quality of finger print imaging be substantially improved.
Another object of the present invention is to provide a kind of optical fingerprint sensing device further that infrared can be penetrated and its manufacturer
Method, it is first pre-baked to half-dried using the ultraviolet light photopolymerization material that will be coated on leaded light component, you can in wearing infrared light under low temperature
Saturating material is fitted, and reaches the reliability that raising leaded light component is combined with infrared light penetrable material.
To reach above-mentioned purpose, the invention discloses a kind of optical fingerprint sensing device further that infrared can be penetrated, main bag
Include a fingerprint sensing module, ultraviolet light photopolymerization layer and an infrared light penetrated bed.Wherein, fingerprint sensing module has a guide-lighting group
Part；Ultraviolet light photopolymerization layer is arranged on leaded light component；And infrared light penetrated bed is arranged on ultraviolet light photopolymerization layer.
Specifically, the material of leaded light component can be makrolon or polymethyl methacrylate.
Specifically, the material of ultraviolet light photopolymerization layer is acrylic polymers, silicon based polymers or base polyurethane prepolymer for use as.
Specifically, the material of infrared light penetrated bed is epoxy resin or silica gel.
Specifically, the thickness of ultraviolet light photopolymerization layer is preferably 3-25 microns.
Specifically, the thickness of infrared light penetrated bed is preferably 8-55 microns.
In addition, the present invention also discloses a kind of optical fingerprint sensing device further manufacture method that infrared can be penetrated, its step is first
First it is to provide a fingerprint sensing module, fingerprint sensing module has a leaded light component；Then, coating one ultraviolet light photopolymerization material in
On leaded light component；Ultraviolet light is recycled, makes ultraviolet light photopolymerization material solidification to leather hard；Afterwards, it is coated with an infrared light
Penetrable material is on half-dried ultraviolet light photopolymerization material；Finally, ultraviolet light photopolymerization material is made to be cured to infrared light penetrable material
Absolutely dried condition, is worn with the infrared light for forming ultraviolet light photopolymerization layer and being incorporated into optical material by ultraviolet light photopolymerization layer
Permeable layers.
Similarly, specifically, the material of leaded light component can be makrolon or polymethyl methacrylate.
Specifically, ultraviolet light photopolymerization material is acrylic polymers, silicon based polymers or base polyurethane prepolymer for use as.
Specifically, infrared light penetrable material is epoxy resin or silica gel.
Specifically, the thickness of ultraviolet light photopolymerization layer is preferably 3-25 microns.
Specifically, the thickness of infrared light penetrated bed is preferably 8-55 microns.
Specifically, wherein making the step of ultraviolet light photopolymerization material is cured to absolutely dried condition with infrared light penetrable material, it is
Surface cure is reached at a temperature of 60-85 DEG C, all solidstate is issued to then at normal temperature.
It is beneath to coordinate appended schema elaborate by specific embodiment, when being easier to understand the purpose of the present invention, skill
Art content, feature and its effect reached.
Brief description of the drawings
Fig. 1 is the profile of the optical fingerprint sensing device further that infrared can be penetrated of embodiments of the invention.
Fig. 2 is the flow of the manufacture method of the optical fingerprint sensing device further that infrared can be penetrated of embodiments of the invention
Figure.
In manufacture methods of Fig. 3 A- Fig. 3 E for the optical fingerprint sensing device further that infrared can be penetrated of embodiments of the invention
The section of structure of each step of correspondence.
Description of reference numerals：The optical fingerprint sensing device further that 100- infrared can be penetrated；110- fingerprint sensing modules；111-
Substrate；112- grooves；113- sensor chips；114- luminescence components；115- glass cover-plates；116- leaded light components；120- ultraviolet lights
Hardened layer；121- ultraviolet light photopolymerization materials；130- infrared light penetrated beds；131- infrared light penetrable materials.
Embodiment
Fig. 1 is refer to, the optical fingerprint sensing device further 100 that infrared can be penetrated that embodiments of the invention are provided is illustrated
Profile.
This optical fingerprint sensing device further 100 that infrared can be penetrated includes a fingerprint sensing module 110, this fingerprint sensing mould
The substrate 111 of block 110 has multiple grooves 112, to accommodating sensor chip 113 and luminescence component 114, respectively to capture shadow
As and as light source, the top of sensor chip 113 is provided with glass cover-plate 115, and to protect sensor chip 113, leaded light component 116 is then
Luminescence component 114, sensor chip 113 and the top of glass cover-plate 115 that substrate 110 is carried are covered at, to import luminous group
The light that part 114 is sent, and light is led into the direction toward sensor chip 113, then sensor chip is supplied by glass cover-plate 115
113 receive；The material of leaded light component 116 can be makrolon (PC) or polymethyl methacrylate (PMMA), and guide-lighting group
It is provided with part 116 on ultraviolet light photopolymerization layer 120, ultraviolet light photopolymerization layer 120 and is more provided with an infrared light penetrated bed 130, by
To improve the bond strength that infrared light penetrated bed 130 is fitted on leaded light component 116.
In above-described embodiment, the thickness of ultraviolet light photopolymerization layer 120 is 3-25 microns, and the thickness of infrared light penetrated bed 130 is
8-55 microns, it is possible to provide preferably splicing results；And ultraviolet light photopolymerization layer material can for acrylic polymers (polymer),
Silica gel (silicone) polymer or polyurethane (PU) performed polymer, the material of infrared light penetrated bed can be epoxy resin (epoxy)
Or silica gel (silicone)..
Also, in above-described embodiment, although specifically noted that fingerprint sensing module 110 includes substrate 111 and substrate
111 each component carried, so herein only as example.The present invention, which is essentially consisted in, emphasizes infrared light penetrated bed 130 and leaded light
Combination between component 116, in addition, the composition about fingerprint sensing module 110 can come in many different forms
Realize, there can be various modifications and variations.For example, the substrate 111 of the present embodiment has and also may be used in multiple grooves 112, practice
Not have a structure of groove 112, and the quantity of luminescence component 114 can be one or more, it is of course also possible to set up adhesive layer,
Optical film, reflecting layer or other assemblies, meanwhile, also the species of these components, shape, quantity and relative position etc. are not come
Limited.
Then, Fig. 2 is refer to, the optical fingerprint sensing device further that infrared can be penetrated provided by embodiments of the invention
The flow chart of 100 manufacture method；Meanwhile, please sequentially reference picture 3A-3E, infrared can be worn by what embodiments of the invention were provided
The section of structure of each step of correspondence in the manufacture method of saturating optical fingerprint sensing device further 100.The manufacturing process is included such as
Lower step：
First, see step S10, as shown in Figure 3A there is provided a fingerprint sensing module 110, have in fingerprint sensing module 110
One leaded light component 116, leaded light component 116 covers at luminescence component 114, sensor chip 113 and the glass cover that substrate 111 is carried
The top of plate 115, and the material of leaded light component 116 is makrolon or polymethyl methacrylate；As foregoing, for fingerprint sense
Each component that the substrate 111 and substrate 110 that survey module 110 is included are carried, it is to come real in what manner to be not intended to limit
It is existing, there can be various modifications and variations, appearance is repeated no more.
See step S20, as shown in Figure 3 B, using spraying or wire mark mode, ultraviolet light photopolymerization material 121 is coated on leaded light
On component 116；Ultraviolet light photopolymerization material 121 is acrylic polymers (polymer), silica gel (silicone) polymer or poly-
Urethane (PU) performed polymer, the coating thickness of ultraviolet light photopolymerization material 121 is about 3-25 microns.
Then, see step S30, as shown in Figure 3 C, using ultraviolet light, ultraviolet light photopolymerization material 121 is cured to half
Dry state, that is, semisolid is presented；The illuminating dose of ultraviolet light is 300-1500 millijoules/square centimeter (mj/
Cm2), the irradiation time is 5-10 minutes, and irradiation distance is 1-30 centimeters.
See step S40, as shown in Figure 3 D, recycle spraying or wire mark mode, infrared light penetrable material 131 is coated on half
On dry ultraviolet light photopolymerization material 121；Infrared light penetrable material 131 can be epoxy resin (epoxy) or silica gel (silicone),
And the coating thickness of infrared light penetrable material 131 is about 8-55 microns.
See step S50, as shown in FIGURE 3 E, ultraviolet light photopolymerization material 121 and infrared light penetrable material 131 are cured to absolutely dry
State, its process is to can be heated to 60-85 DEG C of temperature, first reaches surface cure, all solidstate is issued to then at normal temperature.Finally,
Ultraviolet light photopolymerization layer 120 can then be formed and the infrared light of leaded light component 116 is reliably engaged in by ultraviolet light photopolymerization layer 120
Penetrated bed 130.Wherein, the thickness of ultraviolet light photopolymerization layer 120 is 3-25 microns, and the thickness of infrared light penetrated bed 130 is micro- for 8-55
Rice, can reach preferably splicing results.
In summary, according to disclosed herein the optical fingerprint sensing device further that infrared can be penetrated and its manufacturer
Method, is the formation by ultraviolet light photopolymerization layer, allows infrared light penetrated bed and leaded light component to can reach firm combination, and the present invention is special
The leaded light component of makrolon or polymethyl methacrylate material is not applicable to, and infrared light penetrated bed can be prevented from guide-lighting group
It is peeling-off on part so that the reliability of component is substantially improved, and light wavelength filtering is effectively reached, being effectively prevented from can in environment
See the interference problem of light, and then sensitivity and the accuracy of fingerprint sensing can be lifted.
Furthermore, the present invention utilizes the ultraviolet light photopolymerization material that will be coated on leaded light component first pre-baked to half-dried, you can in
The laminating of infrared light penetrable material, to increase the bond strength of leaded light component and infrared light penetrable material, its work are carried out under low temperature
Skill cost is low, easy to operate, improves economic benefit.
It is described above to be merely exemplary for the purpose of the present invention, and it is nonrestrictive, and those of ordinary skill in the art understand,
In the case where not departing from the spirit and scope that claims appended below is limited, many modifications can be made, are changed, or wait
Effect, but fall within protection scope of the present invention.
Claims (13)
1. a kind of optical fingerprint sensing device further that infrared can be penetrated, it is characterised in that including：
One fingerprint sensing module, with a leaded light component；
One ultraviolet light photopolymerization layer, is arranged on the leaded light component；And
One infrared light penetrated bed, is arranged on ultraviolet light photopolymerization layer.
2. the optical fingerprint sensing device further according to claim 1 that infrared can be penetrated, it is characterised in that the leaded light component
Material be makrolon or polymethyl methacrylate.
3. the optical fingerprint sensing device further according to claim 1 that infrared can be penetrated, it is characterised in that the ultraviolet light is hard
The material for changing layer is acrylic polymers, silicon based polymers or base polyurethane prepolymer for use as.
4. the optical fingerprint sensing device further according to claim 1 that infrared can be penetrated, it is characterised in that the infrared light is worn
The material of permeable layers is epoxy resin or silica gel.
5. the optical fingerprint sensing device further according to claim 1 that infrared can be penetrated, it is characterised in that the ultraviolet light is hard
The thickness for changing layer is 3-25 microns.
6. the optical fingerprint sensing device further according to claim 1 that infrared can be penetrated, it is characterised in that the infrared light is worn
The thickness of permeable layers is 8-55 microns.
7. a kind of manufacture method for the optical fingerprint sensing device further that infrared can be penetrated, it is characterised in that comprise the following steps：
A fingerprint sensing module is provided, the fingerprint sensing module has a leaded light component；
A ultraviolet light photopolymerization material is coated with the leaded light component；
Using ultraviolet light, make the ultraviolet light photopolymerization material solidification to leather hard；
An infrared light penetrable material is coated with the half-dried ultraviolet light photopolymerization material；And
The ultraviolet light photopolymerization material and the infrared light penetrable material is cured to absolutely dried condition, with formed ultraviolet light photopolymerization layer with
And an infrared light penetrated bed of the optical material is incorporated into by ultraviolet light photopolymerization layer.
8. the manufacture method of the optical fingerprint sensing device further according to claim 7 that infrared can be penetrated, it is characterised in that
The material of the leaded light component is makrolon or polymethyl methacrylate.
9. the manufacture method of the optical fingerprint sensing device further according to claim 7 that infrared can be penetrated, it is characterised in that
The ultraviolet light photopolymerization material is acrylic polymers, silicon based polymers or base polyurethane prepolymer for use as.
10. the manufacture method of the optical fingerprint sensing device further according to claim 7 that infrared can be penetrated, its feature exists
In the infrared light penetrable material is epoxy resin or silica gel.
11. the manufacture method of the optical fingerprint sensing device further according to claim 7 that infrared can be penetrated, its feature exists
In the thickness of ultraviolet light photopolymerization layer is 3-25 microns.
12. the manufacture method of the optical fingerprint sensing device further according to claim 7 that infrared can be penetrated, its feature exists
In the thickness of the infrared light penetrated bed is 8-55 microns.
13. the manufacture method of the optical fingerprint sensing device further according to claim 7 that infrared can be penetrated, its feature exists
In making the step of ultraviolet light photopolymerization material and the infrared light penetrable material are cured to absolutely dried condition, be the temperature in 60-85 DEG C
Surface cure is issued to, all solidstate is issued to then at normal temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710194836.3A CN107273787A (en) | 2017-03-28 | 2017-03-28 | The optical fingerprint sensing device further and its manufacture method that infrared can be penetrated |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710194836.3A CN107273787A (en) | 2017-03-28 | 2017-03-28 | The optical fingerprint sensing device further and its manufacture method that infrared can be penetrated |
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| CN107273787A true CN107273787A (en) | 2017-10-20 |
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Cited By (4)
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| CN108038477A (en) * | 2018-01-05 | 2018-05-15 | 敦捷光电股份有限公司 | The protective shell of optical sensing |
| CN109564626A (en) * | 2018-10-30 | 2019-04-02 | 深圳市汇顶科技股份有限公司 | Have optical finger print device and hand-held device under the screen of the anti-fake sensing function of three-dimensional fingerprint |
| CN110286716A (en) * | 2019-06-24 | 2019-09-27 | Oppo广东移动通信有限公司 | Display device, electronic equipment and image acquiring method |
| CN110632978A (en) * | 2018-06-21 | 2019-12-31 | 昇佳电子股份有限公司 | Optical sensing module |
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| CN110286716B (en) * | 2019-06-24 | 2021-03-19 | Oppo广东移动通信有限公司 | Display device, electronic apparatus, and image acquisition method |
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