CN110263747A

CN110263747A - Control method, electronic equipment and non-volatile computer readable storage medium storing program for executing

Info

Publication number: CN110263747A
Application number: CN201910562786.9A
Authority: CN
Inventors: 杨自美; 袁石林
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-06-26
Filing date: 2019-06-26
Publication date: 2019-09-20
Anticipated expiration: 2039-06-26
Also published as: CN110263747B

Abstract

This application discloses a kind of control method, electronic equipment and non-volatile computer readable storage medium storing program for executing.Display device includes fingerprint recognition mould group.The corresponding fingerprint identification region on the display apparatus of fingerprint recognition mould group is located in the display area of display device, and fingerprint identification region includes fringe region and the non-edge in addition to fringe region, and fringe region is located at the edge of at least side of display area.Control method includes: to obtain the working condition of display device；Obtain the touch location of the finger touch fingerprint identification region of user；It is OFF state in working condition, and when touch location is located at the marginal position, fingerprint recognition mould group is in off working state.The control method of the application embodiment by judge the touch location of the finger touch fingerprint identification region of user whether be located at fringe region decide whether trigger fingerprint recognition mould group work, the energy consumption of electronic equipment can be also saved to avoid the generation of the false triggering problem under most of scenes.

Description

Control method, electronic equipment and non-volatile computer readable storage medium storing program for executing

Technical field

This application involves technical field of mobile terminals, in particular to a kind of control method, electronic equipment and non-volatile meter Calculation machine readable storage medium storing program for executing.

Background technique

Electronic equipment would generally be configured with fingerprint identification function to promote the safety that electronic equipment uses, such as by fingerprint Identification is for unlocking, paying etc..Fluency and convenience when to guarantee that user uses electronic equipment, for example receive user Unlock operation when can quick release electronic equipment etc., fingerprint recognition mould group is generally under real-time working condition, with Electronic equipment is set rapidly to respond to the operation of user.But fingerprint recognition mould group, which is under real-time working condition, to be held A series of false triggering problems are also easy to produce, are also possible to after false triggering because fingerprint recognition is unsuccessful so that electronic equipment makes user Unnecessary prompt etc., seriously affects the usage experience of user.

Summary of the invention

The application embodiment provides a kind of control method, electronic equipment and non-volatile computer readable storage medium Matter.

The control method of the application embodiment is used for electronic equipment.The electronic equipment includes display device, described aobvious Showing device includes fingerprint recognition mould group, and the corresponding fingerprint identification region on said display means of the fingerprint recognition mould group is located at In the display area of the display device, the fingerprint identification region includes fringe region and non-in addition to the fringe region Fringe region, the fringe region are located at the edge of at least side of the display area.The control method includes: to obtain institute State the working condition of display device；The finger for obtaining user touches the touch location of the fingerprint identification region；In the work State is OFF state, and when the touch location is located at the marginal position, the fingerprint recognition mould group is in inoperative shape State.

The electronic equipment of the application embodiment includes display device and processor.The display device includes fingerprint recognition Mould group and touch module, the corresponding fingerprint identification region on said display means of the fingerprint recognition mould group are located at the display In the display area of device, the fingerprint identification region includes fringe region and the non-edge area in addition to the fringe region Domain, the fringe region are located at the edge of at least side of the display area.The processor is for obtaining the display dress The working condition set.The finger that the touch module is used to obtain user touches the touch location of the fingerprint identification region.? The working condition is OFF state, and when the touch location is located at the marginal position, the fingerprint recognition mould group is in Off working state.

The non-volatile computer readable storage medium storing program for executing comprising computer-readable instruction of the application embodiment, the meter When calculation machine readable instruction is executed by processor, so that the processor executes above-mentioned control method.

Control method, electronic equipment and the non-volatile computer readable storage medium storing program for executing of the application embodiment pass through judgement Whether the touch location of the finger touch fingerprint identification region of user is located at fringe region to decide whether to trigger fingerprint recognition mould Group work, can also save the energy consumption of electronic equipment to avoid the generation of the false triggering problem under most of scenes.

The additional aspect and advantage of the application embodiment will be set forth in part in the description, partially will be from following Become obvious in description, or is recognized by the practice of the application.

Detailed description of the invention

The above-mentioned and/or additional aspect and advantage of the application can be from combining in description of the following accompanying drawings to embodiment It will be apparent and be readily appreciated that, in which:

Fig. 1 is the flow diagram of the control method of the application certain embodiments.

Fig. 2 is the structural schematic diagram of the electronic equipment of the application certain embodiments.

Fig. 3 is the fingerprint identification region of the application certain embodiments and the schematic diagram of display area.

Fig. 4 and Fig. 5 is the fringe region of the application certain embodiments and the schematic diagram of non-edge.

Fig. 6 to Fig. 8 is the flow diagram of the control method of the application certain embodiments.

Fig. 9 is the schematic illustration of the gravity sensor of the application certain embodiments.

Figure 10 and Figure 11 is the use posture schematic diagram of electronic equipment.

Figure 12 is the flow diagram of the control method of the application certain embodiments.

Figure 13 is the central area of the application certain embodiments and the schematic diagram in non-central region.

Figure 14 to Figure 18 is the flow diagram of the control method of the application certain embodiments.

Figure 19 is the schematic cross-section of the display device of the application certain embodiments.

Figure 20 is the schematic illustration for fingerprint recognition of the display device of the application certain embodiments.

Figure 21 is the schematic perspective view of the display device of the application certain embodiments.

Figure 22 is the photosensitive layer of the application certain embodiments and the structural schematic diagram of imager chip.

Figure 23 is the photosensitive layer of the application certain embodiments and the structural schematic diagram of display driving layer.

Figure 24 is the planar structure schematic diagram of the second substrate of the application certain embodiments.

Figure 25 and Figure 26 is the side structure schematic view of the display device of the application embodiment.

Figure 27 is the decomposition diagram of the display device of the application certain embodiments.

Figure 28 and Figure 29 is the schematic cross-section of the display device of the application certain embodiments.

Figure 30 is the structural schematic diagram of the capacitive fingerprint sensing device diaphragm of the application certain embodiments.

Figure 31 to Figure 33 is the schematic cross-section of the display device of the application certain embodiments.

Figure 34 is the schematic cross-section of the LCM display screen of the application certain embodiments.

Figure 35 is the schematic cross-section of the OLED display screen of the application certain embodiments.

Figure 36 and Figure 37 is the schematic cross-section of the display device of the application certain embodiments.

Figure 38 is the structural schematic diagram of the capacitive fingerprint sensing device diaphragm of the application certain embodiments.

Figure 39 is the non-volatile readable storage medium of the application certain embodiments and the interaction schematic diagram of processor.

Specific embodiment

Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein identical Or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining presently filed embodiment, and should not be understood as to this Shen The limitation of embodiment please.

Fig. 1 to Fig. 5 is please referred to, the application provides a kind of control method for electronic equipment 1000.Electronic equipment 1000 Including display device 100.Display device 100 includes fingerprint recognition mould group 20.Fingerprint recognition mould group 20 is corresponding in display device 100 On fingerprint identification region 712 be located in the display area 711 of display device.Fingerprint identification region 712 includes fringe region 7121 and the non-edge 7122 in addition to fringe region 7121, fringe region 7121 be located at least the one of display area 711 The edge of side.Control method includes:

011: obtaining the working condition of display device 100；

012: obtaining the touch location of the finger touch fingerprint identification region 712 of user；

013: judging whether working condition is whether OFF state and touch location are located at fringe region 7121；With

014: it is OFF state in working condition, and when touch location is located at marginal position 7121, fingerprint recognition mould group 20 In off working state.

Fig. 2 to Fig. 5 is please referred to, the application also provides a kind of electronic equipment 1000.Electronic equipment includes 100 He of display device Processor 300, processor 300 can be one or more.Display device 100 includes fingerprint recognition mould group 20 and touch module 60. The corresponding fingerprint identification region 712 in display device 100 of fingerprint recognition mould group 20 is located at the display area of display device 100 In 711.Fingerprint identification region 712 includes fringe region 7121 and the non-edge 7122 in addition to fringe region 7121, side Edge region 7121 is located at the edge of at least side of display area 711.Step 011 and step 013 can be real by processor 300 It is existing.Step 012 can be realized by touch module 60.Step 014 can be realized by fingerprint recognition mould group 20.In other words, it handles Device 300 can be used for obtaining the working condition of display device 100.The finger touch fingerprint that touch module 60 can be used for obtaining user is known The touch location in other region 712.Processor 300 can be used for judging whether working condition is OFF state and touch location is It is no to be located at fringe region 7121.It is OFF state in working condition, and when touch location is located at marginal position 7121, fingerprint recognition Mould group 20 is in off working state.It should be understood that fingerprint recognition mould group 20 shown in Fig. 2 and touch module 60 are merely representative of It is arranged in electronic equipment 1000, can not explain its area size and setting position, fingerprint recognition mould group 20 and touch module 60 area size is described below with setting position.

Wherein, electronic equipment 1000 can be mobile phone, tablet computer, laptop, intelligent wearable device (such as intelligent hand Table, Intelligent bracelet, intelligent helmet, intelligent glasses etc.), virtual reality device, display, automatic teller machine, game machine, intelligentized Furniture Etc..The application is illustrated so that electronic equipment 1000 is mobile phone as an example, it will be understood that the concrete form of electronic equipment 1000 is simultaneously It is not limited to mobile phone.

Fig. 2 and Fig. 3 are please referred to, display device 100 is integrated with the functions such as fingerprint recognition, display and touch-control.Fingerprint recognition mould Group 20 and touch module 60 are integrated in display device 100.Fingerprint recognition mould group 20 can be optical finger print mould group, capacitor refers to Line mould group, ultrasonic fingerprint mould group etc..Corresponding fingerprint identification region 712 in display device 100 of fingerprint recognition mould group 20 In in the display area of display device 100 711, specifically, the area of fingerprint identification region 712 and the area of display area 711 Ratio be greater than predetermined ratio, for example predetermined ratio can be 15%, the area of fingerprint identification region 712 and display area 711 The ratio of area can be 15%, 20%, 30%, 43%, 56%, 66.7%, 72%, 80%, 90%, 95%, 99%, 100% Etc., when the value range of ratio is [15%, 100%) when, region fingerprint recognition ((1) shown in) in Fig. 3 may be implemented；When Ratio is 100%, and full frame fingerprint recognition may be implemented (shown in (2) in Fig. 3).At this point, fingerprint recognition mould group 20 can be simultaneously Multiple fingers for touching fingerprint identification region 712 are identified, rather than are only capable of identifying a finger.Touch-control mould The area in the corresponding region that can sense user's finger touch operation in display device 100 of group 60 and display area 711 Area is consistent.

Fig. 4 and Fig. 5 are please referred to, if (i.e. region refers to the partial region in the only display area 711 of fingerprint identification region 712 Line), then fingerprint identification region 712 may include some or all of display area 711 at least side edge；If fingerprint identification region 712 be the whole region (i.e. full frame fingerprint) of display area 711, and fingerprint identification region 712 includes the four of display area 711 at this time Whole edges of side.Such as shown in (1) and (2) of Fig. 4, fingerprint identification region 712 is region fingerprint, 7121 part of fringe region It is distributed around non-edge 7122, fringe region 7121 is located at the edge of the side of fingerprint identification region 712.Such as Fig. 4 (3) shown in, fingerprint identification region 712 is region fingerprint, and 7121 part of fringe region is distributed around non-edge 7122, edge Region 7121 is located at the edge of the two sides of fingerprint identification region 712.Such as shown in (4) of Fig. 4, fingerprint identification region 712 is area Domain fingerprint, 7121 part of fringe region are distributed around non-edge 7122, and fringe region 7121 is located at fingerprint identification region 712 Three sides edge.No matter fringe region 7121 is located at the which side of fingerprint identification region 712, and fringe region 712 is respectively positioned on aobvious Show the edge in region 711.Incorporated by reference to Fig. 5, when fingerprint identification region 712 is full frame fingerprint, fringe region 7121 can be located at The edge (shown in (1) of Fig. 5) of 712 side of fingerprint identification region, or edge (Fig. 5 positioned at 712 two sides of fingerprint identification region (2) shown in), perhaps positioned at three sides of fingerprint identification region 712 edge (3) of Fig. 5 (shown in) or be located at fingerprint recognition The edge of four sides in region 712 (shown in (4) of Fig. 5).The area of fringe region 7121 and the area of fingerprint identification region 712 it Between ratio value range can for (0,30%], for example, ratio can be 5%, 10%, 16.8%, 20%, 25%, 30% etc. Deng.The shape of non-edge 7122 is not limited to the rectangle in Fig. 4 and Fig. 5, can also be round rectangle, rectangular, trapezoidal, triangle Shape, circle, ellipse, polygon, irregular figure (such as heart-shaped, pentalpha) etc., this is not restricted.

In the existing mobile phone with fingerprint identification function, fingerprint recognition mould group 20 be generally in real-time working condition with Guarantee quickly to respond the operation of user.But fingerprint recognition mould group 20 may when being in real-time working condition Lead to a series of generation of false triggering problems.For example, user is hand-held under 100 OFF state of display device (i.e. black state) Mobile phone, the finger of user often touches fringe region 7121 at this time, fingerprint recognition mould group 20 will obtain fingerprint image with Processor 300 is set to carry out the authentication of fingerprint recognition, but user is actually the operation for not needing mobile phone and executing fingerprint recognition , false triggering problem is just produced at this time.Fingerprint recognition mould group 20 is not only influenced user by false triggering and uses electronic equipment 1000 Experience, also expend electronic equipment 1000 electric energy.

The control method of the application obtains the working condition and finger touch fingerprint identification region 712 of display device 100 Touch location, and decide whether that according to working condition and touch location, triggering fingerprint recognition mould group 20 works.

Specifically, when display device 100 detects the touch operation of user, processor 300 obtains display device 100 Working condition, and touch module 60 obtains the touch point of finger touch fingerprint identification region 712, and processor 300 is according to touch The coordinate of point judges the touch location of finger touch fingerprint identification region 712.If the working condition of display device 100 is to extinguish State, and touch location is located at fringe region 7121, then and processor 300 thinks that user does not need mobile phone execution fingerprint this moment The operation of identification, processor 300 do not control fingerprint recognition mould group 20 and obtain fingerprint image, and fingerprint recognition mould group 20 is in inoperative State.

The control method and electronic equipment 1000 of the application embodiment obtain the working condition and hand of display device 100 Refer to the touch location of touch fingerprint identification region 712, and decides whether that triggering fingerprint knows according to working condition and touch location Other mould group 20 works, and can also save the energy of electronic equipment 1000 to avoid the generation of the false triggering problem under most of scenes Consumption.

Referring to Fig. 6, in some embodiments, control method further include:

015: when working condition is illuminating state or touch location is located at non-edge position 7122, obtaining finger touch and refer to The touch area of line identification region 712；

016: judging to touch whether area is greater than preset area；

When touching area greater than preset area, fingerprint recognition mould group 20 is in off working state；

017: when touching area less than preset area, fingerprint recognition mould group 20 obtains the fingerprint image of finger.

Referring to Fig. 2, in some embodiments, step 015 can be realized by touch module 60.Step 016 can be by Processor 300 is realized.In other words, touch module 60 can be used in working condition being that illuminating state or touch location are located at non-side When edge position 7122, the touch area of finger touch fingerprint identification region 712 is obtained.Processor 300 can be used for judging touch surface Whether product is greater than preset area.When touching area greater than preset area, fingerprint recognition mould group 20 is in off working state.It is touching When touching area less than preset area, fingerprint recognition mould group 20 obtains the fingerprint image of finger.

Specifically, when the working condition of display device 100 is that (touch location can be located at fringe region to illuminating state at this time 7121 perhaps non-edge 7122) or display device 100 working condition be OFF state and touch location be located at it is non- When fringe region 712, processor 300 needs further judge whether the touch area of user's touch fingerprint identification region 712 is big In preset area.Wherein, the touch area of user's touch fingerprint identification region 712 refers to that touch module 60 does once full frame sweep The touch area of the finger obtained after retouching, touching area can be calculated according to touch point.Specifically, touch module 60 is done After full screen scanning, available one or more touch point.One or more touch points are reported to place by touch module 60 Device 300 is managed, at least one touch point is divided at least one touch area according to the coordinate of touch point by processor 300, and will Touch point merger in the same touch area is by the obtained touch-control of the same finger touch fingerprint identification region 712 Point, processor 300 calculate the area of at least one touch area using the touching as corresponding finger touch fingerprint identification region 712 Touch area.Then, processor 300 judges to touch whether area is greater than preset area, wherein when touch area is one, Processor 300 judges whether the touch area of a touch area is greater than preset area；When touch area is multiple, processing Device 300 judges whether the sum of touch area of multiple touch areas is greater than preset area.Touch area a touch area When the sum of touch area of when more than or equal to preset area or multiple touch areas is greater than or equal to preset area, processing Device 300 also thinks that user does not need the operation that mobile phone executes fingerprint recognition this moment, and processor 300 does not control fingerprint recognition mould group 20 obtain fingerprint image, and fingerprint recognition mould group 20 is in off working state.Touch area a touch area is less than default The sum of area or the touch area of multiple touch areas be less than preset area when, processor 300 think user need finger into Row fingerprint recognition, processor 300 control fingerprint recognition mould group 20 and obtain fingerprint image.

It is appreciated that showing at possible at this time when the touch area a touch area is greater than or equal to preset area In user holds mobile phone and palm contacts are to fingerprint identification region 712 the case where, user does not need mobile phone and carries out fingerprint knowledge at this time Not, fingerprint recognition mould group 20 can not work.When the sum of touch area of multiple touch areas is greater than or equal to preset area, Show to be likely to be at user at this time and hold mobile phone and multiple fingers while the case where touch fingerprint identification region 712, uses at this time Family does not need mobile phone yet and carries out fingerprint recognition, and fingerprint recognition mould group 20 can not work.When touching area less than preset area, Processor 300 thinks that user needs mobile phone to carry out fingerprint recognition at this time, and processor 300 controls fingerprint recognition mould group 20 and works.Refer to Line identification mould group 20 obtains the fingerprint image of finger and fingerprint image is sent to processor 300, and processor 300 compares fingerprint image Matching degree between picture and the fingerprint template prestored, when matching degree is spent greater than preset matching, fingerprint recognition success.In addition, peace Application on mobile phone can use fingerprint and be locked, if the position in display area 712 is applied to be located just at side Edge region 7121, then, when display device 100 is in illuminating state, the finger of user is possible to touch fringe region 7121, to be used to unlock the application in fringe region 7121, therefore, light in display device 100 and touch location are located at side When edge region 7121, if touching area is less than preset area, fingerprint recognition mould group 20 can be triggered.

The control method and electronic equipment 1000 of the application embodiment are to light shape in the working condition of display device 100 The working condition of state or display device 100 is for OFF state and when touch location is located at non-edge 7122, further By judge touch area whether be greater than preset area decide whether trigger fingerprint recognition mould group 20 open, can be further The generation for avoiding false triggering problem improves the usage experience of user.

Referring to Fig. 7, in some embodiments, when touching area less than preset area, fingerprint recognition mould group 20 is obtained The step of taking the fingerprint image of finger include:

0171: obtaining the current distance between electronic equipment 1000 and target object；

0172: judging whether current distance is greater than pre-determined distance；

When current distance is less than pre-determined distance, fingerprint recognition mould group 20 is in off working state；

When current distance is greater than pre-determined distance, fingerprint recognition mould group 20 obtains fingerprint image.

Referring to Fig. 2, in some embodiments, electronic equipment 1000 further includes distance detection device 400.Step 0171 It can be realized by distance detection device 400.Step 0172 can be realized by processor 300.In other words, distance detection device 400 can be used for obtaining the current distance between electronic equipment 1000 and target object.Processor 300 can be used for judging currently away from From whether greater than pre-determined distance.When current distance is less than pre-determined distance, fingerprint recognition mould group 20 is in off working state.Working as When front distance is greater than pre-determined distance, fingerprint recognition mould group 20 obtains fingerprint image.

Specifically, when the working condition of display device 100 is that (touch location can be located at fringe region to illuminating state at this time 7121 perhaps non-edge 7122) or display device 100 working condition be OFF state and touch location be located at it is non- When fringe region 7122, processor 300 needs further to judge between electronic equipment 1000 and target object (i.e. barrier) Whether current distance is greater than pre-determined distance.Wherein, distance detection device 400 can be depth camera (structure light depth camera, fly Row time depth camera, binocular depth camera etc.), proximity sensor etc., this is not restricted.The value of pre-determined distance can be 5cm, 6.5cm, 8cm, 9cm, 10cm, 11.4cm, 12cm, 13.7cm, 14cm, 15cm etc..It is less than or equal in current distance When pre-determined distance, processor 300 thinks that user does not need the operation that mobile phone executes fingerprint recognition this moment, and processor 300 is not controlled Fingerprint recognition mould group 20 processed obtains fingerprint image, and fingerprint recognition mould group 20 is in off working state.It is greater than in current distance default Apart from when, processor 300 think user need mobile phone carry out fingerprint recognition, processor 300 control fingerprint recognition mould group 20 obtain Fingerprint image.

It is appreciated that showing that being likely to be at mobile phone at this time is placed on pocket when current distance is less than or equal to pre-determined distance In, mobile phone is placed in knapsack, mobile phone is placed on cheek side and received calls etc. under scenes by user, user does not need mobile phone at this time Fingerprint recognition is carried out, fingerprint recognition mould group 20 can not work.

The control method and electronic equipment 1000 of the application embodiment are to light shape in the working condition of display device 100 The working condition of state or display device 100 is for OFF state and when touch location is located at non-edge 7122, further By judge current distance whether be greater than pre-determined distance decide whether trigger fingerprint recognition mould group 20 open, can be further The generation for avoiding false triggering problem improves the usage experience of user.

Referring to Fig. 8, in some embodiments, step 017 is when touching area less than preset area, fingerprint recognition mould Organizing the fingerprint image that 20 obtain fingers includes:

0173: obtaining the use posture of electronic equipment 1000；

0174: judging whether meet predetermined condition using posture；

When being unsatisfactory for predetermined condition using posture, 20 groups of fingerprint recognition mould are in off working state；

When meeting predetermined condition using posture, fingerprint recognition mould group 20 obtains fingerprint image.

Referring to Fig. 2, in some embodiments, electronic equipment 1000 further includes attitude transducer 500.Step 0173 can To be realized by attitude transducer 500.Step 0174 can be realized by processor 300.In other words, attitude transducer 500 can be used In the use posture for obtaining electronic equipment 1000.Processor 300 can be used for judging whether meet predetermined condition using posture.Make When being unsatisfactory for predetermined condition with posture, 20 groups of fingerprint recognition mould are in off working state.When meeting predetermined condition using posture, Fingerprint recognition mould group 20 obtains fingerprint image.

Attitude transducer 500 can be gravity sensor, gyroscope or other sensors.The use of electronic equipment 1000 Posture includes the inclination angle of electronic equipment 1000, and inclination angle can indicate the placed angle and display device 100 of electronic equipment 1000 Display surface 71 direction.The embodiment of the present application is illustrated so that attitude transducer 500 is gravity sensor as an example.Please refer to figure 9, if electronic equipment 1000 is placed definition (in Fig. 9 in (1) left side figure or Fig. 9 shown in the right figure of (2)) perpendicular to horizontal plane Use posture for electronic equipment 1000 is 0 ° of inclination angle, then when electronic equipment 1000 rotates clockwise θ angle, electronic equipment 1000 use posture is inclination angle theta ° (in Fig. 9 on the right of (1) shown in figure).When the rotation θ angle counterclockwise of electronic equipment 1000, electricity The use posture of sub- equipment 1000 is-θ ° of inclination angle (in Fig. 9 shown in the figure of (2) left side).The available Y-axis of gravity sensor and Z axis Acceleration value, processor 300 according to the acceleration value of Y-axis and Z axis calculate electronic equipment 1000 inclination angle size, further Ground judges the placed angle of electronic equipment 1000 and the direction of display surface 71 according to inclination angle size.

The case where use posture of electronic equipment 1000 is unsatisfactory for predetermined condition may include: (1) as shown in Figure 10, mobile phone Vertical to place, display surface 71 is (i.e. aobvious towards the rear shell 220 of user (shown in (1) and (3) of Figure 10) or casing 200 towards user Show face 71 backwards to user, shown in (2) of Figure 10)；(2) as shown in figure 11, mobile phone is horizontal positioned, and display surface 71 is downward.It is showing The working condition of device 100 is that (touch location can be located at fringe region 7121 or non-edge to illuminating state at this time 7122) or the working condition of display device 100 is for OFF state and when touch location is located at non-edge 7122, such as The use posture of fruit electronic equipment 1000 is unsatisfactory for predetermined condition, then processor 300 thinks that user does not need mobile phone progress at this time Fingerprint recognition, fingerprint recognition mould group 20 are in off working state.Display device 100 working condition be illuminating state (at this time Touch location can be located at the perhaps non-edge 7122 of fringe region 7121) or the working condition of display device 100 be to put out State of going out and when touch location is located at non-edge 7122, if the use posture of electronic equipment 1000 meets predetermined item Part, then processor 300 thinks that user needs mobile phone to carry out fingerprint recognition at this time, and fingerprint recognition mould group 20 obtains fingerprint image.

It is appreciated that mobile phone will not usually be placed vertically, but can incline relative to the direction of Z axis when user uses mobile phone Oblique certain angle is placed.Therefore, when mobile phone is placed vertically, no matter display surface 71 is directed towards user or backwards user, at this time User is usually not need mobile phone to carry out fingerprint recognition.When mobile phone is horizontally arranged and display surface 71 is under, user is general And it does not need mobile phone and carries out fingerprint recognition.Therefore, the working condition of display device 100 is illuminating state, or display dress 100 working condition is set for OFF state and when touch location is located at non-edge 7122, if electronic equipment 1000 It is unsatisfactory for predetermined condition using posture, then fingerprint recognition mould group 20 does not work.It is to light shape in the working condition of display device 100 The working condition of state or display device 100 is for OFF state and when touch location is located at non-edge 7122, if electric The use posture of sub- equipment 1000 meets predetermined condition, i.e. electronic equipment 1000 is not at vertical placement status or electronic equipment 1000 it is horizontal positioned when display surface 71 not downward, fingerprint recognition mould group 20 just obtains fingerprint image at this time.Further, it is unsatisfactory for Predetermined condition includes following scenario described: 0 degree of θ value, 90 degree, 180 degree, -90 degree, -180 degree.Meeting predetermined condition includes following feelings Shape: θ value is (0,90) degree, (90,180) degree, (- 90,0) degree, (- 180, -90) degree.

The control method and electronic equipment 1000 of the application embodiment are to light shape in the working condition of display device 100 The working condition of state or display device 100 is for OFF state and when touch location is located at non-edge 7122, further It, can be further by judging to decide whether to trigger fingerprint recognition mould group 20 using whether posture meets predetermined condition and open The generation for avoiding false triggering problem improves the usage experience of user.

Figure 12 and Figure 13 are please referred to, in some embodiments, non-edge 7122 includes central area 7123 and ring Around the non-central region 7124 of central area 7123.Step 017 is when touching area less than preset area, fingerprint recognition mould group 20 Obtain finger fingerprint image include:

0175: judging whether touch location is located at central area；

0176: when touch location is located at central area 7123, fingerprint recognition mould group 20 obtains after the first response time section Fetching print image；

0177: when touch location is located at non-central region 7124, fingerprint recognition mould group 20 is after the second response time section Fingerprint image is obtained, the second response time section is greater than the first response time section.

Fig. 2 and Figure 13 is please referred to, in some embodiments, step 0175 can be realized by processor 300.Step 0176 It can be realized by fingerprint recognition mould group 20 with step 0177.In other words, processor 300 can also be used to judge that touch location is It is no to be located at central area 7123.When touch location is located at central area 7123, fingerprint recognition mould group 20 is in the first response time Fingerprint image is obtained after section.When touch location is located at non-central region 7124, fingerprint recognition mould group 20 is in the second response time Fingerprint image is obtained after section, the second response time section is greater than the first response time section.

Wherein, by taking fingerprint identification region 712 is full frame fingerprint as an example, fingerprint identification region 712 is by central area 7123, non- Central area 7124 and fringe region 7121 form (as shown in figure 13), at this time 7124 groups of central area 7123 and non-central region At non-edge 7122.The value model of first ratio of the area of the area and fingerprint identification region 712 of central area 7123 Enclosing to be [50%, 80%], for example, the first ratio can be 50%, 57%, 60%, 65%, 70.4%, 78%, 80% etc.. The value range of second ratio of the area of the area and fingerprint identification region 712 in non-central region 7124 can for [10%, 40%], for example, the second ratio can be 10%, 15%, 18.8%, 20%, 25%, 30%, 38%, 40% etc..

It specifically, is that illuminating state and touch location are located at non-edge 7122 in the working condition of display device 100, Or the working condition of display device 100 is when being that OFF state and touch location are located at non-edge 7122, if touch Position is located at the central area 7123 of non-edge 7122, then fingerprint recognition mould group 20 obtains after the first response time section and refers to Print image.The first response time value of section can be 0 or the value greater than 0.When the value of the first response time section is 0, place Reason device 300 is illuminating state in the working condition for determining display device 100 and touch location is located in non-edge 7122 The working condition of heart district domain 7123 or display device 100 is OFF state and touch location is located at non-edge 7122 Central area 7123 after, at once control 20 groups of acquisition fingerprint images of fingerprint recognition mould.In the first response time, the value of section is big When 0, processor 300 is illuminating state in the working condition of display device 100 and touch location is located at non-edge 7122 Central area 7123 or the working condition of display device 100 be that OFF state and touch location are located at non-edge Behind 7122 central area 7123, processor 300 waits the first response time Duan Houzai control acquisition of fingerprint recognition mould group 20 to refer to Print image.In the first response time section, processor 300 further obtains at least one parameter again, and further according to extremely A few parameter is to determine whether triggering 20 groups of acquisition fingerprint images of fingerprint recognition mould.For example, processor 300 controls gravity sensitive Device obtains the acceleration value of electronic equipment 1000, and the use posture of electronic equipment 1000 is determined further according to acceleration value.Processing Device 300 judges whether the use posture of electronic equipment 1000 meets predetermined condition, and i.e. when meeting predetermined condition using posture It carves triggering fingerprint recognition mould group 20 and obtains fingerprint image.If being unsatisfactory for predetermined condition, fingerprint recognition mould group 20 using posture Do not obtain fingerprint image.

In the working condition of display device 100 be illuminating state and touch location is located at non-edge 7122, Huo Zhexian The working condition of showing device 100 is for OFF state and when touch location is located at non-edge 7122, if touch location position In non-central region 7124, then fingerprint recognition mould group 20 obtains fingerprint image after the second response time section.Second response time The value of section is not 0, and the second response time section is greater than the first response time section.In the second response time section, processor 300 At least two parameters (the i.e. parameter number of the acquisition needed for the second response time section inner treater 300 can be further obtained again Amount is greater than the number of parameters of the acquisition needed for the first response time section inner treater 300), and further according at least two parameters To determine whether triggering fingerprint recognition mould group 20 obtains fingerprint image.For example, processor 300, which controls gravity sensor, obtains electronics The acceleration value of equipment 1000 determines the use posture of electronic equipment 1000, also, processor 300 further according to acceleration value Command range detection device 400 obtains the current distance between electronic equipment 1000 and target object.Then, processor 300 is sentenced The use posture of disconnected electronic equipment 1000 whether meets predetermined condition and whether current distance is greater than pre-determined distance, is using When posture meets predetermined condition and current distance and is greater than pre-determined distance, processor 300 triggers fingerprint recognition mould group 20 at once and obtains Fetching print image.If being unsatisfactory for predetermined condition using posture or current distance being less than pre-determined distance, processor 300 is not It controls fingerprint recognition mould group 20 and obtains fingerprint image.

It is appreciated that the finger of user would generally touch when daily user's touch fingerprint identification region 712 carries out fingerprint recognition Touch the position of central area 7123, the less position for touching non-central region 7124.Therefore, for central area 7123 and it is non-in Heart district domain 7124 sets the different response times, and central area 7123 is very fast relative to the response speed in non-central region 7124, On the one hand it can guarantee response speed, on the other hand can avoid the generation of false triggering, better user experience as far as possible.

The shape of central area 7123 is not limited to the rectangle in Figure 13, can also be round rectangle, rectangular, trapezoidal, triangle Shape, circle, ellipse, polygon, irregular figure (such as heart-shaped), this is not restricted.

Figure 14, Figure 19 and Figure 20 are please referred to, in some embodiments, display device 100 includes stacking gradually setting First substrate 12, photosensitive layer 31, liquid crystal layer 14, the second substrate 15 and multiple collimation units 321.Photosensitive layer 31 includes multiple photosensitive Unit 311.Multiple display units 151 and the shading piece between multiple display units 151 are formed in the second substrate 15 152.Unthreaded hole 1521 was offered on shading piece 152.Collimation unit 321 offers light hole 3211, light hole 3211 and excessively light Hole 1521 is directed at photosensitive unit 311.Fingerprint recognition mould group 20 obtain finger fingerprint image include:

024: receiving the imaging optical signal including target optical signal to form imaging electric signal, target optical signal successively passes through After light hole 3211 and excessively unthreaded hole 1521, photosensitive layer 31 is reached；

025: obtaining the noise signal in display device 100；With

026: fingerprint image is obtained according to imaging electric signal and noise signal.

Fig. 2, Figure 19 and Figure 22 are please referred to, in some embodiments, step 024 can be realized by photosensitive layer 31.Step 025, which can obtain circuit 301 by noise, realizes.Step 026 can be realized by processor 300.In other words, photosensitive layer 31 can be used In imaging optical signal of the reception including target optical signal to form imaging electric signal, wherein target optical signal successively passes through light passing Photosensitive layer 31 is reached after hole 3211 and excessively unthreaded hole 1521.Noise, which obtains circuit 301, can be used for obtaining the noise in display device 100 Signal.Processor 300 can be used for obtaining fingerprint image according to imaging electric signal and noise signal.

In this example it is shown that device 100 includes display module 10 and fingerprint recognition mould group 20, wherein fingerprint recognition Mould group 20 is optical finger print mould group, and optical finger print mould group includes photosensitive layer 31 and collimation layer 32.Display device 100 includes successively heap First substrate 12, photosensitive layer 31, liquid crystal layer 14, the second substrate 15 and the collimation layer 32 of folded setting.Photosensitive layer 31 includes multiple senses Light unit 311, collimation layer 32 include multiple collimation units 321.Incorporated by reference to Figure 24, it is single that multiple displays are formed in the second substrate 15 Member 151 and the shading piece 152 between multiple display units 151.Unthreaded hole 1521 was offered on shading piece 152.Collimation is single Member 321 offers light hole 3211, and light hole 3211 and unthreaded hole 1521 excessively are directed at photosensitive unit 311.Photosensitive unit 311 can connect It receives and enters from the external world and successively pass through light hole 3211 and cross the target optical signal of unthreaded hole 1521, which is by user The reflected signal of finger, the fingerprint image for touching finger in display device 100 can be obtained according to the target optical signal Picture, fingerprint image can be used for fingerprint recognition.

Multiple photosensitive units 311 in photosensitive layer 31 number can be generated into after receiving the letter of the imaging including target optical signal As electric signal.But optical signal is imaged other than including target optical signal, further includes interfering optical signal, infrared signal etc., it is photosensitive Unit 311 can also generate noise signal when working, and therefore, imaging electric signal is in addition to including the target electricity generated by target optical signal It further include the interference electric signal generated by interference optical signal, the infrared electric signal generated by infrared signal, by photosensitive outside signal At least one of the noise electric signal of the generation of unit 311, the circuit noise signal generated by photosensitive unit 311 noise signal. For example, imaging electric signal includes target electric signal and interference two kinds of signals of electric signal；Alternatively, imaging electric signal includes target telecommunications Number, three kinds of infrared electric signal, noise electric signal signals；Alternatively, imaging electric signal includes target electric signal, infrared electric signal, makes an uproar Four kinds of acoustoelectric signal, circuit noise signal signals；Alternatively, imaging electric signal includes target electric signal, interference electric signal, infrared electricity Five kinds of signal, noise electric signal, circuit noise signal signals etc..

The accuracy of the fingerprint image of acquisition can be had an impact in imaging electric signal by the electric signal that noise signal generates, It further will affect the accuracy rate of fingerprint recognition.Therefore, the control method of the application embodiment is obtained by setting noise Circuit 301 obtains noise signal, after photosensitive layer 31 gets imaging electric signal, will be imaged in electric signal and remove target telecommunications The electric signal removal formed by noise signal other than number, to avoid the electric signal formed by noise signal to target electric signal It interferes, so that the fingerprint image that fingerprint recognition mould group 20 obtains is more accurate, is referred to based on more accurate fingerprint image Line identification, can also promote the accuracy rate and safety of fingerprint recognition.

Fig. 2 and Figure 15 are please referred to, in some embodiments, noise signal includes the interference telecommunications for interfering optical signal to be formed Number.The noise signal that step 025 obtains in display device 100 includes: 0251: obtaining interference electric signal.Step 026 is according to imaging It includes: 0261 that electric signal and noise signal, which obtain fingerprint image: obtaining fingerprint image according to imaging electric signal and interference electric signal.

Fig. 2 and Figure 22 is please referred to, in some embodiments, it includes veiling glare photosensitive unit 3111 that noise, which obtains circuit 301,. Step 0251 can be realized by veiling glare photosensitive unit 3111.Step 0261 can be realized by processor 300.In other words, veiling glare Photosensitive unit 3111 can be used for obtaining interference electric signal.Processor 300 can be used for being obtained according to imaging electric signal and interference electric signal Fetching print image.

Specifically, veiling glare photosensitive unit 3111 is by the interference electric signal transmission generated by interference optical signal to processor 300, Processor 300 imaging when will according to interference electric signal fingerprint image will be corrected, such as by be imaged optical signal generate at As electric signal subtract interference electric signal after as the target electric signal eventually for imaging, to obtain the higher fingerprint image of accuracy Picture promotes the accuracy rate of fingerprint recognition.

Fig. 2 and Figure 16 is please referred to, in some embodiments, noise signal includes making an uproar for photosensitive unit 311 itself generation Acoustoelectric signal.The noise signal that step 25 obtains in display device 100 includes: 0252: obtaining noise electric signal.Step 026 piece Obtaining fingerprint image according to imaging electric signal and noise signal includes: 0262: being referred to according to imaging electric signal and the acquisition of noise electric signal Print image.

Fig. 2 and Figure 22 is please referred to, in some embodiments, it includes noise photosensitive unit 3112 that noise, which obtains circuit 301,. Step 0252 can be realized by noise photosensitive unit 3112.Step 0262 can be realized by processor 300.In other words, noise Photosensitive unit 3112 can be used for obtaining noise electric signal.Processor 300 can be used for being obtained according to imaging electric signal and noise electric signal Fetching print image.

Specifically, noise photosensitive unit 3112 is by the noise electric signal transmission generated by photosensitive unit 31 to processor 300, Processor 300 imaging when fingerprint image will be corrected according to noise electric signal, such as by be imaged optical signal generate at As electric signal subtracts after noise electric signal as the target electric signal eventually for imaging, to obtain the higher fingerprint image of accuracy Picture promotes the accuracy rate of fingerprint recognition.

Fig. 2 and Figure 17 is please referred to, in some embodiments, noise signal includes that the circuit of the generation of photosensitive unit 311 is made an uproar Acoustical signal.The noise signal that step 025 obtains in display device 100 includes: 0253: obtaining circuit noise signal.Step 026 piece Obtaining fingerprint image according to imaging electric signal and noise signal includes: 0263: according to imaging electric signal and circuit noise signal acquisition Fingerprint image.

Fig. 2 and Figure 22 is please referred to, in some embodiments, it includes 301 Noise Circuits units 3122 that noise, which obtains circuit,. Step 0253 can be realized by Noise Circuits unit 3122.Step 0263 can be realized by processor 300.In other words, noise Circuit unit 3122 can be used for obtaining circuit noise signal.Processor 300 can be used for according to imaging electric signal and circuit noise letter Number obtain fingerprint image.

Specifically, the circuit noise signal generated by photosensitive unit 311 is transferred to processor by Noise Circuits unit 3122 300, processor 300 will be corrected fingerprint image according to circuit noise signal in imaging, such as imaging optical signal is produced Raw imaging electric signal subtracts after circuit noise signal as the target electric signal eventually for imaging, higher to obtain accuracy Fingerprint image, promote the accuracy rate of fingerprint recognition.

Fig. 2 and Figure 18 is please referred to, in some embodiments, noise signal includes the infrared telecommunications that infrared signal is formed Number.The noise signal that step 025 obtains in display device 100 includes: 0254: obtaining infrared electric signal.Step 026 is according to imaging It includes: 0264 that electric signal and infrared electric signal, which obtain fingerprint image: obtaining fingerprint image according to imaging electric signal and infrared electric signal Picture.

Fig. 2 and Figure 22 is please referred to, in some embodiments, it includes infrared photosensitive unit 3113 that noise, which obtains circuit 301,. Step 0254 can be realized by infrared photosensitive unit 3113.Step 0264 can be realized by processor 300.In other words, infrared Photosensitive unit 3113 can be used for obtaining infrared electric signal.Processor 300 can be used for being obtained according to imaging electric signal and infrared electric signal Fetching print image.

Specifically, infrared photosensitive unit 3113 will be by the infrared electric signal transmission of infrared signal to processor 300, processing Device 300 will be corrected fingerprint image according to infrared electric signal in imaging, such as electric by the imaging that optical signal generates is imaged Signal subtracts after infrared electric signal as the target electric signal eventually for imaging, to obtain the higher fingerprint image of accuracy, Promote the accuracy rate of fingerprint recognition.

Fig. 2 and Figure 10 is please referred to, the electronic equipment 1000 of the application embodiment further includes casing 200.Casing 200 includes Front housing 210 and rear shell 220.Casing 200 can be used for mount display 100, and in other words, casing 200 can be used as display device 100 Installation carrier, casing 200 can also be used in the functions such as power supply unit, imaging device, communication device of installing electronic equipment 1000 Module, so that casing 200 provides the protection of shatter-resistant, waterproof etc. for functional module.Display device 100 can be used for showing picture, view Frequently, the images such as text.Display device 100 is mounted on casing 200, and specifically, display device 100 may be mounted at front housing 210 On perhaps display device 100 be mounted in rear shell 220 or display device 100 while being mounted on front housing 210 and rear shell 220 On or display device 100 be mounted on the side of casing 200, this is not restricted.In the example as shown in fig. 2, it shows Device 100 is mounted on front housing 210.

Fig. 2 and Figure 19 are please referred to Figure 21, in one example, fingerprint recognition mould group 20 is optical finger print mould group, optics Fingerprint mould group includes photosensitive layer 31 and collimation layer 32.Optical finger print mould group is integrated in display device 100.Display module 10 includes Backlight layer 11, the first polarizing layer 12, first substrate 13, liquid crystal layer 14, the second substrate 15 and the second polarizing layer 16.It is filled along display Set 100 light direction, display device 100 successively include backlight layer 11, the first polarizing layer 12, first substrate 13, photosensitive layer 31, Liquid crystal layer 14, the second substrate 15, collimation layer 32, the second polarizing layer 16 and cover board 70.The touch-control being integrated in display device 100 Mould group 60 may be provided between cover board 70 and the second polarizing layer 16.Route in touch module 60 can be using nanometer silver paste etc. thoroughly Bright metal material production receives light and the transmitting light generation shadow of display module 10 to avoid obtaining to optical finger print mould group It rings.

As shown in FIG. 19 and 20, backlight layer 11 can be used for emitting optical signal La or backlight layer 11 and can be used for leading The optical signal La that light lead source (not shown) issues.Optical signal La sequentially passes through the first polarizing layer 12, first substrate 13, photosensitive layer 31, enter the external world after liquid crystal layer 14, the second substrate 15, collimation layer 32, the second polarizing layer 16, touch module 60 and cover board 70.Back Photosphere 11 includes bottom surface 101, and specifically, bottom surface 101 can be surface opposite with the first polarizing layer 12 in backlight layer 11.First Polarizing layer 12 is arranged in backlight layer 11, and the first polarizing layer 12 specifically can be polarizing film or polarizing coating.First substrate 13 is arranged On the first polarizing layer 12, first substrate 13 can be glass substrate.

Photosensitive layer 31 can be the film layer being produced on first substrate 13, such as pass through TFT (Thin Film Transistor) technique is produced on first substrate 13.Figure 21 to Figure 23 is please referred to, photosensitive layer 31 includes multiple photosensitive units 311 and multiple circuit units 312.

Photosensitive unit 311 can use photoelectric effect and convert electric signal for the optical signal received, photosensitive by parsing The intensity for the electric signal that unit 311 generates can reflect the intensity for the optical signal that photosensitive unit 311 receives.Photosensitive unit 311 Visible light signal and/or black light signal be can receive to be converted into electric signal.The type of multiple photosensitive units 311 can be complete It is exactly the same or not exactly the same.Multiple photosensitive units 311 can be arranged in an arbitrary manner, and arrangement mode specifically can be with The demands such as the shape according to display device 100 are set, and in the embodiment of the present application, multiple photosensitive units 311 are arranged in array Cloth, such as multiple photosensitive units 311 line up the matrix of multiple lines and multiple rows.Each photosensitive unit 311 can work independently without by The intensity of the influence of other photosensitive units 311, the optical signal that the photosensitive unit 311 of different location receives may be different, therefore not Intensity with the electric signal of the generation of photosensitive unit 311 of position may also be different.In addition, photosensitive unit 311 towards bottom surface 101 Side reflectorized material can be set, the optical signal for being irradiated to photosensitive unit 311 from backlight layer 11 can be anti-by reflectorized material It penetrates, the part optical signals is avoided to influence the accuracy that photosensitive layer 31 is imaged.

Circuit unit 312 can be connect with photosensitive unit 311.The electricity that circuit unit 312 can generate photosensitive unit 311 Signal is transmitted to processor 300, and processor 300 is multiple at this time, and one of processor 300 is imager chip 300.Circuit Unit 312 can specifically include the elements such as transistor.The quantity of circuit unit 312 can be to be multiple, and each photosensitive unit 311 can To be connected on a corresponding circuit unit 312, multiple circuit units 312 are connect by connecting line with imager chip 300.It is more The arrangement mode of a circuit unit 312 can be similar with the arrangement mode of photosensitive unit 311, such as 311 row of multiple photosensitive units The matrix of multiple lines and multiple rows is arranged into, multiple circuit units 312 can also be arranged in the matrix of multiple lines and multiple rows.

Figure 19 to Figure 21 is please referred to, liquid crystal layer 14 is arranged on photosensitive layer 31, and the liquid crystal molecule in liquid crystal layer 14 is in electric field Under the action of can be changed deflection direction, and then change can pass through the amount of the optical signal of liquid crystal layer 14.Correspondingly, incorporated by reference to Figure 23, Display driving layer 1a can also be made on first substrate 13, display driving layer 1a makees in the driving of driving chip (not shown) Electric field can be applied to liquid crystal layer 14 under, to control the deflection direction of the liquid crystal molecule of different location.Specifically, display driving Layer 1a includes multiple display driver element 1a1, and each display driver element 1a1 can independently control the liquid crystal of corresponding position Deflect direction.

Figure 19, Figure 21 and Figure 24 are please referred to, the second substrate 15 is arranged on liquid crystal layer 14.The second substrate 15 may include glass The multiple display units 151 and shading piece 152 of glass substrate and setting on the glass substrate.Display unit 151 can be colored Optical filter, for example, R indicates infrared fileter, G indicates that green color filter, B indicate blue color filter, by controlling across difference The amount of the optical signal of the optical filter of color, to control the color that display device 100 is finally shown.The row of multiple display units 151 Column mode can be corresponding with the arrangement mode of multiple display driver element 1a1, such as a display unit 151 and a display are driven Moving cell 1a1 alignment.For shading piece 152 between display unit 151, shading piece 152 is spaced two adjacent display units 151, in one example, shading piece 152 can be black matrix" (Black Matrix, BM).The entity part of shading piece 152 It can prevent light from passing through, enter extraneous, shading piece without display unit 151 to avoid the light in display device 100 152 occur optical crosstalk phenomenon when can also prevent optical signal from passing through adjacent display unit 151.

Incorporated by reference to Figure 20, unthreaded hole 1521 was offered on shading piece 152, crossing unthreaded hole 1521 can be used for passing through for optical signal. The position for crossing unthreaded hole 1521 is aligned with photosensitive unit 311, wherein alignment can refer to that the center line of unthreaded hole 1521 passed through photosensitive list Member 311.Optical signal was during passing through unthreaded hole 1521, if optical signal reached the inner wall of unthreaded hole 1521, optical signal The inner wall section that unthreaded hole 1521 can be crossed is absorbed or is all absorbed, and enables to the propagation across the optical signal for crossing unthreaded hole 1521 Direction is almost overlapped with the extending direction for the center line for crossing unthreaded hole 1521.The distribution mode for crossing unthreaded hole 1521 can be with photosensitive unit 311 distribution mode is identical, is aligned so that each photosensitive unit 311 crosses unthreaded hole 1521 with one.

Figure 19 to Figure 21 is please referred to, collimation layer 32 is arranged in the second substrate 15.Collimating layer 32 includes multiple collimation units 321, collimation unit 321 offers light hole 3211, and light hole 3211 is directed at photosensitive unit 311.Specifically, light hole 3211 is gone back It can be aligned with unthreaded hole 1521 is crossed, that is, the center line of light hole 3211 can be overlapped with the center line for crossing unthreaded hole 1521, optical signal After light hole 3211, unthreaded hole 1521 was then passed through to reach photosensitive unit 311.The material of collimation unit 321 can be with screening The material of light part 152 is identical, such as collimation unit 321 is made with shading piece 152 of light absorbent, and it is single that optical signal reaches collimation When the entity part of member 321, optical signal can be partially absorbed or all absorb, for example, optical signal reaches the side of collimation unit 321 When wall or optical signal reach the inner wall of light hole 3211, optical signal is collimated unit 321 and absorbs so that the direction of propagation with The optical signal that the extending direction of the center line of light hole 3211 is overlapped is obtained through light hole 3211 and reaches photosensitive unit 311, Realize that the collimation to optical signal, the interference optical signal that photosensitive unit 311 receives are less.Multiple collimation units 321 are in the second base Orthographic projection on plate 15 can be located in shading piece 152, so that collimation unit 321 will not block display unit 151, guarantee aobvious Showing device 100 has preferable display effect.The extending direction of light hole 3211 can be perpendicular to display surface 71, so that light passing Hole 3211 is only capable of the optical signal vertical with display surface 71 by the direction of propagation, and in other words, light hole 3211 is only capable of by from display The optical signal propagated vertically downward on face 71.The cross-sectional width of light hole 3211 and the ratio of the depth of light hole 3211 are less than 0.2, wherein the depth of light hole 3211 can be light hole 3211 along the depth of centerline direction, the section of light hole 3211 Width can be the maximum across size of the figure that light hole 3211 is cut by the plane perpendicular to center line, and ratio specifically can be with It is the numerical value such as 0.1,0.111,0.125,0.19,0.2, so that collimation unit 321 is preferable to the collimating effect of optical signal.One In a example, collimation layer 32 further includes matrix 322, and matrix 322 can be basic light transmission, and collimation unit 321 is formed in matrix On 322.In another example, collimation layer 32 can only include collimation unit 321, collimation unit 321 can by plated film, splash It the modes such as penetrates to be formed in the second substrate 15.

For the setting of second polarizing layer 16 on collimation layer 32, the second polarizing layer 16 specifically can be polarizing film or polarizing coating.

Please continue to refer to Figure 19 and Figure 20, cover board 70 is arranged on the second polarizing layer 16.Cover board 70 can be by glass, Lan Bao The materials such as stone are made.Cover board 70 includes display surface 71 and the cover board back side 73.The optical signal that display device 100 issues passes through display surface Enter the external world after 71, extraneous light enters display device 100 after passing through display surface 71.It the cover board back side 73 can be with the second polarisation Layer 16 is bonded.In some examples, display device 100 can not also include cover board 70, and display surface 71 is formed in second partially at this time On photosphere 16.

Display surface 71 is formed with display area 711, and display area 711 refers to the region for being displayed for image, viewing area Domain 711 can be in the shapes such as the rectangle of rectangle, circle, round rectangle, band " fringe ", and this is not restricted.In addition, in some examples In son, display surface 71 also could be formed with non-display area, and non-display area can be formed in the peripheral position of display area 711, non- Viewing area can be used for being attached with casing 200.On display surface 71 accounting of display area 711 can for 80%, 90%, Any numbers such as 100%.

In the embodiment of the present application, multiple photosensitive units 311 are located in display area 711 in the orthographic projection of display surface 71. So that multiple photosensitive units 311 can be imaged the object touched in display area 711, user is touched using finger For the example for touching display area 711, multiple photosensitive units 311 can be to the fingerprint for touching the finger on display area 711 It is imaged, and is used for fingerprint recognition.

Figure 19 and Figure 20 is please referred to, will be described by way the detail that display device 100 is imaged: display device below The 100 optical signal La issued sequentially pass through the first polarizing layer 12, first substrate 13, photosensitive layer 31, liquid crystal layer 14, the second substrate 15, enter the external world after collimating layer 32, the second polarizing layer 16, touch module 60, cover board 70, extraneous optical signal may also successively be worn Photosensitive layer 31 is reached after crossing cover board 70, touch module 60, the second polarizing layer 16, collimation layer 32, the second substrate 15, liquid crystal layer 14. If optical signal reaches exactly on the photosensitive unit 311 in photosensitive layer 31, photosensitive unit 311 can generate electric signal to reflect this The intensity of optical signal.As a result, by the intensity of the electric signal of multiple photosensitive units 311, can reflect into display device 100 The strength distribution of optical signal.

By user by taking finger touches display surface 71 as an example.When display device 100 is sending out optical signal La, finger touching The predetermined position of display surface 71 is touched, finger can carry out optical signal La to reflect to form L1, and optical signal L1 then begins to enter display Device 100, optical signal L1 initially passes through cover board 70, touch module 60 and the second polarizing layer 16, for the direction of propagation and light hole 3211 and cross unthreaded hole 1521 extending direction identical optical signal L1, optical signal L1 can also pass through light hole 3211 and cross unthreaded hole After 1521, optical signal L1 pass through light hole 3211 and cross unthreaded hole 1521, optical signal L1 reaches photosensitive list after being then passed through liquid crystal layer 14 Member 311.For the different optical signal of extending direction of the direction of propagation and light hole 3211 or unthreaded hole 1521 excessively, optical signal is passed through After cover board 70, touch module 60 and the second polarizing layer 16, optical signal can not pass through light hole 3211 or mistake unthreaded hole 1521, Jin Erwu Method reaches the photosensitive unit 311 being aligned with light hole 3211 and excessively unthreaded hole 1521.

It is appreciated that there are wave crests and trough for finger print, and when finger 2000 touches display surface 71, wave crest and display surface 71 Directly contacting, there are gaps between trough and display surface 71, after optical signal La reaches wave crest and trough, the optical signal of peak reflection The intensity for the optical signal (calling the second optical signal in the following text) that the intensity of (calling the first optical signal in the following text) is reflected with trough has differences, and then makes The electric signal (calling the first electric signal in the following text) generated due to receiving the first optical signal is obtained to generate with due to receiving the second optical signal The intensity of electric signal (calling the second electric signal in the following text) have differences, imager chip 300 is according to the first electric signal and the second electric signal Distribution situation, available fingerprint image.The fingerprint image can be further used for carrying out fingerprint recognition.User is arbitrarily setting It is equipped with above the fingerprint identification region 712 of photosensitive unit 311 and is touched, can reach and fingerprint is imaged and is identified Purpose.

Figure 22 and Figure 25 is please referred to, in some embodiments, photosensitive unit 311 includes veiling glare photosensitive unit 3111.Lid Ink layer 82 is provided on the cover board back side 73 of plate 70, veiling glare photosensitive unit 3111 is corresponding with the position of ink layer 82, ink layer 82 penetrate the optical signal Lb of cover board 70 for obstructing from the external world.In actual use, the optical signal portion issued from backlight layer 11 It point is directly pierced by from display surface 71, can partially carry out one or many reflections between display surface 71 and backlight layer 11, and portion Point reflected optical signal L2 may reach photosensitive unit 311 and interfere to the imaging of display device 100.That is, being used for It further include interference optical signal L2 in the imaging optical signal of imaging, interference optical signal L2 is reflected by display device 100 and reached photosensitive Photosensitive unit 311 on layer 31.

Position corresponding with veiling glare photosensitive unit 3111 is provided with ink layer 82, display device on the above-mentioned cover board back side 73 Light in 100 is largely absorbed by ink layer 82 after reaching the ink layer 82, and fraction (such as 4%) is anti-by ink layer 82 It penetrates, cover board 70 can be simulated to the reflex of the optical signal inside display device 100, in addition, veiling glare by the ink layer 82 Photosensitive unit 3111 is also possible to that the interference from the side of veiling glare photosensitive unit 3111 to arrival veiling glare photosensitive unit 3111 can be received Optical signal L2.In general, veiling glare photosensitive unit 3111 can receive the interference optical signal same with remaining photosensitive unit 311 L2, and simultaneously, ink layer 82 can obstruct the optical signal Lb that (reflection or absorption) penetrates cover board 70 from the external world, so that the photosensitive list of veiling glare Member 3111 only receives interference optical signal L2, remaining photosensitive unit 311 can then receive simultaneously interferes optical signal L2, and from The external world penetrates the optical signal Lb of cover board 70.The type and performance of veiling glare photosensitive unit 3111 and remaining photosensitive unit 311 are all the same, Veiling glare photosensitive unit 3111 is by the interference electric signal transmission generated by interference optical signal L2 to imager chip 300, imager chip 300 Image will be corrected according to the interference electric signal in imaging, such as subtracted the imaging electric signal that optical signal generates is imaged Image recognition is improved to obtain the higher image of accuracy as the target electric signal eventually for imaging after interference electric signal Accuracy rate.

In one example, the position by proximal edge at the cover board back side 73, veiling glare photosensitive unit is arranged in ink layer 82 3111 are located at the marginal position of photosensitive layer 31.Such as veiling glare photosensitive unit 3111 is set, wherein a in the region a as shown in figure 22 Region is located on a column of the leftmost side of 311 array of photosensitive unit of Figure 22 and a column of the rightmost side.Avoid ink layer 82 to aobvious The display effect of showing device 100 causes too much influence.Specifically, photosensitive unit 311 can arrange in the matrix of multiple lines and multiple rows, The marginal position in the matrix can be set in veiling glare photosensitive unit 3111, such as arranges close to the one of matrix edge to three column, close A line of matrix edge is to three rows, to adapt to the position of ink layer 82.

Further, since veiling glare photosensitive unit 3111 has multiple, multiple interference electric signals, Duo Gegan can correspondingly be generated Disturb electric signal size may it is inconsistent, then, will be imaged electric signal subtract interfere electric signal when, in one example, can To be averaged to multiple interference electric signals, then will be imaged electric signal subtract be averaged after obtained interference electric signal.At another In example, subregion can be carried out respectively to photosensitive unit 311 and veiling glare photosensitive unit 3111, each region includes at least one sense Light unit 311 or including at least one veiling glare photosensitive unit 3111.It then, can be according to each comprising photosensitive unit 311 The position in the position in region (calling first area in the following text) and each region (calling second area in the following text) comprising veiling glare photosensitive unit 3111 It sets to determine with each first area at a distance of nearest second area.For each of each first area photosensitive unit 311, the imaging electric signal that each photosensitive unit 311 can be generated is subtracted with the first area at a distance of nearest second area In veiling glare photosensitive unit 3111 generate interference electric signal to obtain each photosensitive unit 311 eventually for the telecommunications of imaging Number, if in second area veiling glare photosensitive unit 3111 number be it is multiple, can be first to multiple miscellaneous in the second area Multiple interference electric signals that light sensation light unit 3111 generates take mean value, then will imaging electric signal subtract the mean value obtain eventually for The electric signal of imaging.It is appreciated that veiling glare photosensitive unit 3111 is with photosensitive unit 311 at a distance of closer, veiling glare photosensitive unit 3111 The amount of the interference optical signal received with photosensitive unit 311 is also more close, and the interference electric signal of generation is also more close, will be at As electric signal subtract interference electric signal after finally obtain for imaging electric signal it is also more accurate.

Figure 22 and Figure 26 is please referred to, in some embodiments, photosensitive unit 311 includes noise photosensitive unit 3112, is shown Showing device 100 further includes lightproof unit 323, and lightproof unit 323 is arranged on collimation unit 321, and lightproof unit 323 is for blocking The light hole 3211 being aligned with noise photosensitive unit 3112.In use, the temperature meeting of the temperature of photosensitive unit 311 or environment It changes, and as temperature changes, the performance of photosensitive unit 311 may change, for example, photosensitive unit 311 It can be made of amorphous silicon (A-Si) material, in temperature change, the bottom that photosensitive unit 311 generates makes an uproar and can also change.Cause This needs to interfere being corrected caused by temperature change when being imaged.

In present embodiment, the type and performance of noise photosensitive unit 3112 and remaining photosensitive unit 311 are all the same, shading Unit 323 blocks light hole 3211, so that noise photosensitive unit 3112 does not almost receive optical signal.Noise photosensitive unit 3112 Electric signal can be generated in use, but since noise photosensitive unit 3112 does not almost receive optical signal, noise sense The electric signal that light unit 3112 generates can be considered the noise electric signal generated by material and temperature change.At this point, remaining is felt Light unit 311 can then generate noise electric signal simultaneously, and receive imaging optical signal to generate imaging electric signal.Noise is photosensitive For unit 3112 by noise electric signal transmission to imager chip 300, imager chip 300 will be according to the noise electric signal pair in imaging Image is corrected, such as will be imaged after the imaging electric signal that optical signal generates subtracts noise electric signal and be used as eventually for imaging Electric signal improve the accuracy rate of image recognition to obtain the higher image of accuracy.

Specifically, lightproof unit 323 can also be made of light absorbent, and lightproof unit 323 can be filled in light hole In 3211, lightproof unit 323 can be fabricated together with collimation unit 321.In one example, lightproof unit 323 can also To be set up directly on noise photosensitive unit 3112, so that noise photosensitive unit 3112 is received entirely less than optical signal.Noise Photosensitive unit 3112 can be set in the region by proximal edge of 311 array of photosensitive unit, and noise photosensitive unit 3112 can also be with The region adjacent with veiling glare photosensitive unit 3111 is set, such as can be located in matrix one arranges to three column, or is located at square For a line in battle array to three rows, this is not restricted, noise photosensitive unit 3112 is arranged in the region b shown in Figure 22, wherein the area b Domain is located at the secondary series from left to right of 311 array of photosensitive unit of Figure 22 and from right to left on secondary series.

Further, since noise photosensitive unit 3112 has multiple, multiple noise electric signals can be correspondingly generated, it is multiple to make an uproar The size of acoustoelectric signal may be inconsistent, then, it, in one example, can when that electric signal will be imaged and subtract noise electric signal To be averaged to multiple noise electric signals, then will be imaged electric signal subtract be averaged after obtained noise electric signal.At another In example, subregion can be carried out respectively to photosensitive unit 311 and noise photosensitive unit 3112, each region includes at least one sense Light unit 311 or including at least one noise photosensitive unit 3112.It then, can be according to each comprising photosensitive unit 311 The position in the position in region (calling first area in the following text) and each region (calling third region in the following text) comprising noise photosensitive unit 3112 It sets to determine with each first area at a distance of nearest third region.For each of each first area photosensitive unit 311, the imaging electric signal that each photosensitive unit 311 can be generated is subtracted with the first area at a distance of nearest third region In noise photosensitive unit 3112 generate noise electric signal to obtain each photosensitive unit 311 eventually for the telecommunications of imaging Number, if in third region the number of noise photosensitive unit 3112 be it is multiple, can first make an uproar to multiple in the third region Multiple noise electric signals that phonoreception light unit 3112 generates take mean value, then will imaging electric signal subtract the mean value obtain eventually for The electric signal of imaging.It is appreciated that noise photosensitive unit 3112 is with photosensitive unit 311 at a distance of closer, noise photosensitive unit 3112 Also more close with the temperature of photosensitive unit 311, the noise electric signal of generation is also more close, subtracts noise electric signal will be imaged The electric signal for imaging finally obtained after electric signal is also more accurate.

Figure 22 is please referred to, in some embodiments, circuit unit 312 includes photosensitive circuit unit 3121 and Noise Circuits Unit 3122, photosensitive circuit unit 3121 are connect with photosensitive unit 311, and photosensitive unit is not connected on Noise Circuits unit 3122 311.For photosensitive circuit itself there are hardware noise, which will lead to circuit noise signal, and circuit noise signal will affect Therefore the intensity for the electric signal for being finally transferred to imager chip 300 when being imaged, needs to cause circuit noise signal Interference be corrected.In present embodiment, photosensitive unit 311, Noise Circuits unit are not connected on Noise Circuits unit 3122 The circuit noise signal generated on 3122 is the hardware noise for Noise Circuits unit 3122 itself.Noise Circuits unit The circuit noise signal is transmitted to imager chip 300 by 3122, and imager chip 300 will be according to the circuit noise signal in imaging Image is corrected, for example, will be imaged the imaging electric signal that optical signal generates subtract after circuit noise signal as eventually for The electric signal of imaging improves the accuracy rate of image recognition to obtain the higher image of accuracy.

Specifically, multiple circuit units 312 can be in the array arrangement of multiple lines and multiple rows, and Noise Circuits unit 3122 is at least arranged Complete a line and a complete column are arranged into, so that Noise Circuits unit 3122 has point in any a line and any one column Cloth, Noise Circuits unit 3122 generate circuit noise signal sample more comprehensively, according to the circuit noise signal to image into The effect of row timing, correction is more preferable.The array lined up in multiple circuit units 312 also can be set in Noise Circuits unit 3122 Marginal position, or be arranged close to above-mentioned veiling glare photosensitive unit 3111 and noise photosensitive unit 3112.Noise Circuits unit 3122 distribution can cover complete one and arrange to five column, and the complete a line of covering, to the five-element, this is not restricted.Such as In example shown in Figure 22, Noise Circuits unit 3122 is set, wherein the region c is located at the electricity of Figure 22 in the region c of photosensitive layer 31 In the column of third from left to right of 312 array of road unit, from right to left third column, a line of top side and a line of lower side.

Further, since Noise Circuits unit 3122 has multiple, multiple circuit noise signals can be correspondingly generated, it is multiple The size of circuit noise signal may be inconsistent, then, when that electric signal will be imaged and subtract circuit noise signal, in an example In, multiple circuit noise signals can be averaged, then will be imaged electric signal subtract be averaged after obtained circuit noise signal. In another example, subregion can be carried out respectively to photosensitive unit 311 and Noise Circuits unit 3122, each region includes extremely Lack a photosensitive unit 311 or including at least one Noise Circuits unit 3122.It then, can be according to each comprising photosensitive list The position in the region (calling first area in the following text) of member 311 and each region comprising Noise Circuits unit 3122 (call the 4th area in the following text Domain) position determine with each first area at a distance of nearest the fourth region.Each of each first area is felt Light unit 311, the imaging electric signal that each photosensitive unit 311 can be generated are subtracted with the first area at a distance of nearest The circuit noise signal that Noise Circuits unit 3122 in four regions generates with obtain each photosensitive unit 311 eventually at The electric signal of picture, if in the fourth region Noise Circuits unit 3122 number be it is multiple, can be first in the fourth region Multiple circuit noise signals for generating of multiple Noise Circuits units 3122 take mean value, then imaging electric signal subtracted this be worth To the electric signal eventually for imaging.

Figure 22 is please referred to, in some embodiments, photosensitive unit 311 further includes multiple infrared photosensitive units 3113, red Outer photosensitive unit 3113 is for detecting infrared light.Due in external environment there are infrared light, and infrared light may penetrate it is certain Object enters display device 100.For example, infrared light may penetrate user finger, pass through display surface 71, light hole 3211 and It crosses unthreaded hole 1521 and is received by photosensitive unit 311, and the part infrared light and the fingerprint of user be not relevant, the part is red The infrared electric signal that outer light (infrared signal) generates interferes when imager chip 300 can be imaged.Therefore, it is carrying out When imaging, need to interfere being corrected caused by infrared signal.

Infrared photosensitive unit 3113 can only receive infrared signal, and generate infrared electric signal according to infrared signal, Remaining photosensitive unit 311 can receive infrared signal and visible light signal simultaneously, and produce according to infrared signal and visible light signal It generates as electric signal.Infrared electric signal is further transmitted to imager chip 300, and imager chip 300 will be red according to this in imaging Outer electric signal is corrected image, such as will be imaged after the imaging electric signal that optical signal generates subtracts infrared electric signal and be used as most The electric signal for imaging improves the accuracy rate of image recognition to obtain the higher image of accuracy eventually.

Specifically, multiple infrared photosensitive units 3113 can be spaced apart, such as be evenly distributed on 311 array of photosensitive unit Interior, infrared photosensitive unit 3113 ratio shared in photosensitive unit 311 can be smaller, such as accounts for 1%, 7%, 10% etc..Please In conjunction with Figure 20, when user touches display surface 71, display device 100 can sense the position touched, imager chip 300 The infrared electric signal that the infrared photosensitive unit 3113 of one or more corresponding with the position touched generates is read, and red according to this Outer electric signal is corrected image.

Further, since infrared photosensitive unit 3113 has multiple, multiple infrared electric signals, Duo Gehong can correspondingly be generated The size of outer electric signal may be inconsistent, then, it, in one example, can when that electric signal will be imaged and subtract infrared electric signal To be averaged to multiple infrared electric signals, then will be imaged electric signal subtract be averaged after obtained infrared electric signal.At another In example, subregion can be carried out respectively to photosensitive unit 311 and infrared photosensitive unit 3113, each region includes at least one sense Light unit 311 or including at least one infrared photosensitive unit 3113.It then, can be according to each comprising photosensitive unit 311 The position in region (calling first area in the following text) and each position in the region (calling the 5th region in the following text) comprising infrared photosensitive unit 3113 It sets to determine with each first area at a distance of the 5th nearest region.For each of each first area photosensitive unit 311, the imaging electric signal that each photosensitive unit 311 can be generated is subtracted with the first area at a distance of the 5th nearest region In infrared photosensitive unit 3113 generate infrared electric signal to obtain each photosensitive unit 311 eventually for the telecommunications of imaging Number, if in the 5th region infrared photosensitive unit 3113 number be it is multiple, can be first to multiple red in the 5th region Multiple infrared electric signals that outer photosensitive unit 3113 generates take mean value, then will imaging electric signal subtract the mean value obtain eventually for The electric signal of imaging.It is appreciated that infrared photosensitive unit 3113 is with photosensitive unit 311 at a distance of closer, infrared photosensitive unit 3113 Also more close with the amount for the infrared light of photosensitive unit 311 received, the infrared electric signal of generation is also more close, will be imaged It is also more accurate that electric signal subtracts the electric signal for imaging finally obtained after infrared electric signal.

Figure 22 is please referred to, the photosensitive list of veiling glare photosensitive unit 3111, noise can also be set simultaneously on the same photosensitive layer 31 It is any one or more in member 3112, Noise Circuits unit 3122 and infrared photosensitive unit 3113.

Figure 23 is please referred to, in some embodiments, multiple display driver element 1a1 are in the array arrangement of multiple lines and multiple rows, Multiple photosensitive units 311 be in multiple lines and multiple rows array arrangement, positioned at the display driver element 1a1 of same a line or same row with it is photosensitive The effective time of unit 311 is interspersed.It specifically, can the first manufacture display drive on first substrate 13 in production Then dynamic layer 1a manufactures photosensitive layer 31 on display driving layer 1a again.Display driver element 1a1 is set with the interval of photosensitive unit 311 It sets.In an array, multiple photosensitive unit 311 and multiple display driver element 1a1 may are located at same a line or same row simultaneously, Display driver element 1a1 and the effective time of photosensitive unit 311 positioned at same a line or same row are interspersed.Such as Figure 23 Shown in example, multiple display driver element 1a1 of bottom a line are worked at the same time in Figure 23, and bottom a line Multiple photosensitive units 311 work at the same time, and the work of the working time of multiple display driver element 1a1 and multiple photosensitive units 311 Making the time does not intersect, and reduces the interference for the display driver element 1a1 that photosensitive unit 311 is subject at work, improves the standard of imaging True property.In some embodiments, sensitive chip 300 and driving chip can by flip chip technology (Chip On Film, COF) be arranged on the same flexible circuit board, flexible circuit board again bonding (bonding) to display driving layer 1a pin with On the pin of photosensitive layer 31.And showing that the pin of driving layer 1a can be set to a row, the pin of photosensitive layer 31 can be set to Another row, flexible circuit board and two rows of pins bonding simultaneously.

Figure 27 and Figure 28 are please referred to, in another example, fingerprint recognition mould group 20 is capacitive fingerprint mould group.Capacitive fingerprint Mould group is integrated in display device 100.Specifically, display device 100 include cover board 70, capacitive fingerprint sensing device diaphragm 40, Display module 10 and colloid 50.Display module 10, capacitive fingerprint sensing device diaphragm 40 and cover board 70 go out along display device 100 Light direction (namely light direction of display module 10) setting.

Cover board 70 is for protecting capacitive fingerprint sensing device diaphragm 40.The material of cover board 70 can be sapphire (Sapphire), glass, Kapton (Polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET) or composite plate in any one.Composite plate includes polymethyl methacrylate (Polymethyl Methacrylate, PMMA) and polyamide (Polycarbonate, PC).When the material of cover board 70 is sapphire, lid The thickness of plate 70 can be 0.2mm~0.5mm, high with hardness, intensity is high, sand paper falls that effect is good (to bear on cement floor 1.2m height is fallen), scratch resistance the advantages that.When the material of cover board 70 is PI or PET, the thickness of cover board 70 can for 0.1mm~ 0.3mm, cover board 70 are flexible cover plate, and when having many advantages, such as that sand paper falls the material of the good cover board 70 of effect as composite plate, cover board 70 with a thickness of 0.1mm~0.4mm, cover board 70 has many advantages, such as scratch resistance, good toughness.Cover board 70 includes opposite cover board light-emitting surface 72 and the cover board back side 73.The cover board back side 73 and capacitive fingerprint sensing device diaphragm 40 are opposite.Figure 29 is please referred to, on the cover board back side 73 It may be provided with ink layer 87.Ink layer 13 has higher attenuation rate to visible light, such as can reach 70% or more, so that user exists In normal use, it is visually difficult to see that the region covered in electronic equipment 1000 by ink.The thickness of ink layer 87 is less than or waits In 0.2mm.The thickness of ink layer 87 is less than or equal to 0.2mm, so that the thinner thickness of display device 100, is also beneficial to reduce The thickness of electronic equipment 1000.

Capacitive fingerprint sensing device diaphragm 40 is between cover board 70 and display module 10 and covers the aobvious of display module 10 Show face 71, to incude the user fingerprints touched to cover board 70.Capacitive fingerprint sensing device diaphragm 40 can be arranged by colloid 50 On cover board 70, it is specifically located at the side at the cover board back side 73.Capacitive fingerprint sensing device diaphragm 40 includes that opposite sensor goes out Smooth surface 41 and the sensor back side 42.Sensor light-emitting surface 41 and cover board 70 are opposite (specifically opposite with the cover board back side 73), sensor The back side 42 and display module 10 are opposite.Capacitive fingerprint sensing device diaphragm 40 can partly or entirely cover entire display surface 71, with Preferably realize full frame fingerprint identification function.Capacitive fingerprint sensing device diaphragm 40 with a thickness of 0.3mm or so.Capacitance type fingerprint The material (namely material of following sensor base plate 48) of sensor diaphragm 40 is glass or PI.Capacitive fingerprint sensing device film The route material (material of i.e. following sensor line layer 49) of piece 40 includes metal, tin indium oxide (Indium tin Oxide, ITO) or nanometer silver paste in any one.The material and capacitance type fingerprint of capacitive fingerprint sensing device diaphragm 40 pass The route material of sensor diaphragm 40 can carry out any collocation.

Please refer to Figure 30, capacitive fingerprint sensing device diaphragm 40 may include that element sensor 43, sensor board 44, pixel are put Big device 45, outlet line 46 and power supply 47.Element sensor 43 is arranged on sensor board 44.Element sensor 43 is in array point Cloth.For example, inside a capacitive fingerprint sensing device diaphragm 40, it may include the element sensor 43 of 100*100, i.e., 10000 A miniature element sensor 43.The side of sensor board 44, pixel amplifier 45 and output line is arranged in element sensor 43 The other side of sensor board 44 is arranged in road 46.Pixel amplifier 45 is used to amplify the signal of element sensor 43, and by defeated Route 46 exports out.Outlet line 46 may include a plurality of, the corresponding pixel amplifier 45 of each element sensor 43, and corresponding One outlet line 46.Power supply 47 is connect with sensor board 44, for applying voltage to form electric field.Power supply 47 can be set On sensor board 44, it can also be not arranged on sensor board 44.When power supply 47 can be set on sensor board 44, power supply 47 can be mounted on sensor board 44 by welding manner or laminating type.Capacitive fingerprint sensing device diaphragm 40 can also include Semiconductor substrate (not shown), at this point, semiconductor substrate and sensor board 44 are opposite, semiconductor substrate is arranged in sensor board 44 The other side, pixel amplifier 45 and outlet line 46 are respectively provided on a semiconductor substrate.Sensor board 44 is provided with pixel The side of sensor 43 is as sensor light-emitting surface 41, and the side where semiconductor substrate is as the sensor back side 42.

When electronic equipment 1000 is used for fingerprint recognition, the finger of user is pressed by cover board 70 to be sensed in capacitance type fingerprint On device diaphragm 40, element sensor 43 constitutes a pole plate of capacitor, and finger skin constitutes another pole plate of capacitor.Due to hand Referring to that there are wave crests and trough on surface, wave crest and trough are different from the distance between corresponding element sensor 43, therefore formed Capacitance size is also different, can obtain corresponding fingerprint image according to the size of the capacitance.

Capacitive fingerprint sensing device diaphragm 40 is applied not only to realize fingerprint identification function, is also used as display module 10 Touch module 60 (shown in Figure 19) realizes touch function.In other words, display module 10 is led to without in addition setting touch module 60 Crossing capacitive fingerprint sensing device diaphragm 40 can be realized fingerprint recognition and touch-control dual function, the structure of display device 100 is simple, Thinner thickness, integrated level are high, cost is relatively low, translucency is also more preferable, moreover it is possible to reduce the connection terminal of display device 100 quantity, Volume and design difficulty.The fingerprint identification function and touch function of capacitive fingerprint sensing device diaphragm 40 can be with time-sharing multiplexes.When When capacitive fingerprint sensing device diaphragm 40 is for realizing fingerprint identification function, capacitive fingerprint sensing device diaphragm 40 is not used in realization Touch function；When capacitive fingerprint sensing device diaphragm 40 is for realizing touch function, capacitive fingerprint sensing device diaphragm 40 is not For realizing fingerprint identification function.Please refer to Figure 27, display device 100 may also include sensor chip 201, and (processor 300 is When multiple, sensor 201 is one of processor 300), sensor chip 201 and capacitive fingerprint sensing device diaphragm 40 connect It connects.Sensor chip 201 is used to read capacitive fingerprint sensing device diaphragm 40 and detects obtained capacitance, then according to the capacitor Value forms fingerprint image and carries out fingerprint recognition, to realize fingerprint identification function.Alternatively, sensor chip 201 is for reading Capacitive fingerprint sensing device diaphragm 40 detects obtained capacitance, then judges touch point coordinate, pressing rail according to the capacitance Mark etc., to realize touch function.

Figure 28 is please referred to, display module 10 is arranged on capacitive fingerprint sensing device diaphragm 40 by colloid 50, is specifically set Set the side at the sensor back side 42.Display module 10 includes opposite display device front 102 and the display device back side 103. Display device front 102 is opposite (specifically opposite with the sensor back side 42) with capacitive fingerprint sensing device diaphragm 40.Display module 10 can be hard screen or flexible screen.Preferably, when display module 10 is hard screen, the material of capacitive fingerprint sensing device diaphragm 40 For glass, cost is relatively low；The route material of capacitive fingerprint sensing device diaphragm 40 includes appointing in metal, ITO or nanometer silver paste It anticipates one kind.When display module 10 is flexible screen, the material of capacitive fingerprint sensing device diaphragm 40 is PI, to form flexible sensing Device；The route material of capacitive fingerprint sensing device diaphragm 40 includes ITO or nanometer silver paste, to form flexible circuitry.Display module 10 can be LCM display screen or Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen.

Colloid 50 is for bonding cover board 70, capacitive fingerprint sensing device diaphragm 40 and display module 10.It is viscous using colloid 50 Closing lid plate 70, full frame capacitive fingerprint sensor 20 and display screen 30, it is ensured that the structural strength and fingerprint of display component 100 are known The reliability of other performance.Colloid 50 can be optical cement, specially OCA (Optically Clear Adhesive), polyethylene Any one in butyral film (PolyVinyl Butyral Film, PVB) or DAF (Die attach film).

Figure 28 is please referred to, in one embodiment, colloid 50 includes the first optical cement 51 and the second optical cement 52.First light Glue 51 is learned for bonding cover board 70 and capacitive fingerprint sensing device diaphragm 40, specific adhesive cover back 73 and sensor light-emitting surface 41.Second optical cement 52 is specific to bond the sensor back side for bonding capacitive fingerprint sensing device diaphragm 40 and display module 10 42 with display device front 102.In the present embodiment, along the opposite direction of the light direction of display device 100, cover board 70, the first light It learns glue 51, capacitive fingerprint sensing device diaphragm 40, the second optical cement 52 and display module 10 and stacks gradually setting.

Full laminating type bonding cover board 70 and capacitive fingerprint sensing device diaphragm 40 can be used in first optical cement 51.Specifically Ground is pasted cover board 70 and capacitive fingerprint sensing device diaphragm 40 together in seamless mode, the first optical cement 51 completely Apply the whole face of cover plate 70 or the whole face of capacitive fingerprint sensing device diaphragm 40, cover board 70 and capacitive fingerprint sensing device diaphragm 40 Between be not present air layer.Using full laminating type bonding cover board 70 and capacitive fingerprint sensing device diaphragm 40, so that cover board 70 Bonded between capacitive fingerprint sensing device diaphragm 40 more secured, capacitive fingerprint sensing device diaphragm 40 is relative to cover board 70 Position will not be conducive to improve the progress fingerprint knowledge of capacitive fingerprint sensing device diaphragm 40 with using the increase of time to shift Other reliability enters between cover board 70 and capacitive fingerprint sensing device diaphragm 40 alternatively, it is also possible to reduce dust, moisture etc. Probability.First optical cement 51 may include any one in OCA, PVB or DAF.When the first optical cement 51 is OCA, the first light It is softer to learn glue 51, fitting processing technology is simple, and when the pressing of the finger of user is on cover board 70, the first optical cement 51 can be right Cover board 70 and capacitive fingerprint sensing device diaphragm 40 play certain buffer function.When the first optical cement 51 is PVB, the first light The bonding effect for learning glue 51 is stronger, advantageously ensures that the stabilization of structure between cover board 70 and capacitive fingerprint sensing device diaphragm 40 Property.When the first optical cement 51 is DAF, it is possible to reduce the air bubble problem generated during fitting is conducive to improve binding yield, And the flatness between raising cover board 70 and capacitive fingerprint sensing device diaphragm 40.When the first optical cement 51 be OCA, PVB or When DAF, the thickness of the first optical cement 51 is 0.05mm~0.15mm.

Full laminating type can be used in second optical cement 52 or frame patch mode bonds capacitive fingerprint sensing device diaphragm 40 and shows Show mould group 10.

It is with display module 10 using full laminating type bonding capacitive fingerprint sensing device diaphragm 40: by capacitance type fingerprint Sensor diaphragm 40 and display module 10 are pasted together completely in seamless mode, and the second optical cement 52 coating condenser type refers to The whole face of line sensor diaphragm 40 or the whole face of display module 10, between capacitive fingerprint sensing device diaphragm 40 and display module 10 There is no air layers.Using full laminating type bonding capacitive fingerprint sensing device diaphragm 40 and display module 10, so that condenser type Bond more secured between fingerprint sensor diaphragm 40 and display module 10, display module 10 is relative to capacitive fingerprint sensing device The position of diaphragm 40 will not be conducive to improve display area and fingerprint identification region with using the increase of time to shift Consistency enters between capacitive fingerprint sensing device diaphragm 40 and display module 10 alternatively, it is also possible to reduce dust, moisture etc. Probability.

Figure 31 is please referred to, bonding capacitive fingerprint sensing device diaphragm 40 with display module 10 using frame patch mode is: will The frame portion or marginal portion of capacitive fingerprint sensing device diaphragm 40 and display module 10 are pasted together, the second optical cement 52 Coat the surrounding of capacitive fingerprint sensing device diaphragm 40 or the surrounding (week makes a circle) of display module 10, capacitive fingerprint sensing device Air layer may be present between diaphragm 40 and display module 10.Certainly, certain transparent materials (such as PET, PET cost ratio can also be used Optical cement is lower) air layer is filled, so that structure is more stable, and reduce dust, moisture etc. into capacitance type fingerprint Probability between sensor diaphragm 40 and display module 10.Capacitive fingerprint sensing device diaphragm 40 is bonded using frame patch mode and is shown Show mould group 10, so that the usable floor area of the second optical cement 52 is smaller, is conducive to save cost, and binding yield is higher.In addition, working as When capacitive fingerprint sensing device diaphragm 40 is damaged, can easily by capacitive fingerprint sensing device diaphragm 40 from display mould It is disassembled in group 10, carries out the replacement of capacitive fingerprint sensing device diaphragm 40, without by capacitive fingerprint sensing device diaphragm 40 and display module 10 all replaced；Alternatively, when display module 10 is damaged, it can be easily by display module 10 It is disassembled from capacitive fingerprint sensing device diaphragm 40, carries out the replacement of display module 10, without by 10 He of display module Capacitive fingerprint sensing device diaphragm 40 is all replaced.

Second optical cement 52 may include any one in OCA, PVB or DAF.When the second optical cement 52 is OCA, the Two optical cements 52 are softer, and fitting processing technology is simple, and when the pressing of the finger of user is on cover board 70,52 energy of the second optical cement It is enough that certain buffer function is played to capacitive fingerprint sensing device diaphragm 40 and display module 10.When the second optical cement 52 is PVB When, the bonding effect of the second optical cement 52 is stronger, advantageously ensure that capacitive fingerprint sensing device diaphragm 40 and display module 10 it Between structure stability.When the second optical cement 52 is DAF, it is possible to reduce the air bubble problem generated during fitting is conducive to Binding yield is improved, and improves the flatness between capacitive fingerprint sensing device diaphragm 40 and display module 10.When the second light When glue 52 is OCA, PVB or DAF, the thickness of the second optical cement 52 is 0.05mm~0.15mm.

Figure 32 is please referred to, display device 100 can also include strengthening course 83, and strengthening course 83 is located at capacitive fingerprint sensing device Between diaphragm 40 and display module 10, it is particularly located between the sensor back side 42 and display surface 71.Strengthening course 83 includes opposite Reinforcement light-emitting surface 831 and the reinforcement back side 832.Reinforcement light-emitting surface 831 and the sensor back side 42 are opposite, the reinforcement back side 832 and display Device front 102 is opposite.Strengthening course 83 and cover board 70 form double-layer cover plate structure.Strengthening course 83 can be in the thickness of cover board 70 In the case where having 0.3mm or thinner, reinforce the intensity of whole display device 100, reduces the electronic equipment in subsequent use process 1000 due to being impacted or being hit the probability for causing capacitive fingerprint sensing device diaphragm 40 to fail.The material of strengthening course 83 can be with For any one in sapphire, glass, PI, PET or composite plate.Strengthening course 83 with a thickness of 0.1mm~0.5mm.

When display device 100 includes strengthening course 83, colloid 50 is for bonding cover board 70, capacitive fingerprint sensing device diaphragm 40, strengthening course 83 and display module 10.Figure 32 is please referred to, in one embodiment, colloid 50 includes the first optical cement 51, third Optical cement 53 and the 4th optical cement 54.First optical cement 51 has for bonding cover board 70 and capacitive fingerprint sensing device diaphragm 40 Body adhesive cover back 73 and sensor light-emitting surface 41.Third optical cement 53 for bond capacitive fingerprint sensing device diaphragm 40 with Strengthening course 83, it is specific to bond the sensor back side 42 and reinforcement light-emitting surface 831.4th optical cement 54 is for bonding reinforcement layer 83 and shows Show mould group 10, the specific bonding reinforcement back side 832 and display device front 102.In the present embodiment, along going out for display device 100 The opposite direction of light direction, cover board 70, the first optical cement 51, capacitive fingerprint sensing device diaphragm 40, third optical cement 53, strengthening course 83, the 4th optical cement 54 and display module 10 stack gradually setting, i.e., original second optical cement 52 is by 53 He of third optical cement 4th optical cement 54 replaces, and increases the strengthening course being arranged between capacitive fingerprint sensing device diaphragm 40 and display module 10 83.Full laminating type can be used in third optical cement 53 or frame patch mode bonds capacitive fingerprint sensing device diaphragm 40 and strengthening course 83, full laminating type or frame patch mode bonding reinforcement layer 83 and display module 10 can be used in the 4th optical cement 54.Third optical cement 53 and the 4th optical cement 54 may each comprise any one in OCA, PVB or DAF.When third optical cement 53 and the 4th optical cement 54 thickness can be 0.05mm~0.15mm.

Figure 33 is please referred to, in some embodiments, display device 100 may also include polaroid 84.Polaroid 84 passes through Colloid 50 is arranged on cover board 70, is specifically located at the side at the cover board back side 73.Polaroid 84 is located at cover board 70 and refers to condenser type Between line sensor diaphragm 40, it is particularly located between the cover board back side 73 and sensor light-emitting surface 41.Polaroid 84 includes opposite Polarisation light-emitting surface 841 and the polarisation back side 842.Polarisation light-emitting surface 841 and the cover board back side 73 are opposite, the polarisation back side 842 and sensor Light-emitting surface 41 is opposite.The thickness of polaroid 84 can be 100 μm~150 μm.In cover board 70 and capacitive fingerprint sensing device diaphragm 40 Between add one layer of polaroid 84, can reduce ambient by cover board 70 and be incident to entering for capacitive fingerprint sensing device diaphragm 40 The brightness of light is penetrated, to reduce because metal grill walks display device caused by line reflection on capacitive fingerprint sensing device diaphragm 40 There is the heterochromatic phenomenon (khaki phenomenon is such as presented) of certain angle in 100 appearances.

Polaroid 84 can be rotatory polarization piece.Polaroid 84 include along display device 100 light direction be arranged protective film, Triafol T (Triacetyl Cellulose, TAC) functional membrane, polyvinyl alcohol (polyvinyl alcohol, PVA) Film, tabula rasa TAC film, pressure sensitive adhesive and release film.Wherein it is possible to which the surface to TAC functional membrane carries out some process, to reach To corresponding additional function.For example, non-glare treated (AG) can be carried out to the surface of TAC functional membrane, anti-dazzle+low reflection handles (AG+ LR), transparent hard+low reflection processing (CHC+LR), transparent hard processing (CHC), antireflection process (AR) etc..Different surfaces Processing mode can meet the different application demand of electronic equipment 1000.The application embodiment carries out the surface of TAC functional membrane Antireflection process, so that there is TAC functional membrane anti-reflective function (to be made the reflected light on former and later two surfaces of film using interference effect Mutually eliminate to reduce reflection), to reduce the reflected light of the generation of capacitive fingerprint sensing device diaphragm 40, to further mitigate aobvious Showing device 100 is under special angle since soil is presented caused by the reflection of metal grill route on capacitive fingerprint sensing device diaphragm 40 The phenomenon that yellow.

Since polaroid 84 can reduce the brightness of display module 10, polaroid original in display module 10 can be taken Disappear.Specifically, (1) for please referring to Figure 34, when display module 10 is LCM display screen, LCM display screen includes along display device The backlight layer 11 of 100 light direction setting, the first polarizing layer 12, first substrate 13, liquid crystal layer 14, color filter layers 17 (including the second substrate 15 shown in Figure 19 and the display unit 151 being arranged in the second substrate 15) and the second polarizing layer 16, then Second polarizing layer 16 can be cancelled, i.e., LCM display screen include along display device 100 light direction be arranged backlight layer 11, First polarizing layer 12, first substrate 13, liquid crystal layer 14 and color filter layers 17 (shown in (2) of such as Figure 34), polaroid 84 can As the second polarizing layer 16 in LCM display screen.(1) for please referring to Figure 35, when display module 10 is OLED display screen, OLED Display screen includes the glass TFT substrate 181 being arranged along the light direction of display device 100, Organic Light Emitting Diode 182, encapsulation Glass 183 and OLED polaroid 184 can then cancel OLED polaroid 184, i.e., OLED display screen includes along display device Glass TFT substrate 181, Organic Light Emitting Diode 182 and ((2) of such as Figure 35 of packaged glass 183 of 100 light direction setting It is shown), polaroid 84 can be used as the OLED polaroid 184 in OLED display screen.

When display device 100 includes polaroid 84, colloid 50 is for bonding cover board 70, polaroid 84, capacitance type fingerprint Sensor diaphragm 40 and display module 10.Figure 33 is please referred to, in one embodiment, when colloid 50 includes 51 He of the first optical cement When the second optical cement 52, the first optical cement 51 is for bonding cover board 70 and polaroid 84, specific adhesive cover back 73 and polarisation Light-emitting surface 841.Second optical cement 52 is for bonding capacitive fingerprint sensing device diaphragm 40 and display module 10, specific bonding sensing The device back side 42 and display device front 102.In the present embodiment, along the opposite direction of the light direction of display device 100, cover board 70, the first optical cement 51, polaroid 84, capacitive fingerprint sensing device diaphragm 40, the second optical cement 52 and display module 10 be successively Stack setting.Full laminating type bonding cover board 70 and polaroid 84 can be used in first optical cement 51.Second optical cement 52 can be used Full laminating type or frame patch mode bond capacitive fingerprint sensing device diaphragm 40 and display module 10.

Figure 36 is please referred to, in some embodiments, display device 100 may also include T-coating 85.T-coating 85 Between cover board 70 and capacitive fingerprint sensing device diaphragm 40, be particularly located at the cover board back side 73 and sensor light-emitting surface 41 it Between.T-coating 85 includes opposite reflection-proof light-emitting surface 851 and the reflection-proof back side 852.Reflection-proof light-emitting surface 851 and cover board are carried on the back Face 73 is opposite, and the reflection-proof back side 852 and sensor light-emitting surface 41 are opposite.T-coating 85 with a thickness of 200nm~300nm.It is anti- Reflective membrane 85 is also referred to as anti-reflective film, antireflective anti-reflection film, AR (Anti-Refletance) film etc..T-coating 85 is logical It crosses sputtering technology and plates MULTILAYER COMPOSITE optical film on substrate and formed, low-refraction (L) and high refractive index (H) material is used to replace Membrane stack is formed, by film layer design and film thickness monitoring, substrate surface is reduced using interference effect and reflects.The application embodiment In, substrate can be cover board 70 or capacitive fingerprint sensing device diaphragm 40.Specifically, T-coating 85 can be formed in cover board back 73 (not shown) of face, or it is formed in sensor light-emitting surface 41 (as shown in figure 36).In the cover board back side 73 or sensor light-emitting surface 41 form T-coating 85, it is possible to reduce the reflected light that capacitive fingerprint sensing device diaphragm 40 generates, so that capacitance type fingerprint passes 10 side yellowing phenomenon of display module caused by metal grill route is reflective on sensor diaphragm 40 mitigates, and improves appearance display effect Fruit；It can also play the role of anti-dazzle simultaneously, under strong light action, user clearer can see the display of display module 10 clearly Image.

Figure 28 and Figure 37 are please referred to, in some embodiments, display device 100 may also include high impedance film 86.At this point, Capacitive fingerprint sensing device diaphragm 40 includes the sensor base plate 48 and pickup wire being arranged along the light direction of display device 100 Road floor 49 (i.e. aforementioned metal grid cabling).Sensor line layer 49 is arranged on sensor base plate 48, sensor line layer 49 For capacitance being detected when carrying out fingerprint recognition to obtain fingerprint image.High impedance film 86 is located at sensor line layer 49 and passes Between sensor substrate 48.Incorporated by reference to Figure 38, in one example, high impedance film 86 can offer through-hole, in order to pickup wire Road floor 49 passes through through-hole and is formed on sensor base plate 48.High impedance film 86 includes opposite high impedance light-emitting surface 861 and high resistant The anti-back side 862.High impedance light-emitting surface 861 and sensor line layer 49 are opposite, the high impedance back side 861 and 48 phase of sensor base plate It is right.High impedance film 86 with a thickness of 20nm~60nm.The ingredient of high impedance film 86 is graphite oxide, tin oxide, surfactant With the mixture of crosslinking agent.Increase by one layer of high impedance film 86 between sensor line layer 49 and sensor base plate 48, can keep away Exempt from or reduce interfering with each other between capacitive fingerprint sensing device diaphragm 40 and display module 10, avoids due to capacitance type fingerprint Interfering with each other between sensor diaphragm 40 and display module 10, and influence capacitive fingerprint sensing device diaphragm 40 and display module 10 function.

Capacitive fingerprint sensing device shown in capacitive fingerprint sensing device diaphragm 40 and Figure 30 in the application embodiment Diaphragm 40 can be identical or corresponding structure or two different structures.When it is identical or corresponding structure When, sensor base plate 48 can be equivalent to sensor board 44, and sensor line layer 49 can be equivalent to element sensor 43, pixel amplification Device 45 and outlet line 46；Or when capacitive fingerprint sensing device diaphragm 40 further includes semiconductor substrate, sensor base plate 48 It can be equivalent to semiconductor substrate, sensor line layer 49 can be equivalent to element sensor 43, sensor board 44, pixel amplifier 45 With outlet line 46.Certainly, capacitive fingerprint sensing device diaphragm 40 can not also limit herein without including pixel amplifier 45 System.

Figure 39 is please referred to, the application also provides a kind of non-volatile computer readable storage medium storing program for executing 2000.Non-volatile meter Calculation machine readable storage medium storing program for executing 2000 includes computer-readable instruction.When computer-readable instruction is executed by processor 3000, so that Processor 3000 executes control method described in above-mentioned any one embodiment.Wherein, the number of processor 3000 can be one It is a or multiple.

For example, incorporated by reference to Fig. 1, when computer-readable instruction is executed by processor 3000 so that processor 3000 execute with Lower step: 011: obtaining the working condition of display device 100；012: obtaining the finger touch fingerprint identification region 712 of user Touch location；013: judging whether working condition is whether OFF state and touch location are located at fringe region 7121；014: It is OFF state in working condition, and when touch location is located at marginal position 7121, fingerprint recognition mould group 20 is in inoperative shape State.

For another example incorporated by reference to Fig. 7, when computer-readable instruction is executed by processor 3000, so that processor 3000 executes Following steps: 0171: obtaining the current distance between electronic equipment 1000 and target object；0172: whether judging current distance Greater than pre-determined distance；When current distance is less than pre-determined distance, fingerprint recognition mould group 20 is in off working state；In current distance When greater than pre-determined distance, fingerprint recognition mould group 20 obtains fingerprint image.

For another example incorporated by reference to Figure 14, when computer-readable instruction is executed by processor 3000, so that processor 3000 executes Following steps: 024: receiving the imaging optical signal including target optical signal to form imaging electric signal, target optical signal is successively worn After crossing light hole 3211 and crossing unthreaded hole 1521, photosensitive layer 31 is reached；025: obtaining the noise signal in display device 100；026: Fingerprint image is obtained according to imaging electric signal and noise signal.

In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation The description of mode ", " example ", specific examples or " some examples " etc. means the tool described in conjunction with the embodiment or example Body characteristics, structure, material or feature are contained at least one embodiment or example of the application.In the present specification, Schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot Structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.In addition, In the case where not conflicting, those skilled in the art can by different embodiments or examples described in this specification and The feature of different embodiments or examples is combined.

Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes It is one or more for realizing specific logical function or process the step of executable instruction code module, segment or portion Point, and the range of the preferred embodiment of the application includes other realization, wherein can not press shown or discussed suitable Sequence, including according to related function by it is basic simultaneously in the way of or in the opposite order, Lai Zhihang function, this should be by the application Embodiment person of ordinary skill in the field understood.

Although presently filed embodiment has been shown and described above, it is to be understood that above embodiment is Illustratively, it should not be understood as the limitation to the application, those skilled in the art within the scope of application can be right Above embodiment is changed, modifies, replacement and variant.

Claims

1. a kind of control method is used for electronic equipment, which is characterized in that the electronic equipment includes display device, the display Device includes fingerprint recognition mould group, and the corresponding fingerprint identification region on said display means of the fingerprint recognition mould group is located at institute It states in the display area of display device, the fingerprint identification region includes fringe region and the non-side in addition to the fringe region Edge region, the fringe region are located at the edge of at least side of the display area；The control method includes:

Obtain the working condition of the display device；

The finger for obtaining user touches the touch location of the fingerprint identification region；

It is OFF state in the working condition, and when the touch location is located at the marginal position, the fingerprint recognition mould Group is in off working state.

2. control method according to claim 1, which is characterized in that the control method further include:

When the working condition is illuminating state or the touch location is located at the non-edge position, the finger touching is obtained Touch the touch area of the fingerprint identification region；

When the touch area is greater than preset area, the fingerprint recognition mould group is in the off working state；

When the touch area is less than the preset area, the fingerprint recognition mould group obtains the fingerprint image of the finger.

3. control method according to claim 2, which is characterized in that described to be less than the default face in the touch area When product, the fingerprint recognition mould group obtains the fingerprint image of the finger, comprising:

Obtain the use posture of the electronic equipment；

When the use posture is unsatisfactory for predetermined condition, the fingerprint recognition mould group is in the off working state；

When the use posture meets the predetermined condition, the fingerprint recognition mould group obtains the fingerprint image.

4. control method according to claim 2, which is characterized in that described to be less than the default face in the touch area When product, the fingerprint recognition mould group obtains the fingerprint image of the finger, comprising:

Obtain the current distance between the electronic equipment and target object；

When the current distance is less than pre-determined distance, the fingerprint recognition mould group is in the off working state；

When the current distance is greater than the pre-determined distance, the fingerprint recognition mould group obtains the fingerprint image.

5. control method according to claim 2, which is characterized in that the non-edge includes central area and surround The non-central region of the central area；It is described the touch area be less than the preset area when, the fingerprint recognition mould Group obtains the fingerprint image of the finger, comprising:

When the touch location is located at the central area, the fingerprint recognition mould group obtains institute after the first response time section State fingerprint image；

When the touch location is located at the non-central region, the fingerprint recognition mould group obtains after the second response time section The fingerprint image, the second response time section are greater than the first response time section.

6. according to control method described in claim 2-5 any one, which is characterized in that the display device includes successively heap First substrate, photosensitive layer, liquid crystal layer, the second substrate and the multiple collimation units of folded setting；The photosensitive layer includes multiple photosensitive Unit；Multiple display units and the shading piece between multiple display units are formed in the second substrate, it is described Unthreaded hole was offered on shading piece；The collimation unit offers light hole, and the light hole and the unthreaded hole of crossing are directed at institute State photosensitive unit；The fingerprint recognition mould group obtains the fingerprint image, comprising:

The imaging optical signal including target optical signal is received to form imaging electric signal, the target optical signal successively passes through described After light hole and the unthreaded hole excessively, the photosensitive layer is reached；

Obtain the noise signal in the display device；With

The fingerprint image is obtained according to the imaging electric signal and the noise signal.

7. a kind of electronic equipment, which is characterized in that the electronic equipment includes:

Display device, the display device include fingerprint recognition mould group and touch module, and the fingerprint recognition mould group is corresponding in institute The fingerprint identification region stated in display device is located in the display area of the display device, and the fingerprint identification region includes side Edge region and the non-edge in addition to the fringe region, the fringe region are located at at least side of the display area Edge；With

Processor, the processor are used to obtain the working condition of the display device；

The finger that the touch module is used to obtain user touches the touch location of the fingerprint identification region；

8. electronic equipment according to claim 7, which is characterized in that the touch module is also used in the working condition When being located at the non-edge position for illuminating state or the touch location, obtains the finger and touch the fingerprint identification region Touch area；

9. electronic equipment according to claim 8, which is characterized in that the electronic equipment further includes attitude transducer, institute Attitude transducer is stated for obtaining the use posture of the electronic equipment；

10. electronic equipment according to claim 8, which is characterized in that the electronic equipment further includes distance detection device, The distance detection device is used to obtain the current distance between the electronic equipment and target object；

11. electronic equipment according to claim 8, which is characterized in that the non-edge includes central area and ring Around the non-central region of the central area；

12. according to electronic equipment described in claim 8-11 any one, which is characterized in that the display device includes successively Stack first substrate, photosensitive layer, liquid crystal layer, the second substrate and the multiple collimation units of setting；The photosensitive layer includes multiple senses Light unit；Multiple display units and the shading piece between multiple display units, institute are formed in the second substrate It states and offered unthreaded hole on shading piece；The collimation unit offers light hole, and the light hole and the unthreaded hole of crossing are aligned The photosensitive unit；

The photosensitive layer is used to receive the imaging optical signal including target optical signal to form imaging electric signal, the target light letter Number successively pass through the light hole and it is described cross unthreaded hole after, reach the photosensitive layer；

The display device further includes that noise obtains circuit, and the noise obtains circuit for obtaining making an uproar in the display device Acoustical signal；

The processor is also used to obtain the fingerprint image according to the imaging electric signal and the noise signal.

13. electronic equipment according to claim 7, which is characterized in that the fingerprint recognition mould group includes capacitance type fingerprint Sensor diaphragm, the display device further include display module and cover board, and the capacitive fingerprint sensing device diaphragm is located at described Between cover board and the display module and the display surface of the covering display module.

14. a kind of non-volatile computer readable storage medium storing program for executing comprising computer-readable instruction, which is characterized in that the calculating When machine readable instruction is executed by processor, so that the processor perform claim requires control method described in 1-6 any one.