CN110286716A - Display device, electronic equipment and image acquiring method - Google Patents
Display device, electronic equipment and image acquiring method Download PDFInfo
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- CN110286716A CN110286716A CN201910548429.7A CN201910548429A CN110286716A CN 110286716 A CN110286716 A CN 110286716A CN 201910548429 A CN201910548429 A CN 201910548429A CN 110286716 A CN110286716 A CN 110286716A
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- electric signal
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Human Computer Interaction (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Image Input (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
This application discloses a kind of display devices.Display device includes the first substrate for stacking gradually setting, liquid crystal layer, the second substrate, photosensitive layer and collimation layer.Photosensitive layer includes multiple photosensitive units, and photosensitive unit includes infrared photosensitive unit, and infrared photosensitive unit is used to generate infrared electric signal according to the infrared signal received.Collimation layer includes multiple collimation units, and collimation unit offers light hole, and light hole is directed at photosensitive unit, and light hole can allow for optical signal to pass through to photosensitive unit.Disclosed herein as well is a kind of electronic equipment and image acquiring methods.The distribution area of the multiple photosensitive units of setting can be passed through according to demand, so that the area of multiple photosensitive unit distributions accounts for the large percentage of the area of display surface, user can carry out fingerprint recognition over a substantial area, to realize region fingerprint recognition or full frame fingerprint recognition, better user experience.
Description
Technical field
This application involves field of display technology, more specifically, are related to a kind of display device, electronic equipment and image and obtain
Method.
Background technique
In the related art, mobile phone can configure fingerprint recognition mould group and display module, and fingerprint recognition mould group can be used to identify
User identity, display module can be used for showing image, have at present and fingerprint recognition mould group is stacked in the lower section of display module
Mode, user contacts in display module that position corresponding with fingerprint recognition mould group is with typing fingerprint, however, display module is aobvious
Show in region, only very small part touches for user to carry out fingerprint recognition, and user experience is poor.
Summary of the invention
The application embodiment provides a kind of display device, electronic equipment and image acquiring method.
The display device of the application embodiment includes the first substrate for stacking gradually setting, liquid crystal layer, the second substrate, sense
Photosphere and collimation layer；The photosensitive layer includes multiple photosensitive units, and the photosensitive unit includes infrared photosensitive unit, described infrared
Photosensitive unit is used to generate infrared electric signal according to the infrared signal received；The collimation layer includes multiple collimation units,
The collimation unit offers light hole, and the light hole is directed at the photosensitive unit, and the light hole can allow for optical signal
Pass through to the photosensitive unit.
The electronic equipment of the application embodiment includes the display device of casing and the application embodiment；The display dress
Set installation on the housing.
The image acquiring method of the application embodiment is used for display device, and the display device includes stacking gradually setting
First substrate, liquid crystal layer, the second substrate, photosensitive layer and collimation layer；The photosensitive layer includes multiple photosensitive units, described photosensitive
Unit includes infrared photosensitive unit, and the infrared photosensitive unit is used to generate infrared telecommunications according to the infrared signal received
Number；The collimation layer includes multiple collimation units, and the collimation unit offers light hole, and the light hole alignment is described photosensitive
Unit, the light hole can allow for optical signal to pass through to the photosensitive unit；Described image acquisition methods include: to receive
Imaging optical signal including target optical signal reaches the photosensitive unit after the target optical signal passes through the light hole；According to
Infrared electric signal is obtained according to the infrared signal that the infrared photosensitive unit receives；And according to the imaging optical signal and described
Infrared electric signal obtains image.
In the display device of the application embodiment, electronic equipment and image acquiring method, photosensitive unit be can receive from outer
Boundary enters through the optical signal of light hole, and the image for touching object on the display apparatus, figure can be obtained according to the optical signal
As can be used for fingerprint recognition, meanwhile, it can be by the distribution area of the multiple photosensitive units of setting, so that multiple photosensitive according to demand
The area of cell distribution accounts for the large percentage of the area of display surface, and user can carry out fingerprint recognition over a substantial area, with
Realize region fingerprint recognition or full frame fingerprint recognition, better user experience.In addition, generating infrared electricity by infrared photosensitive unit
Signal can correct the image of object, by infrared electric signal to obtain the image of accurate object.
The additional aspect and advantage of presently filed embodiment will be set forth in part in the description, partially will be from following
Description in become obvious, or recognized by the practice of presently filed embodiment.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of the electronic equipment of the application embodiment；
Fig. 2 is the cross section structure schematic diagram of the display device of the application embodiment；
Fig. 3 is that the display device of the application embodiment is used for the schematic illustration of fingerprint recognition；
Fig. 4 is the schematic perspective view of the display device of the application embodiment；
Fig. 5 is the photosensitive layer of the application embodiment and the structural schematic diagram of display driving layer；
Fig. 6 is the planar structure schematic diagram of the second substrate of the application embodiment；
Fig. 7 is the photosensitive layer of the application embodiment and the structural schematic diagram of imager chip；
Fig. 8 is the flow diagram of the image acquiring method of the application embodiment；
Fig. 9 is the schematic perspective view of the cover board of the application embodiment；
Figure 10 is the side structure schematic view of the display device of the application embodiment；
Figure 11 is the flow diagram of the image acquiring method of the application embodiment；
Figure 12 is the side structure schematic view of the display device of the application embodiment；
Figure 13 and Figure 14 is the flow diagram of the image acquiring method of the application embodiment.
Main element symbol description:
It is electronic equipment 1000, display device 100, backlight layer 10, bottom surface 11, the first polarizing layer 20, first substrate 30, photosensitive
Layer 40, photosensitive unit 41, veiling glare photosensitive unit 411, noise photosensitive unit 412, infrared photosensitive unit 413, circuit unit 42, sense
Optical circuit unit 421, Noise Circuits unit 422, liquid crystal layer 50, the second substrate 60, display unit 61, shading piece 62, collimation layer
70, collimation unit 71, light hole 711, matrix 72, lightproof unit 73, the second polarizing layer 80, cover board 90, display surface 91, viewing area
911, the back side 92, ink layer 93, casing 200, imager chip 300, object 2000, display driving layer 1a, display driver element
1a1。
Specific embodiment
Presently filed embodiment is described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing
To the same or similar element of expression or element with the same or similar functions eventually.
In addition, the presently filed embodiment described with reference to the accompanying drawing is exemplary, it is only used for explaining the application's
Embodiment, and should not be understood as the limitation to the application.
In this application unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Referring to Fig. 1, the electronic equipment 1000 of the application embodiment includes casing 200 and display device 100.Display dress
100 are set to be mounted on casing 200.Specifically, electronic equipment 1000 can be mobile phone, tablet computer, display, notebook electricity
Brain, automatic teller machine, gate, smartwatch, head show the equipment such as equipment, game machine, and the application is by taking electronic equipment 1000 is mobile phone as an example
It is illustrated, it will be understood that the concrete form of electronic equipment 1000 is not limited to mobile phone.
Casing 200 can be used for mount display 100, and in other words, the installation that casing 200 can be used as display device 100 carries
Body, casing 200 can also be used to install the functional modules such as power supply unit, imaging device, the communication device of electronic equipment 1000, so that
Casing 200 provides the protection of shatter-resistant, waterproof etc. for functional module.
Display device 100 can be used for showing the images such as picture, video, text.Display device 100 is mounted on casing 200,
Specifically, display device 100 may be mounted on the front of casing 200 or display device 100 is mounted on the back of casing 200
Perhaps display device 100 is mounted on the front and the back side of casing 200 simultaneously on face or display device 100 is mounted on casing
On 200 side, this is not restricted.In example as shown in Figure 1, display device 100 is mounted on the front of casing 200.
Please see Fig. 2 to Fig. 4, display device 100 includes first substrate 30, the liquid crystal layer 50, second for stacking gradually setting
Substrate 60, photosensitive layer 40 and collimation layer 70.Incorporated by reference to Fig. 7, photosensitive layer 40 includes multiple photosensitive units 41, and photosensitive unit 41 includes
Infrared photosensitive unit 413, infrared photosensitive unit 413 are used to generate infrared electric signal according to the infrared signal received.Collimation
Layer 70 includes multiple collimation units 71.Collimation unit 71 offers light hole 711, and light hole 711 is directed at photosensitive unit 41, light passing
Hole 711 can allow for optical signal to pass through to photosensitive unit 41.
In the electronic equipment 1000 of the application embodiment, photosensitive unit 41 can receive from the external world and enter through light hole
711 optical signal, the image for touching the object in display device 100 can be obtained according to the optical signal, and image can be used for fingerprint
Identification, meanwhile, it can be by the distribution area of the multiple photosensitive units 41 of setting, so that multiple photosensitive units 41 are distributed according to demand
Area account for display device 100 display surface 91 area large percentage, user can carry out fingerprint over a substantial area
Identification, to realize region fingerprint recognition or full frame fingerprint recognition, better user experience.In addition, passing through infrared photosensitive unit 413
Infrared electric signal is generated, the image of object can be corrected, by infrared electric signal to obtain the image of accurate object.
Specifically, display device 100 can be shown by the optical signal that the light-emitting component of therein issues to be shown
Showing device 100 can also be by the optical signal of guiding external light source sending to be shown, display device 100 can be not bendable
Folding, display device 100 is also possible to bent, and this is not restricted.
In the embodiment of the present application, please see Fig. 2 to Fig. 4, along the light direction of display device 100, display device 100
It successively include backlight layer 10, the first polarizing layer 20, first substrate 30, liquid crystal layer 50, the second substrate 60, photosensitive layer 40, collimation layer
70, the second polarizing layer 80 and cover board 90.
As shown in Figures 2 and 3, backlight layer 10 can be used for emitting optical signal La or backlight layer 10 and can be used for guiding
The optical signal La that light source (not shown) issues.Optical signal La sequentially pass through the first polarizing layer 20, first substrate 30, liquid crystal layer 50,
The second substrate 60, photosensitive layer 40, collimation layer 70, the second polarizing layer 80, cover board are after 90s into extraneous.Backlight layer 10 includes bottom surface
11, specifically, bottom surface 11 can be surface opposite with the first polarizing layer 20 in backlight layer 10.
First polarizing layer 20 is arranged in backlight layer 10, and the first polarizing layer 20 specifically can be polarizing film or polarizing coating.The
One substrate 30 is arranged on the first polarizing layer 20, and first substrate 30 can be glass substrate.
Please see Fig. 2 to Fig. 4, liquid crystal layer 50 is arranged on first substrate 30, and the liquid crystal molecule in liquid crystal layer 50 is in electric field
Under the action of can be changed deflection direction, and then change can pass through the amount of the optical signal of liquid crystal layer 50.Correspondingly, incorporated by reference to Fig. 5,
Display driving layer 1a, driving effect of the display driving layer 1a in driving chip (not shown) can also have been made on first substrate 30
Under can to liquid crystal layer 50 apply electric field, to control the deflection direction of the liquid crystal molecule of different location.Specifically, display driving layer
1a includes multiple display driver element 1a1, and multiple display driver element 1a1 can be in the array arrangement of multiple lines and multiple rows, Mei Gexian
Show that driving unit 1a1 can independently control the deflection direction of the liquid crystal of corresponding position.
Fig. 2, Fig. 4 and Fig. 6 are please referred to, the second substrate 60 is arranged on liquid crystal layer 50.The second substrate 60 may include glass
Substrate, the multiple display units 61 and shading piece 62 of setting on the glass substrate.Display unit 61 can be colored filter, example
Such as, R indicates infrared fileter, and G indicates that green color filter, B indicate blue color filter, by controlling the optical filtering across different colours
The amount of the optical signal of piece, to control the color that display device 100 is finally shown.The arrangement mode of multiple display units 61 can be with
The arrangement mode of multiple display driver element 1a1 is corresponding, such as a display unit 61 and one 1a1 pairs of display driver element
It is quasi-.
Shading piece 62 is between display unit 61, and shading piece 62 is spaced two adjacent display units 61, in an example
In son, shading piece 62 can be black matrix" (Black Matrix, BM).Shading piece 62 can prevent light from passing through, to avoid
Light in display device 100 enters the external world without display unit 61, and shading piece 62 can also prevent optical signal from passing through phase
Optical crosstalk phenomenon occurs when the display unit 61 of neighbour.
Fig. 3, Fig. 4 and Fig. 7 are please referred to, photosensitive layer 40 can be the film layer being produced in the second substrate 60, such as pass through TFT
(Thin Film Transistor) technique is produced in the second substrate 60.Photosensitive layer 40 includes multiple photosensitive units 41 and multiple
Circuit unit 42.
Photosensitive unit 41 can use photoelectric effect and convert electric signal for the optical signal received, by parsing photosensitive list
The intensity for the electric signal that member 41 generates can reflect the intensity for the optical signal that photosensitive unit 41 receives.In one example, feel
It include that can receive black light in light unit 41 to be converted into the photosensitive unit 41 of electric signal, it is in another example, photosensitive
It include that can receive visible light and black light to be converted into the photosensitive unit 41 of electric signal in unit 41.Multiple photosensitive units 41
Type can be identical, the type of multiple photosensitive units 41 can also be not exactly the same.Multiple photosensitive units 41 can be with any
Mode arranged, the arrangement mode of multiple photosensitive units 41 specifically can the demands such as shape according to display device 100 into
Row setting, in the embodiment of the present application, multiple photosensitive units 41 are arranged in array, such as to line up multirow more for multiple photosensitive units 41
The matrix of column.As shown in figure 5, the sense in the display driver element 1a1 and photosensitive layer 40 that as shown are in display driving layer 1a
The positional relationship that light unit 41 arranges, in same a line, display driver element 1a1 is interspersed with photosensitive unit 41.It can manage
Solution, display driver element 1a1 are located in the different layers of display device 100 from photosensitive unit 41, i.e., the two is in display device 100
Thickness direction position it is different.Each photosensitive unit 41 can work independently without being influenced by other photosensitive units 41,
The intensity for the optical signal that the photosensitive unit 41 of different location receives may be different, therefore what the photosensitive unit 41 of different location generated
The intensity of electric signal may also be different.
In addition, photosensitive unit 41 can be directed at setting with shading piece 62, shading piece 62 can be with stop portions from backlight layer 10
It is irradiated to the optical signal of photosensitive unit 41, to reduce interference of the optical signal inside display device 100 to imaging.In the application reality
It applies in example, photosensitive unit 41 is located in shading piece 62 in the orthographic projection in the second substrate 60, that is, in the light of vertical the second substrate 60
Under the irradiation of line, photosensitive unit 41 is located in shading piece 62 in the projection in the second substrate 60 so that shading piece 62 block from
The effect that backlight layer 10 is irradiated to the optical signal of photosensitive unit 41 is preferable.
Since there are infrared lights in external environment, and infrared light may penetrate certain objects and enter display device 100.Example
Such as, infrared light may penetrate the finger of user, be received across display surface 91 and light hole 711 and by photosensitive unit 41, and
The part infrared light and the fingerprint of user be not relevant, the infrared electric signal meeting which generates
It is interfered when imager chip 300 is imaged.Therefore, when being imaged, the interference caused by infrared signal is needed
It is corrected.
Referring to Fig. 7, photosensitive unit 41 further includes multiple infrared photosensitive units 413, infrared in the application embodiment
Photosensitive unit 413 is for detecting infrared signal.Infrared photosensitive unit 413 can only receive infrared signal, and according to infrared light
Signal generates infrared electric signal, remaining photosensitive unit 41 can receive infrared signal and visible light signal simultaneously, and according to infrared
Optical signal and visible light signal generate imaging electric signal.Specifically, multiple infrared photosensitive units 413 can be spaced apart, such as
It is evenly distributed in 41 array of photosensitive unit, infrared photosensitive unit 413 ratio shared in photosensitive unit 41 can be smaller, example
Such as account for 1%, 7%, 10%.Incorporated by reference to Fig. 3, touch control layer (not shown) is also provided in display device 100, when user touches
When to display surface 91, touch control layer can sense the position touched, and imager chip 300 reads corresponding with the position touched
The infrared electric signal that one or more infrared photosensitive units 413 generate, and image is corrected according to infrared electric signal.
Circuit unit 42 can be connect with photosensitive unit 41.The electric signal that circuit unit 42 can generate photosensitive unit 41
It is transmitted to the imager chip 300 of electronic equipment 1000.Circuit unit 42 can specifically include the elements such as transistor.Circuit unit 42
Quantity can be to be multiple, each photosensitive unit 41 can connect on a corresponding circuit unit 42, multiple circuit units
42 are connect by connecting line with imager chip 300.The arrangement mode of multiple circuit units 42 can be with the arrangement of photosensitive unit 41
Mode is similar, such as multiple photosensitive units 41 are arranged in the matrix of multiple lines and multiple rows, and multiple circuit units 42 can also be arranged in more
The matrix of row multiple row.
Please see Fig. 2 to Fig. 4, collimation layer 70 is arranged on photosensitive layer 40.Collimating layer 70 includes multiple collimation units 71, quasi-
Straight unit 71 offers light hole 711, and light hole 711 is directed at photosensitive unit 41.Optical signal reaches photosensitive after light hole 711
Unit 41.The material of collimation unit 71 can be identical as the material of shading piece 62, for example, collimation unit 71 and shading piece 62 by
Light absorbent is made, and when optical signal reaches the entity part of collimation unit 71, optical signal can be partially absorbed or all absorb, example
Such as, when the lateral wall of optical signal arrival collimation unit 71 or optical signal reach the inner wall of light hole 711, optical signal is collimated
Unit 71 absorb so that the optical signal that the direction of propagation is overlapped with the extending direction of the center line of light hole 711 be obtained through it is logical
Unthreaded hole 711 realizes that the collimation to optical signal, the interference optical signal that photosensitive unit 41 receives are less.Multiple collimation units 71 exist
Orthographic projection in the second substrate 60 can be located in shading piece 62, so that collimation unit 71 2 will not block display unit 61,
Guarantee that display device 100 has preferable display effect.
The extending direction of light hole 711 can be perpendicular to display surface 91, so that light hole 711 is only capable of passing through the direction of propagation
The optical signal vertical with display surface 91, in other words, light hole 711 are only capable of believing by the light propagated vertically downward from display surface 91
Number.The ratio of the depth of the cross-sectional width and light hole 711 of light hole 711 is less than 0.2, wherein the depth of light hole 711 can be with
It is depth of the light hole 711 along centerline direction, the cross-sectional width of light hole 711 can be light hole 711 by perpendicular to center
For the maximum for the figure that the plane of line is cut across size, ratio specifically can be the number such as 0.1,0.111,0.125,0.19,0.2
Value, so that collimation unit 71 is preferable to the collimating effect of optical signal.Further, each light hole 711 may include multiple
Sub- light hole (not shown), multiple sub- light holes are apart from one another by including multiple sub- light holes in a light hole 711 and together
One photosensitive unit 41 is aligned.That is, include multiple sub- light holes in a light hole 711 can be used for it is photosensitive to reaching one
The optical signal of unit 41 is collimated.At this point it is possible to which the ratio of the cross-sectional width of sub- light hole and the depth of sub- light hole is arranged
Less than 0.2, so that the collimating effect of collimation 70 pairs of optical signal of layer is preferable.Due to dividing light hole 711 for the son at multiple intervals
Light hole, under the premise of guaranteeing collimating effect, that is, before the ratio of the cross-sectional width and depth that guarantee light passing space is less than 0.2
It puts, the thickness of collimation layer 70 can be set smaller, to reduce the integral thickness of display device 100.
In one example, collimation layer 70 further includes matrix 72, and matrix 72 can be basic light transmission, 71 shape of collimation unit
At on matrix 72.In another example, collimation layer 70 can only include collimation unit 71, and collimation unit 71 can pass through plating
The modes such as film, sputtering, etching are formed in the second substrate 60.
For the setting of second polarizing layer 80 on collimation layer 70, the second polarizing layer 80 specifically can be polarizing film or polarizing coating.
Fig. 2, Fig. 3 and Fig. 8 are please referred to, cover board 90 is arranged on the second polarizing layer 80.Cover board 90 can be by glass, sapphire
Equal materials are made.Cover board 90 includes display surface 91 and the back side 92.It is laggard that the optical signal that display device 100 issues passes through display surface 91
Enter the external world, extraneous light enters display device 100 after passing through display surface 91.The back side 92 can be bonded with the second polarizing layer 80.
Display surface 91 is formed with viewing area 911, and viewing area 911 refers to the region for being displayed for image, and viewing area 911 can
To be in the shapes such as the rectangle of rectangle, circle, round rectangle, band " fringe ", this is not restricted.In addition, in some instances, showing
Show that face 91 also could be formed with non-display area, non-display area can be formed in the outer fringe position of viewing area 911, and non-display area can be with
For being attached with casing 200.The accounting of viewing area 911 can be the arbitrary numbers such as 80%, 90%, 100% on display surface 91
Value.
In the embodiment of the present application, multiple photosensitive units 41 are located in viewing area 911 in the orthographic projection of display surface 91.So that
Multiple photosensitive units 41 can be imaged the object touched in viewing area 911, touch display using finger for user
For the example in area 911, multiple photosensitive units 41 can be imaged the fingerprint for touching the finger on viewing area 911, and
For fingerprint recognition.
Please refer to figs. 2 and 3, will be described by way the detail that display device 100 is imaged: display device below
The 100 optical signal La issued sequentially pass through the first polarizing layer 20, first substrate 30, liquid crystal layer 50, the second substrate 60, photosensitive layer
40, collimate layer 70, the second polarizing layer 80 and cover board it is after 90s enter it is extraneous, extraneous optical signal may also sequentially pass through cover board 90,
Photosensitive layer 40 is reached after second polarizing layer 80, collimation layer 70.If optical signal reaches exactly to the photosensitive unit 41 in photosensitive layer 40
On, then photosensitive unit 41 can generate electric signal to reflect the intensity of the optical signal.Pass through the telecommunications of multiple photosensitive units 41 as a result,
Number intensity, can reflect the strength distribution of the optical signal into display device 100.
By user by taking finger 2000 touches display surface 91 as an example.When display device 100 is sending out optical signal La, hand
Refer to 2000 predetermined positions for touching display surface 91, finger 2000 can carry out optical signal La to reflect to form L1, and optical signal L1 is subsequent
Display device 100 is initially entered, optical signal L1 initially passes through cover board 90 and the second polarizing layer 80, for the direction of propagation and light hole
711 extending direction identical optical signal L1, optical signal L1 can also pass through light hole 711, after optical signal L1 passes through light hole 711
Reach photosensitive unit 41.For the different optical signal of extending direction of the direction of propagation and light hole 711, optical signal passes through cover board
90 and second polarizing layer it is after 80s, optical signal can not by light hole 711, and then can not reach be aligned with light hole 711 it is photosensitive
Unit 41.
It is appreciated that there are wave crests and trough for finger print, and when finger 2000 touches display surface 91, wave crest and display surface 91
Directly contacting, there are gaps between trough and display surface 91, after optical signal La reaches wave crest and trough, the optical signal of peak reflection
The intensity for the optical signal (calling the second optical signal in the following text) that the intensity of (calling the first optical signal in the following text) is reflected with trough has differences, and then makes
The electric signal (calling the first electric signal in the following text) generated due to receiving the first optical signal is obtained to generate with due to receiving the second optical signal
The intensity of electric signal (calling the second electric signal in the following text) have differences, imager chip 300 is according to the first electric signal and the second electric signal
Distribution situation, the image of available fingerprint.
At the same time, infrared photosensitive unit 413 receives infrared signal and generates infrared electric signal, and infrared electric signal is into one
Step is transmitted to imager chip 300, and imager chip 300 will be corrected image according to the infrared electric signal in imaging, such as
The imaging electric signal that optical signal generates will be imaged to subtract after infrared electric signal as the electric signal eventually for imaging, to obtain standard
The higher image of exactness, improves the accuracy rate of image recognition.
Further, since infrared photosensitive unit 413 has multiple, multiple infrared electric signals, Duo Gehong can correspondingly be generated
The size of outer electric signal may be inconsistent, then, it, in one example, can when that electric signal will be imaged and subtract infrared electric signal
To be averaged to multiple infrared electric signals, then will be imaged electric signal subtract be averaged after obtained infrared electric signal.At another
In example, subregion can be carried out respectively to photosensitive unit 41 and infrared photosensitive unit 413, each region includes that at least one is photosensitive
Unit 41 or including at least one infrared photosensitive unit 413.It then, can be according to each region comprising photosensitive unit 41
The position of (calling first area in the following text) and each position in the region (calling second area in the following text) comprising infrared photosensitive unit 413 are come true
Fixed and each first area is at a distance of nearest second area.It, can be with for each of each first area photosensitive unit 41
The imaging electric signal that each photosensitive unit 41 generates is subtracted infrared in nearest second area with the first area
The infrared electric signal that photosensitive unit 413 generates, to obtain each photosensitive unit 41 eventually for the electric signal of imaging, if the
The number of infrared photosensitive unit 413 is multiple in two regions, then can be first to multiple infrared photosensitive units in the second area
The 413 multiple infrared electric signals generated take mean value, then imaging electric signal is subtracted the mean value and obtains the telecommunications eventually for imaging
Number.It is appreciated that infrared photosensitive unit 413 is with photosensitive unit 41 at a distance of closer, infrared photosensitive unit 413 and photosensitive unit 41
The amount of the infrared light received is also more close, and the infrared electric signal of generation is also more close, will be imaged electric signal subtract it is infrared
The electric signal for imaging finally obtained after electric signal is also more accurate.
It is appreciated that user touches in the overlying regions for being arbitrarily provided with photosensitive unit 41, can reach to finger
The purpose that line is imaged and is identified.When 911 lower section of viewing area is correspondingly arranged on photosensitive unit 41, user is in viewing area
911 any position is touched, and can achieve the purpose that fingerprint is imaged and is identified, and is not limited to viewing area 911
Certain specific positions.Meanwhile user can also touch multiple positions on viewing area 911, Huo Zheduo simultaneously with multiple fingers
The multiple fingers of a user touch multiple positions on viewing area 911 simultaneously, and multiple fingerprints are imaged and are identified to realize
Purpose, in this way, the verification mode and applicable scene of electronic equipment 1000 can be enriched, for example, only when multiple fingerprints simultaneously
By just being authorized after verifying, multiple users can carry out the operation such as game on the same electronic equipment 1000.
Certainly, with user with finger touch display surface 91 when similarly, it is any be capable of reflecting light signal La object (such as with
Arm, forehead, clothing, the flowers and plants at family etc.) touch display surface 91 after the surface texture of the object can be imaged, to imaging
The subsequent processing of progress can be set according to user demand, and this is not restricted.
Incorporated by reference to Fig. 8, the application embodiment also discloses a kind of image acquiring method, and image acquiring method can be applied to
Above-mentioned display device 100, image acquiring method comprising steps of
01: receiving the imaging optical signal including target optical signal；
02: the infrared signal received according to infrared photosensitive unit 413 obtains infrared electric signal；And
03: obtaining image according to imaging optical signal and infrared electric signal.
Wherein, step 01 can be realized by photosensitive layer 40, and step 02 and step 03 can be realized by imager chip 300.At
As optical signal refers to the received all optical signals of photosensitive unit 41, target optical signal, which refers to, reaches photosensitive unit after light hole 711
41 visible light signal.The specific implementation details of step 01,02 and 03 are referred to the above correlation to display device 100 and retouch
It states, details are not described herein.
To sum up, in the electronic equipment 1000 of the application embodiment, photosensitive unit 41 can receive and enter through from the external world
The optical signal of light hole 711, the image for touching the object in display device 100 can be obtained according to the optical signal, and image is available
In fingerprint recognition, meanwhile, it can be by the distribution area of the multiple photosensitive units 41 of setting, so that multiple photosensitive units according to demand
41 distribution areas account for display device 100 display surface 91 area large percentage, user can over a substantial area into
Row fingerprint recognition, to realize region fingerprint recognition or full frame fingerprint recognition, better user experience.In addition, by infrared photosensitive
Unit 413 generates infrared electric signal, can correct the image of object, by infrared electric signal to obtain the figure of accurate object
Picture.
Fig. 9 and Figure 10 is please referred to, in some embodiments, photosensitive unit 41 includes veiling glare photosensitive unit 411.Cover board 90
The back side 92 on be provided with ink layer 93, veiling glare photosensitive unit 411 is corresponding with the position of ink layer 93, and ink layer 93 is for obstructing
The optical signal Lb of cover board 90 is penetrated from the external world.
In actual use, it is directly pierced by from display surface 91 from the signal portions issued in backlight layer 10, part meeting
One or many reflections are carried out between display surface 91 and backlight layer 10, and part reflected optical signal L2 may reach sense
Light unit 41 simultaneously interferes the imaging of display device 100.That is, further including interference light in the imaging optical signal for imaging
Signal L2, interference optical signal L2 are reflected by display device 100 and reach the photosensitive unit 41 on photosensitive layer 40.
Position corresponding with veiling glare photosensitive unit 411 is provided with ink layer 93 on the above-mentioned back side 92, in display device 100
Light is largely absorbed by ink layer 93 after reaching the ink layer 93, and fraction (such as 4%) is reflected by ink layer 93, by this
Ink layer 93 can simulate cover board 90 to the reflex of the optical signal inside display device 100, in addition, veiling glare photosensitive unit
411 are also possible to receive the optical signal L2 from the side of veiling glare photosensitive unit 411 to arrival veiling glare photosensitive unit 411.It is comprehensive next
It sees, veiling glare photosensitive unit 411 can receive the interference optical signal L2 same with remaining photosensitive unit 41, and simultaneously, ink layer
93 can obstruct the optical signal Lb that (reflection or absorption) penetrates cover board 90 from the external world, so that veiling glare photosensitive unit 411 only receives
Optical signal L2 is interfered, remaining photosensitive unit 41 can then receive interference optical signal L2 simultaneously, and penetrate cover board 90 from the external world
Optical signal Lb.
The type and performance of veiling glare photosensitive unit 411 and remaining photosensitive unit 41 are all the same, and veiling glare photosensitive unit 411 will be by
For the interference electric signal transmission for interfering optical signal L2 to generate to imager chip 300, imager chip 300 will be according to infrared electricity in imaging
Signal and the interference electric signal are corrected image, such as subtract infrared telecommunications for the imaging electric signal that optical signal generates is imaged
Number and interference electric signal after be used as the electric signal eventually for imaging, to obtain the higher image of accuracy, raising image recognition
Accuracy rate.
In one example, veiling glare photosensitive unit 411 and remaining photosensitive unit 41 are ccd image sensor, at this point, at
As electric signal and infrared electric signal and subtracting each other for electric signal of interference can carry out in imager chip 300, i.e., imaging electric signal with
Infrared electric signal and interference electric signal are sent in imager chip 300, are executed by imager chip 300 and are subtracted imaging electric signal
Infrared electric signal and the operation for interfering electric signal, alternatively, electric signal and infrared electric signal is imaged and interferes subtracting each other for electric signal
It can be carried out in analog-digital converter, i.e., imaging electric signal, infrared electric signal and interference electric signal are first sent to analog-to-digital conversion
In device, electric signal will be imaged by, which being executed by analog-digital converter, subtracts infrared electric signal and interferes the operation of electric signal, then by the two phase
The electric signal obtained after subtracting is sent in imager chip 300.In another example, veiling glare photosensitive unit 411 is photosensitive with remaining
Unit 41 is cmos image sensor, at this point, imaging electric signal and infrared electric signal and subtracting each other for interference electric signal can be
It being carried out in imager chip 300, i.e., imaging electric signal, infrared electric signal and interference electric signal are sent in imager chip 300, by
Imager chip 300 execute by be imaged electric signal subtracts infrared electric signal and interfere electric signal operation, alternatively, imaging electric signal with
Infrared electric signal and subtracting each other for electric signal of interference can also carry out in photosensitive unit 41, and the first storage is added in photosensitive unit 41
Area, the second memory block and the powered down road of logic, the imaging electric signal that photosensitive unit 41 generates are stored in the first memory block, interference electricity
Signal is sent to photosensitive unit 41 by veiling glare photosensitive unit 411 and is stored in the second memory block, and infrared electric signal is by infrared sense
Light unit 413 is sent to photosensitive unit 41 and is stored in the second memory block, and the powered down road of logic, which executes, subtracts imaging electric signal
After the operation of infrared electric signal and interference electric signal, then the electric signal obtained after the two is subtracted each other is sent in imager chip 300.
It is above-mentioned merely illustrative for imaging electric signal and the description of interference electric signal subtracted each other, it should not be understood as the limitation to the application.
In one example, overleaf 92 position by proximal edge is arranged in ink layer 93, and veiling glare photosensitive unit 411 is located at
The marginal position of photosensitive layer 40.Such as veiling glare photosensitive unit 411 is set, wherein the region a is located at figure in the region a as shown in Figure 7
On one column of the leftmost side of 7 41 array of photosensitive unit and a column of the rightmost side.Avoid ink layer 93 to the aobvious of display device 100
Show that effect causes too much influence.Specifically, photosensitive unit 41 can arrange in the matrix of multiple lines and multiple rows, veiling glare photosensitive unit
411 can be set the marginal position in the matrix, such as close to a column to three column for matrix edge, a line of close matrix edge
To three rows, to adapt to the position of ink layer 93.
Further, since veiling glare photosensitive unit 411 has multiple, multiple interference electric signals, Duo Gegan can correspondingly be generated
Disturb electric signal size may it is inconsistent, then, will be imaged electric signal subtract infrared electric signal and interfere electric signal when, one
In a example, multiple interference electric signals can be averaged, then be obtained after imaging electric signal is subtracted infrared electric signal and is averaged
The interference electric signal arrived.In another example, subregion can be carried out respectively to photosensitive unit 41 and veiling glare photosensitive unit 411,
Each region includes at least one photosensitive unit 41 or including at least one veiling glare photosensitive unit 411.It then, can be according to every
The position in a region (calling first area in the following text) comprising photosensitive unit 41 and each region comprising veiling glare photosensitive unit 411
The position of (calling third region in the following text) is determined with each first area at a distance of nearest third region.For in each first area
Each photosensitive unit 41, the imaging electric signal that each photosensitive unit 41 can be generated subtracts infrared electric signal, and with
The interference electric signal that veiling glare photosensitive unit 411 of the first area in nearest third region generates, to obtain each
Photosensitive unit 41 eventually for imaging electric signal, if in third region veiling glare photosensitive unit 411 number be it is multiple, can
Mean value is taken with the multiple interference electric signals first generated to multiple veiling glare photosensitive units 411 in the third region, then will imaging electricity
Signal subtracts infrared electric signal and the mean value obtains the electric signal eventually for imaging.It is appreciated that veiling glare photosensitive unit 411 with
Photosensitive unit 41 is closer apart, and the amount for the interference optical signal that veiling glare photosensitive unit 411 and photosensitive unit 41 receive is also more close,
The interference electric signal of generation is also more close, finally obtains after electric signal will be imaged and subtract infrared electric signal and interference electric signal
For imaging electric signal it is also more accurate.
Incorporated by reference to Figure 11, in some embodiments, image acquiring method further includes step 04: according to veiling glare photosensitive unit
411 received optical signals generate interference electric signal；Step 03 includes step 031: according to imaging optical signal, infrared electric signal and being done
It disturbs electric signal and obtains image.
Wherein, step 04 can be realized by veiling glare photosensitive unit 411, and step 031 can be realized by imager chip 300.It is real
The detail for applying step 04 and step 031 can be with reference to above description, and details are not described herein.
Fig. 7 and Figure 12 is please referred to, in some embodiments, photosensitive unit 41 includes noise photosensitive unit 412, display dress
Setting 100 further includes lightproof unit 73, and lightproof unit 73 is arranged on collimation unit 71, and lightproof unit 73 is for blocking and noise sense
The light hole 711 that light unit 412 is aligned.
In use, the temperature of photosensitive unit 41 or the temperature of environment can change, and as temperature changes,
The performance of photosensitive unit 41 may change, for example, photosensitive unit 41 can be made of amorphous silicon (A-Si) material, in temperature
When degree variation, the bottom that photosensitive unit 41 generates makes an uproar and can also change, and the electric signal generated due to temperature change is properly termed as
Noise electric signal, and the object and onrelevant of the noise electric signal and actual needs imaging.Therefore, it when being imaged, needs
It interferes and is corrected caused by temperature change.
In present embodiment, the type and performance of noise photosensitive unit 412 and remaining photosensitive unit 41 (remove infrared photosensitive list
Member is 413) all the same, and lightproof unit 73 blocks light hole 711, so that noise photosensitive unit 412 does not almost receive optical signal.It makes an uproar
Phonoreception light unit 412 can generate electric signal in use, but since noise photosensitive unit 412 does not almost receive light letter
Number, therefore, the electric signal that noise photosensitive unit 412 generates can be considered the noise telecommunications generated by material and temperature change
Number.At this point, remaining photosensitive unit 41 (outside removal of impurities light sensation light unit 411) can then generate noise electric signal simultaneously, and receive
Optical signal is imaged to generate imaging electric signal.Noise electric signal transmission to imager chip 300 is imaged noise photosensitive unit 412
Chip 300 will be corrected image according to infrared electric signal and the noise electric signal in imaging, such as optical signal will be imaged
The imaging electric signal of generation subtracts after infrared electric signal and noise electric signal as the electric signal eventually for imaging, to obtain standard
The higher image of exactness, improves the accuracy rate of image recognition.The case where subtracting interference electric signal with imaging electric signal is similar, imaging
Electric signal subtracts the operation of infrared electric signal and noise electric signal in addition to that can execute in imager chip 300, can also be at it
It is executed in remaining device, details are not described herein.
Specifically, lightproof unit 73 can also be made of light absorbent, and lightproof unit 73 can be filled in light hole 711
Interior, lightproof unit 73 can be fabricated together with collimation unit 71.Noise photosensitive unit 412 can be set in photosensitive unit 41
The region by proximal edge of array, noise photosensitive unit 412 also can be set in the region adjacent with veiling glare photosensitive unit 411,
Such as can be located in matrix one arranges to three column, or a line in matrix, to three rows, this is not restricted, Fig. 7 institute
Noise photosensitive unit 412 is set in the region b shown, wherein the region b is located at the secondary series from left to right of 41 array of photosensitive unit of Fig. 7
And from right to left on secondary series.
Further, since noise photosensitive unit 412 has multiple, multiple noise electric signals can be correspondingly generated, it is multiple to make an uproar
The size of acoustoelectric signal may be inconsistent, then, when electric signal will be imaged subtracting infrared electric signal and noise electric signal, one
In a example, multiple noise electric signals can be averaged, then be obtained after imaging electric signal is subtracted infrared electric signal and is averaged
The noise electric signal arrived.In another example, subregion can be carried out respectively to photosensitive unit 41 and noise photosensitive unit 412,
Each region includes at least one photosensitive unit 41 or including at least one noise photosensitive unit 412.It then, can be according to every
The position in a region (calling first area in the following text) comprising photosensitive unit 41 and each region comprising noise photosensitive unit 412
The position of (calling the fourth region in the following text) is determined with each first area at a distance of nearest the fourth region.For in each first area
Each photosensitive unit 41, the imaging electric signal that each photosensitive unit 41 can be generated subtract infrared electric signal and, with
The noise electric signal that noise photosensitive unit 412 of the first area in nearest the fourth region generates, to obtain each
Photosensitive unit 41 eventually for imaging electric signal, if in the fourth region noise photosensitive unit 412 number be it is multiple, can
Mean value is taken with the multiple noise electric signals first generated to multiple noise photosensitive units 412 in the fourth region, then will imaging electricity
Signal subtracts infrared electric signal and the mean value obtains the electric signal eventually for imaging.It is appreciated that noise photosensitive unit 412 with
Photosensitive unit 41 is closer apart, and noise photosensitive unit 412 is also more close with the temperature of photosensitive unit 41, the noise electric signal of generation
Also the telecommunications for being used to be imaged that is more close, finally being obtained after electric signal will be imaged and subtract infrared electric signal and noise electric signal
It is number also more accurate.
Figure 13 is please referred to, in some embodiments, image acquiring method further includes step 05: obtaining noise photosensitive unit
The 412 noise electric signals generated；Step 03 includes step 032: being obtained according to imaging optical signal, infrared electric signal and noise electric signal
Take image.
Wherein, step 05 can be realized by noise photosensitive unit 412, and step 032 can be realized by imager chip 300.It is real
The detail for applying step 05 and step 032 can be with reference to above description, and details are not described herein.
Referring to Fig. 7, in some embodiments, circuit unit 42 includes photosensitive circuit unit 421 and Noise Circuits list
Member 422, photosensitive circuit unit 421 is connect with photosensitive unit 41, and photosensitive unit 41 is not connected on Noise Circuits unit 422.
There are hardware noise, hardware noise meeting generation circuit noise signal, circuit noise signals for circuit unit 42 itself
It will affect the intensity for being finally transferred to the electric signal of imager chip 300, therefore, when being imaged, need to believe circuit noise
Interference caused by number is corrected.
In present embodiment, it is not connected with photosensitive unit 41 on Noise Circuits unit 422, is generated on Noise Circuits unit 422
Circuit noise signal be hardware noise for Noise Circuits unit 422 itself.Noise Circuits unit 422 makes an uproar the circuit
Acoustical signal is transmitted to imager chip 300, and imager chip 300 will be according to infrared electric signal and the circuit noise signal pair in imaging
Image is corrected, such as will be imaged after the imaging electric signal that optical signal generates subtracts infrared electric signal and circuit noise signal and made
The accuracy rate of image recognition is improved for the electric signal eventually for imaging to obtain the higher image of accuracy.
Specifically, multiple circuit units 42 can be in the array arrangement of multiple lines and multiple rows, and Noise Circuits unit 422 at least arranges
At complete a line and a complete column, so that Noise Circuits unit 422 is distributed in any a line and any one column, make an uproar
Sound circuit unit 422 generate circuit noise signal sample more comprehensively, according to infrared electric signal and the circuit noise signal pair
When image is corrected, the effect of correction is more preferable.Noise Circuits unit 422, which also can be set, to be lined up in multiple circuit units 42
The marginal position of array, or be arranged close to above-mentioned veiling glare photosensitive unit 411 and noise photosensitive unit 412.Noise Circuits list
The distribution of member 422 can cover complete one and arrange to five column, and the complete a line of covering, to the five-element, this is not restricted.
In example as shown in Figure 7, Noise Circuits unit 422 is set, wherein the region c is located at the electricity of Fig. 7 in the region c of photosensitive layer 40
In the column of third from left to right of 42 array of road unit, from right to left third column, a line of top side and a line of lower side.
Further, since Noise Circuits unit 422 has multiple, multiple circuit noise signals can be correspondingly generated, it is multiple
The size of circuit noise signal may be inconsistent, then, infrared electric signal and circuit noise signal are subtracted electric signal will be imaged
When, in one example, multiple circuit noise signals can be averaged, then imaging electric signal is subtracted into infrared electric signal and is taken
The circuit noise signal obtained after average.In another example, photosensitive unit 41 and Noise Circuits unit 422 can be distinguished
Subregion is carried out, each region includes at least one photosensitive unit 41 or including at least one Noise Circuits unit 422.Then,
It can be according to the position in each region (calling first area in the following text) comprising photosensitive unit 41 and each comprising Noise Circuits unit
The position in 422 region (calling the 5th region in the following text) is determined with each first area at a distance of the 5th nearest region.For each
Each of first area photosensitive unit 41, the imaging electric signal that each photosensitive unit 41 can be generated subtract infrared electricity
Signal and the circuit noise signal generated with Noise Circuits unit 422 of the first area in the 5th nearest region are to obtain
To each photosensitive unit 41 eventually for the electric signal of imaging, if the number of Noise Circuits unit 422 is in the 5th region
Multiple, then the multiple circuit noise signals that can first generate to multiple Noise Circuits units 422 in the 5th region take mean value,
Imaging electric signal is subtracted into infrared electric signal again and the mean value obtains the electric signal eventually for imaging.
Incorporated by reference to Figure 14, in some embodiments, image acquiring method further includes step 06: obtaining Noise Circuits unit
422 circuit noise signal；Step 03 includes step 033: being obtained according to imaging optical signal, infrared electric signal and circuit noise signal
Take image.
Wherein, step 06 can be realized by Noise Circuits unit 422, and step 033 can be realized by imager chip 300.It is real
The detail for applying step 06 and step 033 can be with reference to above description, and details are not described herein.
Referring to Fig. 7, veiling glare photosensitive unit 411, noise photosensitive unit can also be arranged on the same photosensitive layer 40 simultaneously
412, any one or more in Noise Circuits unit 422 and infrared photosensitive unit 413.For example, it is photosensitive that veiling glare is arranged simultaneously
Unit 411 and noise photosensitive unit 412, imager chip 300 will be according to interference electric signal and noise electric signal in imaging at this time
Image is corrected, such as will be imaged after the imaging electric signal that optical signal generates subtracts interference electric signal and noise electric signal and make
For the electric signal eventually for imaging.For another example veiling glare photosensitive unit 411 and Noise Circuits unit 422 are arranged simultaneously, at this time at
As chip 300 will be corrected image according to interference electric signal and circuit noise signal in imaging, such as imaging is believed
Number imaging electric signal generated subtracts interfere electric signal and circuit noise signal after as the electric signal eventually for imaging.Example again
Such as, while Noise Circuits unit 422 and infrared photosensitive unit 413 are set, imager chip 300 will be according to circuit in imaging at this time
Noise signal and infrared signal are corrected image, such as the imaging electric signal that optical signal generates will be imaged and subtract circuit and make an uproar
As the electric signal eventually for imaging after acoustical signal and infrared electric signal.For another example be arranged simultaneously noise photosensitive unit 412,
Noise Circuits unit 422 and infrared photosensitive unit 413, imager chip 300 will be according to noise electric signal, circuit in imaging at this time
Noise signal and infrared signal are corrected image, such as the imaging electric signal that optical signal generates will be imaged and subtract noise electricity
As the electric signal eventually for imaging after signal, circuit noise signal and infrared electric signal.For another example veiling glare sense is arranged simultaneously
Light unit 411, noise photosensitive unit 412 and infrared photosensitive unit 413, imager chip 300 will be according to interference in imaging at this time
Electric signal, noise electric signal, circuit noise signal and infrared signal are corrected image, such as imaging optical signal is generated
Imaging electric signal subtract after interference electric signal, noise electric signal, circuit noise signal and infrared electric signal as eventually for
Electric signal of imaging etc..
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the application.
In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description
Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side
Formula combines.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one described feature.In the description of the present application, the meaning of " plurality " is at least two, such as two,
Three, unless otherwise specifically defined.
Although embodiments herein has been shown and described above, it is to be understood that above-described embodiment is example
Property, it should not be understood as the limitation to the application, those skilled in the art within the scope of application can be to above-mentioned
Embodiment is changed, modifies, replacement and variant, and scope of the present application is defined by the claims and their equivalents.
Claims (10)
1. a kind of display device, which is characterized in that the display device includes stacking gradually setting:
First substrate；
Liquid crystal layer；
The second substrate；
Photosensitive layer, the photosensitive layer include multiple photosensitive units, and the photosensitive unit includes infrared photosensitive unit, the infrared sense
Light unit is used to generate infrared electric signal according to the infrared signal received；And
Layer is collimated, the collimation layer includes multiple collimation units, and the collimation unit offers light hole, the light hole alignment
The photosensitive unit, the light hole can allow for optical signal to pass through to the photosensitive unit.
2. display device according to claim 1, which is characterized in that be provided with multiple display units in the second substrate
And the shading piece between multiple display units, the photosensitive unit are directed at setting with the shading piece.
3. display device according to claim 2, which is characterized in that the photosensitive unit is on the second substrate just
Projection is located in the shading piece.
4. according to claim 1 to display device described in 3 any one, which is characterized in that the display device includes display
Face, the display surface are formed with viewing area, and multiple photosensitive units are located at the viewing area in the orthographic projection of the display surface
It is interior.
5. according to claim 1 to display device described in 3 any one, which is characterized in that the display device includes display
Face, the collimation unit are made of light absorbent, and the light hole extends perpendicularly to the display surface.
6. according to claim 1 to display device described in 3 any one, which is characterized in that the cross-sectional width of the light hole
Ratio with the depth of the light hole is less than 0.2.
7. according to claim 1 to display device described in 3 any one, which is characterized in that each light hole includes more
A spaced sub- light hole, including in a light hole multiple sub- light holes with it is same described photosensitive
Unit alignment.
8. according to claim 1 to display device described in 3 any one, which is characterized in that the photosensitive unit is arranged in more
The photosensitive array of row multiple row, the infrared photosensitive unit are evenly distributed in the photosensitive array.
9. a kind of electronic equipment characterized by comprising
Casing；And
Display device described in claim 1 to 8 any one, the display device installation is on the housing.
10. a kind of image acquiring method, which is characterized in that described image acquisition methods are used for display device, the display device
First substrate, liquid crystal layer, the second substrate, photosensitive layer and collimation layer including stacking gradually setting；The photosensitive layer includes multiple
Photosensitive unit, the photosensitive unit include infrared photosensitive unit, and the infrared photosensitive unit is used for according to the infrared light received
Signal generates infrared electric signal；The collimation layer includes multiple collimation units, and the collimation unit offers light hole, described logical
Unthreaded hole is directed at the photosensitive unit, and the light hole can allow for optical signal to pass through to the photosensitive unit；Described image
Acquisition methods include:
It receives the imaging optical signal including target optical signal and reaches the sense after the target optical signal passes through the light hole
Light unit；
The infrared signal received according to the infrared photosensitive unit obtains infrared electric signal；And
Image is obtained according to the imaging optical signal and the infrared electric signal.
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| CN108664854A (en) * | 2017-03-30 | 2018-10-16 | 上海箩箕技术有限公司 | Fingerprint imaging module and electronic equipment |
| CN109271057A (en) * | 2018-08-16 | 2019-01-25 | Oppo广东移动通信有限公司 | Display component and electronic equipment |
| CN109359459A (en) * | 2018-10-26 | 2019-02-19 | 京东方科技集团股份有限公司 | Fingerprint identification method, fingerprint identification device and display module |
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| WO2021036747A1 (en) * | 2019-08-29 | 2021-03-04 | 维沃移动通信有限公司 | Display module and electronic device |
| CN110941117A (en) * | 2019-11-28 | 2020-03-31 | 武汉华星光电技术有限公司 | Display panel and electronic device |
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