CN106684067A - Package structure of fingerprint identification chip and electronic device - Google Patents
Package structure of fingerprint identification chip and electronic device Download PDFInfo
- Publication number
- CN106684067A CN106684067A CN201710138399.3A CN201710138399A CN106684067A CN 106684067 A CN106684067 A CN 106684067A CN 201710138399 A CN201710138399 A CN 201710138399A CN 106684067 A CN106684067 A CN 106684067A
- Authority
- CN
- China
- Prior art keywords
- fingerprint recognition
- recognition chip
- encapsulating structure
- metal derby
- line layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Abstract
The embodiment of the invention discloses a package structure of a fingerprint identification chip and an electronic device. The package structure of the fingerprint identification chip comprises a package body, the fingerprint identification chip and at least two metal blocks, wherein the package body comprises a bearing part, at least two through holes are formed in the bearing part, the fingerprint identification chip and the metal blocks are arranged in the package body, the metal blocks are arranged in the at least two through holes of the bearing part, and the fingerprint identification chip is electrically connected with the metal blocks so that the package structure of the fingerprint identification chip is electrically connected onto a circuit board of the electronic device. With the package structure of the fingerprint identification chip and the electronic device, provided by the embodiment of the invention, the thickness of the package structure of the fingerprint identification chip can be reduced.
Description
Technical field
The invention belongs to fingerprint identification technology field, more particularly to a kind of encapsulating structure and electronics dress of fingerprint recognition chip
Put.
Background technology
Fingerprint identification technology has been widely used in personal verification.For example, fingerprint is all configured with many terminals
Identification chip, for owner's authentication of terminal.However, in correlation technique, the encapsulating structure of fingerprint recognition chip is in thickness
Aspect is thicker.
The content of the invention
The embodiment of the present invention provides a kind of encapsulating structure and electronic installation of fingerprint recognition chip, can reduce fingerprint recognition
The thickness of chip-packaging structure.
The embodiment of the present invention a kind of encapsulating structure of fingerprint recognition chip, including packaging body, fingerprint recognition chip are provided with
And at least two metal derbies；
The packaging body includes supporting part, and at least two through holes are offered on the supporting part；
The fingerprint recognition chip and the metal derby are arranged on the inside of the packaging body, and the metal derby is arranged at institute
State at least two through holes of supporting part；
The fingerprint recognition chip is electrically connected with for the encapsulating structure to be electrically connected to electronics dress with the metal derby
On the circuit board put.
The embodiment of the present invention also provides a kind of electronic installation, and the electronic installation includes the fingerprint recognition that the present embodiment is provided
The encapsulating structure and circuit board of chip, encapsulating structure and the circuit board of the fingerprint chip are electrically connected with, so that described
Electronic installation is identified to the finger print information of user.
The encapsulating structure and electronic installation of fingerprint recognition chip provided in an embodiment of the present invention, including the knowledge of packaging body, fingerprint
Other chip and metal derby.The packaging body includes supporting part, and at least two through holes are offered on the supporting part, the fingerprint recognition
Chip and the metal derby are arranged on the inside of the packaging body, and the metal derby is arranged in the through hole of the supporting part.The fingerprint
Identification chip and the metal derby are electrically connected with, and the circuit board of the metal derby and electronic installation is electrically connected with, so that should
The encapsulating structure of fingerprint recognition chip is electrically connected on the circuit board of electronic installation.Due to the fingerprint recognition core in the present embodiment
Piece is electrically connected with metal derby, and the metal derby is electrically connected with circuit board again, therefore the fingerprint recognition chip in the present embodiment can
To be electrically connected with circuit board by metal derby, without being electrically connected with circuit board by traditional substrate.Further, since
The metal derby is may be mounted in the through hole of packaging body supporting part, and need not be used to set in the external additional space that increases of encapsulation
Put metal derby, namely the fingerprint chip-packaging structure that provided of the present embodiment eliminates the space of substrate, so the present embodiment can
To reduce the thickness of fingerprint recognition chip-packaging structure.
Description of the drawings
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, below will be to making needed for embodiment description
Accompanying drawing is briefly described.It should be evident that drawings in the following description are only some embodiments of the present invention, for
For those skilled in the art, on the premise of not paying creative work, can be attached to obtain others according to these accompanying drawings
Figure.
For a more complete understanding of the present invention and its advantage, following explanation is carried out below in conjunction with accompanying drawing, wherein
Identical drawing reference numeral represents same section in the following description.
Fig. 1 is the first structural representation of the encapsulating structure of the fingerprint recognition chip that the present embodiment is provided.
Fig. 2 is second structural representation of the encapsulating structure of the fingerprint recognition chip that the present embodiment is provided.
Fig. 3 is the third structural representation of the encapsulating structure of the fingerprint recognition chip that the present embodiment is provided.
Fig. 4 is the 4th kind of structural representation of the encapsulating structure of the fingerprint recognition chip that the present embodiment is provided.
Fig. 5 is the 5th kind of structural representation of the encapsulating structure of the fingerprint recognition chip that the present embodiment is provided.
Fig. 6 is the 6th kind of structural representation of the encapsulating structure of the fingerprint recognition chip that the present embodiment is provided.
Fig. 7 is the 7th kind of structural representation of the encapsulating structure of the fingerprint recognition chip that the present embodiment is provided.
Fig. 8 is the 8th kind of structural representation of the encapsulating structure of the fingerprint recognition chip that the present embodiment is provided.
Fig. 9 is the 9th kind of structural representation of the encapsulating structure of the fingerprint recognition chip that the present embodiment is provided.
Figure 10 is the structural representation of the electronic installation that the present embodiment is provided.
Figure 11 is the structural representation of the sectional view that the electronic installation in Figure 10 is obtained along P1-P1 lines.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described.Obviously, described embodiment is only a part of embodiment of the invention, rather than the embodiment of whole.It is based on
Embodiment in the present invention, the every other enforcement obtained under the premise of creative work is not made by those skilled in the art
Example, belongs to the scope of protection of the invention.
In describing the invention, it is to be understood that term " " center ", " longitudinal direction ", " horizontal ", " length ", " width ",
" thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " is, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention and simplified description, rather than indicate or imply that the device or element of indication must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.Additionally, term " first ", " second " are only used for
Description purpose, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, define " first ", the feature of " second " can be expressed or implicitly include one or more feature.
In description of the invention, " multiple " are meant that two or more, unless otherwise expressly limited specifically.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Company ", " connection " should be interpreted broadly, for example, it may be being fixedly connected, or being detachably connected, or be integrally connected；Can
Being to be mechanically connected, or electrically connect or mutually can communicate；Can be joined directly together, it is also possible to by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
The first and second feature directly contacts can be included, it is also possible to be not directly contact including the first and second features but by it
Between other characterisation contact.And, fisrt feature second feature " on ", " top " and " above " it is special including first
Levy directly over second feature and oblique upper, or fisrt feature level height is merely representative of higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " below ", or be merely representative of immediately below second feature and obliquely downward including fisrt feature
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the restriction present invention.Additionally, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or arranging
Relation.
Fig. 1 is referred to, Fig. 1 is that the first structure of the encapsulating structure of fingerprint recognition chip provided in an embodiment of the present invention is shown
It is intended to.
The encapsulating structure 100 of fingerprint recognition chip includes packaging body 10, fingerprint recognition chip 20 and at least two metals
Block 30.
Packaging body 10 includes supporting part (namely bottom), and at least two through holes are offered on the supporting part.Fingerprint recognition
Chip 20 and metal derby 30 are arranged on the inside of packaging body 10, and metal derby 30 is arranged in the through hole of supporting part.
In one embodiment, the material of packaging body 10 can be epoxy molding material (Epoxy Molding
Compound, abbreviation EMC) or phenolic resin or organic siliconresin etc..
Fingerprint recognition chip 20 and metal derby 30 are electrically connected with to be electrically connected with the encapsulating structure 100 of fingerprint recognition chip
To the circuit board of electronic installation.In one embodiment, the circuit board of electronic installation can such as flexible PCB
(Flexible Printed Circuit, abbreviation FPC) or printed circuit board (PCB) (Printed Circuit Board, referred to as
PCB) etc..
That is, fingerprint recognition chip 20 and metal derby 30 are electrically connected with, and the electricity of metal derby 30 and electronic installation
Road plate is electrically connected with, so that overall and electronic installation the circuit board of the encapsulating structure 100 of fingerprint recognition chip is electrically connected with.
That is, metal derby 30 can play a part of the circuit board that fingerprint recognition chip 20 is connected to electronic installation.
In one embodiment, the thickness of metal derby 30 can be configured so that less than 100 microns, for example can be by gold
The thickness of category block is set to 40 microns or 50 microns etc..
In a kind of embodiment, the encapsulating structure 100 of fingerprint recognition chip can also include at least two conductive parts, and this is led
Electric portion is used to accommodate and 20 corresponding circuit of fingerprint recognition chip, and each conductive part passes through the fingerprint recognition chip 20 and metal
Block 30 is electrically connected with.
It is understood that in the present embodiment, the sensing device in fingerprint recognition chip 20 is (such as capacitance structure or inductance
Structure) finger print information with receive user can be detected and the signal of telecommunication is generated, then by the electric signal transmission to being contained in conduction
In portion with 20 corresponding circuit of fingerprint recognition chip.As conductive part is electrically connected with metal derby 30, and metal derby 30 with
The circuit board of electronic installation is electrically connected with, therefore the signal of telecommunication can be transmitted to the circuit board of electronic installation and be processed, so as to
The finger print information of user is identified.
Fig. 2 is referred to, Fig. 2 is that second structure of the encapsulating structure of fingerprint recognition chip provided in an embodiment of the present invention is shown
It is intended to.
In one embodiment, at least two through holes can be opened up on fingerprint recognition chip 20, and each conductive part
40 can include line layer 41, extension 42 and weld part 43.
Line layer 41 can be arranged at the upper surface side of fingerprint recognition chip 20.For example, as shown in Fig. 2 the present embodiment
Middle line layer 41 can be arranged on the upper surface of fingerprint recognition chip 20.
Certainly, in another embodiment, line layer 41 can also be arranged on the upper surface of fingerprint recognition chip 20
Top, and 20 interval setting of line layer 41 and fingerprint recognition chip.
Extension 42 can be arranged in the through hole of fingerprint recognition chip 20.For example, the material of fingerprint recognition chip 20 is
Silicon Wafer, then silicon hole can be opened up on Silicon Wafer using through hole technology, then in the silicon hole arrange extension 42.
As shown in Fig. 2 in one embodiment, extension 42 can be arranged at the through hole of fingerprint recognition chip 20
Inner wall surface, and packed layer 50 is set around each extension 42.The packed layer 50 can be insulant.
It is understood that on the one hand, the packed layer 50 can play fixation to the circuit in extension 42.It is another
Aspect, the packed layer of insulant can also by the All other routes in the circuit in extension 42 and fingerprint recognition chip 20 every
Absolutely, it is to avoid short circuit between different circuits etc..
Weld part 43 can be arranged at the lower surface side of fingerprint recognition chip 20.For example, as shown in Fig. 2 the present embodiment
Middle weld part 43 can be arranged on the lower section of the lower surface of fingerprint recognition chip 20, and weld part 43 and fingerprint recognition chip 20
Interval setting.
Certainly, in another embodiment, weld part 43 can also be arranged on the lower surface of fingerprint recognition chip 20.
In one embodiment, as shown in Fig. 2 line layer 41 and extension 42 can be vertically arranged, and weld part 43
Can be arranged in parallel with line layer 41.
In one embodiment, as shown in Fig. 2 the cross-sectional length of weld part 43 can be with the cross-sectional length of metal derby 30
It is equal.That is, the two ends alignment of the two ends of weld part 43 and metal derby 30.
Certainly, in another embodiment, the cross-sectional length of weld part 43 can be less than the cross-sectional length of metal derby 30.
Or, the cross-sectional length of weld part 43 can also be more than the cross-sectional length of metal derby 30.
In one embodiment, welding can be formed between extension 42 and metal derby 30 by the technology of Reflow Soldering
Portion 43.
It should be noted that Reflow Soldering is a kind of solder technology of electronic manufacturing field.Adding in using solder reflow device
Air or nitrogen are heated to sufficiently high temperature after-blow to electronic component by heater circuit, make mutual bonding after electronic component thawing.
As shown in figure 3, in one embodiment, insulating barrier 60 can be provided with around each line layer 41.This is exhausted
Edge layer 60 is used for the line layer 41 for completely cutting off different conductive parts 40.
In one embodiment, the material of insulating barrier 60 can be silicon oxide and silicon nitride etc..
It should be noted that the material of insulating barrier 60 can be identical or different with the material of packed layer 50.
Around each weld part 43, insulating barrier 60 can also be set.The insulating barrier 60 is used to completely cut off different conductive parts 40
Weld layer 43.
In one embodiment, as shown in figure 3, the lower surface 31 of metal derby 30 can be with the supporting part of packaging body 10
Lower surface 11 is flushed.
In another embodiment, the lower surface 31 of metal derby 30 can also be with the lower surface of the supporting part of packaging body 10
11 have difference in height.
For example, as shown in figure 4, Fig. 4 is the 4th kind of the encapsulating structure of fingerprint recognition chip provided in an embodiment of the present invention
Structural representation.The lower surface 31 of metal derby 30 can be higher than the lower surface 11 of the supporting part of packaging body 10, namely metal derby 30
Lower surface 31 packaging body 10 supporting part lower surface 11 top, so as to the supporting part in metal derby 30 and packaging body 10
Between be formed with female.
Fig. 5 is referred to, Fig. 5 is that the 5th kind of structure of the encapsulating structure of fingerprint recognition chip provided in an embodiment of the present invention is shown
It is intended to.In another embodiment, the lower surface 31 of metal derby 30 can be less than the lower surface 11 of the supporting part of packaging body 10,
Namely the lower surface 31 of metal derby 30 is in the lower section of the lower surface 11 of the supporting part of packaging body 10, so as in metal derby 30 and encapsulation
Ledge is formed between the supporting part of body 10.
In one embodiment, the encapsulating structure of fingerprint recognition chip can also include a protective layer, and the protective layer can
To be arranged on the upper surface of the insulating barrier 60 for surrounding line layer 41, protect so as to be formed to fingerprint recognition chip 20, it is to avoid make
It is worn with the surface of process middle finger stricture of vagina identification chip 20.
In one embodiment, the material of the protective layer can be dielectric material of resinae etc..
Fig. 6 is referred to, Fig. 6 is that the 6th kind of structure of the encapsulating structure of fingerprint recognition chip provided in an embodiment of the present invention is shown
It is intended to.In one embodiment, packaging body 10 also includes the side wall being connected with the two ends of supporting part, the upper surface of protective layer 70
Can flush with the top surface of 10 liang of side walls of packaging body.
In another embodiment, as shown in fig. 7, the lower surface of protective layer 70 can cover 10 two ends of packaging body simultaneously
The upper surface of the insulating barrier 60 of the top surface and encirclement line layer 41 of side wall.
Fig. 8 is referred to, Fig. 8 is that the 8th kind of structure of the encapsulating structure of fingerprint recognition chip provided in an embodiment of the present invention is shown
It is intended to.In one embodiment, line layer 41 can be included in the multiple sub- line layer 411 being stacked in vertical direction,
It is electrically connected between different sub- line layers 411, and insulating barrier 60 can be set around different sub- line layers 411, is used for
The different sub- line layer 411 of isolation.
In another embodiment, the encapsulating structure of fingerprint recognition chip can not also include protective layer, but by sealing
Fingerprint recognition chip 20 is surrounded by dress body 10 and metal derby 30, as shown in Figure 9.
Figure 10 is referred to, the present embodiment also provides a kind of electronic installation, the electronic installation can include display screen 200, outer
The encapsulating structure of the fingerprint recognition chip provided by shell 300, the present embodiment, and circuit board.
For example, the sectional view by the electronic installation shown in Figure 10 obtained by P1-P1 lines can be as shown in figure 11.The electronics
Device includes display screen 200, shell 300, the encapsulating structure of fingerprint recognition chip and circuit board 400.The fingerprint recognition chip
Encapsulating structure can include packaging body 10, fingerprint recognition chip 20, metal derby 30, line layer 41, extension 42, weld part
43rd, packed layer 50, insulating barrier 60 and protective layer 70.
The encapsulating structure of fingerprint recognition chip is electrically connected with circuit board 400 by metal derby 30, fingerprint recognition chip
Encapsulating structure and circuit board 400 are arranged on the inside of the host cavity that display screen 200 and shell 300 are formed.
The encapsulating structure and electronic installation of fingerprint recognition chip provided in an embodiment of the present invention, including the knowledge of packaging body, fingerprint
Other chip and metal derby.The packaging body includes supporting part, and at least two through holes are offered on the supporting part, the fingerprint recognition
Chip and the metal derby are arranged on the inside of the packaging body, and the metal derby is arranged in the through hole of the supporting part.The fingerprint
Identification chip and the metal derby are electrically connected with, and the circuit board of the metal derby and electronic installation is electrically connected with, so that should
The encapsulating structure of fingerprint recognition chip is electrically connected on the circuit board of electronic installation.Due to the fingerprint recognition core in the present embodiment
Piece is electrically connected with metal derby, and the metal derby is electrically connected with circuit board again, therefore the fingerprint recognition chip in the present embodiment can
To be electrically connected with circuit board by metal derby, without being electrically connected with circuit board by traditional substrate.Further, since
The metal derby is may be mounted in the through hole of packaging body supporting part, and need not be used to set in the external additional space that increases of encapsulation
Put metal derby, namely the fingerprint chip-packaging structure that provided of the present embodiment eliminates the space of substrate, so the present embodiment can
To reduce the thickness of fingerprint recognition chip-packaging structure.
In order to promote to understand one or more exemplary embodiments, the exemplary embodiment illustrated in reference to accompanying drawing, and
And using concrete syntax describing these embodiments.However, this concrete syntax is not limiting as the scope of idea of the invention,
But exemplary embodiment should be understood to cover all exemplary embodiments that those skilled in the art typically understands.
Word " mechanism ", " element ", " mode " and " configuration " is to refer to, and is not limited to mechanically or physically embodiment, and
It is the software program that may include to combine with processor etc..
The specific embodiment being illustrated and described herein is the illustrative examples of the present invention, and is not intended to limit by any way
The scope of the present invention processed.For brevity, in terms of the other functions of conventional electronic devices, control system, software development and system
(and the part in the single operation part of system) can be not described in detail.Additionally, the connecting line illustrated in each accompanying drawing or connection
Device is intended to indicate the example functional relationships between each element and/or physically or logically connects.It should be noted that can deposit in actual device
In many replacements or the connection of extra functional relationship, physical connection or logic.Additionally, except not element is specifically described as " necessity
" or " crucial ", otherwise, part or part are not requisite for the practice present invention.In technical elements,
The open implication of the expression such as word " including " used herein, " having ".
Term " one " and " described " and similar word have been used (especially during description idea of the invention
In the appended claims), it should be construed to not only cover odd number but also cover plural number by these terms.Additionally, unless herein
In be otherwise noted, otherwise herein describe numerical range when belong to relevant range every to refer to merely by quick method
Individual independent value, and each independent value is incorporated in this specification, just as these values have individually carried out statement one herein
Sample.In addition, unless otherwise stated herein or context have it is clearly contrary point out, institute otherwise specifically described herein is methodical
Step can be performed by any appropriate order.The step of change of the present invention is not limited to description order.Unless in addition
Advocate, otherwise using any and all example presented herein or exemplary language (for example, " such as ") be all only
It is better described idea of the invention, and not the scope of idea of the invention is any limitation as.Without departing from spirit and model
In the case of enclosing, those skilled in the art becomes readily apparent that various modifications and adaptation.
It should be understood that illustrative embodiments as herein described should be to be considered only as descriptive, and it is not limited to.
The description of feature or aspect should be generally considered suitable for other exemplary embodiments in each illustrative embodiments
Similar characteristics or aspect.Although the present invention is described with reference to exemplary embodiment, can advise that those skilled in the art enters
Row various change and change.The invention is intended to cover these changes in the scope of the appended claims and change.
Claims (13)
1. a kind of encapsulating structure of fingerprint recognition chip, it is characterised in that the encapsulating structure includes packaging body, fingerprint recognition core
Piece and at least two metal derbies；
The packaging body includes supporting part, and at least two through holes are offered on the supporting part；
The fingerprint recognition chip and the metal derby are arranged on the inside of the packaging body, and the metal derby is arranged at described holding
In at least two through holes in load portion；
The fingerprint recognition chip is electrically connected with for the encapsulating structure to be electrically connected to electronic installation with the metal derby
On circuit board.
2. the encapsulating structure of fingerprint recognition chip according to claim 1, it is characterised in that：The encapsulating structure also includes
At least two conductive parts, the conductive part are used to accommodate circuit corresponding with the fingerprint recognition chip, each conductive part
The fingerprint recognition chip and the metal derby are electrically connected with through the fingerprint recognition chip.
3. the encapsulating structure of fingerprint recognition chip according to claim 2, it is characterised in that：In the fingerprint recognition chip
On offer at least two through holes, each conductive part at least includes line layer, extension and weld part；
The line layer is arranged at the upper surface side of the fingerprint recognition chip；
The extension is arranged in the through hole of the fingerprint recognition chip；
The weld part is arranged at the lower surface side of the fingerprint recognition chip, and the weld part is electrically connected with the metal derby
Connect.
4. the encapsulating structure of fingerprint recognition chip according to claim 3, it is characterised in that：Each extension is arranged
In the inner wall surface of the through hole of the corresponding fingerprint recognition chip, packed layer is provided with around each extension.
5. the encapsulating structure of fingerprint recognition chip according to claim 4, it is characterised in that：The line layer and described prolong
Extending portion is vertically arranged, and the weld part is be arranged in parallel with the line layer.
6. the encapsulating structure according to arbitrary described fingerprint recognition chip in claim 3 to 5, it is characterised in that：The welding
Cross-sectional length of the cross-sectional length in portion less than the metal derby；Or the cross-sectional length of the weld part is equal to the metal derby
Cross-sectional length；Or the cross-sectional length of the weld part is more than the cross-sectional length of the metal derby.
7. the encapsulating structure according to arbitrary described fingerprint recognition chip in claim 3 to 6, it is characterised in that：Each described
It is provided with insulating barrier around line layer and each weld part, the insulating barrier is used to completely cutting off variant line layer and variant
Weld part.
8. the encapsulating structure of fingerprint recognition chip according to claim 7, it is characterised in that：The line layer is included in vertical
The multiple sub- line layer that Nogata is stacked upwards, is provided with insulating barrier around each sub- line layer.
9. the encapsulating structure according to arbitrary described fingerprint recognition chip in claim 1 to 8, it is characterised in that：The metal
The lower surface of block is flushed with the lower surface of the supporting part；Or the lower surface of the lower surface of the metal derby and the supporting part
There is difference in height.
10. the encapsulating structure of fingerprint recognition chip according to claim 7, it is characterised in that：The encapsulating structure is also wrapped
Protective layer is included, the protective layer is arranged on the upper surface of the insulating barrier for surrounding the line layer.
The encapsulating structure of 11. fingerprint recognition chips according to claim 10, it is characterised in that：The packaging body also includes
The side wall being connected with the two ends of the supporting part, the upper surface of the protective layer are flushed with the top surface of the side wall.
The encapsulating structure of 12. fingerprint recognition chips according to claim 10, it is characterised in that：The packaging body also includes
The side wall being connected with the two ends of the supporting part, the lower surface of the protective layer cover the top surface of the side wall.
13. a kind of electronic installations, it is characterised in that the electronic installation includes the finger as described in arbitrary in claim 1 to 12
The encapsulating structure of stricture of vagina identification chip, and circuit board, encapsulating structure and the circuit board of the fingerprint recognition chip electrically connect
Connect, so that the electronic installation is identified to the finger print information of user.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710138399.3A CN106684067B (en) | 2017-03-09 | 2017-03-09 | Fingerprint identification chip packaging structure and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710138399.3A CN106684067B (en) | 2017-03-09 | 2017-03-09 | Fingerprint identification chip packaging structure and electronic device |
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| CN106684067A true CN106684067A (en) | 2017-05-17 |
| CN106684067B CN106684067B (en) | 2023-09-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107123602A (en) * | 2017-06-12 | 2017-09-01 | 江阴长电先进封装有限公司 | The encapsulating structure and its manufacture method of a kind of fingerprint recognition chip |
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| CN104615979A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module and encapsulation method thereof, and fingerprint identification module group and encapsulation method thereof |
| CN106033753A (en) * | 2015-03-12 | 2016-10-19 | 恒劲科技股份有限公司 | Packaging module and substrata structure |
| CN206602109U (en) * | 2017-03-09 | 2017-10-31 | 广东欧珀移动通信有限公司 | The encapsulating structure and electronic installation of fingerprint recognition chip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107123602A (en) * | 2017-06-12 | 2017-09-01 | 江阴长电先进封装有限公司 | The encapsulating structure and its manufacture method of a kind of fingerprint recognition chip |
| CN107123602B (en) * | 2017-06-12 | 2019-06-21 | 江阴长电先进封装有限公司 | A kind of encapsulating structure and its manufacturing method of fingerprint recognition chip |
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