CN110503039A - Fingerprint sensor, display component device and electronic equipment - Google Patents

Abstract

This application discloses a kind of fingerprint sensor, display component device and electronic equipments.Fingerprint sensor includes substrate, line layer and shielding layer.Line layer includes a plurality of first line and a plurality of second route, and a plurality of first line intersects with the orthographic projection of a plurality of second route on substrate.Shielding layer includes shield wire, and shield wire is for covering first line and the second route.In the fingerprint sensor of the application embodiment, display component device and electronic equipment, shield wire is for covering first line and the second route, when can be incident to line layer to avoid ambient, it is come out by first line and the second line reflection, user is caused to see the problem of appearance such as grid line, screen burnt hair.

Description

Fingerprint sensor, display component device and electronic equipment

Technical field

This application involves fingerprint identification technology fields, more specifically, are related to a kind of fingerprint sensor, display component device And electronic equipment.

Background technique

With the continuous development of intelligent mobile terminal technology, fingerprint recognition application is also more and more extensive.For example, fingerprint recognition It can be used for unlocking screen, quick payment, encryption, fingerprint key function etc..Fingerprint recognition is generally realized by fingerprint sensor.Refer to Include line layer in line identification sensor, when ambient is incident to line layer, is easy by the line reflection in line layer Out, user is caused to see the problem of appearance such as grid line, screen burnt hair.

Summary of the invention

The application embodiment provides a kind of fingerprint sensor, display component device and electronic equipment.

The fingerprint sensor of the application embodiment includes substrate, line layer and shielding layer, and the line layer includes a plurality of First line and a plurality of second route, a plurality of first line and the orthographic projection of a plurality of second route over the substrate Intersection, the shielding layer includes shield wire, and the shield wire is for covering the first line and second route.

The display component device of the application embodiment includes display module, fingerprint sensor and cover board, and the fingerprint passes Sensor is touched to described with induction between the cover board and the display module and the display surface of the covering display module The user fingerprints of cover board；The fingerprint sensor includes substrate, line layer and shielding layer, and the line layer includes a plurality of First Line Road and a plurality of second route, a plurality of first line intersect with the orthographic projection of a plurality of second route over the substrate, The shielding layer includes shield wire, and the shield wire is for covering the first line and second route；The substrate, institute The light direction that line layer and the shielding layer are stated along the display module is arranged.

The electronic equipment of the application embodiment includes casing and display component device, the display component device with it is described Casing combines；The display component device includes display module, fingerprint sensor and cover board, and the fingerprint sensor is located at described Between cover board and the display module and the display surface of the covering display module, referred to incuding to touch to the user of the cover board Line；The fingerprint sensor includes substrate, line layer and shielding layer, and the line layer includes a plurality of first line and a plurality of second Route, a plurality of first line intersect with the orthographic projection of a plurality of second route over the substrate, the shielding layer packet Shield wire is included, the shield wire is for covering the first line and second route；The substrate, the line layer and institute The light direction that shielding layer is stated along the display module is arranged.

In the fingerprint sensor of the application embodiment, display component device and electronic equipment, shield wire is for covering the One route and the second route when can be incident to line layer to avoid ambient, are come out by first line and the second line reflection, User is caused to see the problem of appearance such as grid line, screen burnt hair.

The additional aspect and advantage of presently filed embodiment will be set forth in part in the description, partially will be from following Description in become obvious, or recognized by the practice of presently filed embodiment.

Detailed description of the invention

The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change It obtains obviously and is readily appreciated that, in which:

Fig. 1 and Fig. 2 is the structural schematic diagram of the electronic equipment of the application certain embodiments；

Fig. 3 is the decomposition diagram of the display component device of the application certain embodiments；

Fig. 4 is the schematic cross-section of the display component device of the application certain embodiments；

Fig. 5 is the schematic cross-section of the fingerprint sensor of the application certain embodiments；

Fig. 6 is the perspective exploded view of the fingerprint sensor of the application certain embodiments；

Fig. 7 and Fig. 8 is the schematic cross-section of the display component device of the application certain embodiments；

Fig. 9 and Figure 10 is the floor map of the line layer of the application certain embodiments；

Figure 11 is the floor map of the shielding layer of the application certain embodiments；

Figure 12 is the shield wire of the application certain embodiments and the corresponding states schematic diagram of first line and the second route；

Figure 13 is liquid crystal (Liquid Crystal Display Module, the LCM) display of the application certain embodiments The schematic cross-section of screen；

Figure 14 is Organic Light Emitting Diode (the Organic Light-Emitting of the application certain embodiments Diode, OLED) display screen schematic cross-section；

Figure 15 to Figure 17 is the schematic cross-section of the display module of the application certain embodiments；

Figure 18 to Figure 23 is the schematic cross-section of the display component device of the application certain embodiments；

Figure 24 is the schematic cross-section of the display component device of the application certain embodiments；

Figure 25 is the schematic cross-section of the polaroid of the application certain embodiments；

Figure 26 is the schematic cross-section of the LCM display screen of the application certain embodiments；

Figure 27 is the schematic cross-section of the OLED display screen of the application certain embodiments；

Figure 28 to Figure 30 is the schematic cross-section of the display component device of the application certain embodiments；

Figure 31 to Figure 33 is the fingerprint sensor of the application certain embodiments and the working state schematic representation of display module.

Specific embodiment

Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein identical Or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining presently filed embodiment, and should not be understood as to this Shen The limitation of embodiment please.

Referring to Fig. 1, the electronic equipment 1000 of the application embodiment includes casing 200 and display component device 100.It is aobvious Show that assembly apparatus 100 is combined with casing 200.Specifically, electronic equipment 1000 can be mobile phone, tablet computer, display, notes This computer, automatic teller machine, gate, smartwatch, head show equipment, game machine etc..The application embodiment is with electronic equipment 1000 It is illustrated for mobile phone, it will be understood that the concrete form of electronic equipment 1000 is not limited to mobile phone.

Casing 200 can be used for installing display component device 100, and in other words, casing 200 can be used as display component device 100 Installation carrier.Specifically, incorporated by reference to Fig. 2, casing 200 includes front housing 210, and display component device 100 can pass through side dispensing Or the modes such as viscose glue are assembled together with front housing 210.Casing 200 can also be used in install electronic equipment 1000 power supply unit, The functional modules such as imaging device, communication device, so that casing 200 provides the protection such as dust-proof, shatter-resistant, waterproof for functional module.

Fig. 3 and Fig. 4 are please referred to, display component device 100 includes display module 30, fingerprint sensor 20 and cover board 10.Refer to Line sensor 20 between cover board 10 and display module 30 and cover display module 30 display surface 31, with induction touch to cover The user fingerprints of plate 10.Incorporated by reference to Fig. 5 and Fig. 6, fingerprint sensor 20 includes the lining being arranged along the light direction of display module 30 Bottom 23, line layer 25 and shielding layer 26.Line layer 25 include a plurality of first line 251 and a plurality of second route 252, a plurality of first Route 251 intersects with orthographic projection of a plurality of second route 252 on substrate 23.Shielding layer 26 includes shield wire 261, shield wire 261 for covering first line 251 and the second route 252.

Wherein, fingerprint sensor 20 is laminated structure, and fingerprint sensor 20 can be full frame capacitive fingerprint sensing device. " full frame " refers to that fingerprint sensor 20 covers display surface 31 and reaches predetermined percentage.For example, the covering display of fingerprint sensor 20 Face 31 reaches 80%, 85%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99% or 100%, very Display surface 31 is covered more than 100% to fingerprint sensor 20, at this point, fingerprint sensor 20 covers and exceeds display surface 31.

It is appreciated that with the continuous development of intelligent mobile terminal technology, fingerprint recognition application is also more and more extensive.Example Such as, fingerprint recognition can be used for unlocking screen, quick payment, encryption, fingerprint key function etc..Current fingerprinting scheme is mainly Optical finger print identification under the screen of part.Optical finger print be identified by camera acquisition fingerprint, then with typing in system User fingerprints are matched, if matching, fingerprint recognition pass through.However, camera volume is larger, need to occupy big quantity space.

In the fingerprint sensor 20 of the application embodiment, display component device 100 and electronic equipment 1000, fingerprint sensing Device 20 covers display surface 31, and full frame fingerprint identification function may be implemented, and for local fingerprint, it is more convenient to operate；Separately Outside, using capacitive fingerprint sensor 20 carry out fingerprint recognition, compared to optical finger print identification for, volume that no setting is required compared with Big camera, it is only necessary to one layer of fingerprint sensor 20, thinner thickness, in spatial design advantageously；Further more, shield wire 261 for covering first line 251 and the second route 252, when can be incident to line layer 25 to avoid ambient, by First Line Road 251 and the second route 252 reflect, and user is caused to see the problem of appearance such as grid line, screen burnt hair.

Please refer to Fig. 3 and Fig. 4, in the application embodiment, display component device 100 includes cover board 10, fingerprint sensor 20, display module 30 and colloid 40.

Display component device 100 has a light direction, and display module 30, fingerprint sensor 20 and cover board 10 are along light side out To setting；In other words, cover board 10, fingerprint sensor 20 and display module 30 are arranged along the opposite direction of light direction.The application is real It applies in mode, the light direction of display component device 100 is the light direction of display module 30.

Cover board 10 is for protecting fingerprint sensor 20.The material of cover board 10 can be sapphire (Sapphire), glass, gather Imide membrane (Polyimide, PI), polyethylene terephthalate (Polyethylene terephthalate, PET any one) or in composite plate.Composite plate include polymethyl methacrylate (Polymethyl methacrylate, ) and polyamide (Polycarbonate, PC) PMMA.

In one embodiment, the material of cover board 10 is sapphire.Sapphire is in sapphire except ruby (Ruby) Except, the common name of other color sapphires.Sapphire has high rigidity, the high grade of transparency (85% or so), low-k The advantages that (9.3-11.5).When the material of cover board 10 is sapphire, there is cover board 10 high hardness, intensity height, sand paper to fall effect The advantages that fruit good (falling for 1.2m height can be born on cement floor), scratch resistance.When the material of cover board 10 is sapphire, cover board 10 With a thickness of 0.2mm~0.5mm.In other words, cover board 10 with a thickness of 0.2mm to the arbitrary value between 0.5mm.For example, lid Plate 10 with a thickness of 0.2mm, 0.23mm, 0.26mm, 0.29mm, 0.32mm, 0.35mm, 0.38mm, 0.41mm, 0.44mm, 0.47mm, 0.5mm etc..

In one embodiment, the material of cover board 10 is glass.When the material of cover board 10 is glass, cover board 10 has strong The advantages that degree is high, at low cost.When the material of cover board 10 be glass when, cover board 10 with a thickness of 0.1mm~0.4mm.In other words, Cover board 10 with a thickness of 0.1mm to the arbitrary value between 0.4mm.For example, cover board 10 with a thickness of 0.1mm, 0.13mm, 0.16mm, 0.19mm, 0.22mm, 0.25mm, 0.28mm, 0.31mm, 0.34mm, 0.37mm, 0.4mm etc..

In one embodiment, the material of cover board 10 is PI.When the material of cover board 10 is PI, cover board 10 is flexible cover Plate, and it is good to have many advantages, such as that sand paper falls effect.When the material of cover board 10 be PI when, cover board 10 with a thickness of 0.1mm~ 0.3mm.In other words, cover board 10 with a thickness of 0.1mm to the arbitrary value between 0.3mm.For example, cover board 10 with a thickness of 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm, 0.3mm etc..

In one embodiment, the material of cover board 10 is PET.When the material of cover board 10 is PET, cover board 10 is flexible cover Plate, and it is good to have many advantages, such as that sand paper falls effect.When the material of cover board 10 be PET when, cover board 10 with a thickness of 0.1mm~ 0.3mm.In other words, cover board 10 with a thickness of 0.1mm to the arbitrary value between 0.3mm.For example, cover board 10 with a thickness of 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, 0.22mm, 0.24mm, 0.26mm, 0.28mm, 0.3mm etc..

In one embodiment, the material of cover board 10 is composite plate.Composite plate passes through the works such as welding, pressing by PMMA+PC Skill is fabricated.PMMA has many advantages, such as scratch resistance, and PC has good toughness, therefore, when the material of cover board 10 is compound When plate, cover board 10 has many advantages, such as scratch resistance, good toughness.When the material of cover board 10 be composite plate when, cover board 10 with a thickness of 0.1mm ~0.4mm.In other words, cover board 10 with a thickness of 0.1mm to the arbitrary value between 0.4mm.For example, cover board 10 with a thickness of 0.1mm, 0.13mm, 0.16mm, 0.19mm, 0.22mm, 0.25mm, 0.28mm, 0.31mm, 0.34mm, 0.37mm, 0.4mm etc.. Wherein, PMMA with a thickness of 0.07mm or so.

It is appreciated that the finger of user presses on cover board 10 when electronic equipment 1000 is used for fingerprint recognition.If cover board 10 thickness is larger, it will influences the sensitivity of fingerprint sensor 20, and cannot achieve the lightening of electronic equipment 1000；If lid The thickness of plate 10 is smaller, and can not play preferable protective effect to fingerprint sensor 20 in user by pressure.Therefore, when When the material and thickness of cover board 10 meet the condition in above-described embodiment, the sensitivity of fingerprint sensor 20 both can guarantee, simultaneously It realizes the lightening of electronic equipment 1000, and preferable protective effect can be played to fingerprint sensor 20 in user by pressure.

Referring to Fig. 7, cover board 10 includes opposite cover board light-emitting surface 11 and the cover board back side 12.The cover board back side 12 and fingerprint pass Sensor 20 is opposite.It may be provided with ink layer 13 on the cover board back side 12.Specifically, ink layer 13 can be formed in lid by silk-screen technology In back 12.Ink layer 13 has higher attenuation rate to visible light, such as can reach 70% or more, so that user normally makes In, it is visually difficult to see that the region covered in electronic equipment 1000 by ink.For example, user is difficult to see electricity through cover board 10 The fingerprint sensor 20 and display module 30 of the inside of sub- equipment 1000, the shape of electronic equipment 1000 are more beautiful.

The thickness of ink layer 13 is less than or equal to 0.2mm.The thickness of ink layer 13 is less than or equal to 0.2mm, so that display The thinner thickness of assembly apparatus 100 is also beneficial to reduce the thickness of electronic equipment 1000.

Referring to Fig. 4, fingerprint sensor 20 is between cover board 10 and display module 30 and covers display module 30 Display surface 31, with incude touch to cover board 10 user fingerprints.Fingerprint sensor 20 can be arranged by colloid 40 in cover board 10 On, it is specifically located at the side at the cover board back side 12.Fingerprint sensor 20 includes that opposite sensor light-emitting surface 21 and sensor are carried on the back Face 22.Sensor light-emitting surface 21 and cover board 10 are opposite (specifically opposite with the cover board back side 12), the sensor back side 22 and display module 30 is opposite.Fingerprint sensor 20 with a thickness of 0.3mm or so.

Fingerprint sensor 20 can cover entire display surface 31, preferably to realize full frame fingerprint identification function.That is: fingerprint passes Sensor 20 covers display surface 31 and reaches 100% or more than 100%.When fingerprint sensor 20 covers entire display surface 31, user It can be pressed, can be achieved the purpose that fingerprint recognition in the corresponding any position of display module 30, and be not limited to show Show the corresponding certain specific positions of mould group 30, user's operation is more convenient.Alternatively, same user can be using multiple fingers simultaneously Or corresponding multiple positions in timesharing pressing display module 30；Alternatively, multiple users can be using multiple fingers while or timesharing Corresponding multiple positions in display module 30 are pressed, to realize the purpose identified to multiple fingerprints, reinforce electronic equipment The security level of 1000 encryptions and unlock.

Referring to Fig. 4, in one embodiment, fingerprint sensor 20 just covers entire 31 (i.e. fingerprint sensing of display surface Device 20 covers display surface 31 and just reaches 100%), and fingerprint sensor 20 and the neat in edge of display module 30 are standardized, are conducive to Guarantee the stability that fingerprint sensor 20 is combined with display module 30, and fingerprint sensor 20 can be whole with the realization of lesser area The capacitive fingerprint identification function of a display module 30.Referring to Fig. 8, in another embodiment, fingerprint sensor 20 covers simultaneously Beyond entire display surface 31 (i.e. fingerprint sensor 20 covers display surface 31 more than 100%), to ensure 30 margin location of display module Set the reliability of fingerprint recognition performance.

Incorporated by reference to Fig. 5 and Fig. 6, fingerprint sensor 20 includes substrate 23, the screen being arranged along the light direction of display module 30 Cover layer 24, line layer 25 and shielding layer 26.Substrate 23, shielded layer 24, line layer 25 and shielding layer 26 stack gradually setting.Substrate 23 surface opposite with shielded layer 24 is as the sensor back side 22, and the surface opposite with line layer 25 of shielding layer 26 is as biography The sensor back side 22.

The material of substrate 23 is glass or PI.The light transmittance of glass and PI are higher, will not be to the normal aobvious of display module 30 Show and impacts.In addition, cost is relatively low for fingerprint sensor 20 when the material of substrate 23 is glass；When the material of substrate 23 When for PI, flexible sensor is formed convenient for fingerprint sensor 20.

Shielded layer 24 is between substrate 23 and line layer 25.Shielded layer 24 (or referred to as high-obstruction) can be high resistant Anti- film, shielded layer 24 are made of clear material.In one embodiment, the ingredient of shielded layer 24 is graphite oxide, tin oxide, table The mixture of face activating agent and crosslinking agent.Shielded layer 24 is set between substrate 23 and line layer 25, shielding action can be played, Reduce interfering with each other between fingerprint sensor 20 and display module 30, avoid due to fingerprint sensor 20 and display module 30 it Between interfere with each other, and influence the function of fingerprint sensor 20 and display module 30.

The thickness of shielded layer 24 can be 20nm~60nm.In other words, shielded layer 24 with a thickness of 20nm between 60nm Arbitrary value.For example, shielded layer 24 with a thickness of 20nm, 24nm, 28nm, 32nm, 36nm, 40nm, 44nm, 48nm, 52nm, 56nm, 60nm etc..

Fig. 6 and Fig. 9 are please referred to, line layer 25 includes a plurality of first line 251 and a plurality of second route 252.Such as Fig. 6 and In Fig. 9, first line 251 is seven (merely illustrative, practical item number is much larger than this), and the second route 252 also (only shows for seven Example, practical item number are much larger than this).A plurality of 251 aligned transfer of first line, a plurality of second route 252 also aligned transfer.Specifically Ground, a plurality of first line 251 can be parallel to each other, and a plurality of second route 252 is also parallel to each other.The generation type of line layer 25 can be with It is: one layer of first line 251 is first set, then one layer of second route 252 is set；Alternatively, one layer of second route 252 is first set, then One layer of first line 251 is set, and this is not restricted.Line layer 25, which may also include, to be arranged in first line 251 and the second route Insulating layer between 252, insulating layer can be short-circuit to avoid occurring between first line 251 and the second route 252.

The material of first line 251 is any one in molybdenum aluminium molybdenum, copper or silver.In other words, first line 251 Material can be molybdenum aluminium molybdenum；Alternatively, the material of first line 251 is copper；Alternatively, the material of first line 251 is silver.First Line The line width A1 on road 251 is 3 μm~10 μm.In other words, the line width A1 of first line 251 is the arbitrary value between 3 μm to 10 μm. For example, the line width A1 of first line 251 is 3 μm, 3.5 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 9.5 μm, 10 μm etc..It is adjacent Two first line 251 between spacing A2 be 40 μm~120 μm.In other words, between two adjacent first line 251 Spacing A2 be 40 μm to 120 μm between arbitrary value.For example, the spacing A2 between two adjacent first line 251 is 40 μ M, 45 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm etc..

The line style of first line 251 is any one or more in straight line, curve or folding line.In other words, first The line style of route 251 is straight line；Alternatively, the line style of first line 251 is curve；Alternatively, the line style of first line 251 is bending Line；Alternatively, the line style of first line 251 is straight line and curve；Alternatively, the line style of first line 251 is straight line and folding line；Or Person, the line style of first line 251 are curve and folding line；Alternatively, the line style of first line 251 is straight line, curve and folding line. Wherein, when first line 251 includes at least two line style, what is referred to be can be in same first line 251, each part With different line styles.Such as first line 251 is divided into 3 parts by one end to the other end, and first part is straight line, second It is divided into curve, Part III is folding line.Alternatively, what is referred to can also be when first line 251 includes at least two line style In a plurality of first line 251, every first line 251 has different line styles.Such as first line 251 has three, first First line 251 is straight line, and Article 2 first line 251 is curve, and Article 3 first line 251 is folding line.

Similarly, the material of the second route 252 is any one in molybdenum aluminium molybdenum, copper or silver.In other words, the second line The material on road 252 can be molybdenum aluminium molybdenum；Alternatively, the material of the second route 252 is copper；Alternatively, the material of the second route 252 is Silver.The line width B1 of second route 252 is 3 μm~10 μm.In other words, the line width B1 of the second route 252 is between 3 μm to 10 μm Arbitrary value.For example, the line width B1 of the second route 252 is 3 μm, 3.5 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 9.5 μm, 10 μm etc..Spacing B2 between two adjacent the second routes 252 is 40 μm~120 μm.In other words, two adjacent second lines Spacing B2 between road 252 is the arbitrary value between 40 μm to 120 μm.For example, between two adjacent the second routes 252 It is 40 μm, 45 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm etc. away from B2.

The line style of second route 252 is any one or more in straight line, curve or folding line.In other words, second The line style of route 252 is straight line；Alternatively, the line style of the second route 252 is curve；Alternatively, the line style of the second route 252 is bending Line；Alternatively, the line style of the second route 252 is straight line and curve；Alternatively, the line style of the second route 252 is straight line and folding line；Or Person, the line style of the second route 252 are curve and folding line；Alternatively, the line style of the second route 252 is straight line, curve and folding line. Wherein, when the second route 252 includes at least two line style, what is referred to be can be in the second route of same 252, each part With different line styles.Such as second route 252 3 parts are divided by one end to the other end, first part is straight line, second It is divided into curve, Part III is folding line.Alternatively, what is referred to can also be when the second route 252 includes at least two line style In a plurality of second route 252, every second route 252 has different line styles.Such as second route 252 have three, first Second route 252 is straight line, and the second route of Article 2 252 is curve, and the second route of Article 3 252 is folding line.

It should be pointed out that the material of first line 251 and the material of the second route 252 can be it is identical, can also be with It is different.For example, the material of first line 251 and the material of the second route 252 are molybdenum aluminium molybdenum；In another example first line 251 material is molybdenum aluminium molybdenum, and the material of the second route 252 is copper.The line of the line width A1 of first line 251 and the second route 252 Wide B1 can be identical, be also possible to different.For example, the line width B1 of the line width A1 of first line 251 and the second route 252 It is 3 μm；In another example the line width A1 of first line 251 is 3 μm, the line width B1 of the second route 252 is 5 μm.Adjacent two article The spacing B2 between spacing A2 and two adjacent the second routes 252 between one route 251 can be identical, be also possible to Different.For example, between spacing A2 and two adjacent the second routes 252 between two adjacent first line 251 It is 40 μm away from B2；In another example the spacing A2 between two adjacent first line 251 is 40 μm, two adjacent second lines Spacing B2 between road 252 is 50 μm.The line style of first line 251 and the line style of the second route 252 can be it is identical, can also To be different.For example, the line style of first line 251 and the line style of the second route 252 are straight line；In another example first line 251 line style is straight line, and the line style of the second route 252 is folding line.When the material of first line 251, line width A1, line style and Spacing A2 between two adjacent first line 251, material, line width B1, line style and adjacent two with the second route 252 When spacing B2 between the second route of item 252 corresponds to identical, the manufacture for being conducive to line layer 25 (such as revolves first line 251 It turn 90 degrees, the second route 252 can be obtained).

Please refer to Fig. 6, Fig. 9 and Figure 10, a plurality of first line 251 and positive throwing of a plurality of second route 252 on substrate 23 Shade is handed over, and specifically include: a plurality of first line 251 and orthographic projection of a plurality of second route 252 on substrate 23 are at an acute angle, blunt Angle, or as shown in figure 9, a plurality of first line 251 is mutually perpendicular to orthographic projection of a plurality of second route 252 on substrate 23.

In the application embodiment, fingerprint sensor 20 uses capacitive couplings principle (specially mutual capacitance type), First Line Road 251 can be used as transmitting terminal, and the second route 252 can be used as receiving end, and (or the second route 252 is as transmitting terminal, first line 251 as receiving ends also can).First line 251 connects to power supply, for issuing pumping signal.Second route 252 and output end Connection, for receiving signal and output capacitance value to sensor chip 201 (as shown in Figure 3).First line 251 and the second route The place of 252 intersections will form capacitor, and first line 251 and the second route 252 have respectively constituted the two poles of the earth of capacitor.When electronics is set When being used for fingerprint recognition for 1000, the finger of user is pressed on fingerprint sensor 20 by cover board 10, and it is attached to affect touch point Coupling between nearly two electrodes, to change the capacitance in corresponding crosspoint.Since finger surface is there are wave crest and trough, The influence of wave crest and trough to the capacitance in crosspoint is different, therefore, can according to the size variation of the capacitance in different crosspoints To obtain corresponding fingerprint image.

In addition, may also include the electricity such as thin film transistor (TFT) (Thin-film transistor, TFT), capacitor in line layer 25 Sub- component.TFT controls line by line or scans by column signal for realizing signal switching.

Fingerprint sensor 20 obtains fingerprint image using capacitance, so that fingerprint recognition is carried out, compared to optical finger print For identification, recognition speed faster, high sensitivity, and do not need 30 self-luminous of display module to acquire fingerprint, can be with Fingerprint recognition is carried out under dark scene, and liquid crystal (Liquid Crystal Display Module, LCM) can be supported to show Screen, cost are lower.

Fig. 6 and Figure 11 are please referred to, shielding layer 26 includes shield wire 261 and filling part 262.The thickness of shielding layer 26 be less than or Equal to 50 μm, so that the thinner thickness of fingerprint sensor 20.

Shield wire 261 can be used black light-absorbing material and be made.The line width C1 of shield wire 261 is 5 μm~20 μm.It that is to say It says, the line width C1 of shield wire 261 is the arbitrary value between 5 μm to 20 μm.For example, the line width C1 of shield wire 261 is 5 μm, 6 μm, 7 μm, 9 μm, 11 μm, 13 μm, 15 μm, 17 μm, 19 μm, 20 μm etc..The line style of shield wire 261 is in straight line, curve or folding line Any one or more.In other words, the line style of shield wire 261 is straight line；Alternatively, the line style of shield wire 261 is curve；Or Person, the line style of shield wire 261 are folding line；Alternatively, the line style of shield wire 261 is straight line and curve；Alternatively, shield wire 261 Line style is straight line and folding line；Alternatively, the line style of shield wire 261 is curve and folding line；Alternatively, the line style of shield wire 261 is Straight line, curve and folding line.Wherein, when shield wire 261 includes at least two line style, each portion of shield wire 261 is referred to Different line styles can be had by dividing.Such as shield wire 261 divides for 3 parts, and first part is straight line, and second part is curve, Three parts are folding line.

Shield wire 261 is for covering first line 251 and the second route 252.Shield wire 261 and first line 251 and the Two routes, 252 position is corresponding.Shield wire 261 and first line 251 and 252 position of the second route is corresponding refers to: shield wire 261 Orthographic projection and second route 252 of the first line 251 on substrate 23 are respectively corresponded in substrate 23 in the orthographic projection on substrate 23 On orthographic projection.For example, shield wire 261 is in orthographic projection of the orthographic projection covering first line 251 on substrate 23 on substrate 23 With orthographic projection of second route 252 on substrate 23.

Fig. 9, Figure 11 and Figure 12 are please referred to, is greater than the with the line width C1 of the shield wire 261 of 251 position corresponding position of first line The line width A1 of one route 251 is greater than the second route 252 with the line width C1 of the shield wire 261 of 252 position corresponding position of the second route Line width B1, so as to all shelter from the incident light of set angle.Wherein, set angle may range from 15 degree~165 degree (be parallel to the direction of display module 30 as 0 degree).

It is consistent with the line style of first line 251 with the line style of the shield wire 261 of 251 position corresponding position of first line, with The line style of the shield wire 261 of two routes, 252 position corresponding position is consistent with the line style of the second route 252, so as to the smallest 261 line width of shield wire covers first line 251 and the second route 252, avoids ambient by by first line 251 and the second line Road 252 is reflected；It can also prevent from causing since shield wire 261 and the line style of first line 251, the second route 252 are inconsistent simultaneously The line width of shield wire 261 is wide, and black shield wire 261 is seen in the normal display or user for influencing display module 30, experiences bad.

Fig. 6 and Figure 11 are please referred to, filling part 262 is used to fill the gap of shield wire 261, filling part 262 and shield wire 261 Collectively cover line layer 25 and for protection circuit layer 25.Filling part 262 can be used with high transmittance, corrosion-resistant, scratch resistance etc. The material of characteristic not influence the normal display of display module 30, and can preferably protect entire fingerprint sensor 20.

The manufacturing process of shielding layer 26 can be such that firstly, covering one layer on the black shielding layer of monolith has height Photosensitivity photoresist；Then, screening is radiated at through mask with light (can be ultraviolet light, deep ultraviolet light, extreme ultraviolet etc.) Layer surface is covered, can be reacted by the photoresist that light is irradiated to；Subsequently, it is washed away with specific solvent illuminated/not illuminated Photoresist, to realize masking pattern (i.e. shield wire 261) transfer from mask to shielding layer；Finally, using transparent filling The gap of material (i.e. filling part 262) filling shield wire 261.

Referring to Fig. 4, display module 30 can be used for showing the images such as picture, video, text.Display module 30 passes through colloid 40 are arranged on fingerprint sensor 20, are specifically located at the side at the sensor back side 22.Display module 30 includes opposite display Face 31 and the screen back side 32.Display surface 31 and fingerprint sensor 20 are opposite (specifically opposite with the sensor back side 22).In above-mentioned reality It applies in example, when fingerprint sensor 20 just covers entire display surface 31, the area at the sensor back side 22 and the face of display surface 31 Product is equal (as shown in Figure 4), and the length at the sensor back side 22 is equal to the length of display surface 31, and the width at the sensor back side 22 is equal to The width of display surface 31.When fingerprint sensor 20 covers and exceeds entire display surface 31, the area at the sensor back side 22 is greater than The area (as shown in Figure 8) of display surface 31, the length at the sensor back side 22 are greater than the length of display surface 31, the sensor back side 22 Width is equal to the width of display surface 31；Alternatively, the length at the sensor back side 22 is equal to the length of display surface 31, the sensor back side 22 Width be greater than display surface 31 width；Alternatively, the length at the sensor back side 22 is greater than the length of display surface 31, the sensor back side 22 width is greater than the width of display surface 31.

Display module 30 can be hard screen or flexible screen.Preferably, when display module 30 is hard screen, the material of substrate 23 For glass, cost is relatively low；First line 251 and the material of the second route 252 include any in metal, ITO or nanometer silver paste It is a kind of.When display module 30 is flexible screen, the material of substrate 23 is PI, to form flexible sensor；251 He of first line The material of second route 252 includes ITO or nanometer silver paste, to form flexible circuitry.Certainly, in other embodiments, when aobvious When showing that mould group 30 is hard screen, the material of fingerprint sensor 20 may be PI, and this is not restricted.

Figure 13 and Figure 14 are please referred to, display module 30 can be LCM display screen 33 or Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen 34 (including active matrix organic light emitting diode display screen (Active- Matrix organic light-emitting diode, AMOLED)).Due to fingerprint sensor 20 by capacitance size come Fingerprint recognition is carried out, does not need 30 self-luminous of display module to acquire fingerprint, thus when display module 30 is LCM display screen 33, OLED display screen 34 or when other kinds of display screen, is able to achieve capacitive fingerprint identification function, i.e. the not office of display module 30 It is limited to for OLED display screen 34.

Figure 13 is please referred to, when display module 30 is LCM display screen 33, advantageously reduces the cost of electronic equipment 1000 (33 cost of LCM display screen is lower than OLED display screen).LCM display screen 33 may include the light direction along display component device 100 Backlight module 331, down polaroid 332, TFT substrate 333, liquid crystal layer 334, colored filter 335 and the upper polaroid of setting 336.The surface opposite with colored filter 335 of upper polaroid 336 as display surface 31, backlight module 331 with lower polarisation The opposite surface of piece 332 is as the screen back side 32.LCM display screen 33 is shone by backlight module 331, and light sequentially passes through lower inclined Mating plate 332, TFT substrate 333, liquid crystal layer 334, colored filter 335, upper polaroid 336, fingerprint sensor 20 and cover board 10 arrive It up to the external world, is perceived by the human eye, so that human eye gets the image of the display of display module 30.

Please refer to Figure 14, when display module 30 be OLED display screen 34 when, Curved screen or other forms may be implemented, for Family provides more more options.OLED display screen 34 may include the glass TFT substrate being arranged along the light direction of display component device 100 341, Organic Light Emitting Diode 342, packaged glass 343 and OLED polaroid 344.OLED polaroid 344 with packaged glass 343 Opposite surface is as display surface 31, and the surface opposite with Organic Light Emitting Diode 342 of glass TFT substrate 341 is as screen The back side 32.For OLED display screen 34 by 342 self-luminous of Organic Light Emitting Diode, it is inclined that light sequentially passes through packaged glass 343, OLED Mating plate 344, fingerprint sensor 20 and cover board 10 reach the external world, are perceived by the human eye, so that human eye gets the display of display module 30 Image.

Figure 15 and Figure 16 are please referred to, the display module 30 of the application embodiment can also collect in addition to display function At there is touch function.At this point, display module 30 may also include touch sensor 35.As shown in figure 15, when display module 30 is LCM When display screen 33, backlight module 331, down polaroid 332, TFT substrate 333, liquid crystal layer 334, colored filter 335 and upper polarisation Piece 336 (or following polaroid 60) is used as display module, and touch sensor 35 is used as touch-control module.As shown in figure 16, when aobvious When showing that mould group 30 is OLED display screen 34, glass TFT substrate 341, Organic Light Emitting Diode 342, packaged glass 343 and OLED are inclined Mating plate 344 (or following polaroid 60) is used as display module, and touch sensor 35 is used as touch-control module.Display module and touch-control Module can be two relatively independent modules, module integrated by two by rear end attaching process.Alternatively, Figure 17 is please referred to, Touch-control module can be embedded in display module, such as in Figure 17, and touch sensor 35 is arranged in colored filter 335 and liquid crystal layer Between 334.Alternatively, touch sensor 35 is directly made thoroughly by the surface opposite with liquid crystal layer 334 in colored filter 335 The elements such as prescribed electrode are formed.The touch sensor 35 of the application embodiment can be resistive touch sensor, capacitive touch Touch sensor, infrared-type touch sensor, sound wave type touch sensor, optical imaging type touch sensor, induction Touch sensor etc., this is not restricted.

Referring to Fig. 4, colloid 40 is for bonding cover board 10, fingerprint sensor 20 and display module 30.Using colloid 40 bonding cover boards 10, full frame capacitive fingerprint sensor 20 and display module 30, it is ensured that the structural strength of display component 100 and The reliability of fingerprint recognition performance.Wherein, when display module 30 is LCM display screen 33, colloid 40 is for bonding cover board 10, referring to Line sensor 20 and upper polaroid 336.When display module 30 is OLED display screen 34, colloid 40 is for bonding cover board 10, referring to Line sensor 20 and OLED polaroid 344.

Colloid 40 is referred to for bonding cover board 10, fingerprint sensor 20 and display module 30: colloid 40 by cover board 10, refer to Line sensor 20 and display module 30 this three are glued together.For example, colloid 40 bonds cover board 10 and fingerprint sensor 20, simultaneously Bond fingerprint sensor 20 and display module 30；Alternatively, colloid 40 bonds cover board 10 and fingerprint sensor 20, while bonding cover board 10 with display module 30；Alternatively, colloid 40 bonds cover board 10 and display module 30, while bonding fingerprint sensor 20 and display mould Group 30；Alternatively, colloid 40 bonds cover board 10 and fingerprint sensor 20, while cover board 10 and display module 30 are bonded, bonded simultaneously Fingerprint sensor 20 and display module 30.

Colloid 40 can be optical cement, specially optical clear adhesive (Optically Clear Adhesive, OCA), polyvinyl butyral film (PolyVinyl Butyral Film, PVB) or bonding die film (Die attach film, DAF any one in).In other words, colloid 40 is OCA；Alternatively, colloid 40 is PVB；Alternatively, colloid 40 is DAF.

Referring to Fig. 4, in one embodiment, colloid 40 includes the first optical cement 41 and the second optical cement 42.First light Glue 41 is learned for bonding cover board 10 and fingerprint sensor 20, specific adhesive cover back 12 and sensor light-emitting surface 21.Second light Glue 42 is learned for bonding fingerprint sensor 20 and display module 30, specifically bonds the sensor back side 22 and display surface 31.This implementation In example, along the opposite direction of the light direction of display component device 100, cover board 10, the first optical cement 41, fingerprint sensor 20, Second optical cement 42 and display module 30 stack gradually setting.

Full laminating type bonding cover board 10 and fingerprint sensor 20 can be used in first optical cement 41.

The full laminating type bonding cover board 10 is used to be with fingerprint sensor 20: by cover board 10 with fingerprint sensor 20 with nothing The mode in gap is pasted together completely, and the first optical cement 41 applies the whole face of cover plate 10 or the whole face of fingerprint sensor 20, lid Air layer is not present between plate 10 and fingerprint sensor 20.Using full laminating type bonding cover board 10 and fingerprint sensor 20, make Bond more secured between cover board 10 and fingerprint sensor 20, fingerprint sensor 20 will not be with relative to the position of cover board 10 It is shifted using the increase of time, is conducive to improve the reliability that fingerprint sensor 20 carries out fingerprint recognition, alternatively, it is also possible to Reduce the probability that dust, moisture etc. enter between cover board 10 and fingerprint sensor 20.

First optical cement 41 may include any one in OCA, PVB or DAF.When the first optical cement 41 is OCA, the One optical cement 41 is softer, and fitting processing technology is simple, and when the pressing of the finger of user is on cover board 10,41 energy of the first optical cement It is enough that certain buffer function is played to cover board 10 and fingerprint sensor 20.When the first optical cement 41 is PVB, the first optical cement 41 Bonding effect it is stronger, advantageously ensure that the stability of structure between cover board 10 and fingerprint sensor 20.When the first optical cement 41 When for DAF, it is possible to reduce the air bubble problem generated during fitting is conducive to improve binding yield, and improve cover board 10 with Flatness between fingerprint sensor 20.

When the first optical cement 41 is OCA, PVB or DAF, the thickness of the first optical cement 41 is 0.05mm~0.15mm. In other words, the first optical cement 41 with a thickness of 0.05mm to the arbitrary value between 0.15mm.For example, the thickness of the first optical cement 41 Degree be 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm etc..Preferably, the thickness of the first optical cement 41 is 0.1mm, it can not only guarantee cover board 10 and fingerprint sensor 20 Between the stability that is bonded, will not excessively increase the thickness of electronic equipment 1000.

Full laminating type can be used in second optical cement 42 or frame patch mode bonds fingerprint sensor 20 and display module 30.

It is with display module 30 using full laminating type bonding fingerprint sensor 20: by fingerprint sensor 20 and display mould Group 30 is pasted together completely in seamless mode, and the second optical cement 42 coats the whole face or display module of fingerprint sensor 20 Air layer is not present in 30 whole face between fingerprint sensor 20 and display module 30.Fingerprint sensing is bonded using full laminating type Device 20 and display module 30, so that bonding more secured between fingerprint sensor 20 and display module 30, display module 30 is relatively It will not be conducive to improve display area and fingerprint is known with using the increase of time to shift in the position of fingerprint sensor 20 The consistency in other region, it is several between the entrance fingerprint sensor 20 such as dust, moisture and display module 30 alternatively, it is also possible to reduce Rate.

Figure 18 is please referred to, bonding fingerprint sensor 20 with display module 30 using frame patch mode is: by fingerprint sensor 20 paste together with the frame portion of display module 30 or marginal portion, and the second optical cement 42 coats the four of fingerprint sensor 20 The surrounding (week makes a circle) of week or display module 30, may be present air layer between fingerprint sensor 20 and display module 30.Certainly, Certain transparent materials (such as PET, PET cost are lower than optical cement) can also be used to fill the air layer, so that structure is more Stablize, and reduces the probability that dust, moisture etc. enter between fingerprint sensor 20 and display module 30.It is bonded using frame patch mode Fingerprint sensor 20 and display module 30 are conducive to save cost, and be bonded so that the usable floor area of the second optical cement 42 is smaller Yield is higher.It, can be easily by fingerprint sensor 20 from display module 30 in addition, when fingerprint sensor 20 is damaged On disassemble, carry out fingerprint sensor 20 replacement, without fingerprint sensor 20 and display module 30 are all replaced； Alternatively, can easily be disassembled display module 30 from fingerprint sensor 20 when display module 30 is damaged, The replacement for carrying out display module 30, without all replacing display module 30 and fingerprint sensor 20.

Second optical cement 42 may include any one in OCA, PVB or DAF.When the second optical cement 42 is OCA, the Two optical cements 42 are softer, and fitting processing technology is simple, and when the pressing of the finger of user is on cover board 10,42 energy of the second optical cement It is enough that certain buffer function is played to fingerprint sensor 20 and display module 30.When the second optical cement 42 is PVB, the second optics The bonding effect of glue 42 is stronger, advantageously ensures that the stability of structure between fingerprint sensor 20 and display module 30.When second When optical cement 42 is DAF, it is possible to reduce the air bubble problem generated during fitting is conducive to improve binding yield, and improves Flatness between fingerprint sensor 20 and display module 30.

When the second optical cement 42 is OCA, PVB or DAF, the thickness of the second optical cement 42 is 0.05mm~0.15mm. In other words, the second optical cement 42 with a thickness of 0.05mm to the arbitrary value between 0.15mm.For example, the thickness of the second optical cement 42 Degree be 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm etc..Preferably, the thickness of the second optical cement 42 is 0.1mm, it can not only guarantee cover board 10 and fingerprint sensor 20 Between the stability that is bonded, will not excessively increase the thickness of electronic equipment 1000.

It should be pointed out that the type of the first optical cement 41 and the type of the second optical cement 42 can be same or different, For example, when the type of the first optical cement 41 is identical as the type of the second optical cement 42, the first optical cement 41 and the second optical cement 42 are OCA or are PVB or are DAF.When the type of the first optical cement 41 and the type difference of the second optical cement 42, First optical cement 41 is OCA, and the second optical cement 42 is PVB；Alternatively, the first optical cement 41 is PVB, the second optical cement 42 is DAF； Alternatively, the first optical cement 41 is DAF, the second optical cement 42 is OCA etc., numerous to list herein.The thickness of first optical cement 41 Spending can also be same or different with the thickness of the second optical cement 42, for example, when the thickness and the second optics of the first optical cement 41 When the thickness of glue 42 is identical, the thickness of the thickness of the first optical cement 41 and the second optical cement 42 is 0.09mm or is 0.1mm is 0.11mm.When the thickness difference of the thickness of the first optical cement 41 and the second optical cement 42, the first optical cement 41 thickness with a thickness of 0.09mm, the second optical cement 42 is 0.1mm；Alternatively, the first optical cement 41 with a thickness of 0.1mm, The thickness of second optical cement 42 is 0.11mm；Alternatively, the thickness with a thickness of 0.11mm, the second optical cement 42 of the first optical cement 41 Degree is 0.1mm etc., numerous to list herein.

Figure 19 is please referred to, in another embodiment, colloid 40 includes the first optical cement 41 and the second optical cement 42.First Optical cement 41 is for bonding cover board 10 and fingerprint sensor 20, specific adhesive cover back 12 and sensor light-emitting surface 21.Second Optical cement 42 is for bonding cover board 10 and display module 30, specific adhesive cover back 12 and display surface 31.In the present embodiment, edge The opposite direction of the light direction of display component device 100, in the intermediate region of cover board 10, cover board 10, refers to first optical cement 41 Line sensor 20 and display module 30 stack gradually setting；In the fringe region of cover board 10, cover board 10, the second optical cement 42 and aobvious Show that mould group 30 stacks gradually setting.

Identically as previous embodiment, full laminating type bonding cover board 10 and fingerprint sensor can be used in the first optical cement 41 20；First optical cement 41 may include any one in OCA, PVB or DAF；When the first optical cement 41 is OCA, PVB or DAF When, the thickness of the first optical cement 41 is 0.05mm~0.15mm, and explanation is no longer developed in details herein.

Second optical cement 42 can be used frame patch mode and bond cover board 10 and display module 30.

Bonding cover board 10 with display module 30 using frame patch mode is: by the frame portion of cover board 10 and display module 30 Or marginal portion is pasted together, the second optical cement 42 applies the surrounding of cover plate 10 or the surrounding (surrounding one of display module 30 Circle), air layer (as shown in figure 19) may be present between cover board 10 and display module 30.Certainly, certain transparent materials can also be used (such as PET, PET cost are lower than optical cement) fills the air layer, so that structure is more stable, and reduces dust, moisture Deng the probability entered between cover board 10 and display module 30.Air layer also may be formed at the periphery of the second optical cement 42, rather than Be formed in as shown in figure 19 the second optical cement 42 and between the first optical cement 41, at this point, air layer can be also used for placing Electronic component carries out circuit trace, to save space.Alternatively, since the first optical cement 41 and fingerprint sensor 20 are located at cover board Between 10 and display module 30, the first optical cement 41 and fingerprint sensor 20 are just filled between cover board 10 and display module 30 The air gap so that between cover board 10 and display module 30 be not present air layer (as shown in figure 20).It is viscous using frame patch mode Closing lid plate 10 and display module 30 are conducive to save cost, and binding yield so that the usable floor area of the second optical cement 42 is smaller It is higher.In addition, the thickness of the second optical cement 42 can be equal or close with the sum of the thickness of the first optical cement 41 and fingerprint sensor 20 Patibhaga-nimitta etc. bonds fingerprint sensor compared to the first optical cement 41 bonding cover board 10 and fingerprint sensor 20, the second optical cement 42 20 with display module 30 the case where (shown in Fig. 4) for, the thickness of display component device 100 is only by cover board 10, the first optical cement 41, fingerprint sensor 20 and display module 30 form, that is, save the thickness of the second optical cement 42, display component device 100 Thickness is smaller, is advantageously implemented the lightening of electronic equipment 1000.Further more, when cover board 10 is damaged, it can be easily Cover board 10 is disassembled from display module 30, carries out the replacement of cover board 10, without by cover board 10 and display module 30 all It is replaced；Alternatively, when display module 30 is damaged, under easily display module 30 can be dismantled from cover board 10 Come, the replacement of display module 30 is carried out, without all replacing display module 30 and cover board 10.

Identically as previous embodiment, the second optical cement 42 may include any one in OCA, PVB or DAF；When second When optical cement 42 is OCA, PVB or DAF, the thickness of the second optical cement 42 is 0.05mm~0.15mm；First optical cement 41 Type and the type of the second optical cement 42 can be same or different.

Figure 21 is please referred to, display component device 100 can also include strengthening course 50, and strengthening course 50 is located at fingerprint sensor 20 Between display module 30, it is particularly located between the sensor back side 22 and display surface 31.Strengthening course 50 includes that opposite reinforcement goes out Smooth surface 51 and the reinforcement back side 52.Reinforcement light-emitting surface 51 and the sensor back side 22 are opposite, and the reinforcement back side 52 and display surface 31 are opposite.

Strengthening course 50 and cover board 10 form double-layer cover plate structure.Strengthening course 50 can only have 0.3mm in the thickness of cover board 10 Or it is thinner in the case where, reinforce the intensity of entire display component device 100, reduce the electronic equipment 1000 in subsequent use process Due to being impacted or being hit the probability for causing fingerprint sensor 20 to fail.

The material of strengthening course 50 can be any one in sapphire, glass, PI, PET or composite plate.It is aforementioned to indigo plant The explanation of jewel, glass, PI, PET, composite plate is equally applicable to the application embodiment, is no longer developed in details herein It is bright.When the material of strengthening course 50 is sapphire, glass, any one in PI, PET or composite plate, the thickness of strengthening course 50 For 0.1mm~0.5mm.In other words, strengthening course 50 with a thickness of 0.1mm to the arbitrary value between 0.5mm.For example, strengthening course 50 with a thickness of 0.1mm, 0.14mm, 0.18mm, 0.22mm, 0.26mm, 0.3mm, 0.34mm, 0.38mm, 0.42mm, 0.46mm, 0.5mm etc..

When display component device 100 includes strengthening course 50, colloid 40 is for bonding cover board 10, fingerprint sensor 20, mending Strong layer 50 and display module 30.Colloid 40 is used to bond what cover board 10, fingerprint sensor 20, strengthening course 50 and display module 30 referred to Be: by cover board 10, fingerprint sensor 20, strengthening course 50 and display module 30, this is glued together colloid 40.For example, colloid 40 Bond cover board 10 and fingerprint sensor 20, while bonding fingerprint sensor 20 and strengthening course 50, at the same bonding reinforcement layer 50 with show Show mould group 30；Alternatively, colloid 40 bonds cover board 10 and fingerprint sensor 20, while fingerprint sensor 20 and strengthening course 50 are bonded, Fingerprint sensor 20 and display module 30 are bonded simultaneously；Alternatively, colloid 40 bonds cover board 10 and fingerprint sensor 20, bond simultaneously Fingerprint sensor 20 and display module 30, while bonding reinforcement layer 50 and display module 30；Alternatively, colloid 40 bond cover board 10 with Fingerprint sensor 20, while fingerprint sensor 20 and strengthening course 50 are bonded, while bonding fingerprint sensor 20 and display module 30, Bonding reinforcement layer 50 and display module 30 etc. simultaneously, herein with no restrictions.

Figure 21 is please referred to, in one embodiment, colloid 40 includes the first optical cement 41, third optical cement 43 and the 4th light Learn glue 44.For bonding cover board 10 and fingerprint sensor 20, specific adhesive cover back 12 goes out first optical cement 41 with sensor Smooth surface 21.Third optical cement 43 is specific to bond the sensor back side 22 and reinforcement for bonding fingerprint sensor 20 and strengthening course 50 Light-emitting surface 51.4th optical cement 44 is for bonding reinforcement layer 50 and display module 30, the specific bonding reinforcement back side 52 and display surface 31.In the present embodiment, along the opposite direction of the light direction of display component device 100, cover board 10, the first optical cement 41, fingerprint Sensor 20, third optical cement 43, strengthening course 50, the 4th optical cement 44 and display module 30 stack gradually setting, i.e., original Second optical cement 42 is replaced by third optical cement 43 and the 4th optical cement 44, and increases setting in fingerprint sensor 20 and display Strengthening course 50 between mould group 30.

Full laminating type can be used in third optical cement 43 or frame patch mode bonds fingerprint sensor 20 and strengthening course 50.

Figure 21 is please referred to, is with strengthening course 50 using full laminating type bonding fingerprint sensor 20: by fingerprint sensor 20 are pasted together in seamless mode completely with strengthening course 50, third optical cement 43 coat fingerprint sensor 20 whole face or Air layer is not present in the whole face of strengthening course 50 between fingerprint sensor 20 and strengthening course 50.Fingerprint is bonded using full laminating type Sensor 20 and strengthening course 50, so that bonding more secured between fingerprint sensor 20 and strengthening course 50, reinforcing effect is more preferable, separately Outside, it also can reduce the probability that dust, moisture etc. enter between fingerprint sensor 20 and strengthening course 50.

Figure 22 is please referred to, bonding fingerprint sensor 20 with strengthening course 50 using frame patch mode is: by fingerprint sensor 20 Pasted together with the frame portion of strengthening course 50 or marginal portion, third optical cement 43 coat fingerprint sensor 20 surrounding or The surrounding (week makes a circle) of strengthening course 50, may be present air layer between fingerprint sensor 20 and strengthening course 50.Certainly, it can also be used Certain transparent materials (such as PET, PET cost are lower than optical cement) fill the air layer, so that structure is more stable, and subtract Small dust, moisture etc. enter the probability between fingerprint sensor 20 and strengthening course 50.Fingerprint sensor is bonded using frame patch mode 20 are conducive to save cost and binding yield are higher with strengthening course 50 so that the usable floor area of third optical cement 43 is smaller.

Third optical cement 43 may include any one in OCA, PVB or DAF.When third optical cement 43 is OCA, the Three optical cements 43 are softer, and fitting processing technology is simple, and when the pressing of the finger of user is on cover board 10,43 energy of third optical cement It is enough that certain buffer function is played to fingerprint sensor 20.When third optical cement 43 is PVB, the bonding effect of third optical cement 43 Fruit is stronger, advantageously ensures that the stability of structure between fingerprint sensor 20 and strengthening course 50.When third optical cement 43 is DAF When, it is possible to reduce fitting during generate air bubble problem, be conducive to improve binding yield, and improve fingerprint sensor 20 with Flatness between strengthening course 50.

When third optical cement 43 is OCA, PVB or DAF, the thickness of third optical cement 43 is 0.05mm~0.15mm. In other words, third optical cement 43 with a thickness of 0.05mm to the arbitrary value between 0.15mm.For example, the thickness of third optical cement 43 Degree be 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm etc..Preferably, the thickness of third optical cement 43 is 0.1mm, it can not only guarantee fingerprint sensor 20 and strengthening course The stability being bonded between 50 will not excessively increase the thickness of electronic equipment 1000.

Similarly, full laminating type or frame patch mode bonding reinforcement layer 50 and display module can be used in the 4th optical cement 44 30。

Figure 21 is please referred to, is with display module 30 using full laminating type bonding reinforcement layer 50: by strengthening course 50 and being shown Show that mould group 30 is pasted together completely in seamless mode, the 4th optical cement 44 coats the whole face or display module of strengthening course 50 Air layer is not present in 30 whole face between strengthening course 50 and display module 30.Using full laminating type bonding reinforcement layer 50 and show Show mould group 30, so that bonding more secured between strengthening course 50 and display module 30, reinforcing effect is more preferable, alternatively, it is also possible to subtract Small dust, moisture etc. enter the probability between strengthening course 50 and display module 30.

Figure 23 is please referred to, is with display module 30 using frame patch mode bonding reinforcement layer 50: by strengthening course 50 and display The frame portion of mould group 30 or marginal portion are pasted together, and the 4th optical cement 44 coats the surrounding or display module of strengthening course 50 30 surrounding (week makes a circle), may be present air layer between strengthening course 50 and display module 30.Certainly, it can also be used certain transparent Material (such as PET, PET cost are lower than optical cement) fills the air layer so that structure is more stable, and reduce dust, Moisture etc. enters the probability between strengthening course 50 and display module 30.Mode bonding reinforcement layer 50 and display module are pasted using frame 30, so that the usable floor area of the 4th optical cement 44 is smaller, is conducive to save cost and binding yield is higher.

4th optical cement 44 may include any one in OCA, PVB or DAF.When the 4th optical cement 44 is OCA, the Four optical cements 44 are softer, and fitting processing technology is simple, and when the pressing of the finger of user is on cover board 10,44 energy of the 4th optical cement It is enough that certain buffer function is played to display module 30.When the 4th optical cement 44 is PVB, the bonding effect of the 4th optical cement 44 It is relatively strong, advantageously ensure that the stability of structure between strengthening course 50 and display module 30.It, can when the 4th optical cement 44 is DAF To reduce the air bubble problem generated during fitting, be conducive to improve binding yield, and improve strengthening course 50 and display module Flatness between 30.

When the 4th optical cement 44 is OCA, PVB or DAF, the thickness of the 4th optical cement 44 is 0.05mm~0.15mm. In other words, the 4th optical cement 44 with a thickness of 0.05mm to the arbitrary value between 0.15mm.For example, the thickness of the 4th optical cement 44 Degree be 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.10mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm etc..Preferably, the thickness of the 4th optical cement 44 is 0.1mm, it can not only guarantee strengthening course 50 and display module 30 Between the stability that is bonded, will not excessively increase the thickness of electronic equipment 1000.

Figure 24 is please referred to, in some embodiments, display component device 100 may also include polaroid 60.Polaroid 60 It is arranged on cover board 10 by colloid 40, is specifically located at the side at the cover board back side 12.Polaroid 60 is located at cover board 10 and fingerprint Between sensor 20, it is particularly located between the cover board back side 12 and sensor light-emitting surface 21.Polaroid 60 includes that opposite polarisation goes out Smooth surface 61 and the polarisation back side 62.Polarisation light-emitting surface 61 and the cover board back side 12 are opposite, the polarisation back side 62 and 21 phase of sensor light-emitting surface It is right.

Polaroid 60 with a thickness of 100 μm~150 μm.In other words, polaroid 60 with a thickness of 100 μm to 150 μm it Between arbitrary value.For example, polaroid 60 with a thickness of 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, 125 μm, 130 μm, 135 μm, 140 μm, 145 μm, 150 μm etc..

Polaroid 60 is that have the optical thin film for generating polarised light function made of a kind of Material cladding as layer high molecule, Polaroid 60 can convert polar biased light for the natural light for not having deflection polarity, make to pass through with the light of electric field in vertical direction, reach To control light whether passing through.One layer of polaroid 60 is added between cover board 10 and fingerprint sensor 20, can reduce the external world Light is incident to the brightness of the incident light of fingerprint sensor 20 by cover board 10, to reduce because of metal grill on fingerprint sensor 20 The heterochromatic phenomenon that certain angle occurs in 100 appearance of display component device caused by line reflection is walked (such as to present khaki existing As).

Figure 25 is please referred to, polaroid 60 can be rotatory polarization piece.Polaroid 60 includes going out light side along display component device 100 Protective film 63, Triafol T (Triacetyl Cellulose, TAC) functional membrane 64, polyvinyl alcohol to setting (polyvinyl alcohol, PVA) film 65, tabula rasa TAC film 66, pressure sensitive adhesive 67 and release film 68.Wherein it is possible to TAC function The surface of film 64 carries out some process, to reach corresponding additional function.For example, can be to the surface of TAC functional membrane 64 Carry out non-glare treated (AG), anti-dazzle+low reflection processing (AG+LR), transparent hard+low reflection processing (CHC+LR), transparent hard Handle (CHC), antireflection process (AR) etc..Different surface treatment modes can meet the different application need of electronic equipment 1000 It asks.The application embodiment carries out antireflection process to the surface of TAC functional membrane 64, so that TAC functional membrane 64 has antireflection Function (eliminates the reflected light on former and later two surfaces of film mutually to reduce reflection using interference effect), to reduce fingerprint sensing The reflected light that device 20 generates, to further mitigate display component device 100 under special angle due on fingerprint sensor 20 Khaki phenomenon is presented caused by the reflection of metal grill route.

Since polaroid 60 can reduce the brightness of display module 30, polaroid original in display module 30 can be taken Disappear.

Specifically, Figure 13 and Figure 26 are please referred to, when display module 30 is LCM display screen 33, LCM display screen 33 includes edge Display component device 100 light direction setting backlight module 331, down polaroid 332, TFT substrate 333, liquid crystal layer 334, Colored filter 335 and upper polaroid 336 (as shown in figure 13), then can cancel upper polaroid 336, i.e. LCM display screen 33 Backlight module 331, down polaroid 332, TFT substrate 333, liquid crystal including the light direction setting along display component device 100 Layer 334 and colored filter 335 (as shown in figure 26), polaroid 60 can be used as the upper polaroid 336 in LCM display screen 33.

Figure 14 and Figure 27 are please referred to, when display module 30 is OLED display screen 34, OLED display screen 34 includes along display Glass TFT substrate 341, Organic Light Emitting Diode 342, packaged glass 343 and the OLED of the light direction setting of assembly apparatus 100 Polaroid 344 (as shown in figure 14) can then cancel OLED polaroid 344, i.e., OLED display screen 34 includes along display component Glass TFT substrate 341, Organic Light Emitting Diode 342 and the packaged glass 343 of the light direction setting of device 100 are (such as Figure 27 institute Show), polaroid 60 can be used as the OLED polaroid 344 in OLED display screen 34.

Certainly, in other embodiments, original polaroid in display module 30 can not also be cancelled, only will lead to The brightness of display module 30 slightly reduces, at this point, display module 30 is still using the structure in Figure 13 and Figure 14.

When display component device 100 includes polaroid 60, colloid 40 is passed for bonding cover board 10, polaroid 60, fingerprint Sensor 20 and display module 30.

Figure 24 is please referred to, in one embodiment, when colloid 40 includes the first optical cement 41 and the second optical cement 42, the One optical cement 41 is for bonding cover board 10 and polaroid 60, specific adhesive cover back 12 and polarisation light-emitting surface 61.Second optics Glue 42 is specific to bond the sensor back side 22 and display surface 31 for bonding fingerprint sensor 20 and display module 30.The present embodiment In, along the opposite direction of the light direction of display component device 100, cover board 10, the first optical cement 41, polaroid 60, fingerprint are passed Sensor 20, the second optical cement 42 and display module 30 stack gradually setting.Full laminating type bonding can be used in first optical cement 41 Cover board 10 and polaroid 60.Full laminating type can be used in second optical cement 42 or frame patch mode bonds fingerprint sensor 20 and display Mould group 30.

Figure 28 is please referred to, in another embodiment, when colloid 40 includes the first optical cement 41 and the second optical cement 42, First optical cement 41 is for bonding cover board 10 and polaroid 60, specific adhesive cover back 12 and polarisation light-emitting surface 61.Second light Glue 42 is learned for bonding cover board 10 and display module 30, specific adhesive cover back 12 and display surface 31.In the present embodiment, along The opposite direction of the light direction of display component device 100, in the intermediate region of cover board 10, cover board 10, the first optical cement 41, polarisation Piece 60, fingerprint sensor 20 and display module 30 stack gradually setting；In the fringe region of cover board 10, cover board 10, the second optics Glue 42 and display module 30 stack gradually setting.Full laminating type bonding cover board 10 and polaroid can be used in first optical cement 41 60, the second optical cement 42 can be used frame patch mode and bond cover board 10 and display module 30.

Figure 29 is please referred to, in some embodiments, display component device 100 may also include T-coating 70.Reflection-proof Film 70 is particularly located between the cover board back side 12 and sensor light-emitting surface 21 between cover board 10 and fingerprint sensor 20.Counnter attack Light film 70 includes opposite reflection-proof light-emitting surface 71 and the reflection-proof back side 72.Reflection-proof light-emitting surface 71 and the cover board back side 12 are opposite, The reflection-proof back side 72 and sensor light-emitting surface 21 are opposite.

T-coating 70 with a thickness of 200nm~300nm.In other words, T-coating 70 with a thickness of 200nm extremely Arbitrary value between 300nm.For example, T-coating 70 with a thickness of 200nm, 210nm, 220nm, 230nm, 240nm, 250nm, 260nm, 270nm, 280nm, 290nm, 300nm etc..

T-coating 70 is also referred to as anti-reflective film, antireflective anti-reflection film, AR (Anti-Refletance) film etc..Counnter attack Light film 70 is to plate MULTILAYER COMPOSITE optical film on substrate by sputtering technology to be formed, and uses low-refraction (L) and high refractive index (H) material is alternatively formed membrane stack, by film layer design and film thickness monitoring, reduces substrate surface using interference effect and reflects.This Shen Please be in embodiment, substrate can be cover board 10 or fingerprint sensor 20.

Specifically, T-coating 70 can be formed in the cover board back side 12 (as shown in figure 30), or be formed in sensor and go out Smooth surface 21 (as shown in figure 29).T-coating 70 is formed at the cover board back side 12 or sensor light-emitting surface 21, it is possible to reduce fingerprint passes The reflected light that sensor 20 generates, so that the jaundice of 30 side of display module caused by metal grill route is reflective on fingerprint sensor 20 Phenomenon mitigates, and improves appearance display effect；It can also play the role of anti-dazzle simultaneously, under strong light action, user can be more Clearly see the image of the display of display module 30 clearly.

It should be pointed out that compared to shown in Fig. 3, Fig. 4, Fig. 7, Fig. 8, Figure 18, Figure 19, Figure 20, Figure 21, Figure 22 and Figure 23 Display component device 100 structure for, the display component device 100 of the application embodiment only the cover board back side 12 or pass Sensor light-emitting surface 21 increases one layer of T-coating 70, and other structures can be identical as the structure in above-mentioned multiple figures.Increasing After one layer of T-coating 70, the other structures in above-mentioned multiple figures can accordingly be changed.For example, colloid 40 is for bonding Cover board 10, T-coating 70, fingerprint sensor 20 and display module 30.When colloid 40 includes the first optical cement 41 and the second optics When glue 42, the first optical cement 41 is for bonding T-coating 70 and fingerprint sensor 20 (as shown in figure 30)；Or first optics Explanation is not unfolded for bonding cover board 10 and T-coating 70 (as shown in figure 29) in glue 41 one by one herein.

Fig. 4 and Figure 15 are please referred to, in some embodiments, fingerprint sensor 20 is applied not only to realize fingerprint recognition function Can, the touch sensor 35 for also serving as display module 30 realizes touch function.In other words, display module 30 is without in addition setting Touch sensor 35 (structure of display module 30 is as shown in Figure 13 and Figure 14) can be realized fingerprint by fingerprint sensor 20 and know Other and touch-control dual function, the structure of display component device 100 is simple, thinner thickness, integrated level are high, cost is relatively low, translucency Also more preferable, moreover it is possible to reduce the quantity, volume and design difficulty of the connection terminal of display component device 100.

The fingerprint identification function and touch function of fingerprint sensor 20 can be with time-sharing multiplexes.When fingerprint sensor 20 is for real When existing fingerprint identification function, fingerprint sensor 20 is not used in realization touch function；When fingerprint sensor 20 is for realizing touch-control function When energy, fingerprint sensor 20 is not used in realization fingerprint identification function.

Referring to Fig. 3, display component device 100 may also include sensor chip 201, sensor chip 201 and fingerprint are passed Sensor 20 connects.Sensor chip 201 is used to read fingerprint sensor 20 and detects obtained capacitance, then according to the capacitance It forms fingerprint image and carries out fingerprint recognition, to realize fingerprint identification function.Alternatively, sensor chip 201 refers to for reading Line sensor 20 detects obtained capacitance, then touch point coordinate, pressing track etc. is judged according to the capacitance, to realize touching Control function.

After sensor chip 201 reads the capacitance that the detection of fingerprint sensor 20 obtains, it is particularly used for realizing that fingerprint is known Other function still realizes touch function, can be determined according to the application scenarios of electronic equipment 1000.For example, working as electronic equipment 1000 Whens applied to encryption scene, unlock scene, payment scene etc., sensor chip 201 reads what the detection of fingerprint sensor 20 obtained After capacitance, for realizing fingerprint identification function.When electronic equipment 1000 is applied to non-above-mentioned scene, sensor chip 201 After reading the capacitance that the detection of fingerprint sensor 20 obtains, for realizing touch function.

Certainly, in other embodiments, electronic equipment 1000 other also settable decision logics judge fingerprint sensing Device 20 and sensor chip 201 are for realizing fingerprint identification function or touch function, and this is not restricted.

Fig. 1 and Fig. 3 are please referred to, in some embodiments, electronic equipment 1000 may also include mainboard chip 220.Display Assembly apparatus 100 further includes sensor chip 201 and display chip 301.Sensor chip 201 is connect with fingerprint sensor 20, Display chip 301 is connect with display module 30.Sensor chip 201 and display chip 301 are also connect with mainboard chip 220. Wherein, sensor chip 201 is connect to realize fingerprint identification function, display chip 301 and mainboard chip with mainboard chip 220 220 connections are to realize display function.

Mainboard chip 220 can control fingerprint sensor 20 and display module by sensor chip 201 and mainboard chip 220 30 time-sharing works.Specifically, Figure 31 is please referred to, when fingerprint sensor 20 is for realizing fingerprint identification function, sensor chip 201, which control fingerprint sensor 20 according to the first working signal T1, works, meanwhile, mainboard chip 220 is obtained from sensor chip 201 First synchronization signal T10 corresponding with the first working signal T1 is taken, controls display chip 301 further according to the first synchronization signal T10, So that display module 30 does not work.Alternatively, Figure 32 is please referred to, and when display module 30 is for realizing display function, display chip 301 according to the second working signal T2 control display module 30 work, meanwhile, mainboard chip 220 is obtained from display chip 301 and The corresponding second synchronization signal T20 of second working signal T2 controls sensor chip 201 further according to the second synchronization signal T20, makes Fingerprint sensor 20 is obtained not work.In the application embodiment, fingerprint sensor 20 and 30 time-sharing work of display module, the first work Make signal T1 and the second working signal T2 to be staggered, to avoid user during using electronic equipment 1000, fingerprint biography occurs Sensor 20 and the work of display module 30 entanglement mutually lead to the problem of interference.

Wherein, the display frequency of display module 30 can be greater than the fingerprint detection frequency of fingerprint sensor 20.Adjacent two It may include having multiple second working signal T2 between first working signal T1.For example, in Figure 33, the display frequency of display module 30 Rate is twice of the fingerprint detection frequency of fingerprint sensor 20.It include that there are two the between two adjacent the first working signal T1 Two working signal T2.It is appreciated that user generally uses display module 30 more frequently, and need to use fingerprint sensor 20 Situation is less, and therefore, the display frequency of display module 30 is greater than the fingerprint detection frequency of fingerprint sensor 20, can preferably expire The sufficient actual use demand of user.

In the description of this specification, reference term " certain embodiments ", " in an example ", " illustratively " etc. are retouched It states and means to be contained in the application extremely in conjunction with the embodiment or example particular features, structures, materials, or characteristics described In a few embodiment or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical Embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be real in any one or more Applying can be combined in any suitable manner in mode or example.In addition, without conflicting with each other, those skilled in the art can be with The feature of different embodiments or examples described in this specification and different embodiments or examples is combined.

Although presently filed embodiment has been shown and described above, it is to be understood that above embodiment is Illustratively, it should not be understood as the limitation to the application, those skilled in the art within the scope of application can be right Above embodiment is changed, modifies, replacement and variant.

Claims (14)

1. a kind of fingerprint sensor, which is characterized in that the fingerprint sensor includes substrate, line layer and shielding layer, the line Road floor includes a plurality of first line and a plurality of second route, and a plurality of first line and a plurality of second route are in the lining Orthographic projection intersection on bottom, the shielding layer includes shield wire, and the shield wire is for covering the first line and described the Two routes.

2. fingerprint sensor according to claim 1, which is characterized in that the fingerprint sensor further includes shielded layer, institute Shielded layer is stated between the substrate and the line layer.

3. fingerprint sensor according to claim 1, which is characterized in that with described in the corresponding position of the first line position The line width of shield wire is greater than the line width of the first line, the line width with the shield wire of second place on line corresponding position Greater than the line width of second route.

4. fingerprint sensor according to claim 1, which is characterized in that between two adjacent first line Away from being 40 μm~120 μm；And/or

The line width of the first line is 3 μm~10 μm；And/or

Spacing between second route of adjacent two is 40 μm~120 μm；And/or

The line width of second route is 3 μm~10 μm；And/or

The line width of the shield wire is 5 μm~20 μm；And/or

The thickness of the shielding layer is less than or equal to 50 μm.

5. fingerprint sensor according to claim 1, which is characterized in that with described in the corresponding position of the first line position The line style of shield wire is consistent with the line style of the first line, the line with the shield wire of second place on line corresponding position Type is consistent with the line style of second route.

6. fingerprint sensor according to claim 1, which is characterized in that the line style of the first line be straight line, curve, Or any one or more in folding line；And/or

The line style of second route is any one or more in straight line, curve or folding line；And/or

The line style of the shield wire is any one or more in straight line, curve or folding line.

7. fingerprint sensor according to claim 1, which is characterized in that the shielding layer further includes for filling the screening The filling part in line gap is covered, the filling part and the shield wire collectively cover the line layer and for protecting the route Layer.

8. a kind of display component device, which is characterized in that the display component device includes display module, claim 1 to 7 times Fingerprint sensor and cover board described in meaning one, the fingerprint sensor is between the cover board and the display module and covers The display surface of the display module is covered, to incude the user fingerprints touched to the cover board；The substrate, the line layer and institute The light direction that shielding layer is stated along the display module is arranged.

9. display component device according to claim 8, which is characterized in that the display component device further includes colloid, The colloid includes the first optical cement and the second optical cement, and first optical cement is passed for bonding the cover board and the fingerprint Sensor, second optical cement is for bonding the fingerprint sensor and the display module；Or

For first optical cement for bonding the cover board and the fingerprint sensor, second optical cement is described for bonding Cover board and the display module.

10. display component device according to claim 9, which is characterized in that first optical cement is using full fitting side Formula, second optical cement paste mode using full laminating type or frame；And/or

First optical cement includes any one in optical clear adhesive, polyvinyl butyral film or bonding die film； And/or

Second optical cement includes any one in optical clear adhesive, polyvinyl butyral film or bonding die film.

11. display component device according to claim 8, which is characterized in that the material of the cover board is sapphire, glass Any one in glass, Kapton, polyethylene terephthalate or composite plate, the composite plate includes poly- first Base methyl acrylate and polyamide；And/or

The material of the substrate is glass or Kapton；And/or

The material of the first line is any one in molybdenum aluminium molybdenum, copper or silver；And/or

The material of second route is any one in molybdenum aluminium molybdenum, copper or silver.

12. display component device according to claim 8, which is characterized in that the display module is hard screen or flexible screen； And/or

The display module is liquid crystal display or organic light-emitting diode (OLED) display screen.

13. display component device according to claim 8, which is characterized in that the display component device further includes reinforcement Layer, the strengthening course is between the fingerprint sensor and the display module.

14. a kind of electronic equipment characterized by comprising

Casing；With

Display component device described in claim 8 to 13 any one, the display component device is in conjunction with the casing.