KR101320973B1 - Integrated circuit device package and method for manufacturing the same - Google Patents

Abstract

PURPOSE: An integrated circuit device package and a method for manufacturing the same are provided to be applied to a bending region by forming a protection member made of a flexible material. CONSTITUTION: A substrate has one surface and the other surface. The substrate comprises a line. An integrated circuit device (20) has the line and an electrical connection part surface-touching the line. A fixing member (24) insulates a residual region except the surface-touching region. A protection member (30) is formed on one surface of the substrate.

Description

[0001] Integrated circuit device package and method for manufacturing same [0002]

The present invention relates to an integrated circuit device package and a method of manufacturing the same, and more particularly, to a flexible integrated circuit device package that can be flexed and unfolded freely and a method of manufacturing the same.

Currently, the electronics industry is broadening its application range. Accordingly, packaging technologies for integrated circuit devices, such as semiconductor memories, are also increasingly required for high capacity, thinness, and miniaturization, and various solutions for solving them are being developed. In particular, in recent years, flexible integrated circuit devices capable of flexing have been developed, and flexibly integrated circuit device packages capable of flexing with the above-mentioned integrated circuit devices have been developed. An example of a flexible integrated circuit device package capable of flexing is disclosed in Korean Patent No. 643,756 and the like.

However, the technology for flexible flexible integrated circuit device packages is still in the development stage.

It is an object of the present invention to provide an integrated circuit device package that is applicable to bent or warped locations and a method of manufacturing the same.

An integrated circuit device package according to an embodiment of the present invention for achieving the above object has a flexible substrate having one side and the other surface, the wiring is formed to enable electrical connection from the other surface to one surface, and the electrical connection is possible A flexible integrated circuit device including an electrical connection unit, the wiring provided on one surface of the substrate and the electrical connection unit to be in contact with each other, and an area in which the wiring provided on one surface of the substrate and the electrical connection unit are arranged to interview each other. An insulating flexible fixing member formed on one surface of the substrate and the remaining regions of the integrated circuit device facing each other such that the integrated circuit device is fixedly disposed on one surface of the substrate while insulated between the remaining areas except the other regions; and the integrated circuit device Flexible protective member formed on one surface of the substrate including a It can be compared.

In the integrated circuit device package according to an embodiment of the present invention mentioned above, the substrate may include a flexible printed circuit board, the integrated circuit device may have a thickness of 5 to 30㎛ to bend, The fixing member may include an adhesive of a film structure, and the protective member may include a protective tape, an insulator for a flexible printed circuit board, or a composite structure thereof.

In the integrated circuit device package according to an embodiment of the present invention, the wiring may include copper and may be formed in one side, the other side of the substrate, and a through hole connecting one side and the other side of the substrate.

In the integrated circuit device package according to an embodiment of the present invention, a solder resist may be provided between the wires provided on the other surface of the substrate to insulate the wires provided on the other surface of the substrate.

In accordance with another aspect of the present invention, there is provided a method of manufacturing an integrated circuit device package, the method comprising: forming a wiring film that is electrically connected to the other surface of a flexible substrate, and the electrical connection unit provided in the integrated circuit device. Fixing the integrated circuit device on one surface of the substrate by interposing an insulating flexible fixing member between the surface of the substrate and the integrated circuit device so as to face one surface of the substrate; and including the integrated circuit device. Forming a flexible protective member on one surface of the substrate, forming a through hole from the other surface of the substrate to the electrical connection portion to expose the electrical connection portion of the integrated circuit device, and the wiring provided on the other surface of the substrate; The through hole and the electrical connection exposed to electrically connect the electrical connection; Forming a wire on one surface of the substrate may be provided.

In the method of manufacturing an integrated circuit device package according to an embodiment of the present invention, the substrate may include a flexible printed circuit board, and the integrated circuit device may have a thickness of 5 to 30 μm to allow bending. The fixing member may include an adhesive of a film structure, and the protective member may include a protective tape, an insulator for a flexible printed circuit board, or a composite structure thereof.

In the method of manufacturing an integrated circuit device package according to an embodiment of the present invention mentioned above, the through hole may be formed by performing a laser drilling or photolithography process.

In the method of manufacturing an integrated circuit device package according to an embodiment of the present invention, a wire may be formed on one surface of the substrate to which the through hole and the electrical connection part are exposed by electroplating.

According to the integrated circuit device package and the manufacturing method thereof of the present invention, both of the components of the integrated circuit device package, the substrate, the integrated circuit device, the insulating member, the wiring and the protection member are provided to have a flexible material, ≪ / RTI >

Therefore, the integrated circuit device package of the present invention can be bent or expanded freely, so that it can be applied to a bent or bent portion.

1 is a cross-sectional view schematically illustrating an integrated circuit device package according to an embodiment of the present invention.
2A through 2D are schematic views illustrating a method of manufacturing the integrated circuit device package of FIG. 1.

While the present invention has been described in connection with certain exemplary embodiments, it is obvious to those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. In describing the drawings, similar reference numerals are used for similar components. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Example

1 is a cross-sectional view schematically illustrating an integrated circuit device package according to an embodiment of the present invention.

Referring to FIG. 1, the integrated circuit device package 100 includes a substrate 10, an integrated circuit device 20, a protection member 30, a fixing member 24, and the like.

The mentioned substrate 10 has one side and the other side. The substrate 10 has a flexible structure that can be bent. Thus, examples of the substrate 10 include a flexible printed circuit board (FPCB) and the like. In addition, the board | substrate 10 is equipped with wiring 41a, 41b, 41c. In particular, the wirings 41a, 41b, and 41c are formed to enable electrical connection from one surface of the substrate 10 to one surface. That is, the wirings 41a, 41b, and 41c may include the wiring 41a formed on the other surface of the substrate 10, the wiring 41b formed on one surface of the substrate, and the wirings formed on the other surface and one surface of the substrate 10, respectively. The wiring 41c formed in the through hole 43 which connects 41a and 41b is provided. Thus, the wirings 41a, 41b, and 41c are formed by patterning as described later. In addition, insulation must be made between the wirings 41a, 41b, and 41c formed on the substrate 10. Thus, an insulating material is formed in portions of the wirings 41a, 41b, and 41c formed on the substrate 10 that require insulation. In particular, in the present invention, the wirings 41a provided on the other surface of the substrate 10 can be insulated from each other. Therefore, the wiring 41a formed on the other surface of the substrate 10 is insulated using an insulating material. However, in the present invention, the insulation between the wirings 41a provided on the other surface of the substrate 10 is described, but the present invention is not limited thereto. That is, if necessary, the wirings 41b provided on one surface of the substrate 10 may be insulated from each other. Here, the soldering resist 45 etc. are mentioned as an example of the insulating material which insulates the wiring 41a, 41b mentioned above. In addition, although the wiring 41c is formed in the side wall in the through-hole 43 in this invention, it is not limited to this. In other words, the wiring 41c may be formed so as to be sufficiently filled in the through hole 43. In addition, since the substrate 10 mentioned above must be bent in spite of having the wirings 41a, 41b, and 41c, the wirings 41a, 41b, and 41c must be made of a flexible material that can be bent in the case of the wirings 41a, 41b, and 41c. 41b, 41c) may include copper or the like.

The integrated circuit device 20 may include semiconductor devices such as memory devices, non-memory devices, and the like. In addition, the integrated circuit device 20 may include an active element, a passive element, and the like. And the integrated circuit element 20 has a flexible structure capable of bending. Accordingly, the integrated circuit device 20 may include a silicon substrate having a thin thickness. In particular, in the case of a silicon substrate having a thin thickness for use as the integrated circuit device 20 described above, it may be provided to have a thickness of about several to several tens of micrometers. For example, the warpable thin thickness may be about 1.0 to 50 占 퐉, and preferably about 5.0 to 30.0 占 퐉. This is because when the integrated circuit device 20 has a thickness less than about 1.0 μm, the integrated circuit device 20 may not be easily manufactured. When the integrated circuit device 20 exceeds about 50 μm, the integrated circuit device 20 may be easily bent. Because it does not.

In addition, the integrated circuit device 20 has an electrical connection 20a capable of electrical connection. That is, the integrated circuit device 20 includes an electrical connection part 20a for electrical connection between the internal circuit pattern of the integrated circuit device 20 and an external device. Thus, the electrical connection portion 20a of the integrated circuit device 20 mentioned above may be disposed to interview the wiring 41b formed on one surface of the substrate 10. Therefore, it can be understood that the integrated circuit device package 100 of the present invention has a flip chip stacked structure. That is, the integrated circuit device package 100 of the present invention can be understood as a flip chip stack structure using the electrical connection unit 20a, not the electrical connection using the bumps. In particular, in the integrated circuit device package 100 of the present invention, a wiring 41b connected to one surface of the substrate 10 through a through hole 43 among the wirings 41a, 41b, and 41c formed in the substrate 10. ) Can be electrically connected by being arranged to interview each other.

The fixing member 24 mentioned above is integrated on one surface of the substrate 10 while insulating between the wiring 41b provided on one surface of the substrate 10 and the remaining regions except for the region in which the electrical connection portions 20a are arranged to be in contact with each other. The circuit device 20 may be formed on one surface of the substrate 10 and the remaining areas of the integrated circuit device 20 facing each other such that the circuit device 20 is fixedly disposed. That is, the fixing member 24 is interposed between the one surface of the substrate 10 and the integrated circuit device 20 disposed to face the one surface of the substrate 10, and thus the wiring provided on one surface of the substrate 10. 41b and the electrical connection part 20a are formed between remaining areas except the area | region arrange | positioned so that it may mutually interview. In addition, the fixing member 24 should also have a flexible structure capable of bending. Thus, examples of the fixing member 24 include an adhesive of a film structure. Examples of the adhesive of the film structure include double-sided tape and the like. In addition, the fixing member 24 may insulate the wiring 41b formed on one surface of the substrate 10 and the electrical connection portion 20a of the integrated circuit device 20 between the remaining regions. In this way, the integrated circuit device 20 is formed by forming the fixing member 24 in the remaining region except for the region in which the wiring 41b and the electrical connection portion 20a provided on one surface of the substrate 10 are in contact with each other. Not only can it be fixedly placed on one surface of 10, but the other regions can be insulated.

The protection member 30 mentioned above is formed on one surface of the substrate 10 on which the integrated circuit device 20 is disposed and fixed to protect the integrated circuit device 20. That is, the protection member 30 is formed on one surface of the substrate 10 including the integrated circuit device 20 to sufficiently cover the integrated circuit device 20. Here, the protective member 30 has a flexible structure that can be bent. Thus, examples of the protective member 30 include a protective tape, an insulating material for a flexible printed circuit board, and the like. In particular, both the protective tape and the insulation for the flexible printed circuit board may have a film structure.

As mentioned, the integrated circuit device package 100 according to an exemplary embodiment of the present invention is flexible in which the substrate 10, the integrated circuit device 20, the fixing member 24, and the protection member 30 are all bent. It is made of material. Thus, the aforementioned integrated circuit device package 100 can be bent or unfolded freely, and as a result, it is applicable to a bent or bent portion.

Hereinafter, a method of manufacturing the integrated circuit device package 100 according to an embodiment of the present invention will be described.

2A through 2D are schematic views illustrating a method of manufacturing the integrated circuit device package of FIG. 1.

Referring to FIG. 2A, a substrate 10 having one surface and the other surface is provided. Here, the substrate 10 is made of a flexible material because it must be warpable. Accordingly, the substrate 10 may include a flexible printed circuit board or the like. In addition, the other surface of the substrate 10 is formed with a wiring film 41 that can be electrically connected. In particular, in the case of the wiring film 41 mentioned above, since the bending should be possible, the copper film may be mainly included. Therefore, the wiring film 41 mentioned above can be understood as a copper film. Here, the wiring film 41 mentioned above may be provided as the wiring 41a formed on the other surface of the substrate 10 by performing patterning described later.

Referring to FIG. 2B, the integrated circuit device 20 is disposed on one surface of the substrate 10. In particular, the electrical connection 20a of the integrated circuit device 20 is disposed to face one surface of the substrate 10. Here, the electrical connection part 20a mentioned above interviews the wiring 41b formed in one surface of the board | substrate 10 mentioned later. Accordingly, the integrated circuit device package 100 of the present invention has a flip chip structure because the wiring 41b formed on one surface of the substrate 10 and the electrical connection portion 20a of the integrated circuit device 20 are arranged to be interviewed. I can understand that. In addition, when the integrated circuit device 20 is disposed on one surface of the substrate 10, a fixing member 24 may be interposed between the integrated circuit device 20 and one surface of the substrate 10. That is, the fixing member 24 is provided so that the integrated circuit device 20 is fixedly disposed on one surface of the substrate 10. Here, the fixing member 24 mentioned above may have an insulating material. In addition, the fixing member 24 should be made of a flexible material capable of bending. Therefore, the fixing member 24 in the present invention may be made of an insulating flexible material. As an example of the fixing member 24 mentioned above, the adhesive of a film structure, such as a double-sided tape, etc. are mentioned.

Referring to FIG. 2C, the protection member 30 is formed on one surface of the substrate 10 on which the integrated circuit device 20 is disposed and fixed to protect the integrated circuit device 20 from the outside. That is, the protection member 30 is formed on one surface of the substrate 10 including the integrated circuit device 20 so as to cover the integrated circuit device 20 sufficiently. Here, the protective member 30 has a flexible structure that can be bent. Thus, examples of the protective member 30 include a protective tape, an insulating material for a flexible printed circuit board, and the like. In particular, both the protective tape and the insulation for the flexible printed circuit board may have a film structure.

Referring to FIG. 2D, the electrical connection 20a of the integrated circuit device 20 mentioned above is exposed. Accordingly, the through hole 43 is formed from the other surface of the substrate 10 to the electrical connection portion 20a of the integrated circuit device 20. That is, the through hole 43 is formed from the other surface of the lower substrate 10 where the electrical connection portion 20a of the integrated circuit element 20 is located to the electrical connection portion 20a of the integrated circuit element 20. In other words, the electrical connection 20a of the integrated circuit device 20 is patterned by sequentially removing the wiring film 41, the substrate 10, and the fixing member 24 formed on the other surface of the substrate 10. To form a through hole 43 to expose. Here, the formation of the aforementioned through hole 43 can be achieved by performing a laser drilling, photolithography process, or the like. In particular, the wiring film 41 formed on the other surface of the substrate 10 by patterning for forming the through hole 43 may be provided as the wiring 41a formed on the other surface of the substrate 10.

Subsequently, the through hole 43 and the electrical connection part 20a are exposed to electrically connect the wiring 41a provided on the other surface of the substrate 10 and the electrical connection part 20a exposed by the through hole 43. Wirings 41b and 41c are formed on one surface 10. That is, the wirings 41b and 41c are formed from the wiring 41a provided on the other surface of the substrate 10 to one surface of the substrate 10 through the through hole 43. In other words, the wirings 41a, 41b, and 41c which are electrically connected to the one surface of the substrate 10 through the through hole 43 from the other surface of the substrate 10 are formed. Accordingly, the wiring 41b formed on one surface of the substrate 10 and the electrical connection portion 20a of the integrated circuit device 20 are electrically connected to each other. In this case, the electrical connection part 20a of the integrated circuit device 20 is electrically connected to the wiring 41b formed on one surface of the substrate 10 through the through hole 43. In addition, the wiring 41c formed in the through hole 43 may be understood to be mainly formed only on the sidewall of the through hole 43, but may be formed to be sufficiently filled in the through hole 43. In addition, the above-mentioned through holes 43 and the wirings 41b and 41c formed on one surface of the substrate 10 can be obtained mainly by performing electroplating.

An insulating material such as solder resist 45 is used to insulate the wirings 41a formed on the other surface of the substrate 10.

In addition, although not shown in FIG. 2A, a fixing film may be attached to the other surface of the substrate 10 to perform a subsequent process. This is because the components of the integrated circuit device package 100 of the present invention are all made of a flexible material that can be bent, so as to achieve a more stable process by attaching a fixing film to perform the process.

As described above, the flexible substrate 10 having the wirings 41a, 41b, and 41c formed to enable electrical connection from the other surface to one surface by performing the manufacturing method of the present invention, and is provided on one surface of the substrate 10 The flexible integrated circuit device 20 in which the wiring 41b and the electrical connecting portion 20a are interviewed with each other, and the wiring 41b and the electrical connecting portion 20a provided on one surface of the substrate 10 are arranged to interview each other. An insulating layer formed on one surface of the substrate 10 and the remaining regions of the integrated circuit device 20 facing each other such that the integrated circuit device 20 is fixedly disposed on one surface of the substrate 10 while insulating between the remaining areas except the region. Flexible protection formed on one surface of the substrate 10 including the flexible fixing member 24 and the integrated circuit device 20 to cover the integrated circuit device 20 to protect the integrated circuit device 20 from the outside The warp provided with the member 30 Possible, it is possible to obtain a flexible integrated circuit device package 100.

As mentioned, in the method of manufacturing the integrated circuit device package 100 according to the exemplary embodiment, all of the substrate 10, the integrated circuit device 20, the fixing member 24, and the protection member 30 are bent. Use this flexible material as possible. Thus, the integrated circuit device package 100 obtained by the above-described manufacturing method can be bent or unfolded freely, and as a result, it is applicable to a bent or warped area.

As mentioned above, according to the integrated circuit device package of the present invention and the manufacturing method thereof, both the components of the integrated circuit device package, the substrate, the integrated circuit device, the fixing member, and the protecting member are provided to have a flexible material, Manufactured using the components mentioned.

Therefore, the integrated circuit device package of the present invention can be bent or expanded freely, so that it can be applied to a bent or bent portion.

10 substrate 20 integrated circuit device
20a: electrical connection 24: fixing member
30: protection member 41: film for wiring
41a, 41b, 41c: Wiring 43: Through Hole
45 solder resist 100 integrated circuit device package

Claims (8)

And the other surface having a surface, capable of warping a flexible substrate having a wiring which is formed an electrical connection to one side from the other surface said to be;
A flexible integrated circuit device having an electrical connection portion capable of electrical connection, and capable of bending a wire provided on one surface of the substrate and the electrical connection portion disposed to interview each other;
One surface of the substrate and the integrated circuit device may be fixed so that the integrated circuit device is fixedly disposed on one surface of the substrate while insulated between the wiring provided on one surface of the substrate and an area except the region where the electrical connection parts are arranged to be in contact with each other. a flexible holding member of insulating warp formed in the remaining areas facing each other as possible; And
An integrated circuit device package having a flexible protective member capable of bending formed on one surface of the substrate including the integrated circuit device. The method of claim 1, wherein the substrate comprises a flexible printed circuit board, the integrated circuit device has a thickness of 5 to 30㎛ to enable the bending, the fixing member comprises an adhesive of the film structure, the protective And the member comprises a protective tape, an insulator for a flexible printed circuit board, or a composite structure thereof. The integrated circuit device package of claim 1, wherein the wiring line comprises copper and is formed in one surface, the other surface of the substrate, and a through hole connecting one surface and the other surface of the substrate. The integrated circuit device package according to claim 1, further comprising a solder resist formed between the wirings provided on the other surface of the substrate to insulate the wirings provided on the other surface of the substrate. Forming a film for wiring to be electrically connected to the other surface of the flexible substrate which is capable of bending ;
The integrated circuit on one surface of the substrate is interposed between the one surface of the substrate and the integrated circuit device such that the electrical connection portion provided in the integrated circuit device that is capable of bending faces the one surface of the substrate. Fixedly placing the device;
Forming a flexible protective member capable of bending on one surface of the substrate including the integrated circuit device;
Forming a through hole from the other surface of the substrate to the electrical connection portion to expose the electrical connection portion of the integrated circuit device; And
And forming a wiring on one surface of the substrate to which the through hole and the electrical connecting portion are exposed to electrically connect the wiring provided on the other surface of the substrate and the electrical connecting portion. . The method of claim 5, wherein the substrate comprises a flexible printed circuit board, the integrated circuit device has a thickness of 5 to 30㎛ to enable the bending, the fixing member comprises an adhesive of the film structure, the protective The member includes a protective tape, an insulator for a flexible printed circuit board, or a composite structure thereof. 6. The method of claim 5, wherein the through hole is formed by performing a laser drilling or photolithography process. The method of claim 5, wherein a wiring is formed on one surface of the substrate to which the through hole and the electrical connector are exposed by electroplating.

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