CN106662312A - 基于发光二极管的日行灯 - Google Patents
基于发光二极管的日行灯 Download PDFInfo
- Publication number
- CN106662312A CN106662312A CN201580047182.0A CN201580047182A CN106662312A CN 106662312 A CN106662312 A CN 106662312A CN 201580047182 A CN201580047182 A CN 201580047182A CN 106662312 A CN106662312 A CN 106662312A
- Authority
- CN
- China
- Prior art keywords
- led
- drl
- polymer composition
- carrier
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims abstract description 30
- 229920000642 polymer Polymers 0.000 claims abstract description 17
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 16
- 239000003365 glass fiber Substances 0.000 claims abstract description 11
- 239000004020 conductor Substances 0.000 claims abstract description 10
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 12
- 239000000654 additive Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims 2
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 13
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 13
- 239000000463 material Substances 0.000 description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 5
- 229920001519 homopolymer Polymers 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000004513 sizing Methods 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006399 behavior Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 2
- 235000010234 sodium benzoate Nutrition 0.000 description 2
- 239000004299 sodium benzoate Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 235000012222 talc Nutrition 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- HSQFVBWFPBKHEB-UHFFFAOYSA-N 2,3,4-trichlorophenol Chemical compound OC1=CC=C(Cl)C(Cl)=C1Cl HSQFVBWFPBKHEB-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/02—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments
- B60Q1/04—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights
- B60Q1/18—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights being additional front lights
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/02—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments
- B60Q1/04—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights
- B60Q1/0483—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights mounted on a bracket, e.g. details concerning the mouting of the lamps on the vehicle body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
包含载体的基于发光二极管(LED)的日行灯(DRL),所述载体包含含有聚对苯二甲酸乙二醇酯和玻璃纤维的聚合物组合物,所述载体的表面包含用于安装一个或多个LED的导体轨道。
Description
日行灯(DRL)(也称为昼行灯)是公路机动车或自行车前面的汽车闪电装置和自行车闪电装置,最终在车辆向前移动时自动打开,从而发射白色、黄色或琥珀色光以增加在白天条件下车辆的能见度。
日行灯在冬季持续黑暗的斯堪的纳维亚国家首先授权并感知到安全益处。
日行灯的功能最初是通过以最高强度或降低的强度操作近光前照灯或甚至雾灯,通过以降低的强度操作远光前照灯,或者通过稳定地燃烧前转向信号等来实现的。
欧盟指令2008/89/EC要求在2011年2月7日或之后在欧盟批准的所有乘用车和I型小型货车配备日行灯。该命令于2012年8月扩展到卡车和公共汽车。不再允许提供双重功能的DLR,例如将前照灯或前转向信号灯灯或雾灯作为DRL操作,并且欧盟指令要求功能特定的日行灯符合ECE规章87,并根据ECE规章48被安装到车辆上以符合R87发射400-1200坎德拉的白光。在世界上的其它国家,DRL也是强制性的。
DLR能量消耗因实施情况而变化很大。迄今为止,基于发光二极管(LED)的DRL系统获得了最低能量消耗。因此,这种系统得到欧盟的支持,并且被认为在充分提高安全性的同时几乎不增加燃料消耗。通常使用几个LED的光束,所述光束有时构建在机动车辆的前照灯中。
市场上提供的现有技术中的基于LED的DRL基于聚碳酸酯载体和聚酰亚胺膜,其包括在膜上的导体轨道的结构。用金属夹将该膜安装在载体上。将LED焊接在膜的导体轨道上。膜和载体之间存在间隙以确保载体不被LED加热。
已知的基于LED的DRL的问题是其昂贵,这是因为它很难生产。另一个问题是,如果仅一个组件失效,则整个组装体在生产后必须被拒绝。另一个问题是,已知的基于LED的DRL在使用期间显示出大量故障。
US 2013/0193452中公开了一种LED系统,其具有符合三维载体(也称为散热器)的弯曲的层状结构。弯曲的层状结构包括类似的聚酰亚胺膜,其包含在膜上的导体轨道的结构。LED被焊接在膜的导体轨道上。三维载体是导热材料(如铝)或导热聚合物。该系统可应用于各种类型的灯,但并未提及DLR。
由US 2013/0193452已知的基于LED的DRL的问题在于,它仍然是昂贵的,这是因为它很难生产。另一个问题是,如果仅一个组件失效,则整个组装体在生产后必须被拒绝。
本发明的目标是提供基于LED的DRL,其具有简单得多的结构,以使得其不显示上述问题。
令人惊讶的是,通过提供包含载体的基于LED的DRL已实现了该目标,所述载体包含含有聚对苯二甲酸乙二醇酯、玻璃纤维和激光定向结构(LDS)添加剂的聚合物组合物,所述导体轨道是通过LDS工艺和随后的镀金属、优选地镀铜-镍-金来提供的。
通过这种方式,已经获得了具有非常简单的结构的DRL,载体是一个整合的单部件。DRL易于生产;由于高LED精度,生产后的拒绝非常低;并且DRL的故障也非常低。此外,载体显示出低脱气,例如当DRL整合在前照灯中时,这是非常重要的。令人惊讶的是,尽管组合物中存在玻璃纤维和LDS添加剂,但是组合物具有非常好的流动性能。最后,组合物的螺钉耐性(screw resisitance)高。这使得载体能够通过标准螺钉固定而安装到汽车上,同时提供仍然足够的汽车/道路振动模式耐性。
根据本发明的DRL可包含5-30个LED。优选地,DRL包含15-25个LED。优选地,LED在12伏特下每个LED消耗少于2瓦特、更优选地少于1瓦特、甚至更优选地少于0.75瓦特。这确保了足够的能见度、低能量消耗和载体的适度加热。
聚对苯二甲酸乙二醇酯聚合物是包含对苯二甲酸和乙二醇作为单体单元的聚酯。聚对苯二甲酸乙二醇酯还可以含有少量其它二酸(例如间苯二甲酸)或少量其它二醇(例如二乙二醇)作为共聚单体。优选地,载体的组合物至少包含聚对苯二甲酸乙二醇酯均聚物。聚对苯二甲酸乙二醇酯均聚物在本文中被理解为含有少于5mol%的不同于对苯二甲酸和乙二醇那些单体单元的单体单元。这种均聚物的优点是更高的熔点和更好的结晶行为。更优选地,聚对苯二甲酸乙二醇酯均聚物含有少于4mol%、甚至更优选少于3mol%、最优选少于2mol%的不同于对苯二甲酸和乙二醇那些单体单元的单体单元。优选地,组合物中至少50重量(wt)%、更优选地至少90重量%、最优选地至少95重量%的聚对苯二甲酸乙二醇酯是均聚物。
聚对苯二甲酸乙二醇酯的相对溶液粘度(RSV,在25℃下对1克聚合物在125克7/10(m/m)三氯苯酚/苯酚混合物中的溶液进行测定;基于ISO1628-5的方法)可以为1.50-2.00、优选地1.60-1.85、最优选地1.65-1.80。通常,较高的RSV导致组合物的强度和韧性得到改善,而较低的RSV促进熔体流动和结晶速度。在本发明的RSV范围时,达到了最佳性能,而不需要添加冲击改性剂或流动促进剂,这有利于甚至进一步延长RF外壳的使用期限。为了达到这些RSV值,聚对苯二甲酸乙二醇酯可已经以固态后缩合,例如通过在惰性气氛中使颗粒形式的组合物暴露于比其熔点低最多约10℃的高温持续数小时来实现。这种固态后缩合的另一个优点是:存在于组合物中并且可能影响组合物的加工性能或其模制部件的性质的任何挥发物基本上被除去。
聚合物组合物优选地含有成核剂以增强聚对苯二甲酸乙二醇酯的结晶。可以使用任何已知的成核剂作为成核剂。优选使用无机添加剂(例如微滑石)或金属羧酸盐,特别是碱金属羧酸盐(例如苯甲酸钠)。更优选地,苯甲酸钠的使用量为约0.05-0.5质量%(基于聚对苯二甲酸乙二醇酯)。
适用于聚合物组合物中的玻璃纤维可具有5-20μm、优选地8-15μm、最优选地9-11μm的纤维直径,用于机械性能和加工性能的最佳平衡。优选地,玻璃纤维的表面上具有胶料,所述胶料与聚对苯二甲酸乙二醇酯相容并且含有环氧官能化合物或氨基官能化合物。优选地,胶料含有环氧官能化合物。其优点是:在聚对苯二甲酸乙二醇酯中良好的分散性和改进的聚合物组合物的长期机械性能,特别是疲劳性能。
聚合物组合物可以含有10-60重量%的玻璃纤维。优选地,聚合物组合物含有30-50重量%、最优选地35-45重量%的玻璃纤维。
组合物优选地含有导热填料,以确保载体的良好热传导,以传送LED所产生的热。优选地,导热材料的热导率λ(W/m.K)比聚合物组合物(但不含热导材料)的热导率高优选地至少5倍、更优选地至少25倍、甚至更优选地至少100倍。
导热填料包括例如铝、氧化铝、铜、镁、氧化镁、黄铜、氮化硅、氮化铝、氮化硼、氧化锌、石墨(优选地膨胀石墨)、PITCH基碳纤维等填料。这种导热材料的混合物也是合适的。导热填料的形式可以为粒状粉末、颗粒、晶须、短纤维、薄片、小片、米、线或球状形状或任何其它合适的形式。相对于聚合物组合物的总量,导热填料的存在量为优选地1-10重量%、更优选地2-7重量%。
最优选地,导热材料是膨胀石墨,因为这是非常有效的。
组合物适当地包含周期系的d族或f族中的金属的无机金属化合物作为LDS添加剂。优选地,无机金属化合物是金属氧化物。优选氧化铜。最优选地,使用铜和镍化合物的混合物作为LDS添加剂。可通过以下方式产生导体轨迹:用二极管泵浦Nd:Yag激光辐照包含LDS添加剂的载体以释放金属核用于进一步的金属化处理。在另一步骤中,可将载体引入化学金属化浴中,以施加导体轨迹。
载体的组合物还可包含0-20质量%的其它纤维或微粒状矿物填料。优选使用填料颗粒,例如滑石或高岭土,这是因为它们有助于组合物的刚度,而不会不期望地增强组合物的性质的各向异性。
根据本发明的方法中使用的聚合物组合物还可以包含常用的添加剂,如稳定剂、抗氧化剂、着色剂、加工助剂(如脱模剂)、粘度改性剂(如扩链剂)、冲击改性等等。
优选地,聚合物组合物含有少于5重量%、更优选地少于3重量%、最优选地少于1重量%的常用添加剂。
Claims (4)
1.包含载体的基于发光二极管(LED)的日行灯(DRL),所述载体包含含有聚对苯二甲酸乙二醇酯、玻璃纤维和激光定向结构(LDS)添加剂的聚合物组合物,所述导体轨道是通过LDS工艺和随后的金属电镀提供的。
2.根据权利要求1所述的基于LED的DRL,其中所述聚合物组合物包含10-60重量%的玻璃纤维。
3.根据权利要求1所述的基于LED的DRL,其中所述聚合物组合物包含30-50重量%的玻璃纤维。
4.基于LED的DRL,其中所述聚合物组合物包含35-45重量%的玻璃纤维。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14183770.8 | 2014-09-05 | ||
EP14183770 | 2014-09-05 | ||
PCT/EP2015/066565 WO2016034323A1 (en) | 2014-09-05 | 2015-07-20 | A light emitting diode based daylight running light |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106662312A true CN106662312A (zh) | 2017-05-10 |
Family
ID=51483354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580047182.0A Pending CN106662312A (zh) | 2014-09-05 | 2015-07-20 | 基于发光二极管的日行灯 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20170283588A1 (zh) |
EP (1) | EP3189268A1 (zh) |
CN (1) | CN106662312A (zh) |
WO (1) | WO2016034323A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6710048B2 (ja) * | 2015-12-28 | 2020-06-17 | 川崎重工業株式会社 | 乗物 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1518850A (zh) * | 2001-07-05 | 2004-08-04 | Lpkf激光和电子股份公司 | 导体轨道结构及其制造方法 |
CN101688027A (zh) * | 2007-06-29 | 2010-03-31 | 帝斯曼知识产权资产管理有限公司 | 改进的反射镜光学系统 |
CN101784607A (zh) * | 2007-08-17 | 2010-07-21 | 帝斯曼知识产权资产管理有限公司 | 芳族聚碳酸酯组合物 |
CN103154135A (zh) * | 2011-03-18 | 2013-06-12 | 三菱化学欧洲合资公司 | 生产电路载体的方法 |
US20130193452A1 (en) * | 2012-01-31 | 2013-08-01 | E.I. Du Pont De Nemours And Company | Light emitting diode system and methods relating thereto |
CN103849126A (zh) * | 2012-11-29 | 2014-06-11 | 索尔维特殊聚合物美国有限责任公司 | 具有改进的热和光老化的聚酯组合物 |
US20140191263A1 (en) * | 2013-01-07 | 2014-07-10 | Sabic Innovative Plastics Ip B.V. | Compositions for an led reflector and articles thereof |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10132092A1 (de) * | 2001-07-05 | 2003-01-23 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und Verfahren zu ihrer Herstellung |
-
2015
- 2015-07-20 WO PCT/EP2015/066565 patent/WO2016034323A1/en active Application Filing
- 2015-07-20 EP EP15736853.1A patent/EP3189268A1/en not_active Withdrawn
- 2015-07-20 US US15/508,179 patent/US20170283588A1/en not_active Abandoned
- 2015-07-20 CN CN201580047182.0A patent/CN106662312A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1518850A (zh) * | 2001-07-05 | 2004-08-04 | Lpkf激光和电子股份公司 | 导体轨道结构及其制造方法 |
CN101688027A (zh) * | 2007-06-29 | 2010-03-31 | 帝斯曼知识产权资产管理有限公司 | 改进的反射镜光学系统 |
CN101784607A (zh) * | 2007-08-17 | 2010-07-21 | 帝斯曼知识产权资产管理有限公司 | 芳族聚碳酸酯组合物 |
CN103154135A (zh) * | 2011-03-18 | 2013-06-12 | 三菱化学欧洲合资公司 | 生产电路载体的方法 |
US20130193452A1 (en) * | 2012-01-31 | 2013-08-01 | E.I. Du Pont De Nemours And Company | Light emitting diode system and methods relating thereto |
CN103849126A (zh) * | 2012-11-29 | 2014-06-11 | 索尔维特殊聚合物美国有限责任公司 | 具有改进的热和光老化的聚酯组合物 |
US20140191263A1 (en) * | 2013-01-07 | 2014-07-10 | Sabic Innovative Plastics Ip B.V. | Compositions for an led reflector and articles thereof |
Also Published As
Publication number | Publication date |
---|---|
US20170283588A1 (en) | 2017-10-05 |
EP3189268A1 (en) | 2017-07-12 |
WO2016034323A1 (en) | 2016-03-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103968313B (zh) | 用于车辆的照明装置、散热装置和照明装置 | |
US20090154180A1 (en) | Heat-dissipating apparatus | |
US9506617B2 (en) | Combination LED fog lamp and daytime running lamp | |
US7736035B2 (en) | Seven inch round LED headlamp | |
KR102158330B1 (ko) | 방열구조체 일체형 pcb가 구비된 차량용 램프 | |
CN106662312A (zh) | 基于发光二极管的日行灯 | |
JP6531414B2 (ja) | ポリアミド樹脂組成物およびそれを成形してなる成形品 | |
KR102041737B1 (ko) | 방열성능이 향상된 차량 램프용 히트싱크 및 그 제조방법 | |
CN205118860U (zh) | 一种卡车智能同步尾灯 | |
CN201246652Y (zh) | 激光提示型机动车尾灯 | |
CN205853990U (zh) | 车用激光防雾尾灯 | |
JP4474649B2 (ja) | 車両用灯具 | |
WO2013068536A1 (en) | Vehicle light bezels | |
Paine et al. | Daytime running lights for motorcycles | |
KR20210021695A (ko) | 자동차용 led 헤드램프 모듈 | |
CN206555889U (zh) | 一种汽车用led大灯 | |
CN204611589U (zh) | 一种汽车 | |
CN219735075U (zh) | 一种自带透镜的led汽车灯 | |
CN211203910U (zh) | 一种用于汽车的电气设备 | |
CN106016123B (zh) | 外罩注塑一体式防水天使眼雾灯 | |
CN219761721U (zh) | 一种激光雷达的散热结构 | |
CN204687938U (zh) | 一种车灯结构及车辆 | |
CN109654451A (zh) | 一种可变换灯型的led车灯 | |
CN203797514U (zh) | 一种汽车大灯 | |
CN207455469U (zh) | 一种带不对称遮光罩的led前照灯及汽车和摩托车前照灯 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170510 |
|
WD01 | Invention patent application deemed withdrawn after publication |