CN106684067B - Fingerprint identification chip packaging structure and electronic device - Google Patents
Fingerprint identification chip packaging structure and electronic device Download PDFInfo
- Publication number
- CN106684067B CN106684067B CN201710138399.3A CN201710138399A CN106684067B CN 106684067 B CN106684067 B CN 106684067B CN 201710138399 A CN201710138399 A CN 201710138399A CN 106684067 B CN106684067 B CN 106684067B
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- Prior art keywords
- fingerprint identification
- metal block
- identification chip
- fingerprint
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Abstract
The embodiment of the invention discloses a packaging structure of a fingerprint identification chip and an electronic device. The packaging structure of the fingerprint identification chip comprises a packaging body, the fingerprint identification chip and at least two metal blocks; the package body comprises a bearing part, wherein at least two through holes are formed in the bearing part; the fingerprint identification chip and the metal block are arranged in the package body, and the metal block is arranged in at least two through holes of the bearing part; the fingerprint identification chip is electrically connected with the metal block so as to electrically connect the packaging structure of the fingerprint identification chip to a circuit board of the electronic device. The encapsulation structure of the fingerprint identification chip and the electronic device provided by the embodiment can reduce the thickness of the encapsulation structure of the fingerprint identification chip.
Description
Technical Field
The invention belongs to the technical field of fingerprint identification, and particularly relates to a packaging structure of a fingerprint identification chip and an electronic device.
Background
Fingerprint recognition technology has been widely used for personal authentication. For example, many terminals are equipped with fingerprint recognition chips for identity verification of the terminal owner. However, in the related art, the package structure of the fingerprint recognition chip is thick in terms of thickness.
Disclosure of Invention
The embodiment of the invention provides a packaging structure of a fingerprint identification chip and an electronic device, which can reduce the thickness of the packaging structure of the fingerprint identification chip.
The embodiment of the invention provides a packaging structure of a fingerprint identification chip, which comprises a packaging body, the fingerprint identification chip and at least two metal blocks;
the packaging body comprises a bearing part, and at least two through holes are formed in the bearing part;
the fingerprint identification chip and the metal block are arranged in the package body, and the metal block is arranged in at least two through holes of the bearing part;
the fingerprint identification chip is electrically connected with the metal block so as to electrically connect the packaging structure to a circuit board of the electronic device.
The embodiment of the invention also provides an electronic device, which comprises the packaging structure of the fingerprint identification chip and the circuit board, wherein the packaging structure of the fingerprint identification chip is electrically connected with the circuit board, so that the electronic device can identify fingerprint information of a user.
The embodiment of the invention provides a packaging structure of a fingerprint identification chip and an electronic device. The package body comprises a bearing part, at least two through holes are formed in the bearing part, the fingerprint identification chip and the metal block are arranged in the package body, and the metal block is arranged in the through holes of the bearing part. The fingerprint identification chip is electrically connected with the metal block, and the metal block is electrically connected with the circuit board of the electronic device, so that the packaging structure of the fingerprint identification chip is electrically connected to the circuit board of the electronic device. Since the fingerprint identification chip in the embodiment is electrically connected with the metal block, and the metal block is electrically connected with the circuit board, the fingerprint identification chip in the embodiment can be electrically connected with the circuit board through the metal block without being electrically connected with the circuit board through a traditional substrate. In addition, since the metal block can be installed in the through hole of the package body bearing part, no additional space is required to be added outside the package body for arranging the metal block, namely, the fingerprint chip package structure provided by the embodiment omits the space of the substrate, so that the thickness of the fingerprint identification chip package structure can be reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the invention and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.
For a more complete understanding of the present invention and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which like reference numerals represent like parts throughout the following description.
Fig. 1 is a schematic diagram of a first structure of a package structure of a fingerprint identification chip according to the present embodiment.
Fig. 2 is a schematic diagram of a second structure of a package structure of a fingerprint identification chip according to the present embodiment.
Fig. 3 is a schematic diagram of a third structure of a package structure of a fingerprint identification chip according to the present embodiment.
Fig. 4 is a schematic diagram of a fourth structure of a package structure of a fingerprint identification chip according to the present embodiment.
Fig. 5 is a schematic diagram of a fifth structure of a package structure of a fingerprint identification chip according to the present embodiment.
Fig. 6 is a schematic diagram of a sixth structure of a package structure of a fingerprint identification chip according to the present embodiment.
Fig. 7 is a seventh structural schematic diagram of a package structure of a fingerprint identification chip according to the present embodiment.
Fig. 8 is a schematic diagram of an eighth structure of a package structure of a fingerprint identification chip according to the present embodiment.
Fig. 9 is a schematic diagram of a ninth structure of a package structure of a fingerprint identification chip according to the present embodiment.
Fig. 10 is a schematic structural diagram of an electronic device according to the present embodiment.
Fig. 11 is a schematic structural view of the electronic device of fig. 10 in a cross-sectional view taken along the line P1-P1.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a package structure of a fingerprint identification chip according to an embodiment of the invention.
The fingerprint recognition chip package structure 100 includes a package body 10, a fingerprint recognition chip 20, and at least two metal blocks 30.
The package 10 includes a carrier portion (i.e., a bottom portion), on which at least two through holes are opened. The fingerprint recognition chip 20 and the metal block 30 are mounted inside the package body 10, and the metal block 30 is disposed in the through hole of the carrier.
In one embodiment, the material of the package body 10 may be epoxy molding compound (Epoxy Molding Compound, abbreviated as EMC) or phenolic resin or silicone resin, etc.
The fingerprint recognition chip 20 and the metal block 30 are electrically connected to electrically connect the package structure 100 of the fingerprint recognition chip to a circuit board of the electronic device. In one embodiment, the circuit board of the electronic device may be, for example, a flexible circuit board (Flexible Printed Circuit, abbreviated as FPC) or a printed circuit board (Printed Circuit Board, abbreviated as PCB) or the like.
That is, the fingerprint recognition chip 20 is electrically connected to the metal block 30, and the metal block 30 is electrically connected to the circuit board of the electronic device, so that the whole package structure 100 of the fingerprint recognition chip is electrically connected to the circuit board of the electronic device. That is, the metal block 30 may function as a circuit board connecting the fingerprint recognition chip 20 to the electronic device.
In one embodiment, the thickness of the metal block 30 may be set to not more than 100 micrometers, for example, the thickness of the metal block may be set to 40 micrometers or 50 micrometers, or the like.
In one embodiment, the package structure 100 of the fingerprint recognition chip may further include at least two conductive parts for accommodating the circuit corresponding to the fingerprint recognition chip 20, and each conductive part penetrates the fingerprint recognition chip 20 and is electrically connected with the metal block 30.
It will be appreciated that in this embodiment, the sensing device (e.g., capacitive structure or inductive structure) in the fingerprint recognition chip 20 may detect and receive fingerprint information of a user and generate an electrical signal, and then transmit the electrical signal to the circuit corresponding to the fingerprint recognition chip 20 accommodated in the conductive part. Because the conductive part is electrically connected with the metal block 30, and the metal block 30 is electrically connected with the circuit board of the electronic device, the electric signal can be transmitted to the circuit board of the electronic device for processing, so that fingerprint information of a user can be identified.
Referring to fig. 2, fig. 2 is a schematic diagram of a second structure of a package structure of a fingerprint identification chip according to an embodiment of the invention.
In one embodiment, at least two through holes may be formed on the fingerprint recognition chip 20, and each conductive portion 40 may include a circuit layer 41, an extension portion 42, and a soldering portion 43.
The wiring layer 41 may be disposed at the upper surface side of the fingerprint recognition chip 20. For example, as shown in fig. 2, the circuit layer 41 may be provided on the upper surface of the fingerprint recognition chip 20 in this embodiment.
Of course, in another embodiment, the circuit layer 41 may also be disposed above the upper surface of the fingerprint recognition chip 20, and the circuit layer 41 and the fingerprint recognition chip 20 are disposed at intervals.
The extension 42 may be disposed in a through hole of the fingerprint recognition chip 20. For example, the fingerprint recognition chip 20 is made of a silicon wafer, and then a through hole technology may be used to form a through silicon hole on the silicon wafer, and then the extension portion 42 is disposed in the through silicon hole.
As shown in fig. 2, in one embodiment, the extension portions 42 may be provided to the inner wall surface of the through hole of the fingerprint recognition chip 20, and the filling layer 50 may be provided around each extension portion 42. The filler layer 50 may be an insulating material.
It will be appreciated that, on the one hand, the filler layer 50 may act as a securing for the wiring in the extension 42. On the other hand, the filling layer of the insulating material may also isolate the circuit in the extension portion 42 from other circuits in the fingerprint identification chip 20, so as to avoid short circuits between different circuits.
The soldering part 43 may be provided at the lower surface side of the fingerprint recognition chip 20. For example, as shown in fig. 2, the soldering portion 43 may be provided below the lower surface of the fingerprint recognition chip 20 in the present embodiment, and the soldering portion 43 and the fingerprint recognition chip 20 may be provided at a spacing.
Of course, in another embodiment, the soldering portion 43 may also be provided on the lower surface of the fingerprint recognition chip 20.
In one embodiment, as shown in fig. 2, the wire layer 41 and the extension portion 42 may be vertically disposed, and the soldering portion 43 and the wire layer 41 may be disposed in parallel.
In one embodiment, as shown in fig. 2, the cross-sectional length of the weld 43 may be equal to the cross-sectional length of the metal block 30. That is, both ends of the welded portion 43 are aligned with both ends of the metal block 30.
Of course, in another embodiment, the cross-sectional length of the weld 43 may be less than the cross-sectional length of the metal block 30. Alternatively, the cross-sectional length of the welded portion 43 may be longer than the cross-sectional length of the metal block 30.
In one embodiment, the weld 43 may be formed between the extension 42 and the metal block 30 by a reflow technique.
Reflow soldering is a soldering technique in the field of electronic manufacturing. And heating air or nitrogen to a high enough temperature by using a heating circuit in the reflow soldering equipment, and blowing the air or nitrogen to the electronic components to enable the electronic components to be mutually bonded after melting.
As shown in fig. 3, in one embodiment, an insulating layer 60 may be provided around each wiring layer 41. The insulating layer 60 is used to isolate the wiring layers 41 of the different conductive portions 40.
In one embodiment, the material of the insulating layer 60 may be silicon oxide, silicon nitride, or the like.
Note that the material of the insulating layer 60 may be the same as or different from the material of the filling layer 50.
An insulating layer 60 may be provided around each of the welded portions 43. The insulating layer 60 is used to isolate the solder layers 43 of the different conductive portions 40.
In one embodiment, as shown in fig. 3, the lower surface 31 of the metal block 30 may be flush with the lower surface 11 of the carrier portion of the package body 10.
In another embodiment, the lower surface 31 of the metal block 30 may have a height difference from the lower surface 11 of the carrier portion of the package body 10.
For example, as shown in fig. 4, fig. 4 is a schematic diagram of a fourth structure of a package structure of a fingerprint identification chip according to an embodiment of the present invention. The lower surface 31 of the metal block 30 may be higher than the lower surface 11 of the carrier of the package body 10, i.e., the lower surface 31 of the metal block 30 is above the lower surface 11 of the carrier of the package body 10, so that a concave portion is formed between the metal block 30 and the carrier of the package body 10.
Referring to fig. 5, fig. 5 is a schematic diagram of a fifth structure of a package structure of a fingerprint identification chip according to an embodiment of the invention. In yet another embodiment, the lower surface 31 of the metal block 30 may be lower than the lower surface 11 of the carrier of the package body 10, i.e., the lower surface 31 of the metal block 30 is below the lower surface 11 of the carrier of the package body 10, so that a protruding portion is formed between the metal block 30 and the carrier of the package body 10.
In one embodiment, the package structure of the fingerprint recognition chip may further include a protection layer, which may be disposed on the upper surface of the insulation layer 60 surrounding the circuit layer 41, so as to protect the fingerprint recognition chip 20 from abrasion or the like of the surface of the fingerprint recognition chip 20 during use.
In one embodiment, the material of the protective layer may be a dielectric material such as a resin.
Referring to fig. 6, fig. 6 is a schematic diagram of a sixth structure of a package structure of a fingerprint identification chip according to an embodiment of the invention. In one embodiment, the package body 10 further includes sidewalls connected to both ends of the carrier portion, and the upper surface of the protective layer 70 may be flush with the top surfaces of the sidewalls of both ends of the package body 10.
In another embodiment, as shown in fig. 7, the lower surface of the protective layer 70 may cover both the top surface of the sidewalls of the both ends of the package body 10 and the upper surface of the insulating layer 60 surrounding the wiring layer 41.
Referring to fig. 8, fig. 8 is a schematic diagram illustrating an eighth structure of a package structure of a fingerprint identification chip according to an embodiment of the invention. In one embodiment, the wiring layer 41 may include a plurality of sub-wiring layers 411 stacked in a vertical direction, electrically connected between the different sub-wiring layers 411, and an insulating layer 60 may be disposed around the different sub-wiring layers 411 to isolate the different sub-wiring layers 411.
In another embodiment, the package structure of the fingerprint recognition chip may not include a protection layer, but the fingerprint recognition chip 20 is surrounded by the package body 10 and the metal block 30, as shown in fig. 9.
Referring to fig. 10, the present embodiment further provides an electronic device, which may include a display screen 200, a housing 300, a package structure of the fingerprint identification chip provided in the present embodiment, and a circuit board.
For example, a cross-sectional view of the electronic device shown in fig. 10 taken along the line P1-P1 may be as shown in fig. 11. The electronic device includes a display screen 200, a housing 300, a fingerprint recognition chip package structure, and a circuit board 400. The package structure of the fingerprint recognition chip may include a package body 10, a fingerprint recognition chip 20, a metal block 30, a circuit layer 41, an extension 42, a soldering part 43, a filling layer 50, an insulating layer 60, and a protective layer 70.
The encapsulation structure of the fingerprint identification chip is electrically connected with the circuit board 400 through the metal block 30, and the encapsulation structure of the fingerprint identification chip and the circuit board 400 are installed in the accommodating cavity formed by the display screen 200 and the housing 300.
The embodiment of the invention provides a packaging structure of a fingerprint identification chip and an electronic device. The package body comprises a bearing part, at least two through holes are formed in the bearing part, the fingerprint identification chip and the metal block are arranged in the package body, and the metal block is arranged in the through holes of the bearing part. The fingerprint identification chip is electrically connected with the metal block, and the metal block is electrically connected with the circuit board of the electronic device, so that the packaging structure of the fingerprint identification chip is electrically connected to the circuit board of the electronic device. Since the fingerprint identification chip in the embodiment is electrically connected with the metal block, and the metal block is electrically connected with the circuit board, the fingerprint identification chip in the embodiment can be electrically connected with the circuit board through the metal block without being electrically connected with the circuit board through a traditional substrate. In addition, since the metal block can be installed in the through hole of the package body bearing part, no additional space is required to be added outside the package body for arranging the metal block, namely, the fingerprint chip package structure provided by the embodiment omits the space of the substrate, so that the thickness of the fingerprint identification chip package structure can be reduced.
For the purposes of promoting an understanding of one or more exemplary embodiments, reference will now be made to the exemplary embodiments illustrated in the drawings and specific language will be used to describe the same. However, this specific language is not intended to limit the scope of the inventive concept, but rather the exemplary embodiments should be understood to cover all exemplary embodiments that are generally known to those skilled in the art.
The terms "mechanism," "element," "manner," and "configuration" refer broadly and are not limited to mechanical or physical embodiments, but may include software programs in combination with a processor or the like.
The particular embodiments shown and described herein are illustrative examples of the invention and are not intended to limit the scope of the invention in any way. For the sake of brevity, conventional electronics, control systems, software development and other functional aspects of the systems (and components of the individual operating components of the systems) may not be described in detail. Furthermore, the connecting lines or connectors shown in the various figures are intended to represent exemplary functional relationships and/or physical or logical connections between the various elements. It should be noted that many alternative or additional functional relationships, physical connections, or logical connections may be present in a practical device. Furthermore, no part or component is essential to the practice of the invention unless the element is specifically described as "essential" or "critical". In technical terms, the words "comprise", "have" and the like as used herein are to be interpreted in an open-ended fashion.
The use of the terms "a" and "an" and "the" and similar referents in the context of describing the concepts of the invention (especially in the context of the following claims) are to be construed to cover both the singular and the plural. Furthermore, unless otherwise indicated herein, recitation of ranges of values herein are merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein. In addition, the steps of all methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The changes of the invention are not limited to the order of the steps described. The use of any and all examples, or exemplary language (e.g., "such as") provided herein, is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention unless otherwise claimed. Numerous modifications and adaptations will be readily apparent to those skilled in the art without departing from the spirit and scope.
It should be understood that the exemplary embodiments described herein are to be considered merely descriptive and not as limiting. The description of features or aspects in each of the exemplary embodiments should generally be construed as applicable to similar features or aspects in other exemplary embodiments. While the present invention has been described with reference to exemplary embodiments, various changes and modifications may be suggested to one skilled in the art. The present invention is intended to embrace those changes and modifications that fall within the scope of the appended claims.
Claims (12)
1. The packaging structure of the fingerprint identification chip is characterized by comprising a packaging body, the fingerprint identification chip and at least two metal blocks;
the packaging body comprises a bearing part, and at least two through holes are formed in the bearing part;
the fingerprint identification chip and the metal block are arranged in the package body, and the metal block is arranged in at least two through holes of the bearing part;
the fingerprint identification chip is electrically connected with the metal block so as to electrically connect the packaging structure to a circuit board of the electronic device;
the packaging structure further comprises at least two conductive parts, wherein the conductive parts are used for accommodating circuits corresponding to the fingerprint identification chips, and each conductive part penetrates through the fingerprint identification chip to electrically connect the fingerprint identification chip with the metal block;
the package body further comprises side walls connected with two ends of the bearing part, the side walls are attached to the side faces of the fingerprint identification chips, and the bearing part and the side walls are matched to enable the fingerprint identification chips to be enclosed in the package body.
2. The fingerprint recognition chip package structure according to claim 1, wherein: at least two through holes are formed in the fingerprint identification chip, and each conductive part at least comprises a circuit layer, an extending part and a welding part;
the circuit layer is arranged on one side of the upper surface of the fingerprint identification chip;
the extension part is arranged in a through hole of the fingerprint identification chip;
the welding part is arranged on one side of the lower surface of the fingerprint identification chip, and the welding part is electrically connected with the metal block.
3. The fingerprint recognition chip package structure according to claim 2, wherein: each extension part is arranged on the inner wall surface of the through hole of the corresponding fingerprint identification chip, and a filling layer is arranged around each extension part.
4. The fingerprint recognition chip package structure of claim 3, wherein: the circuit layer and the extension portion are vertically arranged, and the welding portion and the circuit layer are arranged in parallel.
5. The package structure of a fingerprint recognition chip according to any one of claims 2 to 4, wherein: the section length of the welding part is smaller than that of the metal block; or the section length of the welding part is equal to the section length of the metal block; or the section length of the welding part is larger than the section length of the metal block.
6. The package structure of a fingerprint recognition chip according to any one of claims 2 to 4, wherein: and an insulating layer is arranged around each circuit layer and each welding part and is used for isolating each different circuit layer and each different welding part.
7. The fingerprint recognition chip package structure according to claim 6, wherein: the circuit layer includes a plurality of sub-circuit layers stacked in a vertical direction, and an insulating layer is provided around each of the sub-circuit layers.
8. The package structure of a fingerprint recognition chip according to any one of claims 2 to 4, wherein: the lower surface of the metal block is flush with the lower surface of the bearing part; or the lower surface of the metal block and the lower surface of the bearing part have a height difference.
9. The fingerprint recognition chip package structure according to claim 6, wherein: the packaging structure further comprises a protective layer, wherein the protective layer is arranged on the upper surface of the insulating layer surrounding the circuit layer.
10. The fingerprint recognition chip package structure according to claim 9, wherein: the upper surface of the protective layer is flush with the top surface of the sidewall.
11. The fingerprint recognition chip package structure according to claim 9, wherein: the lower surface of the protective layer covers the top surface of the side wall.
12. An electronic device, characterized in that the electronic device comprises the packaging structure of the fingerprint identification chip as claimed in any one of claims 1 to 11, and a circuit board, wherein the packaging structure of the fingerprint identification chip is electrically connected with the circuit board, so that the electronic device can identify fingerprint information of a user.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710138399.3A CN106684067B (en) | 2017-03-09 | 2017-03-09 | Fingerprint identification chip packaging structure and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710138399.3A CN106684067B (en) | 2017-03-09 | 2017-03-09 | Fingerprint identification chip packaging structure and electronic device |
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| CN106684067A CN106684067A (en) | 2017-05-17 |
| CN106684067B true CN106684067B (en) | 2023-09-29 |
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| CN107123602B (en) * | 2017-06-12 | 2019-06-21 | 江阴长电先进封装有限公司 | A kind of encapsulating structure and its manufacturing method of fingerprint recognition chip |
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| CN101369591A (en) * | 2007-08-17 | 2009-02-18 | 精材科技股份有限公司 | Image sensing element packaging body and preparation thereof |
| CN104615979A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module and encapsulation method thereof, and fingerprint identification module group and encapsulation method thereof |
| CN106033753A (en) * | 2015-03-12 | 2016-10-19 | 恒劲科技股份有限公司 | Packaging module and substrata structure |
| CN206602109U (en) * | 2017-03-09 | 2017-10-31 | 广东欧珀移动通信有限公司 | The encapsulating structure and electronic installation of fingerprint recognition chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9768037B2 (en) * | 2014-05-16 | 2017-09-19 | Infineon Technologies Ag | Electronic device package including metal blocks |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101369591A (en) * | 2007-08-17 | 2009-02-18 | 精材科技股份有限公司 | Image sensing element packaging body and preparation thereof |
| CN104615979A (en) * | 2015-01-27 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification module and encapsulation method thereof, and fingerprint identification module group and encapsulation method thereof |
| CN106033753A (en) * | 2015-03-12 | 2016-10-19 | 恒劲科技股份有限公司 | Packaging module and substrata structure |
| CN206602109U (en) * | 2017-03-09 | 2017-10-31 | 广东欧珀移动通信有限公司 | The encapsulating structure and electronic installation of fingerprint recognition chip |
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