CN102289097B - Display device and method for manufacturing the same - Google Patents
Display device and method for manufacturing the same Download PDFInfo
- Publication number
- CN102289097B CN102289097B CN 201110208923 CN201110208923A CN102289097B CN 102289097 B CN102289097 B CN 102289097B CN 201110208923 CN201110208923 CN 201110208923 CN 201110208923 A CN201110208923 A CN 201110208923A CN 102289097 B CN102289097 B CN 102289097B
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- Prior art keywords
- display device
- hole
- metal level
- shield layer
- light shield
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- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims abstract description 61
- 238000002310 reflectometry Methods 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229920000297 Rayon Polymers 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 11
- 239000011521 glass Substances 0.000 description 19
- 239000010408 film Substances 0.000 description 5
- 239000006059 cover glass Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010420 art technique Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display device and a manufacturing method thereof. The manufacturing method comprises the following steps: providing a transparent substrate, forming a shading layer on the transparent substrate, forming a through hole on the shading layer to expose the transparent substrate, forming a metal layer on the shading layer and in the through hole, capturing an alignment mark of the metal layer positioned in the through hole from the transparent substrate through an alignment module, and setting an object to be aligned on the metal layer according to the alignment mark. By the above mode, when the object to be aligned is aligned, the metal layer in the through hole can be used for aligning, so that the object to be aligned can be smoothly arranged on the metal layer without being shielded by the shading layer.
Description
Technical field
The present invention is about a kind of manufacture method of display device, particularly a kind of manufacture method that applies to the display device of monolithic glass scheme.
Background technology
Monolithic glass scheme (One glass solution, OGS) is the technology that touch-control glass (Touch Sensor) and cover glass (Cover Glass) are combined.In more detail, the monolithic glass scheme is to plate indium tin oxide (Indium Tin Oxide, ITO) conductive layer in general cover glass inboard, makes monolithic glass not only possess intensity, the security of cover glass, also has touch controllable function simultaneously concurrently.
Take glass baseplate as main Projected capacitive touch panel, adopt two sheet glass structures, that is a slice touch-control glass adds a slice cover glass due at present more.For simplifying material, processing procedure, improving production efficiency and reducing costs, reduce simultaneously the use of glass, so that the end product design is lighter, thinner and make panel light transmission Du Genggao, so the monolithic glass scheme is considered to be the important development direction of next stage contact panel.
When using the monolithic glass scheme to make liquid crystal panel, shading element (can be described as again black matrix", Black Matrix) can be arranged at the upside of glass baseplate, and metal gasket is to be arranged on shading element.That is to say, shading element is between metal gasket and glass baseplate.Then, when be arranged at chip on metal gasket, can use the image identification module to look for the contraposition sign that sets in advance on metal gasket from the downside of glass baseplate.Yet, because between metal gasket and glass baseplate also across shading element, therefore in present monolithic glass scheme, the image identification module that is positioned at the glass baseplate downside can't obtain the contraposition sign, also just can't smoothly chip be arranged on metal gasket.
Summary of the invention
In view of above problem, the present invention proposes a kind of manufacture method of display device.This manufacture method comprises: a transparency carrier is provided, form a light shield layer on transparency carrier, form a through hole in light shield layer with expose transparency carrier, form metal level on light shield layer with through hole in, be positioned at the contraposition sign of the metal level of through hole by the acquisition of contraposition module self-induced transparency substrate; According to the contraposition sign, arrange one and treat that the contraposition object is in metal level.
In addition, the present invention separately proposes a kind of display device, comprises transparency carrier, light shield layer and metal level.
Light shield layer is positioned on transparency carrier, and light shield layer has a through hole.Metal level arranges on light shield layer, and metal level fills up through hole and metal level is connected to transparency carrier by through hole.
In one embodiment of this invention, wherein between light shield layer and metal level the difference of reflectivity more than or equal to 40%.
In one embodiment of this invention, wherein the material of metal level is selected from gold, silver, copper, aluminium, molybdenum or its combination, and the reflectivity of metal level is greater than 47%.
In one embodiment of this invention, wherein through hole is a rectangle, a triangle or a circle.
In one embodiment of this invention, wherein the aperture of through hole less than 100 μ m.
By above-mentioned mode, when during in contraposition, utilizing the metal level in through hole to carry out contraposition until the contraposition object, therefore can not be subject to covering of light shield layer and can will treat that the contraposition object is arranged at metal level smoothly.
Description of drawings
Figure 1A to Fig. 1 F is the process flow diagram of the manufacture method of display device of the present invention; And
Fig. 2 is the diagrammatic cross-section of display device of the present invention.
Wherein, Reference numeral:
10 transparency carriers
11 first sides
12 second sides
13 transmission regions
14 lightproof areas
20 light shield layers
30 through holes
40 metal levels
50 display apparatus modules
51 colored filter substrates
52 thin film transistor base plates
53 backlights
54 transparent viscose glues
60 contraposition modules
70 treat the contraposition object
100 display device
Embodiment
Below further describe detailed features of the present invention and advantage in embodiment, its content is enough to make any related art techniques person of haveing the knack of understand technology contents of the present invention and implement according to this, and content disclosed according to this instructions, claim and graphic, any related art techniques person of haveing the knack of can understand purpose and the advantage that the present invention is correlated with easily.
Please refer to Figure 1A to Fig. 1 E, Figure 1A to Fig. 1 E is the process flow diagram of the manufacture method of display device of the present invention.
In Figure 1A, provide transparency carrier 10.Transparency carrier 10 has the first side 11 and the second side 12.The first side 11 side extraneous for actual product can be exposed to wherein, the namely side that can watch of user's reality.The second 12 of sides are sides of piling up light shield layer 20 retes such as grade and carrying out processing procedure.Transparency carrier 10 can be glass substrate or the substrate of plastic material.
In Figure 1B, utilize plated film/gold-tinted/etching technique to form light shield layer 20 on the second side 12 of transparency carrier 10.Light shield layer 20 can be black out ink, and black out ink is covered in transparency carrier 10 with nozzle in the mode of spraying.
In Fig. 1 C, utilize plated film/gold-tinted/etching technique to form through hole 30 in light shield layer 20.Through hole 30 is through to the relative opposite side of light shield layer 20 by a side of light shield layer 20.Light shield layer 20 is after being run through, and the second side 12 of transparency carrier 10 is exposed by through hole 30.Through hole 30 can be rectangle, triangle, circle or other polygon or irregular type in the shape of the second side 12 of transparency carrier 10.In order to make through hole 30 not affect visually attractive in appearance of display device, in one embodiment of this invention, the aperture of through hole 30 is better for 100 μ m, and therefore, the user is not easy to discover this through hole 30.Take polygon as example, the aperture of through hole 30 may be defined as in polygon at a distance of the distance between two summits farthest.
In Fig. 1 D, utilize plated film/gold-tinted/etching technique form metal level 40 on light shield layer 20 with through hole 30 in.In this embodiment, the method for plated film formation metal level 40 can be but be not limited to electron-beam vapor deposition method, physical vapor deposition or sputtering method.Because metal level 40 is formed at through hole 30, metal level 40 can be connected to the second side 12 of transparency carrier 10.That is to say, be formed at the metal level 40 in through hole 30, can not covered by light shield layer 20.Therefore, the first side 11 of self-induced transparency substrate 10 also can be seen this metal level 40.In the present embodiment, the material of metal level 40 can be selected from gold, silver, copper, aluminium, molybdenum or its combination, so that the reflectivity of metal level 40 when radiation of visible light is more than or equal to 47%.Due to metal level 40 with light shield layer 20 difference in reflectivity more than or equal to 40%.Can pick out the different of light shield layer 20 and metal level 40 in the first side 11.In the shape of the second side 12 of transparency carrier 10 and the difference in reflectivity of metal level 40 and light shield layer 20, the metal level 40 that is formed at through hole 30 can be considered as the contraposition sign to assist the contraposition of successive process by through hole 30.
Be noted that especially herein, metal level 40 can be with the script metal wiring layer with processing procedure, at this moment, metal level 40 carry out simultaneously the step such as plated film/gold-tinted/etching with metal wiring layer originally and be formed on light shield layer 20 with through hole 30 in or be formed in through hole 30.
In Fig. 1 E, be positioned at a pair of bit flag of the metal level 40 of through hole 30 by 60 self-induced transparency substrate 10 acquisitions of contraposition module.The contraposition sign is through hole 30 formed shape on the second side 12 of transparency carrier 10.Contraposition module 60 comprises light source production module and image capture unit.Contraposition module 60 is positioned at a side of transparency carrier 10 first sides 11.The light source production module of contraposition module 60 can be towards transparency carrier 10 transmitting illuminants.After the light source reflection, can be received by image capture unit.Because reflectivity is different, image capture unit can according to the light source of reflection, be obtained an image information.
In Fig. 1 F, according to the contraposition sign, arrange and treat that contraposition object 70 is on metal level.In this embodiment, treat that contraposition object 70 can be chip (chip) or flexible circuit board (flexible printed circuit board).Chip or flexible circuit board can be via the assembling device clampings.Assembling device such as can be but be not limited to fixture, this fixture is configurable in a robotic arm.Contraposition module 60 can be obtained according to image capture unit image information, adjust angle and the position of robotic arm, so that chip or flexible circuit board are positioned on metal level 40.For example, when the contraposition sign was arranged in the left side of image information, the capable of regulating robotic arm was moved to the left, or adjusting transparency carrier 10 moves right.When the contraposition sign was arranged in the right side of image information, the capable of regulating robotic arm moved right, or adjusting transparency carrier 10 is moved to the left.Yet assembling device of the present invention is not limited to a fixture and robotic arm, other any can be via automatic control the utensil of move angle or position, all can be the assembling device of this case.
Generally speaking, chip or flexible circuit board color and light shield layer 20 in appearance is approximate.Therefore, when the user watched this display device from the first side 11, the user was not easy to find the existence of through hole 30, therefore can not have influence on visual attractive in appearance.
By above-mentioned mode, when carrying out the contraposition of chip or flexible circuit, light source can carry out contraposition by through hole 30 and the reflection differences that is formed at metal level 40 wherein in a survey of the first side 11 of transparency carrier 10, therefore can not be subject to covering of light shield layer 20 and can complete smoothly contraposition.
Please refer to Fig. 2, Fig. 2 is the diagrammatic cross-section of display device of the present invention.
Comprehensively the above, use display device proposed by the invention and the method for making display device, can effectively overcome the problem that can't obtain smoothly the contraposition sign in the monolithic glass scheme.
Although the present invention discloses as above with aforesaid embodiment, so it is not to limit the present invention.Without departing from the spirit and scope of the present invention, the change of doing and retouching all belong to scope of patent protection of the present invention.The protection domain that defines about the present invention please refer to appended claim.
Claims (13)
1. the manufacture method of a display device, is characterized in that, comprising:
One transparency carrier is provided;
Form a light shield layer on this transparency carrier;
Form a through hole in this light shield layer to expose this transparency carrier;
Form a metal level on this light shield layer with this through hole in;
Be positioned at a pair of bit flag of this metal level of this through hole from this transparency carrier acquisition by a contraposition module; And
According to this contraposition sign, arrange one and treat that the contraposition object is in this metal level;
Between this light shield layer and this metal level, the difference of reflectivity is more than or equal to 40%.
2. the manufacture method of display device according to claim 1, is characterized in that, the material of this metal level is selected from gold, silver, copper, aluminium, molybdenum or its combination.
3. the manufacture method of display device according to claim 1, is characterized in that, the reflectivity of this metal level is greater than 47%.
4. the manufacture method of display device according to claim 1, is characterized in that, this through hole is a rectangle, a triangle or a circle.
5. the manufacture method of display device according to claim 1, is characterized in that, the aperture of this through hole is less than 100 μ m.
6. a display device, is characterized in that, comprising:
One transparency carrier;
One light shield layer is positioned on this transparency carrier, and this light shield layer has a through hole; And
One metal level arranges on this light shield layer, and this metal level fills up this through hole and this metal level is connected to this transparency carrier by this through hole;
Between this light shield layer and this metal level, the difference of reflectivity is more than or equal to 40%.
7. display device according to claim 6, is characterized in that, this transparency carrier has a transmission region and a lightproof area, and this light shield layer is arranged at this lightproof area, and this display device comprises that separately a display apparatus module is arranged at this transmission region.
8. display device according to claim 7, is characterized in that, this display apparatus module comprises a liquid crystal display device module or an Organic Light Emitting Diode.
9. display device according to claim 7, is characterized in that, this display apparatus module is arranged on this transparency carrier by a transparent viscose glue.
10. display device according to claim 6, is characterized in that, the material of this metal level is selected from gold, silver, copper, aluminium, molybdenum or its combination.
11. display device according to claim 6 is characterized in that, the reflectivity of this metal level is greater than 47%.
12. display device according to claim 6 is characterized in that, this through hole is a rectangle, a triangle or a circle.
13. display device according to claim 6 is characterized in that, the aperture of this through hole is less than 100 μ m.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100117854 | 2011-05-20 | ||
| TW100117854A TWI440937B (en) | 2011-05-20 | 2011-05-20 | Display devices and manufacturing methods for the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102289097A CN102289097A (en) | 2011-12-21 |
| CN102289097B true CN102289097B (en) | 2013-06-12 |
Family
ID=45335630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110208923 Expired - Fee Related CN102289097B (en) | 2011-05-20 | 2011-07-21 | Display device and method for manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102289097B (en) |
| TW (1) | TWI440937B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103383503B (en) * | 2012-05-03 | 2016-09-28 | 群康科技(深圳)有限公司 | Colored filter substrate and touch control display apparatus |
| TWI499951B (en) * | 2013-08-06 | 2015-09-11 | Innolux Corp | Touch display device and method of bonding alignment thereof |
| TWI657563B (en) * | 2015-12-15 | 2019-04-21 | 優顯科技股份有限公司 | Opto-electronic apparatus and manufacturing method thereof |
| KR102572819B1 (en) * | 2016-02-23 | 2023-08-30 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Fabricating method for light emitting module and display device |
| CN109375805B (en) * | 2018-10-22 | 2022-04-15 | 业成科技（成都）有限公司 | Method for manufacturing display device |
| CN110764305B (en) * | 2019-06-11 | 2020-12-25 | 惠科股份有限公司 | Display panel and display device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3736121B2 (en) * | 1998-06-18 | 2006-01-18 | 双葉電子工業株式会社 | Fluorescent display tube |
| US8697254B2 (en) * | 2006-11-14 | 2014-04-15 | Sri International | Cavity electroluminescent devices and methods for producing the same |
| JP2009087557A (en) * | 2007-09-27 | 2009-04-23 | Futaba Corp | Fluorescent display tube and conductive material paste for fluorescent display tube |
-
2011
- 2011-05-20 TW TW100117854A patent/TWI440937B/en not_active IP Right Cessation
- 2011-07-21 CN CN 201110208923 patent/CN102289097B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW201248252A (en) | 2012-12-01 |
| CN102289097A (en) | 2011-12-21 |
| TWI440937B (en) | 2014-06-11 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
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Granted publication date: 20130612 Termination date: 20200721 |