CN110278299B

CN110278299B - Display device, electronic apparatus, and image acquisition method

Info

Publication number: CN110278299B
Application number: CN201910548872.4A
Authority: CN
Inventors: 袁石林
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-06-24
Filing date: 2019-06-24
Publication date: 2021-10-19
Anticipated expiration: 2039-06-24
Also published as: CN110278299A

Abstract

The application discloses a display device. The display device comprises a display surface and a bottom surface which are opposite, and a first substrate, a photosensitive layer, a liquid crystal layer, a second substrate and an infrared cut-off layer are arranged between the display surface and the bottom surface; the photosensitive layer is arranged on the first substrate and comprises a plurality of photosensitive units; the liquid crystal layer is arranged on the photosensitive layer; the second substrate is arranged on the liquid crystal layer, a shading piece is arranged on the second substrate, a plurality of light passing holes are formed in the shading piece, each light passing hole is aligned to one corresponding photosensitive unit, and the light passing holes can allow optical signals to pass through and reach the photosensitive units; the infrared cut-off layer is arranged between the photosensitive layer and the display surface and used for filtering infrared light signals reaching the infrared cut-off layer. The application also discloses an electronic device and an image acquisition method. According to the demand, the distribution area of the plurality of photosensitive units can be set, so that the proportion of the distribution area of the plurality of photosensitive units in the area of the display surface is large, and the user experience is good.

Description

Display device, electronic apparatus, and image acquisition method

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a display device, an electronic apparatus, and an image acquisition method.

Background

In the correlation technique, the cell-phone can dispose fingerprint identification module and display module assembly, the fingerprint identification module assembly can be used for discerning user's identity, the display module assembly can be used to show the image, there is the mode of setting up the range upon range of the below at the display module assembly with the fingerprint identification module assembly at present, the position that corresponds with the fingerprint identification module assembly on the user contact display module assembly is in order to type in the fingerprint, however, in the display area of display module assembly, only very little some can supply the user to touch in order to carry out fingerprint identification, user experience is relatively poor.

Disclosure of Invention

The embodiment of the application provides a display device, electronic equipment and an image acquisition method.

The display device comprises a display surface and a bottom surface which are opposite, and a first substrate, a photosensitive layer, a liquid crystal layer, a second substrate and an infrared cut-off layer are arranged between the display surface and the bottom surface; the photosensitive layer is arranged on the first substrate and comprises a plurality of photosensitive units; the liquid crystal layer is arranged on the photosensitive layer; the second substrate is arranged on the liquid crystal layer, a light shielding piece is arranged on the second substrate, a plurality of light passing holes are formed in the light shielding piece, each light passing hole is aligned with one corresponding photosensitive unit, and the light passing holes can allow optical signals to pass through and reach the photosensitive units; the infrared cut-off layer is arranged between the photosensitive layer and the display surface and used for filtering infrared light signals reaching the infrared cut-off layer.

The electronic equipment of the embodiment of the application comprises a machine shell and the display device of the embodiment of the application, wherein the display device is installed on the machine shell.

The image acquisition method is applied to a display device, the display device comprises a display surface and a bottom surface which are opposite, and a first substrate, a photosensitive layer, a liquid crystal layer, a second substrate and an infrared cut-off layer are arranged between the display surface and the bottom surface; the image acquisition method comprises the following steps: receiving an imaging optical signal comprising a target optical signal, wherein the target optical signal passes through the display surface, the infrared cut-off layer and the light passing hole and then reaches the photosensitive layer; and acquiring an image according to the imaging optical signal.

In the display device, the electronic device and the image acquisition method of the embodiment of the application, a plurality of photosensitive units are arranged between the display surface and the bottom surface of the display device, the photosensitive units can receive optical signals entering from the display surface and penetrating through the light passing holes, images of objects touching on the display surface can be acquired according to the optical signals, the images can be used for fingerprint identification, the distribution area of the plurality of photosensitive units can be set according to requirements, the proportion of the areas distributed by the plurality of photosensitive units in the area of the display surface is large, a user can perform fingerprint identification on the large area of the display surface, user experience is good, meanwhile, infrared signals can be filtered by an infrared cut-off layer, the influence of the infrared signals on the images of the objects is avoided, and the imaging accuracy is improved.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic cross-sectional structure diagram of a display device according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a display device for fingerprint recognition according to an embodiment of the present application;

fig. 4 is a schematic perspective view of a display device according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a photosensitive layer and an imaging chip according to an embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram of a photosensitive layer and a display driving layer according to an embodiment of the present disclosure;

fig. 7 is a schematic plan view of a second substrate according to an embodiment of the present application;

fig. 8 is an enlarged schematic view of a portion VIII of the second substrate in fig. 7;

FIG. 9 is a schematic flow chart diagram of an image acquisition method according to an embodiment of the present application;

FIG. 10 is a schematic side view of a display device according to an embodiment of the present disclosure;

FIG. 11 is a schematic flow chart diagram of an image acquisition method according to an embodiment of the present application;

FIG. 12 is a schematic side view of a display device according to an embodiment of the present disclosure;

fig. 13 is a flowchart illustrating an image acquisition method according to an embodiment of the present application.

Description of the main element symbols:

the display device comprises an electronic device 1000, a display device 100, a backlight layer 10, a bottom surface 11, a first polarizing layer 20, a first substrate 30, a photosensitive layer 40, a photosensitive unit 41, a stray light photosensitive unit 411, a noise photosensitive unit 412, a circuit unit 42, a photosensitive circuit unit 421, a noise circuit unit 422, a liquid crystal layer 50, a second substrate 60, a display unit 61, a light shielding member 62, a light passing hole 621, a light shielding unit 63, an infrared cut-off layer 70, a second polarizing layer 80, a cover plate 90, a display surface 91, a display area 911, a back surface 92, an ink layer 93, a chassis 200, an imaging chip 300, an object 2000, a display driving layer 1a and a display driving unit 1a 1.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, an electronic device 1000 according to an embodiment of the present disclosure includes a housing 200 and a display device 100. The display device 100 is mounted on the set cover 200. Specifically, the electronic device 1000 may be a mobile phone, a tablet computer, a display, a notebook computer, a teller machine, a gate, a smart watch, a head display device, a game console, and the like, and the electronic device 1000 is taken as an example of a mobile phone in the present application, it is understood that the specific form of the electronic device 1000 is not limited to a mobile phone.

The chassis 200 may be used to mount the display device 100, or the chassis 200 may be used as a mounting carrier of the display device 100, and the chassis 200 may also be used to mount functional modules of the electronic apparatus 1000, such as a power supply device, an imaging device, and a communication device, so that the chassis 200 provides protection for the functional modules against falling, water, and the like.

The display device 100 can be used for displaying images such as pictures, videos, and texts. The display device 100 is mounted on the cabinet 200, and specifically, the display device 100 may be mounted on the front surface of the cabinet 200, or the display device 100 is mounted on the rear surface of the cabinet 200, or the display device 100 is mounted on both the front surface and the rear surface of the cabinet 200, or the display device 100 is mounted on the side surface of the cabinet 200, which is not limited herein. In the example shown in fig. 1, the display device 100 is mounted on the front surface of the cabinet 200.

Referring to fig. 2 to 4, the display device 100 includes a display surface 91 and a bottom surface 11 opposite to each other, and between the display surface 91 and the bottom surface 11, the display device 100 includes a first substrate 30, a photosensitive layer 40, a liquid crystal layer 50, a second substrate 60, and an infrared cut-off layer 70. A photosensitive layer 40 is disposed on the first substrate 30, and the photosensitive layer 40 includes a plurality of photosensitive cells 41. The liquid crystal layer 50 is disposed on the photosensitive layer 40. The second substrate 60 is disposed on the liquid crystal layer 50. The second substrate 60 is provided with a light shielding member 62, the light shielding member 62 is provided with a plurality of light passing holes 621, each light passing hole 621 is aligned with a corresponding one of the light sensing units 41, and the light passing holes 621 can allow the light signal to pass through and reach the light sensing units 41. The infrared cut-off layer 70 is disposed between the photosensitive layer 40 and the display surface 91, and the infrared cut-off layer 70 is used for filtering infrared signals reaching the infrared cut-off layer 70.

In the electronic device 1000 according to the embodiment of the present application, the plurality of photosensitive units 41 are disposed between the display surface 91 and the bottom surface 11 of the display device 100, the photosensitive units 41 can receive the light signal entering from the display surface 91 and passing through the light passing hole 621, the image of the object touching on the display surface 91 can be obtained according to the light signal, the image can be used for fingerprint identification, the distribution area of the plurality of photosensitive units 41 can be set according to the requirement, the ratio of the distribution area of the plurality of photosensitive units 41 to the area of the display surface 91 is large, the user can perform fingerprint identification on the large area of the display surface 91, the user experience is good, meanwhile, the infrared cut-off layer 70 can filter the infrared light signal, the influence of the infrared light signal on the image of the object is avoided, and the imaging accuracy is improved.

Specifically, the display device 100 may display the light signal emitted by the light emitting element inside the display device 100, the display device 100 may display the light signal emitted by the external light source by guiding the light signal, the display device 100 may be non-bendable, and the display device 100 may be bendable, which is not limited herein.

In the embodiment of the present application, referring to fig. 2 to 4, along the light emitting direction of the display device 100, the display device 100 sequentially includes a backlight layer 10, a first polarizing layer 20, a first substrate 30, a photosensitive layer 40, a liquid crystal layer 50, a second substrate 60, an infrared cut-off layer 70, a second polarizing layer 80, and a cover plate 90.

As shown in fig. 2 and 3, the backlight layer 10 may be used for emitting an optical signal La, or the backlight layer 10 may be used for guiding the optical signal La emitted by a light source (not shown). The optical signal La sequentially passes through the first polarizing layer 20, the first substrate 30, the photosensitive layer 40, the liquid crystal layer 50, the second substrate 60, the infrared cut-off layer 70, the second polarizing layer 80, and the cover plate 90, and then enters the outside. The backlight layer 10 includes a bottom surface 11, and specifically, the bottom surface 11 may be a surface of the backlight layer 10 opposite to the first polarizing layer 20.

The first polarizing layer 20 is disposed on the backlight layer 10, and the first polarizing layer 20 may be a polarizing plate or a polarizing film, in particular. The first substrate 30 is disposed on the first polarizing layer 20, and the first substrate 30 may be a glass substrate.

The photosensitive layer 40 may be a Film layer formed on the first substrate 30, for example, formed on the first substrate 30 by a tft (thin Film transistor) process. Referring to fig. 4 to 6, the photosensitive layer 40 includes a plurality of photosensitive units 41 and a plurality of circuit units 42.

The light sensing unit 41 may convert the received optical signal into an electrical signal by using a photoelectric effect, and the intensity of the optical signal received by the light sensing unit 41 may be reflected by analyzing the intensity of the electrical signal generated by the light sensing unit 41. In one example, the light sensing unit 41 may receive only visible light signals to be converted into electrical signals, in another example, the light sensing unit 41 may receive only invisible light to be converted into electrical signals, and in yet another example, the light sensing unit 41 may receive visible light and invisible light to be converted into electrical signals. The types of the plurality of photosensitive units 41 may be the same, and the types of the plurality of photosensitive units 41 may not be completely the same. The plurality of photosensitive units 41 may be arranged in any manner, and the arrangement manner of the plurality of photosensitive units 41 may be specifically set according to the requirements of the appearance and the like of the display device 100. Each of the light sensing units 41 can operate independently without being affected by other light sensing units 41, and the intensity of the light signal received by the light sensing unit 41 at different positions may be different, so the intensity of the electrical signal generated by the light sensing unit 41 at different positions may also be different. In addition, a side of the photosensitive unit 41 facing the bottom surface 11 may be provided with a reflective material, and a light signal irradiated from the backlight layer 10 to the photosensitive unit 41 may be reflected by the reflective material, so as to prevent the light signal from affecting the accuracy of imaging performed by the photosensitive layer 40.

The circuit unit 42 may be connected to the photosensitive unit 41. The circuit unit 42 may transmit the electrical signal generated by the light sensing unit 41 to the imaging chip 300 of the electronic device 1000. The circuit unit 42 may specifically include a transistor and the like. The number of the circuit units 42 may be plural, each of the photosensitive units 41 may be connected to a corresponding one of the circuit units 42, and the plural circuit units 42 are connected to the imaging chip 300 by a connection line. The arrangement of the plurality of circuit units 42 may be similar to the arrangement of the photosensitive units 41, for example, the plurality of photosensitive units 41 may be arranged in a matrix of rows and columns, and the plurality of circuit units 42 may also be arranged in a matrix of rows and columns.

Referring to fig. 2 to 4, the liquid crystal layer 50 is disposed on the photosensitive layer 40, and liquid crystal molecules in the liquid crystal layer 50 can change a deflection direction under the action of an electric field, so as to change an amount of an optical signal passing through the liquid crystal layer 50. Accordingly, referring to fig. 6, a display driving layer 1a may be further formed on the first substrate 30, and the display driving layer 1a may apply an electric field to the liquid crystal layer 50 under the driving action of a driving chip (not shown) to control the deflection directions of the liquid crystal molecules at different positions. Specifically, the display driving layer 1a includes a plurality of display driving units 1a1, and each display driving unit 1a1 can independently control the deflection direction of the liquid crystal at the corresponding position.

Referring to fig. 2, 4, 7 and 8, the second substrate 60 is disposed on the liquid crystal layer 50. The second substrate 60 may include a glass substrate, and a plurality of display units 61 and a light blocking member 62 disposed on the glass substrate. The display unit 61 may be a color filter, for example, R represents an infrared filter, G represents a green filter, and B represents a blue filter, to control the color finally displayed by the display device 100 by controlling the amount of light signals passing through the filters of different colors. The arrangement of the plurality of display units 61 may correspond to the arrangement of the plurality of display driving units 1a1, for example, one display unit 61 is aligned with one display driving unit 1a 1.

The light-shielding members 62 are located between the display units 61, and the light-shielding members 62 space adjacent two display units 61, and in one example, the light-shielding members 62 may be Black Matrix (BM). The light shielding member 62 can prevent light from passing through the display unit 61, so as to prevent light in the display device 100 from entering the outside without passing through the display unit 61, and the light shielding member 62 can prevent light crosstalk when light signals pass through the adjacent display units 61.

Referring to fig. 3, the light shielding member 62 is provided with a light passing hole 621, and the light passing hole 621 is used for passing an optical signal. The position of the light passing hole 621 is aligned with the photosensitive unit 41, wherein the alignment may mean that the center line of the light passing hole 621 passes through the photosensitive unit 41. The light shielding member 62 may be made of a light absorbing material, and when the light signal reaches the solid portion of the light shielding member 62, the light signal may be partially or completely absorbed, for example, in the process of passing through the light passing hole 621, if the light signal reaches the inner wall of the light passing hole 621, the light signal may be partially or completely absorbed by the inner wall of the light passing hole 621, so that the propagation direction of the light signal that can pass through the light passing hole 621 almost coincides with the extending direction of the center line of the light passing hole 621, collimation of the light signal is achieved, and the interference light signal received by the light sensing unit 41 is less. The light passing holes 621 may be distributed in the same manner as the photosensitive cells 41, such that each photosensitive cell 41 is aligned with one light passing hole 621.

The light transmitting holes 621 may extend perpendicular to the display surface 91, so that the light transmitting holes 621 can only transmit light signals propagating in a direction perpendicular to the display surface 91, or the light transmitting holes 621 can only transmit light signals propagating vertically downward from the display surface 91. The ratio of the cross-sectional width of the light passing hole 621 to the depth of the light passing hole 621 is less than 0.2, wherein the depth of the light passing hole 621 may be the depth of the light passing hole 621 along the center line direction, the cross-sectional width of the light passing hole 621 may be the maximum cross-sectional dimension of the figure cut by the plane perpendicular to the center line of the light passing hole 621, and the ratio may be specifically 0.1, 0.111, 0.125, 0.19, 0.2, and the like, so that the light shielding member 62 has a good collimation effect on the light signal.

Referring to fig. 4, 7 and 8, in the embodiment of the present application, the light passing hole 621 includes a plurality of sub light passing holes 6211, the sub light passing holes 6211 are spaced from each other, and the sub light passing holes 6211 included in one light passing hole 621 are aligned with the same photosensitive unit 41. Specifically, as in the example shown in fig. 8, four sub light passing holes 6211 are aligned with the same photosensitive unit 41, and the light passing through each sub light passing hole 6211 can reach the same photosensitive unit 41. It is understood that the plurality of sub-clearance holes 6211 may be identical in shape and size to facilitate mass production. The extending direction of each sub light passing hole 6211 may be perpendicular to the display surface 91. Each sub-pupil 6211 can achieve the collimation effect on the optical signal.

The ratio of the cross-sectional width of the sub light-passing hole 6211 to the depth of the sub light-passing hole 6211 is less than 0.2, wherein the depth of the sub light-passing hole 6211 may be the depth of the sub light-passing hole 6211 along the direction of the central line, and the cross-sectional width of the sub light-passing hole 6211 may be the maximum cross-sectional dimension of the pattern cut by the plane perpendicular to the central line of the sub light-passing hole 6211, and the ratio may be specifically 0.1, 0.121, 0.127, 0.178, 00.192, 0.2, and the like, so that the light-shielding member 62 has a good collimation effect on the light signal. Since the light passing hole 621 is divided into a plurality of sub light passing holes 6211 at intervals, the thickness of the light shielding member 62 can be set to be smaller on the premise of ensuring the collimation effect, i.e., on the premise of ensuring that the ratio of the cross-sectional width to the depth of the light passing space is less than 0.2, so as to reduce the overall thickness of the display device 100.

Of course, the light transmitting hole 621 may not include the plurality of sub light transmitting holes 6211, and the light transmitting hole 621 is a complete and single hole.

Referring to fig. 2 to 4, in the embodiment of the present invention, an infrared cut layer 70 is disposed on the second substrate 60. In other embodiments, the infrared cut layer 70 may be disposed between the photosensitive layer 40 and the display surface 91, for example, the infrared cut layer 70 is disposed between the second polarizing layer 80 and the cover plate 90, or the infrared cut layer 70 is disposed between the liquid crystal layer 50 and the second substrate 60, or the infrared cut layer 70 is disposed between the photosensitive layer 40 and the liquid crystal layer 50. The number of the infrared cut-off layers 70 may also be multiple, and multiple infrared cut-off layers 70 are respectively disposed on different layers between the photosensitive layer 40 and the display surface 91 to filter out the infrared light signals multiple times, for example, one infrared cut-off layer 70 is disposed between the second substrate 60 and the second polarizing layer 80, and another infrared cut-off layer 70 is disposed between the second polarizing layer 80 and the cover plate 90.

The infrared cut layer 70 may be in the form of an infrared cut film, an infrared cut sheet, or the like, and the infrared cut layer 70 may be used to filter out an infrared light signal reaching the infrared cut layer 70. Specifically, after an infrared light signal (e.g., a light signal having a wavelength exceeding 780 nm) reaches the infrared cut-off layer 70, the infrared light signal is absorbed or reflected by the infrared cut-off layer 70, so that the transmittance of the infrared light signal by the infrared cut-off layer 70 is very low and approaches to 0, and meanwhile, the transmittance of the visible light signal (e.g., a light signal having a wavelength of 350 nm to 780 nm) by the infrared cut-off layer 70 is very high and can reach 93% or more, so that the influence of the infrared cut-off layer 70 on the display brightness of the display device 100 is very small.

In practical use, since infrared light exists in the external environment and may penetrate through some objects to enter the display device 100, if the infrared cut-off layer 70 is not provided, the infrared light may penetrate through an object to be imaged (e.g., a finger of a user), pass through the display surface 91 and the light passing hole 621, and be received by the light sensing unit 41, and the infrared light and a texture of the object to be imaged (e.g., a fingerprint of the user) are not associated, and an infrared signal generated by the infrared light (infrared light signal) may interfere with the imaging of the imaging chip 300. After the infrared cut-off layer 70 is arranged between the display surface 91 and the photosensitive layer 40, most of the infrared signals are filtered by the infrared cut-off layer 70 before reaching the photosensitive unit 41 of the photosensitive layer 40, so that the influence of the infrared signals on the image of the object is avoided, and the imaging accuracy is improved.

The second polarizing layer 80 is disposed on the second substrate 60, and the second polarizing layer 80 may be a polarizing plate or a polarizing film, in particular.

With continued reference to fig. 2 and fig. 3, the cover plate 90 is disposed on the second polarizing layer 80. The cover plate 90 may be made of glass, sapphire, or the like. The cover 90 includes a display surface 91 and a back surface 92. The optical signal emitted from the display device 100 passes through the display surface 91 and enters the outside, and the external light passes through the display surface 91 and enters the display device 100. The back surface 92 may be attached to the second polarizing layer 80. In some examples, the display device 100 may not include the cover plate 90, and the display surface 91 is formed on the second polarizing layer 80.

The display surface 91 is formed with a display area 911, the display area 911 refers to an area that can be used to display an image, and the display area 911 may have any shape such as a rectangle, a circle, a rectangle with rounded corners, or a rectangle with "bang", and the present invention is not limited thereto. In addition, in some examples, the display surface 91 may also be formed with a non-display area, the non-display area may be formed at a peripheral position of the display area 911, and the non-display area may be used for connecting with the chassis 200. The ratio of the display area 911 on the display surface 91 may be any value such as 80%, 90%, 100%, or the like.

In the embodiment of the present application, the orthographic projection of the plurality of light sensing units 41 on the display surface 91 is located in the display area 911. So that the plurality of light sensing units 41 can image an object touched within the display area 911, for an example in which a user touches the display area 911 with a finger, the plurality of light sensing units 41 can image a fingerprint of the finger touched on the display area 911 and be used for fingerprint recognition.

Referring to fig. 2 and 3, the following describes the imaging performed by the display device 100 by way of example: the optical signal La emitted by the display device 100 sequentially passes through the first polarizing layer 20, the first substrate 30, the photosensitive layer 40, the liquid crystal layer 50, the second substrate 60, the infrared cut-off layer 70, the second polarizing layer 80, and the cover plate 90 and then enters the outside, and the external optical signal La may also sequentially pass through the cover plate 90, the second polarizing layer 80, the second substrate 60, and the liquid crystal layer 50 and then reach the photosensitive layer 40. If the light signal just reaches the light sensing unit 41 in the photosensitive layer 40, the light sensing unit 41 generates an electrical signal to reflect the intensity of the light signal. Thereby, the intensity distribution of the optical signal entering the display device 100 can be reflected by the intensity of the electric signal of the plurality of light receiving units 41.

Take the example where the user touches the display surface 91 with a finger 2000. When the display device 100 is emitting the optical signal La outward, the finger 2000 touches a predetermined position of the display surface 91, the finger 2000 reflects the optical signal La to form an optical signal L1, the optical signal L1 then starts to enter the display device 100, the optical signal L1 first passes through the cover plate 90 and the second polarizing layer 80, for the optical signal L1 whose propagation direction is the same as the extending direction of the light passing hole 621 (or the sub light passing hole 6211), the optical signal L1 can also pass through the light passing hole 621 (or the sub light passing hole 6211), after the optical signal L1 passes through the light passing hole 621, the optical signal L1 passes through the liquid crystal layer 50 and reaches the light sensing unit 41. For the optical signal with the propagation direction different from the extending direction of the light passing hole 621 (or the sub-light passing hole 6211), after the optical signal passes through the cover plate 90 and the second polarizing layer 80, the optical signal cannot pass through the light passing hole 621 (or the sub-light passing hole 6211) and further cannot reach the photosensitive unit 41 aligned with the light passing hole 621 (or the sub-light passing hole 6211).

It can be understood that the fingerprint of the finger has a peak and a valley, when the finger 2000 touches the display surface 91, the peak is in direct contact with the display surface 91, a gap exists between the valley and the display surface 91, and after the optical signal La reaches the peak and the valley, the intensity of the optical signal reflected by the peak (hereinafter referred to as a first optical signal) and the intensity of the optical signal reflected by the valley (hereinafter referred to as a second optical signal) are different, so that the intensity of the electrical signal generated by receiving the first optical signal (hereinafter referred to as a first electrical signal) and the intensity of the electrical signal generated by receiving the second optical signal (hereinafter referred to as a second electrical signal) are different, and the imaging chip 300 can acquire the image of the fingerprint according to the distribution of the first electrical signal and the second electrical signal. The image of the fingerprint may further be used for fingerprint recognition.

It is understood that the user touches over any area where the light sensing unit 41 is disposed, and the purpose of imaging and recognizing the fingerprint can be achieved. When the photosensitive units 41 are correspondingly arranged below the display area 911, the purpose of imaging and identifying the fingerprint can be achieved by a user touching any position of the display area 911, and the user is not limited to certain specific positions of the display area 911. Meanwhile, a user can simultaneously touch a plurality of positions on the display area 911 with a plurality of fingers, or a plurality of users simultaneously touch a plurality of positions on the display area 911 with a plurality of fingers, so as to achieve the purpose of imaging and identifying a plurality of fingerprints, thereby enriching the verification modes and applicable scenes of the electronic device 1000, for example, authorization is performed only when a plurality of fingerprints are verified simultaneously, and a plurality of users can perform operations such as games on the same electronic device 1000.

Of course, similarly to the case where the user touches the display surface 91 with a finger, any object (for example, an arm, a forehead, clothes, flowers, and plants of the user) capable of reflecting the optical signal La can image the surface texture of the object after touching the display surface 91, and the subsequent processing for imaging can be set according to the user requirement, which is not limited herein.

Referring to fig. 9, an embodiment of the present application further discloses an image obtaining method, which can be applied to the display device 100, and the image obtaining method includes the steps of:

01: receiving an imaging light signal including a target light signal; and

02: and acquiring an image according to the imaging optical signal.

Wherein, step 01 can be implemented by the photosensitive layer 40, and step 02 can be implemented by the imaging chip 300. The imaging light signal refers to all light signals received by the light sensing unit 41, and the target light signal refers to a light signal that reaches the light sensing unit 41 after passing through the light passing hole 621. The details of the steps 01 and 02 can be referred to the above description of the display device 100, and are not repeated herein.

In summary, in the electronic apparatus 1000 and the image acquiring method according to the embodiment of the application, the plurality of photosensitive units 41 are disposed between the display surface 91 and the bottom surface 11 of the display device 100, the photosensitive units 41 can receive the light signal entering from the display surface 91 and passing through the light passing hole 621, and the image of the object touching on the display surface 91 can be acquired according to the light signal, and the image can be used for fingerprint identification, meanwhile, the distribution area of the plurality of photosensitive units 41 can be set according to the requirement, so that the ratio of the distribution area of the plurality of photosensitive units 41 to the area of the display surface 91 is relatively large, the user can perform fingerprint identification on a relatively large area of the display surface 91, and the user experience is relatively good.

Referring to fig. 5 and 10, in some embodiments, the light sensing unit 41 includes a stray light sensing unit 411. An ink layer 93 is disposed on the back 92 of the cover plate 90, the stray light sensing unit 411 corresponds to the ink layer 93, and the ink layer 93 is used for blocking the optical signal Lb penetrating into the cover plate 90 from the outside.

In actual use, part of the light signal emitted from the backlight layer 10 directly passes through the display surface 91, and part of the light signal may be reflected between the display surface 91 and the backlight layer 10 one or more times, while part of the reflected light signal L2 may reach the light-sensing unit 41 and interfere with the imaging of the display device 100. That is, among the imaging light signals for imaging, there is also included the disturbing light signal L2, the disturbing light signal L2 being reflected by the display device 100 and reaching the photosensitive cells 41 on the photosensitive layer 40.

The ink layer 93 is disposed at a position corresponding to the stray light sensing unit 411 on the back surface 92, most of the light in the display device 100 reaching the ink layer 93 is absorbed by the ink layer 93, and a small portion (e.g., 4%) of the light is reflected by the ink layer 93, so that the reflection of the cover plate 90 on the optical signal inside the display device 100 can be simulated by the ink layer 93, and the stray light sensing unit 411 may receive the optical signal L2 reaching the stray light sensing unit 411 from the side of the stray light sensing unit 411. In summary, the parasitic light sensing unit 411 can receive the same interference light signal L2 as the rest of the light sensing units 41, and at the same time, the ink layer 93 can block (reflect or absorb) the light signal Lb penetrating into the cover 90 from the outside, so that the parasitic light sensing unit 411 only receives the interference light signal L2, and the rest of the light sensing units 41 can simultaneously receive the interference light signal L2 and the light signal Lb penetrating into the cover 90 from the outside.

The type and performance of the veiling glare photosensitive unit 411 are the same as those of the rest of the photosensitive units 41, the veiling glare photosensitive unit 411 transmits the interference electrical signal generated by the interference optical signal L2 to the imaging chip 300, and the imaging chip 300 corrects the image according to the interference electrical signal during imaging, for example, the imaging electrical signal generated by the imaging optical signal is subtracted from the interference electrical signal to be used as the electrical signal finally for imaging, so as to obtain an image with higher accuracy and improve the accuracy of image recognition.

In one example, the veiling glare photosensitive unit 411 and the remaining photosensitive units 41 are both CCD image sensors, and at this time, the imaging electrical signal and the interference electrical signal may be subtracted in the imaging chip 300, that is, the imaging electrical signal and the interference electrical signal are both transmitted to the imaging chip 300, and the imaging chip 300 performs the operation of subtracting the interference electrical signal from the imaging electrical signal, or the imaging electrical signal and the interference electrical signal may be subtracted in an analog-to-digital converter, that is, the imaging electrical signal and the interference electrical signal are both transmitted to the analog-to-digital converter, and the analog-to-digital converter performs the operation of subtracting the interference electrical signal from the imaging electrical signal, and then transmits the electrical signal obtained by subtracting the two signals to the imaging chip 300. In another example, the stray light sensing unit 411 and the remaining light sensing units 41 are both CMOS image sensors, and in this case, the subtraction of the imaging electrical signal and the interference electrical signal can be performed in the imaging chip 300, i.e., the imaging electrical signal and the interference electrical signal are both transmitted to the imaging chip 300, the imaging chip 300 performs the operation of subtracting the interference electrical signal from the imaging electrical signal, alternatively, the subtraction of the imaging electrical signal and the interference electrical signal can be performed in the light sensing unit 41, a first storage region, a second storage region and a logic subtraction circuit are added in the light sensing unit 41, the imaging electrical signal generated by the light sensing unit 41 is stored in the first storage region, the disturbing electrical signal is sent by the veiling glare cell 411 to the light sensing cell 41 and stored in the second storage region, the logic subtraction circuit performs an operation of subtracting the interference electrical signal from the imaging electrical signal, and then transmits the electrical signal obtained by subtracting the interference electrical signal from the imaging electrical signal to the imaging chip 300. The above description of the subtraction of the imaging electrical signal and the interfering electrical signal is merely an example and is not to be construed as limiting the present application.

In one example, the ink layer 93 is disposed near the edge of the back surface 92, and the stray light sensing unit 411 is disposed at the edge of the photosensitive layer 40, for example, as shown in an area a of fig. 5, the stray light sensing unit 411 is disposed in the area a, where the area a is disposed in the leftmost column and the rightmost column of the array of the sensing units 41 of fig. 5, so as to avoid the ink layer 93 from causing too much influence on the display effect of the display device 100. Specifically, the light sensing units 41 may be arranged in a matrix with multiple rows and multiple columns, and the veiling glare light sensing units 411 may be disposed at an edge of the matrix, for example, one to three columns near the edge of the matrix, and one to three rows near the edge of the matrix, so as to adapt to the position of the ink layer 93.

Further, since there are a plurality of stray light sensing units 411, a plurality of interference electrical signals may be generated accordingly, and the magnitudes of the plurality of interference electrical signals may be different, when subtracting the interference electrical signal from the imaging electrical signal, in one example, the plurality of interference electrical signals may be averaged, and then the averaged interference electrical signal may be subtracted from the imaging electrical signal. In another example, the light sensing units 41 and the parasitic light sensing units 411 may be partitioned, respectively, and each area includes at least one light sensing unit 41 or at least one parasitic light sensing unit 411. Subsequently, the second region closest to each first region may be determined according to the position of each region (hereinafter referred to as a first region) including the photosensitive unit 41 and the position of each region (hereinafter referred to as a second region) including the veiling glare photosensitive unit 411. For each photo-sensing unit 41 in each first region, the imaging electrical signal generated by each photo-sensing unit 41 may be subtracted by the interference electrical signal generated by the parasitic photo-sensing unit 411 in the second region closest to the first region to obtain the electrical signal finally used for imaging by each photo-sensing unit 41, and if there are a plurality of parasitic photo-sensing units 411 in the second region, the plurality of interference electrical signals generated by the plurality of parasitic photo-sensing units 411 in the second region may be averaged, and then the average value is subtracted from the imaging electrical signal to obtain the electrical signal finally used for imaging. It can be understood that the closer the stray light sensing unit 411 is to the light sensing unit 41, the more similar the amount of the interference light signal received by the stray light sensing unit 411 and the light sensing unit 41 is, the more similar the generated interference electrical signal is, and the more accurate the electrical signal for imaging finally obtained after subtracting the interference electrical signal from the imaging electrical signal is.

Referring to fig. 11, in some embodiments, the image capturing method further includes step 03: acquiring an interference optical signal; step 02 includes step 021: and acquiring an image according to the imaging optical signal and the interference optical signal.

Wherein, step 03 can be implemented by the veiling glare photosensitive unit 411, and step 021 can be implemented by the imaging chip 300. For the details of step 03 and step 021, reference may be made to the above description, which is not repeated herein.

Referring to fig. 5 and 12, in some embodiments, the light sensing unit 41 includes a noise sensing unit 412, and the display device 100 further includes a light shielding unit 63, wherein the light shielding unit 63 is used for shielding a light passing hole 621 aligned with the noise sensing unit 412.

In use, the temperature of the photosensitive unit 41 or the temperature of the environment may change, and as the temperature changes, the performance of the photosensitive unit 41 may change, which may cause inconsistency of the electrical signals generated when receiving the same intensity of the optical signals, and therefore, when performing image formation, it is necessary to correct the interference caused by the temperature change.

In the present embodiment, the light shielding unit 63 is disposed on the light shielding member 62, the type and performance of the noise photosensitive unit 412 are the same as those of the rest of the photosensitive units 41, and the light shielding unit 63 shields the light passing hole 621, so that the noise photosensitive unit 412 can hardly receive the light signal. The noise sensing unit 412 generates an electrical signal during use, but since the noise sensing unit 412 hardly receives the optical signal, the electrical signal generated by the noise sensing unit 412 can be regarded as a noise electrical signal generated due to material and temperature changes. At this time, the rest of the photosensitive units 41 can simultaneously generate the noise electrical signal and receive the imaging optical signal to generate the imaging electrical signal. The noise sensing unit 412 transmits the noise electrical signal to the imaging chip 300, and the imaging chip 300 corrects the image according to the noise electrical signal during imaging, for example, the imaging electrical signal generated by the imaging optical signal is subtracted from the noise electrical signal to be used as an electrical signal finally used for imaging, so as to obtain an image with higher accuracy and improve the accuracy of image recognition. Similar to the case where the light sensing unit 41 includes the stray light sensing unit 411, the operation of subtracting the noise electrical signal from the imaging electrical signal may be performed in the imaging chip 300 or other devices, and will not be described herein.

Specifically, the light shielding unit 63 may also be made of a light absorbing material, the light shielding unit 63 may be filled in the light passing hole 621, and the light shielding unit 63 and the light shielding member 62 may be manufactured together. In one example, the light shielding unit 63 may also be directly disposed on the noise photosensitive unit 412 so that the noise photosensitive unit 412 does not receive the optical signal at all. The noise photosensitive unit 412 may be disposed in an area near an edge of the array of photosensitive units 41, and the noise photosensitive unit 412 may also be disposed in an area adjacent to the stray light photosensitive unit 411, for example, one to three columns in the matrix, or one to three rows in the matrix, without limitation, and the noise photosensitive unit 412 is disposed in an area b shown in fig. 5, where the area b is located in the second column from the left and the second column from the right of the array of photosensitive units 41 in fig. 5.

Further, since there are a plurality of noise sensing units 412, a plurality of noise electrical signals may be generated accordingly, and the magnitudes of the plurality of noise electrical signals may not be consistent, when subtracting the noise electrical signal from the imaging electrical signal, in one example, the plurality of noise electrical signals may be averaged, and then the averaged noise electrical signal may be subtracted from the imaging electrical signal. In another example, the light sensing units 41 and the noise sensing units 412 may be partitioned, respectively, and each region includes at least one light sensing unit 41 or at least one noise sensing unit 412. Subsequently, a third region closest to each first region may be determined from the position of each region (hereinafter referred to as a first region) including the light-sensing unit 41 and the position of each region (hereinafter referred to as a third region) including the noise-sensing unit 412. For each of the light-sensing units 41 in each of the first regions, the electrical signal generated by the noise-sensing unit 412 in the third region closest to the first region may be subtracted from the electrical signal generated by each of the light-sensing units 41 to obtain an electrical signal finally used for imaging of each of the light-sensing units 41, and if there are a plurality of noise-sensing units 412 in the third region, the plurality of electrical signals generated by the plurality of noise-sensing units 412 in the third region may be averaged, and then the average value is subtracted from the electrical signal generated for imaging to obtain an electrical signal finally used for imaging. It can be understood that the closer the distance between the noise sensing unit 412 and the light sensing unit 41 is, the more similar the temperature between the noise sensing unit 412 and the light sensing unit 41 is, the more similar the generated noise electrical signal is, and the more accurate the electrical signal for imaging finally obtained after subtracting the noise electrical signal from the imaging electrical signal is.

Referring to fig. 5, in some embodiments, the circuit unit 42 includes a photosensitive circuit unit 421 and a noise circuit unit 422, the photosensitive circuit unit 421 is connected to the photosensitive unit 41, and the noise circuit unit 422 is not connected to the photosensitive unit 41.

The light sensing circuit itself has hardware noise that causes a circuit noise signal that affects the intensity of the electric signal that is finally transmitted to the imaging chip 300, and therefore, when imaging is performed, it is necessary to correct the interference caused by the circuit noise signal.

In the present embodiment, the photosensitive unit 41 is not connected to the noise circuit unit 422, and circuit noise signals generated in the noise circuit unit 422 are all hardware noise of the noise circuit unit 422 itself. The noise circuit unit 422 transmits the circuit noise signal to the imaging chip 300, and the imaging chip 300 corrects the image according to the circuit noise signal during imaging, for example, the imaging electrical signal generated by the imaging optical signal is subtracted by the circuit noise signal to be used as the electrical signal finally used for imaging, so as to obtain an image with higher accuracy and improve the accuracy of image recognition.

Specifically, the plurality of circuit units 42 may be arranged in an array of a plurality of rows and a plurality of columns, and the noise circuit units 422 are arranged at least in a complete row and a complete column, so that the noise circuit units 422 are distributed in any row and any column, samples of circuit noise signals generated by the noise circuit units 422 are more comprehensive, and when an image is corrected according to the circuit noise signals, the correction effect is better. The noise circuit unit 422 may be disposed at an edge position of an array in which the plurality of circuit units 42 are arranged, or may be disposed near the stray light receiving unit 411 and the noise receiving unit 412. The distribution range of the noise circuit unit 422 may cover a complete row to five rows and a complete row to five rows, which is not limited herein. In the example shown in fig. 5, the noise circuit unit 422 is disposed in the c region of the photosensitive layer 40, wherein the c region is located on the third left column, the third right column, the uppermost row and the lowermost row of the circuit unit 42 array in fig. 5.

Further, since there are a plurality of noise circuit units 422, a plurality of circuit noise signals may be generated accordingly, and the sizes of the plurality of circuit noise signals may be different, when subtracting the circuit noise signal from the imaging electrical signal, in one example, the plurality of circuit noise signals may be averaged, and then the averaged circuit noise signal may be subtracted from the imaging electrical signal. In another example, the light sensing units 41 and the noise circuit units 422 may be partitioned, respectively, and each region includes at least one light sensing unit 41 or includes at least one noise circuit unit 422. Subsequently, a fourth region closest to each first region may be determined according to the position of each region (hereinafter, referred to as a first region) including the light-sensing unit 41 and the position of each region (hereinafter, referred to as a fourth region) including the noise circuit unit 422. For each light-sensing unit 41 in each first region, the electrical signal generated by the noise circuit unit 422 in the fourth region closest to the first region may be subtracted from the imaging electrical signal generated by each light-sensing unit 41 to obtain the electrical signal finally used for imaging by each light-sensing unit 41, and if the number of the noise circuit units 422 in the fourth region is multiple, the electrical signals finally used for imaging may be obtained by averaging the plurality of electrical circuit noise signals generated by the plurality of noise circuit units 422 in the fourth region and then subtracting the average value from the imaging electrical signal.

Referring to fig. 13, in some embodiments, the image capturing method further includes step 04: acquiring a circuit noise signal of the photosensitive layer 40; step 02 includes step 022: and acquiring an image according to the imaging optical signal and the circuit noise signal.

Wherein step 04 may be implemented by the noise circuit unit 422, and step 022 may be implemented by the imaging chip 300. For the details of step 04 and step 022, reference may be made to the above description, which is not repeated here.

One or more of the veiling glare sensitive unit 411, the noise sensitive unit 412 and the noise circuit unit 422 may be disposed on the same photosensitive layer 40. For example, the veiling glare sensitive unit 411 and the noise sensitive unit 412 are disposed at the same time, and at this time, the imaging chip 300 corrects the image according to the interference electrical signal and the noise electrical signal during imaging, for example, the interference electrical signal and the noise electrical signal are subtracted from the imaging electrical signal generated by the imaging optical signal to be used as the electrical signal finally used for imaging. For another example, the veiling glare light sensing unit 411 and the noise circuit unit 422 are simultaneously disposed, and at this time, the imaging chip 300 corrects the image according to the interference electrical signal and the circuit noise signal during imaging, for example, the interference electrical signal and the circuit noise signal are subtracted from the imaging electrical signal generated by the imaging optical signal to be used as the electrical signal finally used for imaging. For another example, the veiling glare light receiving unit 411, the noise light receiving unit 412 and the noise circuit unit 422 are simultaneously disposed, and at this time, the imaging chip 300 corrects the image according to the interference electrical signal, the noise electrical signal and the circuit noise signal during imaging, for example, the interference electrical signal, the noise electrical signal and the circuit noise signal are subtracted from the imaging electrical signal generated by the imaging optical signal to obtain an electrical signal finally used for imaging.

Referring to fig. 6, in some embodiments, the plurality of display driving units 1a1 are arranged in an array of rows and columns, the plurality of photosensitive units 41 are arranged in an array of rows and columns, and the effective working times of the display driving units 1a1 and the photosensitive units 41 in the same row or the same column are staggered.

Specifically, in the manufacturing process, the display driving layer 1a may be first manufactured on the first substrate 30, and then the photosensitive layer 40 may be manufactured on the display driving layer 1 a. The display driving unit 1a1 is disposed spaced apart from the photosensitive unit 41. In the array, there may be a plurality of photosensitive cells 41 and a plurality of display driving units 1a1 in the same row or column, and the active working time of the display driving units 1a1 and the photosensitive cells 41 in the same row or column are staggered. In the example shown in fig. 6, the plurality of display driving units 1a1 in the lowermost row in fig. 6 operate simultaneously, and the plurality of photosensitive units 41 in the lowermost row operate simultaneously, and the operating times of the plurality of display driving units 1a1 do not intersect with the operating times of the plurality of photosensitive units 41, so that interference of the display driving units 1a1 on the photosensitive units 41 during operation is reduced, and accuracy of image formation is improved.

In some embodiments, the photosensitive Chip 300 and the driving Chip may be disposed On the same flexible circuit board by a Chip On Film (COF) technology, and the flexible circuit board is bonded to the pins of the display driving layer 1a and the pins of the photosensitive layer 40. The pins of the display driving layer 1a may be arranged in one row, the pins of the photosensitive layer 40 may be arranged in another row, and the flexible circuit board is bonded to the two rows of pins simultaneously.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. A display device, comprising a display surface and a bottom surface opposite to each other, wherein between the display surface and the bottom surface, the display device further comprises:

a first substrate;

a photosensitive layer disposed on the first substrate, the photosensitive layer including a plurality of photosensitive cells, the photosensitive cells including a veiling glare photosensitive cell;

the display panel comprises a display surface, a cover plate and a light source, wherein the display surface is formed on the cover plate, the cover plate comprises a back surface which faces back to the display surface, an ink layer is arranged on the back surface, the stray light sensing unit corresponds to the ink layer in position, and the ink layer is used for blocking an interference light signal penetrating into the cover plate from the outside; a liquid crystal layer disposed on the photosensitive layer;

the second substrate is arranged on the liquid crystal layer, a light shielding piece is arranged on the second substrate, a plurality of light passing holes are formed in the light shielding piece, each light passing hole is aligned to one corresponding photosensitive unit, and the light passing holes can allow optical signals to pass through and reach the photosensitive units; and

the infrared cut-off layer is arranged between the photosensitive layer and the display surface and used for filtering infrared light signals reaching the infrared cut-off layer.

2. The display device according to claim 1, wherein the light passing hole comprises a plurality of sub light passing holes, the sub light passing holes are spaced apart from each other, and the sub light passing holes included in one light passing hole are aligned with the same one of the light sensing units.

3. The display device according to claim 2, wherein the ratio of the cross-sectional width of the sub-aperture to the depth of the sub-aperture is less than 0.2.

4. The display device according to any one of claims 1 to 3, wherein the display surface is formed with a display area, and a front projection of the plurality of light sensing units on the display surface is located in the display area.

5. A display device as claimed in any one of claims 1 to 3, wherein the light-passing aperture extends in a direction perpendicular to the display surface.

6. The display device according to any one of claims 1 to 3, wherein a side of the plurality of photosensitive units facing the bottom surface is provided with a light reflecting material.

7. The display device according to claim 1, wherein the ink layer is disposed on the back surface at a position near an edge, and the parasitic light sensing unit is located at an edge of the photosensitive layer.

8. The display device according to any one of claims 1 to 3, wherein the light sensing unit comprises a noise sensing unit, and the display device further comprises a light shielding unit for shielding the light passing hole aligned with the noise sensing unit.

9. The display device according to any one of claims 1 to 3, wherein the photosensitive layer further comprises a plurality of circuit units, the circuit units including a photosensitive circuit unit and a noise circuit unit, each of the photosensitive units being connected to a corresponding one of the photosensitive circuit units, and the noise circuit unit being not connected to the photosensitive unit.

10. The display device according to claim 9, wherein the plurality of circuit units are arranged in an array of rows and columns, and the noise circuit units are arranged in at least one complete row and one complete column.

11. The display device according to any one of claims 1 to 3, wherein a plurality of display driving units are further disposed on the first substrate, the display driving units are arranged in an array of rows and columns, the photosensitive units are arranged in an array of rows and columns, and the effective working times of the display driving units and the photosensitive units in the same row or column are distributed in a staggered manner.

12. The display device according to any one of claims 1 to 3, wherein the infrared cut layer is provided over the second substrate.

13. An electronic device, comprising:

a housing; and

a display device according to any one of claims 1 to 12, mounted on the housing.

14. The image acquisition method is used for a display device, the display device comprises a display surface and a bottom surface which are opposite, and the display device also comprises a first substrate, a photosensitive layer, a liquid crystal layer, a second substrate and an infrared cut-off layer between the display surface and the bottom surface, wherein the photosensitive layer comprises a plurality of photosensitive units, and the photosensitive units comprise stray light photosensitive units; the display panel comprises a display surface, a cover plate and a light source, wherein the display surface is formed on the cover plate, the cover plate comprises a back surface which faces back to the display surface, an ink layer is arranged on the back surface, the stray light sensing unit corresponds to the ink layer in position, and the ink layer is used for blocking an interference light signal penetrating into the cover plate from the outside; the second substrate is provided with a light shielding piece, the light shielding piece is provided with a plurality of light passing holes, each light passing hole is aligned with one corresponding photosensitive unit, the light passing holes can allow optical signals to pass through and reach the photosensitive units, and the infrared cut-off layer is used for filtering infrared optical signals reaching the infrared cut-off layer; the image acquisition method comprises the following steps:

receiving an imaging optical signal comprising a target optical signal, wherein the target optical signal passes through the display surface, the infrared cut-off layer and the light passing hole and then reaches the photosensitive layer; and

and acquiring an image according to the imaging optical signal and the interference optical signal.