CN110290241B

CN110290241B - Display device, electronic apparatus, and image acquisition method

Info

Publication number: CN110290241B
Application number: CN201910548440.3A
Authority: CN
Inventors: 袁石林
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-06-24
Filing date: 2019-06-24
Publication date: 2021-03-02
Anticipated expiration: 2039-06-24
Also published as: CN110290241A

Abstract

The application discloses a display device. The display device comprises a display surface and a bottom surface which are opposite to each other, and a photosensitive layer, a plurality of collimation units and a shading layer are arranged between the display surface and the bottom surface, wherein the photosensitive layer comprises a plurality of photosensitive units, and the photosensitive units comprise noise photosensitive units. A plurality of collimation units set up between photosensitive layer and display surface, and the collimation unit has seted up logical unthreaded hole, leads to the unthreaded hole and aims at the sensitization unit, leads to the unthreaded hole and can allow the light signal to pass. The shading layer is arranged between the photosensitive layer and the collimation unit, a light transmitting area and a shading area are formed on the shading layer, the shading area is aligned with the noise photosensitive unit, and the shading area is used for preventing optical signals from reaching the noise photosensitive unit. The application also discloses an electronic device and an image acquisition method.

Description

Display device, electronic apparatus, and image acquisition method

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a display device, an electronic apparatus, and an image acquisition method.

Background

In the correlation technique, the cell-phone can dispose fingerprint identification module and display module assembly, the fingerprint identification module assembly can be used for discerning user's identity, the display module assembly can be used to show the image, there is the mode of setting up the range upon range of the below at the display module assembly with the fingerprint identification module assembly at present, the position that corresponds with the fingerprint identification module assembly on the user contact display module assembly is in order to type in the fingerprint, however, in the display area of display module assembly, only very little some can supply the user to touch in order to carry out fingerprint identification, user experience is relatively poor.

Disclosure of Invention

The embodiment of the application provides a display device, electronic equipment and an image acquisition method.

The display device comprises a display surface and a bottom surface which are opposite to each other, and a photosensitive layer, a plurality of collimation units and a shading layer are arranged between the display surface and the bottom surface, wherein the photosensitive layer comprises a plurality of photosensitive units, and the photosensitive units comprise noise photosensitive units; the plurality of collimation units are arranged between the photosensitive layer and the display surface, the collimation units are provided with light through holes, the light through holes are aligned with the photosensitive units, and light signals can be allowed to pass through the light through holes; the light shielding layer is arranged between the photosensitive layer and the collimation unit, a light transmitting area and a light shielding area are formed on the light shielding layer, the light shielding area is aligned with the noise photosensitive unit, and the light shielding area is used for preventing optical signals from reaching the noise photosensitive unit.

The electronic equipment of the embodiment of the application comprises a machine shell and the display device of the embodiment of the application, wherein the display device is installed on the machine shell.

The image acquisition method is applied to a display device, the display device comprises a display surface and a bottom surface which are opposite to each other, a photosensitive layer, a shading layer and a collimation unit are arranged between the display surface and the bottom surface, the photosensitive layer comprises a plurality of photosensitive units, each photosensitive unit comprises a noise photosensitive unit, each collimation unit is provided with a light through hole, the shading layer comprises a light transmitting area and a shading area, the shading areas are aligned with the noise photosensitive units, and the shading areas are used for preventing optical signals from reaching the noise photosensitive units; the image acquisition method comprises the following steps: receiving an imaging optical signal comprising a target optical signal, wherein the target optical signal sequentially passes through the display surface and the light through hole and then reaches the photosensitive unit; acquiring a noise electric signal generated by the noise photosensitive unit; and acquiring an image according to the imaging optical signal and the noise electrical signal.

In the display device, the electronic device and the image acquisition method of the embodiment of the application, a plurality of photosensitive units are arranged between the display surface and the bottom surface of the display device, the photosensitive units can receive optical signals entering from the display surface and penetrating through the light through holes, images of objects touching on the display surface can be acquired according to the optical signals, the images can be used for fingerprint identification, and meanwhile, the distribution area of the plurality of photosensitive units can be set according to requirements, so that the distribution area of the plurality of photosensitive units occupies a larger proportion of the area of the display surface, a user can perform fingerprint identification on a larger area of the display surface, and the user experience is better. In addition, the light shielding layer prevents the optical signal from reaching the noise photosensitive unit, so that the noise photosensitive unit can be used for generating a noise electric signal caused by temperature change, self materials and the like, and the image of the object can be corrected through the noise electric signal so as to obtain a more accurate image of the object.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic cross-sectional structure diagram of a display device according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a display device for fingerprint recognition according to an embodiment of the present application;

fig. 4 is a schematic perspective view of a display device according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a photosensitive layer and an imaging chip according to an embodiment of the present disclosure;

fig. 6 is a schematic plan view of a light-shielding layer according to the embodiment of the present application;

FIG. 7 is a schematic side view of a display device according to an embodiment of the present disclosure;

FIG. 8 is a schematic structural diagram of a photosensitive layer and a display driving layer according to an embodiment of the present disclosure;

fig. 9 is a schematic plan view of a second substrate according to an embodiment of the present application;

FIG. 10 is a schematic flow chart diagram of an image acquisition method according to an embodiment of the present application;

FIG. 11 is a schematic side view of a display device according to an embodiment of the present disclosure;

FIG. 12 is a schematic flow chart diagram of an image acquisition method according to an embodiment of the present application;

fig. 13 and 14 are schematic flowcharts of an image acquisition method according to the embodiment of the present application.

Description of the main element symbols:

the display device comprises an electronic device 1000, a display device 100, a backlight layer 10, a bottom surface 11, a first polarization layer 20, a first substrate 30, a photosensitive layer 40, a photosensitive unit 41, a stray light photosensitive unit 411, a noise photosensitive unit 412, an infrared photosensitive unit 413, a circuit unit 42, a photosensitive circuit unit 421, a noise circuit unit 422, a liquid crystal layer 50, a second substrate 60, a display unit 61, a light shielding member 62, a light passing hole 621, a collimating layer 70, a collimating unit 71, a light passing hole 711, a base body 72, a second polarization layer 80, a cover plate 90, a display surface 91, a display area 911, a back surface 92, an ink layer 93, a chassis 200, an imaging chip 300, an object 2000, a display driving layer 1a, a display driving unit 1a1, a light shielding layer 1b, a light transmitting area 1b1 and a light shielding area 1b 2.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, an electronic device 1000 according to an embodiment of the present disclosure includes a housing 200 and a display device 100. The display device 100 is mounted on the set cover 200. Specifically, the electronic device 1000 may be a mobile phone, a tablet computer, a display, a notebook computer, a teller machine, a gate, a smart watch, a head display device, a game console, and the like, and the electronic device 1000 is taken as an example of a mobile phone in the present application, it is understood that the specific form of the electronic device 1000 is not limited to a mobile phone.

The chassis 200 may be used to mount the display device 100, or the chassis 200 may be used as a mounting carrier of the display device 100, and the chassis 200 may also be used to mount functional modules of the electronic apparatus 1000, such as a power supply device, an imaging device, and a communication device, so that the chassis 200 provides protection for the functional modules against falling, water, and the like.

The display device 100 can be used for displaying images such as pictures, videos, and texts. The display device 100 is mounted on the cabinet 200, and specifically, the display device 100 may be mounted on the front surface of the cabinet 200, or the display device 100 is mounted on the rear surface of the cabinet 200, or the display device 100 is mounted on both the front surface and the rear surface of the cabinet 200, or the display device 100 is mounted on the side surface of the cabinet 200, which is not limited herein. In the example shown in fig. 1, the display device 100 is mounted on the front surface of the cabinet 200.

Referring to fig. 2 to 4, the display device 100 includes a display surface 91 and a bottom surface 11 opposite to each other, and between the display surface 91 and the bottom surface 11, the display device 100 includes a photosensitive layer 40, a plurality of collimating units 71 and a light shielding layer 1 b. The photosensitive layer 40 includes a plurality of photosensitive cells 41, and the photosensitive cells 41 include noise photosensitive cells 412. The collimating unit 71 is disposed between the photosensitive layer 40 and the display surface 91, the collimating unit 71 is opened with a light passing hole 711, the light passing hole 711 is aligned with the photosensitive unit 41, and the light passing hole 711 can allow the light signal to pass through. The light shielding layer 1b is disposed between the photosensitive layer 40 and the collimating unit 71, the light shielding layer 1b is formed with a light transmitting region 1b1 and a light shielding region 1b2, the light shielding region 1b2 is aligned with the noise sensing unit 412, and the light shielding region 1b2 is used for blocking the optical signal from reaching the noise sensing unit 412.

In the electronic device 1000 according to the embodiment of the application, the plurality of photosensitive units 41 are disposed between the display surface 91 and the bottom surface 11 of the display device 100, the photosensitive units 41 can receive the light signals entering from the display surface 91 and passing through the light-passing holes 711, the image of the object touching on the display surface 91 can be acquired according to the light signals, the image can be used for fingerprint identification, and meanwhile, the distribution area of the plurality of photosensitive units 41 can be set according to the requirement, so that the distribution area of the plurality of photosensitive units 41 occupies a larger proportion of the area of the display surface 91, a user can perform fingerprint identification on a larger area of the display surface 91, and the user experience is better. In addition, the light shielding layer 1b blocks the optical signal from reaching the noise sensing unit 412, so that the noise sensing unit 412 can be used to generate a noise electrical signal caused by temperature change, self material, and the like, and the image of the object can be corrected by the noise electrical signal to obtain a more accurate image of the object.

Specifically, the display device 100 may display the light signal emitted by the light emitting element inside the display device 100, the display device 100 may display the light signal emitted by the external light source by guiding the light signal, the display device 100 may be non-bendable, and the display device 100 may be bendable, which is not limited herein.

In the embodiment of the present application, referring to fig. 2 to 4, along the light emitting direction of the display device 100, the display device 100 sequentially includes a backlight layer 10, a first polarizing layer 20, a first substrate 30, a photosensitive layer 40, a light shielding layer 1b, a liquid crystal layer 50, a second substrate 60, a collimating layer 70, a second polarizing layer 80, and a cover plate 90.

As shown in fig. 2 and 3, the backlight layer 10 may be used for emitting an optical signal La, or the backlight layer 10 may be used for guiding the optical signal La emitted by a light source (not shown). The optical signal La sequentially passes through the first polarizing layer 20, the first substrate 30, the photosensitive layer 40, the light shielding layer 1b, the liquid crystal layer 50, the second substrate 60, the collimating layer 70, the second polarizing layer 80, and the cover plate 90, and then enters the outside. The backlight layer 10 includes a bottom surface 11, and specifically, the bottom surface 11 may be a surface of the backlight layer 10 opposite to the first polarizing layer 20.

The first polarizing layer 20 is disposed on the backlight layer 10, and the first polarizing layer 20 may be a polarizing plate or a polarizing film, in particular. The first substrate 30 is disposed on the first polarizing layer 20, and the first substrate 30 may be a glass substrate.

The photosensitive layer 40 may be a Film layer formed on the first substrate 30, for example, formed on the first substrate 30 by a tft (thin Film transistor) process. Referring to fig. 4 and 5, the photosensitive layer 40 includes a plurality of photosensitive units 41 and a plurality of circuit units 42.

The light sensing unit 41 may convert the received optical signal into an electrical signal by using a photoelectric effect, and the intensity of the optical signal received by the light sensing unit 41 may be reflected by analyzing the intensity of the electrical signal generated by the light sensing unit 41. In one example, the light sensing unit 41 may receive only visible light signals to be converted into electrical signals, in another example, the light sensing unit 41 may receive only invisible light to be converted into electrical signals, and in yet another example, the light sensing unit 41 may receive visible light and invisible light to be converted into electrical signals. The types of the plurality of photosensitive units 41 may be the same, and the types of the plurality of photosensitive units 41 may not be completely the same. The plurality of photosensitive units 41 may be arranged in any manner, and the arrangement manner of the plurality of photosensitive units 41 may be specifically set according to the requirements of the appearance and the like of the display device 100. Each of the light sensing units 41 can operate independently without being affected by other light sensing units 41, and the intensity of the light signal received by the light sensing unit 41 at different positions may be different, so the intensity of the electrical signal generated by the light sensing unit 41 at different positions may also be different. In addition, a side of the photosensitive unit 41 facing the bottom surface 11 may be provided with a reflective material, and a light signal irradiated from the backlight layer 10 to the photosensitive unit 41 may be reflected by the reflective material, so as to prevent the light signal from affecting the accuracy of imaging performed by the photosensitive layer 40.

In use, the temperature of the light sensing unit 41 or the temperature of the environment may change, and the performance of the light sensing unit 41 may change as the temperature changes, for example, the light sensing unit 41 may be made of an amorphous silicon (a-Si) material, the background noise generated by the light sensing unit 41 may also change when the temperature changes, and the electrical signal generated due to the temperature change may be referred to as a noise electrical signal. Therefore, when imaging is performed, it is necessary to acquire the noise electric signal and correct the image according to the noise electric signal. In the embodiment of the present application, the light sensing unit 41 includes a noise sensing unit 412. The type and performance of the noise sensing unit 412 are the same as those of the remaining sensing units 41. The noise sensing unit 412 may also generate a noise electric signal due to temperature change, own material, and the like, which may be used to correct an image after being measured.

The circuit unit 42 may be connected to the photosensitive unit 41. The circuit unit 42 may transmit the electrical signal generated by the light sensing unit 41 to the imaging chip 300 of the electronic device 1000. The circuit unit 42 may specifically include a transistor and the like. The number of the circuit units 42 may be plural, each of the photosensitive units 41 may be connected to a corresponding one of the circuit units 42, and the plural circuit units 42 are connected to the imaging chip 300 by a connection line. The arrangement of the plurality of circuit units 42 may be similar to the arrangement of the photosensitive units 41, for example, the plurality of photosensitive units 41 may be arranged in a matrix of rows and columns, and the plurality of circuit units 42 may also be arranged in a matrix of rows and columns.

Referring to fig. 3, 4 and 6, the light shielding layer 1b may be disposed on any layer between the photosensitive layer 40 and the collimating unit 71. In the embodiment of the present application, the light shielding layer 1b is provided on the photosensitive layer 40. The light shielding layer 1b may be made of an insulating material to insulate the circuit unit 42 and the photosensitive unit 41 on the photosensitive layer 40 from the liquid crystal layer 50. The light-shielding layer 1b is formed with a light-transmitting region 1b1 and a light-shielding region 1b 2. The light-shielding region 1b2 is aligned with the noise-sensitive cell 412, the light-shielding region 1b2 is used to block the light signal from reaching the noise-sensitive cell 412, the light-transmitting region 1b1 is aligned with the photosensitive layer 40 except the noise-sensitive cell 412, and the light signal transmitted through the light-transmitting region 1b1 can reach the photosensitive cells 41 except the noise-sensitive cell 412. Since the light shielding layer 1b is disposed between the photosensitive layer 40 and the liquid crystal layer 50, the distance between the light shielding region 1b2 and the noise sensing unit 412 is as small as possible, and even the light shielding region 1b2 can be directly attached to the noise sensing unit 412, so as to reduce the possibility that the optical signal reaches the noise sensing unit 412 and obtain a more accurate noise electrical signal.

Referring to fig. 7, due to the blocking effect of the light shielding region 1b2, the noise sensing unit 412 can hardly receive the optical signal, and therefore, the electrical signal generated by the noise sensing unit 412 can be regarded as the noise electrical signal generated by the material and temperature change. At this time, the rest of the photosensitive cells 41 can simultaneously generate the noise electrical signal and receive the light signal to generate the imaging electrical signal.

The light-shielding region 1b2 can be made of light-absorbing material, and after the light signal reaches the light-shielding region 1b2, most of the light signal is absorbed by the light-shielding region 1b2 and cannot pass through the light-shielding region 1b 2. The light-transmitting region 1b1 can be made of light-transmitting material, and after the light signal reaches the light-transmitting region 1b1, most of the light signal will transmit through the light-transmitting region 1b 1. In one example, when the light shielding layer 1b is manufactured, a transparent film layer is first manufactured on the photosensitive layer 40, and then a light absorbing material is coated on the transparent film layer at a position opposite to the noise sensing unit 412, wherein the portion coated with the light absorbing material forms the light shielding region 1b2, and the portion not coated with the light absorbing material forms the light transmitting region 1b 1. In another example, when the light shielding layer 1b is manufactured, a light absorbing film layer formed of a light absorbing material is manufactured on the photosensitive layer 40, the light absorbing film layer is etched, only the light absorbing film layer opposite to the noise sensing unit 412 is remained, and the etched region is filled with a transparent material, so that the light shielding region 1b2 is formed by the light absorbing film layer remained finally, and the light transmitting region 1b1 is formed by the region filled with the transparent material.

Referring to fig. 2 to 4, the liquid crystal layer 50 is disposed on the light shielding layer 1b, and liquid crystal molecules in the liquid crystal layer 50 can change a deflection direction under the action of an electric field, so as to change an amount of an optical signal passing through the liquid crystal layer 50. Accordingly, referring to fig. 8, a display driving layer 1a may be further formed on the first substrate 30, and the display driving layer 1a may apply an electric field to the liquid crystal layer 50 under the driving action of a driving chip (not shown) to control the deflection directions of the liquid crystal molecules at different positions. Specifically, the display driving layer 1a includes a plurality of display driving units 1a1, and each display driving unit 1a1 can independently control the deflection direction of the liquid crystal at the corresponding position.

Referring to fig. 2, 4 and 9, the second substrate 60 is disposed on the liquid crystal layer 50. The second substrate 60 may include a glass substrate, and a plurality of display units 61 and a light blocking member 62 disposed on the glass substrate. The display unit 61 may be a color filter, for example, R represents an infrared filter, G represents a green filter, and B represents a blue filter, to control the color finally displayed by the display device 100 by controlling the amount of light signals passing through the filters of different colors. The arrangement of the plurality of display units 61 may correspond to the arrangement of the plurality of display driving units 1a1, for example, one display unit 61 is aligned with one display driving unit 1a 1.

The light-shielding members 62 are located between the display units 61, and the light-shielding members 62 space adjacent two display units 61, and in one example, the light-shielding members 62 may be Black Matrix (BM). The light shielding member 62 can prevent light from passing through the display unit 61, so as to prevent light in the display device 100 from entering the outside without passing through the display unit 61, and the light shielding member 62 can prevent light crosstalk when light signals pass through the adjacent display units 61.

Referring to fig. 3, the light shielding member 62 is provided with a light passing hole 621, and the light passing hole 621 is used for passing an optical signal. The position of the light passing hole 621 is aligned with the photosensitive unit 41, wherein the alignment may mean that the center line of the light passing hole 621 passes through the photosensitive unit 41. In the process of the optical signal passing through the light passing hole 621, if the optical signal reaches the inner wall of the light passing hole 621, the optical signal is partially or completely absorbed by the inner wall of the light passing hole 621, so that the propagation direction of the optical signal capable of passing through the light passing hole 621 almost coincides with the extending direction of the center line of the light passing hole 621. The light passing holes 621 may be distributed in the same manner as the photosensitive cells 41, such that each photosensitive cell 41 is aligned with one light passing hole 621.

Referring to fig. 2 to 4, the alignment layer 70 is disposed on the second substrate 60. The collimating layer 70 includes a plurality of collimating units 71, the collimating units 71 are opened with light passing holes 711, and the light passing holes 711 are aligned with the light sensing units 41. Specifically, the light passing hole 711 may also be aligned with the light passing hole 621, that is, a center line of the light passing hole 711 may coincide with a center line of the light passing hole 621, the light signal passes through the light passing hole 711 and then passes through the light passing hole 621 to reach the light shielding layer 1b, and the light signal further passes through the light transmitting region 1b1 to reach the photosensitive unit 41 in a region corresponding to the light transmitting region 1b 1. The material of the collimating unit 71 may be the same as that of the light shielding member 62, for example, the collimating unit 71 and the light shielding member 62 are both made of light absorbing material, and when the light signal reaches the solid portion of the collimating unit 71, the light signal is partially or completely absorbed, for example, when the light signal reaches the sidewall of the collimating unit 71 or the inner wall of the light through hole 711, the light signal is absorbed by the collimating unit 71, so that the light signal whose propagation direction coincides with the extending direction of the central line of the light through hole 711 passes through the light through hole 711, thereby achieving collimation of the light signal, and the light sensing unit 41 receives less interference light signals. The orthographic projections of the plurality of collimating units 71 on the second substrate 60 can be located in the light shielding member 62, and the orthographic projections of the light shielding regions 1b2 on the second substrate 60 can also be located in the light shielding member 62, so that the collimating units 71 and the light shielding regions 1b2 cannot shield the display units 61, and the display device 100 is ensured to have a better display effect.

The extending direction of the light passing hole 711 may be perpendicular to the display surface 91, so that the light passing hole 711 can only pass light signals which have a propagation direction perpendicular to the display surface 91, or the light passing hole 711 can only pass light signals which have propagated vertically downward from the display surface 91. The ratio of the cross-sectional width of the light-passing hole 711 to the depth of the light-passing hole 711 is less than 0.2, where the depth of the light-passing hole 711 may be the depth of the light-passing hole 711 along the center line direction, the cross-sectional width of the light-passing hole 711 may be the maximum cross-sectional size of a figure cut by the light-passing hole 711 from a plane perpendicular to the center line, and the ratio may be specifically 0.1, 0.111, 0.125, 0.19, 0.2, and the like, so that the collimating effect of the collimating unit 71 on the optical signal is better.

In one example, the collimating layer 70 further comprises a substrate 72, the substrate 72 may be substantially light transmissive, and the collimating elements 71 are formed on the substrate 72. In another example, the alignment layer 70 may include only the alignment unit 71, and the alignment unit 71 may be formed on the second substrate 60 by plating, sputtering, etching, or the like.

The second polarizing layer 80 is disposed on the collimating layer 70, and the second polarizing layer 80 may be a polarizing plate or a polarizing film, in particular.

With continued reference to fig. 2 and fig. 3, the cover plate 90 is disposed on the second polarizing layer 80. The cover plate 90 may be made of glass, sapphire, or the like. The cover 90 includes a display surface 91 and a back surface 92. The optical signal emitted from the display device 100 passes through the display surface 91 and enters the outside, and the external light passes through the display surface 91 and enters the display device 100. The back surface 92 may be attached to the second polarizing layer 80. In some examples, the display device 100 may not include the cover plate 90, and the display surface 91 is formed on the second polarizing layer 80.

The display surface 91 is formed with a display area 911, the display area 911 refers to an area that can be used to display an image, and the display area 911 may be in a shape of a rectangle, a circle, a rectangle with rounded corners, a rectangle with "bang", or the like, which is not limited herein. In addition, in some examples, the display surface 91 may also be formed with a non-display area, the non-display area may be formed at an outer edge position of the display area 911, and the non-display area may be used for connecting with the housing 200. The ratio of the display area 911 on the display surface 91 may be any value such as 80%, 90%, 100%, or the like.

In the embodiment of the present application, the orthographic projection of the plurality of light sensing units 41 on the display surface 91 is located in the display area 911. So that the plurality of light sensing units 41 can image an object touched within the display area 911, for an example in which a user touches the display area 911 with a finger, the plurality of light sensing units 41 can image a fingerprint of the finger touched on the display area 911 and be used for fingerprint recognition. In addition, the orthographic projections of the plurality of noise sensing units 412 on the display surface 91 are located near the edge of the display area 911. Since the plurality of noise sensing units 412 do not receive the imaging optical signal and the plurality of noise sensing units 412 cannot generate the imaging electrical signal according to the imaging optical signal, the plurality of noise sensing units 412 are disposed at positions close to the edge of the display area 911, which does not affect the imaging of an object touching the middle position of the display area 911, has little effect on the normal use of a user, and can acquire the noise electrical signal to correct an image.

Referring to fig. 2 and 3, the following describes the imaging performed by the display device 100 by way of example: the optical signal La emitted by the display device 100 sequentially passes through the first polarizing layer 20, the first substrate 30, the photosensitive layer 40, the light shielding layer 1b, the liquid crystal layer 50, the second substrate 60, the collimating layer 70, the second polarizing layer 80, and the cover plate 90 and then enters the outside, and the external optical signal La may also sequentially pass through the cover plate 90, the second polarizing layer 80, the collimating layer 70, the second substrate 60, the liquid crystal layer 50, and the light shielding layer 1b and then reach the photosensitive layer 40. If the light signal just reaches the light sensing unit 41 in the photosensitive layer 40, the light sensing unit 41 generates an electrical signal to reflect the intensity of the light signal. Thereby, the intensity distribution of the optical signal entering the display device 100 can be reflected by the intensity of the electric signal of the plurality of light receiving units 41.

Take the example where the user touches the display surface 91 with a finger 2000. When the display device 100 is emitting the optical signal La outward, the finger 2000 touches a predetermined position of the display surface 91, the finger 2000 reflects the optical signal La to form L1, the optical signal L1 then starts to enter the display device 100, the optical signal L1 first passes through the cover plate 90 and the second polarizing layer 80, for the optical signal L1 which has the same propagation direction as the extending direction of the light-passing hole 711 and the light-passing hole 621, the optical signal L1 can also pass through the light-passing hole 711 and the light-passing hole 621, and after the optical signal L1 passes through the light-passing hole 711 and the light-passing hole 621, the optical signal L1 may further pass through the liquid crystal layer 50 and the light-shielding layer 1b and reach the light-sensing unit 41. For the optical signals with the propagation direction different from the extending direction of the light transmitting hole 711 or the light passing hole 621, after the optical signals pass through the cover plate 90 and the second polarizing layer 80, the optical signals cannot pass through the light transmitting hole 711 or the light passing hole 621 and further cannot reach the photosensitive unit 41 aligned with the light transmitting hole 711 and the light passing hole 621; as for the optical signal that reaches the light-shielding region 1b2 of the light-shielding layer 1b, the optical signal is blocked by the light-shielding region 1b2 and does not reach the noise-sensitive cell 412.

It can be understood that the fingerprint of the finger has a peak and a valley, when the finger 2000 touches the display surface 91, the peak is in direct contact with the display surface 91, a gap exists between the valley and the display surface 91, and after the optical signal La reaches the peak and the valley, the intensity of the optical signal reflected by the peak (hereinafter referred to as a first optical signal) and the intensity of the optical signal reflected by the valley (hereinafter referred to as a second optical signal) are different, so that the intensity of the electrical signal generated by receiving the first optical signal (hereinafter referred to as a first electrical signal) and the intensity of the electrical signal generated by receiving the second optical signal (hereinafter referred to as a second electrical signal) are different, and the imaging chip 300 can acquire the image of the fingerprint according to the distribution of the first electrical signal and the second electrical signal.

In addition, the noise sensing unit 412 transmits the noise electrical signal to the imaging chip 300, and the imaging chip 300 corrects the image of the fingerprint according to the noise electrical signal during imaging, for example, the imaging electrical signal generated by the imaging optical signal is subtracted by the noise electrical signal to be used as the electrical signal finally used for imaging, so as to obtain an image of the fingerprint with higher accuracy, and the image of the fingerprint can be further used for fingerprint identification, so that the accuracy of fingerprint identification is improved.

Further, since there are a plurality of noise sensing units 412, a plurality of noise electrical signals may be generated accordingly, and the magnitudes of the plurality of noise electrical signals may not be consistent, when subtracting the noise electrical signal from the imaging electrical signal, in one example, the plurality of noise electrical signals may be averaged, and then the averaged noise electrical signal may be subtracted from the imaging electrical signal. In another example, the light sensing units 41 and the noise sensing units 412 may be partitioned, respectively, and each region includes at least one light sensing unit 41 or at least one noise sensing unit 412. Subsequently, the second region closest to each first region may be determined according to the position of each region (hereinafter referred to as a first region) including the light-sensing unit 41 and the position of each region (hereinafter referred to as a second region) including the noise-sensing unit 412. For each of the light-sensing units 41 in each first region, the electrical signal generated by the noise-sensing unit 412 in the second region closest to the first region may be subtracted from the electrical signal generated by each of the light-sensing units 41 to obtain an electrical signal finally used for imaging by each of the light-sensing units 41, and if there are a plurality of noise-sensing units 412 in the second region, the electrical signals generated by the noise-sensing units 412 in the second region may be averaged, and then the average value is subtracted from the electrical signal generated by the imaging unit to obtain an electrical signal finally used for imaging. It can be understood that the closer the distance between the noise sensing unit 412 and the light sensing unit 41 is, the more similar the temperature between the noise sensing unit 412 and the light sensing unit 41 is, the more similar the generated noise electrical signal is, and the more accurate the electrical signal for imaging finally obtained after subtracting the noise electrical signal from the imaging electrical signal is.

It is understood that the user touches over any area where the light sensing unit 41 is disposed, and the purpose of imaging and recognizing the fingerprint can be achieved. When the photosensitive units 41 are correspondingly arranged below the display area 911, the purpose of imaging and identifying the fingerprint can be achieved by a user touching any position of the display area 911, and the user is not limited to certain specific positions of the display area 911. Meanwhile, a user can simultaneously touch a plurality of positions on the display area 911 with a plurality of fingers, or a plurality of users simultaneously touch a plurality of positions on the display area 911 with a plurality of fingers, so as to achieve the purpose of imaging and identifying a plurality of fingerprints, thereby enriching the verification modes and applicable scenes of the electronic device 1000, for example, authorization is performed only when a plurality of fingerprints are verified simultaneously, and a plurality of users can perform operations such as games on the same electronic device 1000.

Of course, similarly to the case where the user touches the display surface 91 with a finger, any object (for example, an arm, a forehead, clothes, flowers, and plants of the user) capable of reflecting the optical signal La can image the surface texture of the object after touching the display surface 91, and the subsequent processing for imaging can be set according to the user requirement, which is not limited herein.

Referring to fig. 10, an embodiment of the present application further discloses an image obtaining method, which can be applied to the display device 100, and the image obtaining method includes the steps of:

01: receiving an imaging light signal including a target light signal;

02: acquiring a noise electric signal generated by a noise photosensitive unit; and

03: and acquiring an image according to the imaging optical signal and the noise electric signal.

Wherein, step 01 can be implemented by the photosensitive layer 40, and steps 02 and 03 can be implemented by the imaging chip 300. The imaging light signal refers to all light signals received by the light sensing unit 41, and the target light signal refers to a light signal that reaches the light sensing unit 41 after passing through the light passing hole 711 and the light passing hole 621. For details of the implementation of

steps

01, 02 and 03, reference may be made to the above description of the display device 100, and further description is omitted here.

In summary, in the electronic apparatus 1000 and the image acquiring method according to the embodiment of the application, the plurality of photosensitive units 41 are disposed between the display surface 91 and the bottom surface 11 of the display device 100, the photosensitive units 41 can receive the light signal entering from the display surface 91 and passing through the light-passing hole 711, and the image of the object touching on the display surface 91 can be acquired according to the light signal, and the image can be used for fingerprint identification, meanwhile, the distribution area of the plurality of photosensitive units 41 can be set according to the requirement, so that the ratio of the distribution area of the plurality of photosensitive units 41 to the area of the display surface 91 is relatively large, the user can perform fingerprint identification on a relatively large area of the display surface 91, and the user experience is relatively good. In addition, the light shielding layer 1b blocks the optical signal from reaching the noise sensing unit 412, so that the noise sensing unit 412 can be used to generate a noise electrical signal caused by temperature change, self material, and the like, and the image of the object can be corrected by the noise electrical signal to obtain a more accurate image of the object.

Referring to fig. 5 and 11, in some embodiments, the light sensing unit 41 includes a stray light sensing unit 411. An ink layer 93 is disposed on the back 92 of the cover plate 90, the stray light sensing unit 411 corresponds to the ink layer 93, and the ink layer 93 is used for blocking the optical signal Lb penetrating into the cover plate 90 from the outside.

In actual use, part of the light signal emitted from the backlight layer 10 directly passes through the display surface 91, and part of the light signal may be reflected between the display surface 91 and the backlight layer 10 one or more times, while part of the reflected light signal L2 may reach the light-sensing unit 41 and interfere with the imaging of the display device 100. That is, among the imaging light signals for imaging, there is also included the disturbing light signal L2, the disturbing light signal L2 being reflected by the display device 100 and reaching the photosensitive cells 41 on the photosensitive layer 40.

The ink layer 93 is disposed at a position corresponding to the stray light sensing unit 411 on the back surface 92, most of the light in the display device 100 reaching the ink layer 93 is absorbed by the ink layer 93, and a small portion (e.g., 4%) of the light is reflected by the ink layer 93, so that the reflection of the cover plate 90 on the optical signal inside the display device 100 can be simulated by the ink layer 93, and the stray light sensing unit 411 may receive the optical signal L2 reaching the stray light sensing unit 411 from the side of the stray light sensing unit 411. In summary, the parasitic light sensing unit 411 can receive the same interference light signal L2 as the rest of the light sensing units 41, and at the same time, the ink layer 93 can block (reflect or absorb) the light signal Lb penetrating into the cover plate 90 from the outside, so that the parasitic light sensing unit 411 only receives the interference light signal L2, and the light sensing units 41 except the parasitic light sensing unit 411 and the noise sensing unit 412 can simultaneously receive the interference light signal L2 and the light signal Lb penetrating into the cover plate 90 from the outside.

The type and performance of the veiling glare photosensitive unit 411 are the same as those of the rest of the photosensitive units 41, the veiling glare photosensitive unit 411 transmits the interference electrical signal generated by the interference optical signal L2 to the imaging chip 300, and the imaging chip 300 corrects the image according to the interference electrical signal during imaging, for example, the imaging electrical signal generated by the imaging optical signal is subtracted from the interference electrical signal and the noise electrical signal to be used as the electrical signal finally for imaging, so as to obtain an image with higher accuracy and improve the accuracy of image recognition.

In one example, the veiling glare light sensing unit 411 and the remaining light sensing units 41 are both CCD image sensors, and at this time, the subtraction between the imaging electrical signal and the interference electrical signal and the noise electrical signal may be performed in the imaging chip 300, that is, the imaging electrical signal, the interference electrical signal and the noise electrical signal are all transmitted to the imaging chip 300, and the imaging chip 300 performs the operation of subtracting the interference electrical signal and the noise electrical signal from the imaging electrical signal, or the subtraction between the imaging electrical signal and the interference electrical signal and the noise electrical signal may also be performed in an analog-to-digital converter, that is, the imaging electrical signal, the interference electrical signal and the noise electrical signal are all transmitted to the analog-to-digital converter, and the analog-to-digital converter performs the operation of subtracting the interference electrical signal and the noise electrical signal from the imaging electrical. In another example, the veiling glare cell 411 and the rest of the light sensing units 41 are CMOS image sensors, in this case, the subtraction of the imaging electrical signal from the interference electrical signal and the noise electrical signal can be performed in the imaging chip 300, that is, the imaging electrical signal, the interference electrical signal and the noise electrical signal are all transmitted to the imaging chip 300, and the imaging chip 300 performs the operation of subtracting the interference electrical signal and the noise electrical signal from the imaging electrical signal, or alternatively, the subtraction of the imaging electrical signal from the interference electrical signal and the noise electrical signal can be performed in the light sensing unit 41, a first storage region, a second storage region and a logic subtraction circuit are added to the light sensing unit 41, the imaging electrical signal generated by the light sensing unit 41 is stored in the first storage region, the interference electrical signal is transmitted to the light sensing unit 41 by the veiling glare cell 411 and is stored in the second storage region, the noise electrical signal is transmitted to the light sensing unit 41 by the noise, the logic subtraction circuit performs an operation of subtracting the interference electrical signal and the noise electrical signal from the imaging electrical signal, and then transmits the electrical signal obtained by the subtraction to the imaging chip 300. The above description of the subtraction of the imaging electrical signal from the interference electrical signal and the noise electrical signal is merely an example and is not to be construed as a limitation of the present application.

In one example, the ink layer 93 is disposed on the back surface 92 near the edge, and the veiling glare sensitive unit 411 is disposed on the edge of the photosensitive layer 40. For example, as shown in fig. 5, the stray light sensing unit 411 is disposed in the area a, where the area a is located in the leftmost column and the rightmost column of the array of sensing units 41 in fig. 5. The ink layer 93 is prevented from greatly affecting the display effect of the display device 100. Specifically, the light sensing units 41 may be arranged in a matrix with multiple rows and multiple columns, and the veiling glare light sensing units 411 may be disposed at an edge of the matrix, for example, one to three columns near the edge of the matrix, and one to three rows near the edge of the matrix, so as to adapt to the position of the ink layer 93.

Further, since there are a plurality of stray light sensing units 411, a plurality of interference electrical signals may be generated accordingly, and the magnitudes of the plurality of interference electrical signals may be different, when subtracting the noise electrical signal from the imaging electrical signal, in one example, the plurality of interference electrical signals may be averaged, and then the noise electrical signal is subtracted from the imaging electrical signal and the interference electrical signal obtained by averaging is obtained. In another example, the light sensing units 41 and the parasitic light sensing units 411 may be partitioned, respectively, and each area includes at least one light sensing unit 41 or at least one parasitic light sensing unit 411. Subsequently, a third region closest to each first region may be determined according to the position of each region (hereinafter referred to as a first region) including the photosensitive unit 41 and the position of each region (hereinafter referred to as a third region) including the veiling glare photosensitive unit 411. For each of the light-sensing units 41 in each first region, the noise electrical signal may be subtracted from the imaging electrical signal generated by each light-sensing unit 41, and the interference electrical signal generated by the parasitic light-sensing unit 411 in the third region closest to the first region, so as to obtain the electrical signal finally used for imaging by each light-sensing unit 41, and if the number of the parasitic light-sensing units 411 in the third region is multiple, the plurality of interference electrical signals generated by the plurality of parasitic light-sensing units 411 in the third region may be averaged, and then the noise electrical signal and the average value are subtracted from the imaging electrical signal, so as to obtain the electrical signal finally used for imaging. It can be understood that the closer the stray light sensing unit 411 and the light sensing unit 41 are, the closer the amount of the interference light signal received by the stray light sensing unit 411 and the light sensing unit 41 is, the more similar the generated interference electrical signal is, and the more accurate the electrical signal for imaging finally obtained after subtracting the noise electrical signal and the interference electrical signal from the imaging electrical signal is.

Referring to fig. 12, in some embodiments, the image capturing method further includes step 04: acquiring an interference optical signal; step 03 includes step 031: and acquiring an image according to the imaging optical signal, the noise electrical signal and the interference optical signal.

Wherein, step 04 can be implemented by the veiling glare photosensitive unit 411, and step 031 can be implemented by the imaging chip 300. For the details of step 04 and step 031, reference may be made to the above description, which is not repeated herein.

In addition, referring to fig. 5, the noise photosensitive unit 412 may be disposed in a region near an edge of the array of photosensitive units 41, the noise photosensitive unit 412 may also be disposed in a region adjacent to the stray light photosensitive unit 411, for example, may be disposed in one to three rows in a matrix, or disposed in one to three rows in the matrix, which is not limited herein, and the noise photosensitive unit 412 is disposed in a region b shown in fig. 5, where the region b is disposed in a second row from the left and a second column from the right of the array of photosensitive units 41 in fig. 5.

Referring to fig. 5, in some embodiments, the circuit unit 42 includes a photosensitive circuit unit 421 and a noise circuit unit 422, the photosensitive circuit unit 421 is connected to the photosensitive unit 41, and the noise circuit unit 422 is not connected to the photosensitive unit 41.

The light sensing circuit itself has hardware noise that causes a circuit noise signal that affects the intensity of the electric signal that is finally transmitted to the imaging chip 300, and therefore, when imaging is performed, it is necessary to correct the interference caused by the circuit noise signal.

In the present embodiment, the photosensitive unit 41 is not connected to the noise circuit unit 422, and circuit noise signals generated in the noise circuit unit 422 are all hardware noise of the noise circuit unit 422 itself. The noise circuit unit 422 transmits the circuit noise signal to the imaging chip 300, and the imaging chip 300 corrects the image according to the noise electrical signal and the circuit noise signal during imaging, for example, the imaging electrical signal generated by the imaging optical signal is subtracted by the noise electrical signal and the circuit noise signal to be used as the electrical signal finally used for imaging, so as to obtain an image with higher accuracy and improve the accuracy of image recognition.

Specifically, the plurality of circuit units 42 may be arranged in an array of a plurality of rows and a plurality of columns, and the noise circuit units 422 are arranged at least in a complete row and a complete column, so that the noise circuit units 422 are distributed in any row and any column, samples of circuit noise signals generated by the noise circuit units 422 are more comprehensive, and when an image is corrected according to the circuit noise signals, the correction effect is better. The noise circuit unit 422 may be disposed at an edge position of an array in which the plurality of circuit units 42 are arranged, or may be disposed near the stray light receiving unit 411 and the noise receiving unit 412. The distribution range of the noise circuit unit 422 may cover a complete row to five rows and a complete row to five rows, which is not limited herein. In the example shown in fig. 5, the noise circuit unit 422 is disposed in the c region of the photosensitive layer 40, wherein the c region is located on the third left column, the third right column, the uppermost row and the lowermost row of the circuit unit 42 array in fig. 5.

Further, since there are a plurality of noise circuit units 422, a plurality of circuit noise signals are correspondingly generated, and the sizes of the plurality of circuit noise signals may be different, when the noise electrical signal and the circuit noise signal are subtracted from the imaging electrical signal, in one example, the plurality of circuit noise signals may be averaged, and then the noise electrical signal is subtracted from the imaging electrical signal and the averaged circuit noise signal is obtained. In another example, the light sensing units 41 and the noise circuit units 422 may be partitioned, respectively, and each region includes at least one light sensing unit 41 or includes at least one noise circuit unit 422. Subsequently, a fourth region closest to each first region may be determined according to the position of each region (hereinafter, referred to as a first region) including the light-sensing unit 41 and the position of each region (hereinafter, referred to as a fourth region) including the noise circuit unit 422. For each light-sensing unit 41 in each first region, the noise electrical signal and the circuit noise signal generated by the noise circuit unit 422 in the fourth region closest to the first region may be subtracted from the imaging electrical signal generated by each light-sensing unit 41 to obtain an electrical signal finally used for imaging by each light-sensing unit 41, and if the number of the noise circuit units 422 in the fourth region is multiple, the plurality of circuit noise signals generated by the plurality of noise circuit units 422 in the fourth region may be averaged, and then the noise electrical signal and the average value are subtracted from the imaging electrical signal to obtain an electrical signal finally used for imaging.

Referring to fig. 13, in some embodiments, the image capturing method further includes the step 05: acquiring a circuit noise signal of the photosensitive layer 40; step 03 includes step 032: and acquiring an image according to the imaging optical signal, the noise electric signal and the circuit noise signal.

Wherein, step 05 can be implemented by the noise circuit unit 422, and step 032 can be implemented by the imaging chip 300. For the details of performing step 05 and step 032, reference may be made to the above description, which is not repeated herein.

Referring to fig. 5, in some embodiments, the light sensing unit 41 further includes a plurality of infrared light sensing units 413, and the infrared light sensing units 413 are used for detecting infrared light.

Due to the presence of infrared light in the external environment, the infrared light may penetrate through some objects into the display device 100. For example, infrared light may penetrate through the finger of the user, pass through the display surface 91 and the light-passing hole 711, and be received by the light-sensing unit 41, and the portion of the infrared light is not related to the fingerprint of the user, and an infrared signal generated by the portion of the infrared light (infrared light signal) may interfere with the imaging of the imaging chip 300. Therefore, it is necessary to correct the disturbance caused by the infrared light signal at the time of imaging.

The infrared light-sensing units 413 can receive only the infrared light signal and generate an infrared electrical signal according to the infrared light signal, and the remaining light-sensing units 41 (the noise-removing light-sensing units 412) can receive the infrared light signal and the visible light signal at the same time and generate an imaging electrical signal according to the infrared light signal and the visible light signal. The infrared electrical signal is further transmitted to the imaging chip 300, and the imaging chip 300 corrects the image according to the noise electrical signal and the infrared electrical signal during imaging, for example, the noise electrical signal and the infrared electrical signal are subtracted from the imaging electrical signal generated by the imaging optical signal to be used as the electrical signal finally used for imaging, so as to obtain an image with higher accuracy and improve the accuracy of image recognition. Similar to the case where the light sensing unit 41 includes the stray light sensing unit 411, the operations of subtracting the noise electrical signal and the infrared electrical signal from the imaging electrical signal may be performed in the imaging chip 300, or may be performed in other devices, and will not be described herein again.

Specifically, the plurality of infrared photosensitive units 413 may be distributed at intervals, for example, uniformly distributed in the array of photosensitive units 41, and the proportion of the infrared photosensitive units 413 in the photosensitive units 41 may be small, for example, 1%, 7%, 10%, and the like. Referring to fig. 3, when the user touches the display surface 91, the display device 100 can sense the touched position, and the imaging chip 300 reads the infrared electrical signals generated by the one or more infrared light sensing units 413 corresponding to the touched position and corrects the image according to the noise electrical signals and the infrared electrical signals.

Referring to fig. 14, in some embodiments, the image capturing method further includes step 06: acquiring an infrared light signal; step 03 includes step 033: and acquiring an image according to the imaging optical signal, the noise electrical signal and the infrared optical signal.

Wherein, step 06 can be implemented by the infrared photosensitive unit 413, and step 033 can be implemented by the imaging chip 300. For the details of step 06 and step 033, reference may be made to the above description, and details are not described herein again.

In some embodiments, instead of the infrared photosensitive unit 413, an infrared cut film may be disposed between the photosensitive layer 40 and the display surface 91, for example, the infrared cut film is disposed between the second substrate 60 and the collimating layer 70, and the infrared cut film has a high transmittance of visible light, which may be 90% or more, and a low transmittance of infrared light signals, so as to prevent the external infrared light signals from reaching the photosensitive unit 41.

Further, since there are a plurality of infrared sensing units 413, a plurality of infrared electrical signals are generated accordingly, and the magnitude of the plurality of infrared electrical signals may not be consistent, when subtracting the noise electrical signal from the imaging electrical signal, in one example, the plurality of infrared electrical signals may be averaged, and then the noise electrical signal is subtracted from the imaging electrical signal and the averaged infrared electrical signal is obtained. In another example, the light sensing units 41 and the infrared sensing units 413 may be partitioned, respectively, and each region includes at least one light sensing unit 41 or at least one infrared sensing unit 413. Subsequently, a fifth region closest to each first region may be determined according to the position of each region (hereinafter referred to as a first region) including the photosensitive unit 41 and the position of each region (hereinafter referred to as a fifth region) including the infrared photosensitive unit 413. For each light-sensing unit 41 in each first region, the noise electrical signal may be subtracted from the imaging electrical signal generated by each light-sensing unit 41, and the infrared electrical signal generated by the infrared light-sensing unit 413 in the fifth region closest to the first region may be used to obtain the electrical signal finally used for imaging by each light-sensing unit 41, and if the number of the infrared light-sensing units 413 in the fifth region is multiple, the plurality of infrared electrical signals generated by the plurality of infrared light-sensing units 413 in the fifth region may be averaged, and then the noise electrical signal and the average value are subtracted from the imaging electrical signal to obtain the electrical signal finally used for imaging. It can be understood that the closer the distance between the infrared sensing unit 413 and the sensing unit 41 is, the more similar the amount of the infrared light received by the infrared sensing unit 413 and the sensing unit 41 is, the more similar the generated infrared electrical signal is, and the more accurate the electrical signal for imaging finally obtained after subtracting the noise electrical signal and the infrared electrical signal from the imaging electrical signal is.

Referring to fig. 5, one or more of the veiling glare sensor unit 411, the noise sensor unit 412, the noise circuit unit 422 and the infrared sensor unit 413 may be disposed on the same photosensitive layer 40. For example, the veiling glare sensitive unit 411 and the noise sensitive unit 412 are disposed at the same time, and at this time, the imaging chip 300 corrects the image according to the interference electrical signal and the noise electrical signal during imaging, for example, the interference electrical signal and the noise electrical signal are subtracted from the imaging electrical signal generated by the imaging optical signal to be used as the electrical signal finally used for imaging. For another example, the veiling glare light sensing unit 411 and the noise circuit unit 422 are simultaneously disposed, and at this time, the imaging chip 300 corrects the image according to the interference electrical signal and the circuit noise signal during imaging, for example, the interference electrical signal and the circuit noise signal are subtracted from the imaging electrical signal generated by the imaging optical signal to be used as the electrical signal finally used for imaging. For another example, the noise circuit unit 422 and the infrared sensing unit 413 are simultaneously disposed, and at this time, the imaging chip 300 corrects the image according to the circuit noise signal and the infrared light signal during imaging, for example, the imaging electrical signal generated by the imaging optical signal is subtracted from the circuit noise signal and the infrared light signal to be used as the electrical signal finally used for imaging. For another example, the noise sensing unit 412, the noise circuit unit 422, and the infrared sensing unit 413 are disposed at the same time, and at this time, the imaging chip 300 corrects the image according to the noise electrical signal, the circuit noise signal, and the infrared optical signal during imaging, for example, the imaging electrical signal generated by the imaging optical signal is subtracted from the noise electrical signal, the circuit noise signal, and the infrared optical signal to obtain the final electrical signal for imaging. For another example, the veiling glare sensing unit 411, the noise sensing unit 412 and the infrared sensing unit 413 are simultaneously disposed, and at this time, the imaging chip 300 corrects the image according to the interference electrical signal, the noise electrical signal, the circuit noise signal and the infrared optical signal during imaging, for example, the interference electrical signal, the noise electrical signal, the circuit noise signal and the infrared optical signal are subtracted from the imaging electrical signal generated by the imaging optical signal to be used as the electrical signal finally used for imaging.

Referring to fig. 8, in some embodiments, the plurality of display driving units 1a1 are arranged in an array of rows and columns, the plurality of photosensitive units 41 are arranged in an array of rows and columns, and the effective working times of the display driving units 1a1 and the photosensitive units 41 in the same row or the same column are staggered.

Specifically, in the manufacturing process, the display driving layer 1a may be first manufactured on the first substrate 30, and then the photosensitive layer 40 may be manufactured on the display driving layer 1 a. The display driving unit 1a1 is disposed spaced apart from the photosensitive unit 41. In the array, there may be a plurality of photosensitive cells 41 and a plurality of display driving units 1a1 in the same row or column, and the active working time of the display driving units 1a1 and the photosensitive cells 41 in the same row or column are staggered. In the example shown in fig. 8, the plurality of display driving units 1a1 located in the lowermost row in fig. 8 operate simultaneously, and the plurality of photosensitive units 41 in the lowermost row operate simultaneously, and the operating times of the plurality of display driving units 1a1 do not intersect with the operating times of the plurality of photosensitive units 41, so that interference of the display driving units 1a1 on the photosensitive units 41 during operation is reduced, and accuracy of image formation is improved.

In some embodiments, the photosensitive Chip 300 and the driving Chip may be disposed On the same flexible circuit board by a Chip On Film (COF) technology, and the flexible circuit board is bonded to the pins of the display driving layer 1a and the pins of the photosensitive layer 40. The pins of the display driving layer 1a may be arranged in one row, the pins of the photosensitive layer 40 may be arranged in another row, and the flexible circuit board is bonded to the two rows of pins simultaneously.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. A display device, comprising a display surface and a bottom surface opposite to each other, wherein between the display surface and the bottom surface, the display device further comprises:

a photosensitive layer including a plurality of photosensitive cells, the photosensitive cells including noise photosensitive cells;

the plurality of collimation units are arranged between the photosensitive layer and the display surface, the collimation units are provided with light through holes, the light through holes are aligned with the photosensitive units, and the light through holes can allow optical signals to pass through; and

the light shielding layer is arranged between the photosensitive layer and the collimation unit, a light transmitting area and a light shielding area are formed on the light shielding layer, the light shielding area is aligned with the noise photosensitive unit, the light shielding area is used for preventing optical signals from reaching the noise photosensitive unit, the noise photosensitive unit is used for generating noise electric signals caused by temperature change or self materials, and the noise electric signals are used for image correction.

2. The display device according to claim 1, further comprising a first substrate, a liquid crystal layer, and a second substrate stacked in sequence, wherein the plurality of light sensing units are disposed on the first substrate, the second substrate is disposed with a plurality of display units and a light shielding member located between the plurality of display units, the light shielding member is disposed with a light passing hole, the light passing hole is aligned with the light passing hole, and the light passing hole is aligned with the light sensing units.

3. The display device according to claim 2, wherein the light shielding layer is provided between the photosensitive layer and the liquid crystal layer.

4. The display device according to any one of claims 1 to 3, wherein the display surface is formed with a display area, and a front projection of the plurality of light sensing units on the display surface is located in the display area.

5. The display device according to claim 4, wherein the orthographic projection of the plurality of noise sensitive units on the display surface is located near the edge of the display area.

6. A display device as claimed in any one of claims 1 to 3, wherein the collimating unit is made of a light absorbing material, and the light passing hole extends in a direction perpendicular to the display surface.

7. The display device according to any one of claims 1 to 3, wherein a ratio of a cross-sectional width of the light passing hole to a depth of the light passing hole is less than 0.2.

8. The display device according to claim 2 or 3, wherein the light shielding member is located between the collimating unit and the light sensing unit, and an orthographic projection of the plurality of collimating units on the second substrate is located within the light shielding member.

9. The display device according to any one of claims 1 to 3, wherein a side of the plurality of photosensitive units facing the bottom surface is provided with a light reflecting material.

10. The display device according to any one of claims 1 to 3, wherein the light sensing unit comprises a stray light sensing unit, the display device further comprises a cover plate, the display surface is formed on the cover plate, the cover plate further comprises a back surface opposite to the display surface, an ink layer is arranged on the back surface, the stray light sensing unit corresponds to the ink layer, and the ink layer is used for blocking light signals penetrating into the cover plate from the outside.

11. The display device according to claim 10, wherein the ink layer is disposed on the back surface at a position near an edge, and the parasitic light sensing unit is located at an edge of the photosensitive layer.

12. The display device according to any one of claims 1 to 3, wherein the photosensitive layer further comprises a plurality of circuit units, the circuit units including a photosensitive circuit unit and a noise circuit unit, each of the photosensitive units being connected to a corresponding one of the photosensitive circuit units, and the noise circuit unit being not connected to the photosensitive unit.

13. The display device according to claim 12, wherein the plurality of circuit units are arranged in an array of rows and columns, and the noise circuit units are arranged in at least one complete row and one complete column.

14. The display device according to any one of claims 1 to 3, wherein the light sensing unit further comprises a plurality of infrared light sensing units for detecting infrared light.

15. The display device according to claim 2 or 3, wherein a plurality of display driving units are further disposed on the first substrate, the display driving units are arranged in an array of rows and columns, the photosensitive units are arranged in an array of rows and columns, and the effective working times of the display driving units and the photosensitive units in the same row or the same column are distributed in a staggered manner.

16. An electronic device, comprising:

a housing; and

a display device according to any one of claims 1 to 15, mounted on the housing.

17. An image acquisition method is used for a display device, the display device comprises a display surface and a bottom surface which are opposite, a photosensitive layer, a shading layer and a collimation unit are arranged between the display surface and the bottom surface, the photosensitive layer comprises a plurality of photosensitive units, the photosensitive units comprise noise photosensitive units, the collimation units are provided with light through holes, the shading layer comprises a light transmitting area and a shading area, the shading area is aligned with the noise photosensitive units, the shading area is used for preventing optical signals from reaching the noise photosensitive units, the noise photosensitive units are used for generating noise electric signals caused by temperature change or self materials, and the noise electric signals are used for image correction; the image acquisition method comprises the following steps:

receiving an imaging optical signal comprising a target optical signal, wherein the target optical signal sequentially passes through the display surface and the light through hole and then reaches the photosensitive unit;

acquiring a noise electric signal generated by the noise photosensitive unit; and

and acquiring an image according to the imaging optical signal and the noise electrical signal.