CN106654849B - A kind of high heat-radiating semiconductor laser - Google Patents
A kind of high heat-radiating semiconductor laser Download PDFInfo
- Publication number
- CN106654849B CN106654849B CN201710158305.9A CN201710158305A CN106654849B CN 106654849 B CN106654849 B CN 106654849B CN 201710158305 A CN201710158305 A CN 201710158305A CN 106654849 B CN106654849 B CN 106654849B
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- China
- Prior art keywords
- heat
- ventilation hole
- semiconductor laser
- placing groove
- placement rack
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of high heat-radiating semiconductor lasers, including refrigerating seat, it is offered on the refrigerating seat along the cooling duct of refrigerating seat length direction setting, and one end of buffer gear is welded at the top of refrigerating seat, the other end of the buffer gear is welded with placement rack, and buffer gear is for buffering the vibration force transmitted between refrigerating seat and placement rack, placing groove is offered at the top of the placement rack, and heat-conducting plate is fixedly installed in the bottom interior wall of placing groove, the semiconductor laser chip mounting assembly in placing groove is placed on the heat-conducting plate, and card slot is offered on the two sides inner wall of placing groove, it is bolted on the side inner wall that the card slot is open far from card slot and push-rod electric machine is installed.The present invention has buffer capacity, and easy to disassemble, more can double-radiation function, radiating efficiency is high, and radiating rate is fast, and structure is simple, easy to use.
Description
Technical field
The present invention relates to field of laser device technology more particularly to a kind of high heat-radiating semiconductor lasers.
Background technique
With the continuous improvement of semiconductor laser output power, transfer efficiency and stability, high power semi-conductor
Laser being more widely applied in industry, medical treatment and military affairs, the market demand is huge, and development prospect is more wide.
The horizontal array for disclosing a kind of replacing chip application No. is 201010198093.5 patent document is high-power
Semiconductor laser, for providing a kind of horizontal-array high-power semiconductor laser of replacing chip, this semiconductor swashs
Light device is made of multiple independent chip mounting assemblies, and multiple chip mounting assemblies share a refrigerator, and each chip is installed
Heat dissipation between component will not interact, and still, radiating efficiency is low, with during be easy accumulation heat cause partly to lead
The damage of body laser chip mounting assembly.
Therefore, we have proposed a kind of high heat-radiating semiconductor lasers for solving the above problems.
Summary of the invention
Technical problems based on background technology, the invention proposes a kind of high heat-radiating semiconductor lasers.
A kind of high heat-radiating semiconductor laser proposed by the present invention, including refrigerating seat are offered along cold on the refrigerating seat
But the cooling duct of seat length direction setting, and one end of buffer gear is welded at the top of refrigerating seat, the buffer gear
The other end is welded with placement rack, and buffer gear is for buffering the vibration force transmitted between refrigerating seat and placement rack, the placement
The top of seat offers placing groove, and heat-conducting plate is fixedly installed in the bottom interior wall of placing groove, is placed on the heat-conducting plate
Semiconductor laser chip mounting assembly in placing groove, and card slot is offered on the two sides inner wall of placing groove, it is described
It is bolted on the side inner wall that card slot is open far from card slot and push-rod electric machine is installed, and welded on the output shaft of push-rod electric machine
It is connected to the fixture block being slidably mounted in card slot, push-rod electric machine drives fixture block to press in semiconductor laser chip mounting assembly,
For clamping semiconductor laser chip mounting assembly；The heat-conducting plate is connected with heat-dissipating pipe, and heat-dissipating pipe is located at placement rack
Bottom, the periphery of the heat-dissipating pipe is connected with multiple first cooling fins, and heat conductive rod is slidably fitted in heat-dissipating pipe, described thermally conductive
Stick extends in cooling duct far from one end of heat-dissipating pipe, and the periphery of heat conductive rod is connected with the second cooling fin, and described second dissipates
Backing is located in cooling duct, and the side of the placement rack is equipped with multiple the first ventilation holes being connected to placing groove, and placement rack
The other side be equipped with multiple the second ventilation holes being connected to placing groove.
Preferably, the buffer gear includes the fixed column that one end is welded at the top of refrigerating seat, and the other end of fixed column
Dashpot is offered, one end of spring is welded in the bottom interior wall of the dashpot, and the other end of spring is welded with sliding
The bumper post being installed in dashpot, the bumper post are welded in the bottom of placement rack far from one end of spring.
Preferably, the heat transmission that the heat-conducting plate is used to generate when running semiconductor laser chip mounting assembly is extremely
Heat-dissipating pipe, heat-dissipating pipe and the first cooling fin are used to distribute the heat of heat-conducting plate transmission.
Preferably, the heat conductive rod is used in the heat transmission to cooling duct of heat-dissipating pipe, and heat conductive rod and second dissipates
Backing is for distributing heat.
Preferably, the cross section of first ventilation hole and the second ventilation hole is trapezoidal.
Preferably, first ventilation hole is logical far from second less than the first ventilation hole close to one end path length of the second ventilation hole
One end path length of air holes, and the second ventilation hole is greater than the second ventilation hole far from the first ventilation close to one end path length of the first ventilation hole
One end path length in hole, first ventilation hole are greater than the second ventilation hole close to the first ventilation close to one end path length of the second ventilation hole
One end path length in hole.
In the present invention, a kind of high heat-radiating semiconductor laser can be convenient for by push-rod electric machine, fixture block and placing groove
Installation semiconductor laser chip mounting assembly is placed, is dissipated by heat-conducting plate, heat-dissipating pipe, the first cooling fin, heat conductive rod and second
The heat Quick diffusing that backing generates when can run semiconductor laser chip mounting assembly is gone out, and the first ventilation hole is passed through
It can accelerate the air passage rates in placing groove with the second ventilation hole, achieve the purpose that rapid cooling, pass through buffer gear energy
The vibration force transmitted between refrigerating seat and placement rack is enough buffered, the present invention has buffer capacity, and easy to disassemble, more can be dual
Heat dissipation, radiating efficiency is high, and radiating rate is fast, and structure is simple, easy to use.
Detailed description of the invention
Fig. 1 is that a kind of high heat-radiating semiconductor laser proposed by the present invention faces anatomy structural schematic diagram；
Fig. 2 is a kind of positive structure diagram of high heat-radiating semiconductor laser proposed by the present invention；
Fig. 3 is a kind of backsight structural representation of high heat-radiating semiconductor laser proposed by the present invention；
Fig. 4 is a kind of anatomy structural schematic diagram of the buffer gear of high heat-radiating semiconductor laser proposed by the present invention.
In figure: 1 refrigerating seat, 2 cooling ducts, 3 buffer gears, 31 fixed columns, 32 dashpots, 33 springs, 34 bumper posts, 4
Placement rack, 5 placing grooves, 6 heat-conducting plates, 7 semiconductor laser chip mounting assemblies, 8 card slots, 9 push-rod electric machines, 10 fixture blocks, 11 dissipate
Heat pipe, 12 first cooling fins, 13 heat conductive rods, 14 second cooling fins, 15 first ventilation holes, 16 second ventilation holes.
Specific embodiment
Combined with specific embodiments below the present invention is made further to explain.
Embodiment
Referring to Fig.1-4, the present embodiment proposes a kind of high heat-radiating semiconductor laser, including refrigerating seat 1, on refrigerating seat 1
It offers along the cooling duct 2 of 1 length direction of refrigerating seat setting, and the top of refrigerating seat 1 is welded with one end of buffer gear 3,
The other end of buffer gear 3 is welded with placement rack 4, and buffer gear 3 is used to buffering and transmit between refrigerating seat 1 and placement rack 4
Vibration force, the top of placement rack 4 offers placing groove 5, and heat-conducting plate 6 is fixedly installed in the bottom interior wall of placing groove 5, thermally conductive
It is placed with the semiconductor laser chip mounting assembly 7 in placing groove 5 on plate 6, and is opened on the two sides inner wall of placing groove 5
It equipped with card slot 8, is bolted on the side inner wall that card slot 8 is open far from card slot 8 and push-rod electric machine 9 is installed, and push rod electricity
The fixture block 10 being slidably mounted in card slot 8 is welded on the output shaft of machine 9, push-rod electric machine 9 drives fixture block 10 to press on semiconductor
In chip of laser mounting assembly 7, for clamping semiconductor laser chip mounting assembly 7；Heat-conducting plate 6 is connected with heat-dissipating pipe
11, and heat-dissipating pipe 11 is located at the bottom of placement rack 4, the periphery of heat-dissipating pipe 11 is connected with multiple first cooling fins 12, and heat-dissipating pipe
Heat conductive rod 13 is slidably fitted in 11, heat conductive rod 13 extends in cooling duct 2 far from one end of heat-dissipating pipe 11, and heat conductive rod 13
Periphery be connected with the second cooling fin 14, the second cooling fin 14 is located in cooling duct 2, the side of placement rack 4 be equipped with it is multiple with
The first ventilation hole 15 that placing groove 5 is connected to, and the other side of placement rack 4 is equipped with multiple the second ventilation holes being connected to placing groove 5
16, a kind of high heat-radiating semiconductor laser can be convenient for placing installation semiconductor by push-rod electric machine 9, fixture block 10 and placing groove 5
Chip of laser mounting assembly 7 passes through heat-conducting plate 6, heat-dissipating pipe 11, the first cooling fin 12, heat conductive rod 13 and the second cooling fin 14
The heat Quick diffusing generated when can run semiconductor laser chip mounting assembly 7 is gone out, and the first ventilation hole 15 is passed through
It can accelerate the air passage rates in placing groove 5 with the second ventilation hole 16, achieve the purpose that rapid cooling, pass through buffer gear
3 can buffer the vibration force transmitted between refrigerating seat 1 and placement rack 4, and the present invention has buffer capacity, and easy to disassemble, more can
Enough double-radiation functions, radiating efficiency is high, and radiating rate is fast, and structure is simple, easy to use.
In the present embodiment, buffer gear 3 includes the fixed column 31 that one end is welded in the top of refrigerating seat 1, and fixed column 31
The other end offers dashpot 32, and one end of spring 33, and the other end of spring 33 are welded in the bottom interior wall of dashpot 32
It is welded with the bumper post 34 being slidably mounted in dashpot 32, bumper post 34 is welded in placement rack 4 far from one end of spring 33
Bottom, the heat transmission that heat-conducting plate 6 is used to generate when running semiconductor laser chip mounting assembly 7 to heat-dissipating pipe 11 dissipate
Heat pipe 11 and the first cooling fin 12 are used to distribute the heat of the transmission of heat-conducting plate 6, and heat conductive rod 13 is used to pass the heat of heat-dissipating pipe 11
It transports in cooling duct 2, and heat conductive rod 13 and the second cooling fin 14 are for distributing heat, the first ventilation hole 15 and the second ventilation hole
16 cross section be it is trapezoidal, the first ventilation hole 15 is separate less than the first ventilation hole 15 close to one end path length of the second ventilation hole 16
One end path length of second ventilation hole 16, and the second ventilation hole 16 is greater than the second ventilation hole close to one end path length of the first ventilation hole 15
16 one end path lengths far from the first ventilation hole 15, the first ventilation hole 15 are greater than second close to one end path length of the second ventilation hole 16 and lead to
For air holes 16 close to one end path length of the first ventilation hole 15, a kind of high heat-radiating semiconductor laser passes through push-rod electric machine 9,10 and of fixture block
Placing groove 5 can be dissipated convenient for placing installation semiconductor laser chip mounting assembly 7 by heat-conducting plate 6, heat-dissipating pipe 11, first
The heat that backing 12, heat conductive rod 13 and the second cooling fin 14 generate when can run semiconductor laser chip mounting assembly 7
Quick diffusing is gone out, and can be accelerated the air passage rates in placing groove 5 by the first ventilation hole 15 and the second ventilation hole 16, be reached
To the purpose of rapid cooling, the vibration force transmitted between refrigerating seat 1 and placement rack 4 can be buffered by buffer gear 3, the present invention
Have buffer capacity, and easy to disassemble, more can double-radiation function, radiating efficiency is high, and radiating rate is fast, and structure is simple, user
Just.
In the present embodiment, semiconductor laser chip mounting assembly 7 is put into placing groove 5, push-rod electric machine is then started
9, push-rod electric machine 9 drives fixture block 10 to press in semiconductor laser chip mounting assembly 7, clamping semiconductor laser chip peace
Arrangement 7 completes installation, the heat transmission that heat-conducting plate 6 generates when running semiconductor laser chip mounting assembly 7 to heat dissipation
Pipe 11, heat-dissipating pipe 11 and the first cooling fin 12 distribute the heat of the transmission of heat-conducting plate 6, and heat conductive rod 13 is by the heat transmission of heat-dissipating pipe 11
To cooling duct 2, and heat conductive rod 13 and the second cooling fin 14 distribute heat, meanwhile, the first ventilation hole 15 and the second ventilation hole
16 accelerate the air passage rates in placing groove 5, achieve the purpose that rapid cooling.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (5)
1. a kind of high heat-radiating semiconductor laser, including refrigerating seat (1), which is characterized in that offer edge on the refrigerating seat (1)
The cooling duct (2) of refrigerating seat (1) length direction setting, and one end of buffer gear (3) is welded at the top of refrigerating seat (1),
The other end of the buffer gear (3) is welded with placement rack (4), and buffer gear (3) is for buffering refrigerating seat (1) and placement rack
(4) vibration force transmitted between offers placing groove (5) at the top of the placement rack (4), and the bottom interior wall of placing groove (5)
On be fixedly installed with heat-conducting plate (6), the semiconductor laser chip in placing groove (5) is placed on the heat-conducting plate (6)
Mounting assembly (7), and card slot (8) are offered on the two sides inner wall of placing groove (5), the card slot (8) is open far from card slot (8)
Side inner wall on be bolted and be equipped with push-rod electric machine (9), and sliding peace is welded on the output shaft of push-rod electric machine (9)
Loaded on the fixture block (10) in card slot (8), push-rod electric machine (9) drives fixture block (10) to press on semiconductor laser chip mounting assembly
(7) on, for clamping semiconductor laser chip mounting assembly (7)；The heat-conducting plate (6) is connected with heat-dissipating pipe (11), and dissipates
Heat pipe (11) is located at the bottom of placement rack (4), and the periphery of the heat-dissipating pipe (11) is connected with multiple first cooling fins (12), and dissipates
It is slidably fitted with heat conductive rod (13) in heat pipe (11), the heat conductive rod (13) extends to cooling logical far from the one end of heat-dissipating pipe (11)
In road (2), and the periphery of heat conductive rod (13) is connected with the second cooling fin (14), and second cooling fin (14) is located at cooling duct
(2) in, the side of the placement rack (4) is equipped with multiple the first ventilation holes (15) being connected to placing groove (5), and placement rack (4)
The other side be equipped with multiple the second ventilation holes (16) being connected to placing groove (5)；
The buffer gear (3) includes the fixed column (31) that one end is welded at the top of refrigerating seat (1), and fixed column (31) is another
End offers dashpot (32), and one end of spring (33), and spring (33) are welded in the bottom interior wall of the dashpot (32)
The other end be welded with the bumper post (34) being slidably mounted in dashpot (32), the bumper post (34) is far from spring (33)
One end is welded in the bottom of placement rack (4).
2. a kind of high heat-radiating semiconductor laser according to claim 1, which is characterized in that the heat-conducting plate (6) is used for
By the heat transmission that generates when semiconductor laser chip mounting assembly (7) operation to heat-dissipating pipe (11), heat-dissipating pipe (11) and the
One cooling fin (12) is used to distribute the heat of heat-conducting plate (6) transmission.
3. a kind of high heat-radiating semiconductor laser according to claim 1, which is characterized in that the heat conductive rod (13) is used for
The heat transmission of heat-dissipating pipe (11) is interior to cooling duct (2), and heat conductive rod (13) and the second cooling fin (14) are for distributing heat
Amount.
4. a kind of high heat-radiating semiconductor laser according to claim 1, which is characterized in that first ventilation hole (15)
Cross section with the second ventilation hole (16) is trapezoidal.
5. a kind of high heat-radiating semiconductor laser according to claim 1, which is characterized in that first ventilation hole (15)
One end path length of one end path length of close second ventilation hole (16) less than the first ventilation hole (15) far from the second ventilation hole (16), and
One end path length of second ventilation hole (16) close to the first ventilation hole (15) is greater than the second ventilation hole (16) far from the first ventilation hole
(15) one end path length, one end path length of first ventilation hole (15) close to the second ventilation hole (16) are greater than the second ventilation hole
(16) close to one end path length of the first ventilation hole (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710158305.9A CN106654849B (en) | 2017-03-17 | 2017-03-17 | A kind of high heat-radiating semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710158305.9A CN106654849B (en) | 2017-03-17 | 2017-03-17 | A kind of high heat-radiating semiconductor laser |
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| Publication Number | Publication Date |
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| CN106654849A CN106654849A (en) | 2017-05-10 |
| CN106654849B true CN106654849B (en) | 2019-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710158305.9A Active CN106654849B (en) | 2017-03-17 | 2017-03-17 | A kind of high heat-radiating semiconductor laser |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107182193B (en) * | 2017-07-25 | 2023-05-16 | 江苏中色锐毕利实业有限公司 | High heat conduction aluminum alloy radiator for automobile controller |
| CN111829381B (en) * | 2020-06-01 | 2024-01-09 | 佛山市伟卓铝业有限公司 | Aluminum alloy heat abstractor with automatic sealing mechanism |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS625679A (en) * | 1985-07-02 | 1987-01-12 | Nec Corp | Composite semiconductor laser device |
| CN204258031U (en) * | 2014-12-26 | 2015-04-08 | 北京镭宝光电技术有限公司 | A kind of air-cooling laser laser pump cavity device of diode pumping |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101469972B1 (en) * | 2007-10-17 | 2014-12-05 | 엘지이노텍 주식회사 | Semiconductor light emitting device and fabrication method thereof |
| US20130147050A1 (en) * | 2011-12-12 | 2013-06-13 | Advanced Cooling Technologies, Inc. | Semiconductor having integrally-formed enhanced thermal management |
-
2017
- 2017-03-17 CN CN201710158305.9A patent/CN106654849B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS625679A (en) * | 1985-07-02 | 1987-01-12 | Nec Corp | Composite semiconductor laser device |
| CN204258031U (en) * | 2014-12-26 | 2015-04-08 | 北京镭宝光电技术有限公司 | A kind of air-cooling laser laser pump cavity device of diode pumping |
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| Publication number | Publication date |
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| CN106654849A (en) | 2017-05-10 |
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