CN106654849A - High-heat-dissipation semiconductor laser - Google Patents
High-heat-dissipation semiconductor laser Download PDFInfo
- Publication number
- CN106654849A CN106654849A CN201710158305.9A CN201710158305A CN106654849A CN 106654849 A CN106654849 A CN 106654849A CN 201710158305 A CN201710158305 A CN 201710158305A CN 106654849 A CN106654849 A CN 106654849A
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- CN
- China
- Prior art keywords
- heat
- air vent
- semiconductor laser
- radiating
- welded
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a high-heat-dissipation semiconductor laser. The high-heat-dissipation semiconductor laser comprises a cooling base, wherein a cooling channel which is formed in the length direction of the cooling base is formed in the cooling base; one end of a buffer mechanism is welded on the top of the cooling base; a placement base is welded at the other end of the buffer mechanism; the buffer mechanism is used for buffering vibration force transferred between the cooling base and the placement base; a placement groove is formed in the top of the placement base; a heat conducting plate is fixedly mounted on the inner wall at the bottom of the placement groove; a semiconductor laser chip mounting assembly positioned in the placement groove is arranged on the heat conducting plate; clamping grooves are formed in the inner walls on the two sides of the placement groove respectively; and a push rod moor is fixedly mounted on the inner wall on one side, far from a clamping groove opening, of each clamping groove through a bolt separately. The high-heat-dissipation semiconductor laser has buffering capability, and is convenient to detach and assemble, capable of realizing dual heat dissipation, high in heat dissipation efficiency, high in heat dissipation speed, simple in structure and convenient to use.
Description
Technical field
The present invention relates to field of laser device technology, more particularly to a kind of high heat-radiating semiconductor laser instrument.
Background technology
With the continuous improvement of semiconductor laser power output, conversion efficiency and stability, high power semi-conductor
Laser instrument being more widely applied in industry, medical treatment and military affairs, the market demand is huge, and development prospect is more wide.
It is high-power that the patent document of Application No. 201010198093.5 discloses a kind of horizontal array of replacing chip
Semiconductor laser, for providing a kind of horizontal-array high-power semiconductor laser of replacing chip, this semiconductor swashs
Light device is made up of multiple independent chip mounting assemblies, and multiple chip mounting assemblies share a refrigerator, and each chip is installed
Radiating between component will not interact, but, its radiating efficiency is low, causes partly to lead heat is easily accumulated with during
Body laser chip mounting assembly is damaged.
Therefore, a kind of high heat-radiating semiconductor laser instrument is we have proposed for solving the above problems.
The content of the invention
Based on the technical problem that background technology is present, the present invention proposes a kind of high heat-radiating semiconductor laser instrument.
A kind of high heat-radiating semiconductor laser instrument proposed by the present invention, including refrigerating seat, offer along cold on the refrigerating seat
But the cooling duct that seat length direction is arranged, and the welded top of refrigerating seat has one end of buffer gear, the buffer gear
The other end is welded with placement rack, and buffer gear is used to buffer the vibration force transmitted between refrigerating seat and placement rack, the placement
The top of seat offers and be installed with standing groove, and the bottom interior wall of standing groove heat-conducting plate, is placed with the heat-conducting plate
Semiconductor laser chip mounting assembly in standing groove, and draw-in groove is offered on the both sides inwall of standing groove, it is described
Draw-in groove is welded away from being bolted to be provided with push-rod electric machine, and the output shaft of push-rod electric machine on the side inwall of draw-in groove opening
The fixture block being slidably mounted in draw-in groove is connected to, push-rod electric machine drives fixture block to press in semiconductor laser chip mounting assembly,
For clamping semiconductor laser chip mounting assembly；The heat-conducting plate is connected with radiating tube, and radiating tube is located at placement rack
Bottom, the periphery of the radiating tube is connected with multiple first fin, and heat conductive rod is slidably fitted with radiating tube, the heat conduction
Rod is extended in cooling duct away from one end of radiating tube, and the periphery of heat conductive rod is connected with the second fin, and described second dissipates
Backing is located in cooling duct, and the side of the placement rack is provided with multiple the first air vents connected with standing groove, and placement rack
Opposite side be provided with multiple the second air vents connected with standing groove.
Preferably, the buffer gear is welded in fixed column at the top of refrigerating seat, and the other end of fixed column including one end
Dashpot is offered, one end of spring is welded with the bottom interior wall of the dashpot, and the other end of spring is welded with slip
The bumper post being installed in dashpot, the bumper post is welded in the bottom of placement rack away from one end of spring.
Preferably, the heat-conducting plate is used for the heat transmission produced when semiconductor laser chip mounting assembly is run extremely
Radiating tube, radiating tube and the first fin are used to distribute the heat of heat-conducting plate transmission.
Preferably, the heat conductive rod is used in the heat transmission of radiating tube to cooling duct, and heat conductive rod and second dissipates
Backing is used to distribute heat.
Preferably, the cross section of first air vent and the second air vent is trapezoidal.
Preferably, first air vent is logical away from second less than the first air vent near one end path length of the second air vent
One end path length of air holes, and the second air vent is more than the second air vent away from the first ventilation near one end path length of the first air vent
One end path length in hole, first air vent is divulged information more than the second air vent near one end path length of the second air vent near first
One end path length in hole.
In the present invention, a kind of high heat-radiating semiconductor laser instrument can be easy to by push-rod electric machine, fixture block and standing groove
Place and semiconductor laser chip mounting assembly is installed, dissipated by heat-conducting plate, radiating tube, the first fin, heat conductive rod and second
The heat Quick diffusing that backing is produced when can semiconductor laser chip mounting assembly be run is gone out, by the first air vent
The air passage rates in standing groove can be accelerated with the second air vent, the purpose of quick heat radiating is reached, by buffer gear energy
The vibration force transmitted between refrigerating seat and placement rack is enough buffered, the present invention possesses buffer capacity, and is easy to dismounting, more can be dual
Radiating, radiating efficiency is high, and radiating rate is fast, and simple structure is easy to use.
Description of the drawings
Fig. 1 is that a kind of high heat-radiating semiconductor laser instrument proposed by the present invention faces anatomy structural representation；
Fig. 2 is a kind of positive structure diagram of high heat-radiating semiconductor laser instrument proposed by the present invention；
Fig. 3 is a kind of backsight structural representation of high heat-radiating semiconductor laser instrument proposed by the present invention；
Fig. 4 is a kind of anatomy structural representation of the buffer gear of high heat-radiating semiconductor laser instrument proposed by the present invention.
In figure：1 refrigerating seat, 2 cooling ducts, 3 buffer gears, 31 fixed columns, 32 dashpots, 33 springs, 34 bumper posts, 4
Placement rack, 5 standing grooves, 6 heat-conducting plates, 7 semiconductor laser chip mounting assemblies, 8 draw-in grooves, 9 push-rod electric machines, 10 fixture blocks, 11 dissipate
Heat pipe, 12 first fin, 13 heat conductive rods, 14 second fin, 15 first air vents, 16 second air vents.
Specific embodiment
The present invention is made with reference to specific embodiment further explain.
Embodiment
Reference picture 1-4, the present embodiment proposes a kind of high heat-radiating semiconductor laser instrument, including refrigerating seat 1, on refrigerating seat 1
The cooling duct 2 arranged along the length direction of refrigerating seat 1 is offered, and the welded top of refrigerating seat 1 has one end of buffer gear 3,
The other end of buffer gear 3 is welded with placement rack 4, and buffer gear 3 is used to buffer what is transmitted between refrigerating seat 1 and placement rack 4
Vibration force, the top of placement rack 4 offers and heat-conducting plate 6, heat conduction is installed with standing groove 5, and the bottom interior wall of standing groove 5
The semiconductor laser chip mounting assembly 7 in standing groove 5 is placed with plate 6, and is opened on the both sides inwall of standing groove 5
Draw-in groove 8 is provided with, is bolted on the side inwall that draw-in groove 8 is open away from draw-in groove 8 and push-rod electric machine 9 is installed, and push rod electricity
The fixture block 10 being slidably mounted in draw-in groove 8 is welded with the output shaft of machine 9, push-rod electric machine 9 drives fixture block 10 to press on semiconductor
In chip of laser mounting assembly 7, for clamping semiconductor laser chip mounting assembly 7；Heat-conducting plate 6 is connected with radiating tube
11, and radiating tube 11 is located at the bottom of placement rack 4, the periphery of radiating tube 11 is connected with multiple first fin 12, and radiating tube
Heat conductive rod 13 is slidably fitted with 11, heat conductive rod 13 is extended in cooling duct 2 away from one end of radiating tube 11, and heat conductive rod 13
Periphery be connected with the second fin 14, the second fin 14 is located in cooling duct 2, the side of placement rack 4 be provided with it is multiple with
First air vent 15 of the connection of standing groove 5, and the opposite side of placement rack 4 is provided with multiple the second air vents connected with standing groove 5
16, a kind of high heat-radiating semiconductor laser instrument can be easy to place by push-rod electric machine 9, fixture block 10 and standing groove 5 installs semiconductor
Chip of laser mounting assembly 7, by heat-conducting plate 6, radiating tube 11, the first fin 12, the fin 14 of heat conductive rod 13 and second
The heat Quick diffusing produced when can semiconductor laser chip mounting assembly 7 be run is gone out, by the first air vent 15
The air passage rates in standing groove 5 can be accelerated with the second air vent 16, the purpose of quick heat radiating is reached, by buffer gear
3 can buffer the vibration force transmitted between refrigerating seat 1 and placement rack 4, and the present invention possesses buffer capacity, and is easy to dismounting, more can
Enough double-radiation functions, radiating efficiency is high, and radiating rate is fast, and simple structure is easy to use.
In the present embodiment, buffer gear 3 is welded in the fixed column 31 at the top of refrigerating seat 1 including one end, and fixed column 31
The other end offers dashpot 32, and one end of spring 33, and the other end of spring 33 are welded with the bottom interior wall of dashpot 32
The bumper post 34 being slidably mounted in dashpot 32 is welded with, bumper post 34 is welded in placement rack 4 away from one end of spring 33
Bottom, heat-conducting plate 6 is used for the heat transmission produced when semiconductor laser chip mounting assembly 7 is run to radiating tube 11, dissipates
The fin 12 of heat pipe 11 and first is used to distribute the heat of the transmission of heat-conducting plate 6, and heat conductive rod 13 is used to pass the heat of radiating tube 11
Transport in cooling duct 2, and the fin 14 of heat conductive rod 13 and second is used to distribute heat, the first air vent 15 and the second air vent
16 cross section be it is trapezoidal, the first air vent 15 near the second air vent 16 one end path length less than the first air vent 15 away from
One end path length of the second air vent 16, and the second air vent 16 is more than the second air vent near one end path length of the first air vent 15
16 away from the first air vent 15 one end path length, the first air vent 15 is logical more than second near one end path length of the second air vent 16
, near one end path length of the first air vent 15, a kind of high heat-radiating semiconductor laser instrument is by push-rod electric machine 9, the and of fixture block 10 for air holes 16
Standing groove 5 can be easy to place installs semiconductor laser chip mounting assembly 7, is dissipated by heat-conducting plate 6, radiating tube 11, first
The heat that backing 12, the fin 14 of heat conductive rod 13 and second are produced when can semiconductor laser chip mounting assembly 7 be run
Quick diffusing is gone out, and the air passage rates in standing groove 5 can be accelerated by the first air vent 15 and the second air vent 16, is reached
To the purpose of quick heat radiating, the vibration force transmitted between refrigerating seat 1 and placement rack 4, the present invention can be buffered by buffer gear 3
Possess buffer capacity, and be easy to dismounting, more can double-radiation function, radiating efficiency is high, and radiating rate is fast, simple structure, user
Just.
In the present embodiment, semiconductor laser chip mounting assembly 7 is put into standing groove 5, then starts push-rod electric machine
9, push-rod electric machine 9 drives fixture block 10 to press in semiconductor laser chip mounting assembly 7, clamping semiconductor laser chip peace
Arrangement 7, completes to install, and the heat transmission that heat-conducting plate 6 is produced when semiconductor laser chip mounting assembly 7 is run is to radiating
Pipe 11, the fin 12 of radiating tube 11 and first distributes the heat of the transmission of heat-conducting plate 6, and heat conductive rod 13 is by the heat transmission of radiating tube 11
To cooling duct 2, and the fin 14 of heat conductive rod 13 and second distributes heat, meanwhile, the first air vent 15 and the second air vent
16 accelerate the air passage rates in standing groove 5, reach the purpose of quick heat radiating.
The above, the only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto,
Any those familiar with the art the invention discloses technical scope in, technology according to the present invention scheme and its
Inventive concept equivalent or change in addition, all should be included within the scope of the present invention.
Claims (6)
1. a kind of high heat-radiating semiconductor laser instrument, including refrigerating seat（1）, it is characterised in that the refrigerating seat（1）On offer edge
Refrigerating seat（1）The cooling duct that length direction is arranged（2）, and refrigerating seat（1）Welded top have buffer gear（3）One end,
The buffer gear（3）The other end be welded with placement rack（4）, and buffer gear（3）For buffering refrigerating seat（1）And placement rack
（4）Between transmit vibration force, the placement rack（4）Top offer standing groove（5）, and standing groove（5）Bottom interior wall
On be installed with heat-conducting plate（6）, the heat-conducting plate（6）On be placed with positioned at standing groove（5）Interior semiconductor laser chip
Mounting assembly（7）, and standing groove（5）Both sides inwall on offer draw-in groove（8）, the draw-in groove（8）Away from draw-in groove（8）Opening
Side inwall on be bolted push-rod electric machine be installed（9）, and push-rod electric machine（9）Output shaft on be welded with slip peace
Loaded on draw-in groove（8）Interior fixture block（10）, push-rod electric machine（9）Drive fixture block（10）Press on semiconductor laser chip mounting assembly
（7）On, for clamping semiconductor laser chip mounting assembly（7）；The heat-conducting plate（6）It is connected with radiating tube（11）, and dissipate
Heat pipe（11）Positioned at placement rack（4）Bottom, the radiating tube（11）Periphery be connected with multiple first fin（12）, and dissipate
Heat pipe（11）Inside it is slidably fitted with heat conductive rod（13）, the heat conductive rod（13）Away from radiating tube（11）To extend to cooling logical for one end
Road（2）It is interior, and heat conductive rod（13）Periphery be connected with the second fin（14）, second fin（14）Positioned at cooling duct
（2）It is interior, the placement rack（4）Side be provided with multiple and standing groove（5）First air vent of connection（15）, and placement rack（4）
Opposite side be provided with multiple and standing groove（5）Second air vent of connection（16）.
2. a kind of high heat-radiating semiconductor laser instrument according to claim 1, it is characterised in that the buffer gear（3）Bag
Include one end and be welded in refrigerating seat（1）The fixed column at top（31）, and fixed column（31）The other end offer dashpot（32）, institute
State dashpot（32）Bottom interior wall on be welded with spring（33）One end, and spring（33）The other end be welded with and be slidably installed
In dashpot（32）Interior bumper post（34）, the bumper post（34）Away from spring（33）One end be welded in placement rack（4）'s
Bottom.
3. a kind of high heat-radiating semiconductor laser instrument according to claim 1, it is characterised in that the heat-conducting plate（6）For
By semiconductor laser chip mounting assembly（7）The heat transmission produced during operation is to radiating tube（11）, radiating tube（11）With
One fin（12）For distributing heat-conducting plate（6）The heat of transmission.
4. a kind of high heat-radiating semiconductor laser instrument according to claim 1, it is characterised in that the heat conductive rod（13）For
By radiating tube（11）Heat transmission to cooling duct（2）It is interior, and heat conductive rod（13）With the second fin（14）For distributing heat
Amount.
5. a kind of high heat-radiating semiconductor laser instrument according to claim 1, it is characterised in that first air vent（15）
With the second air vent（16）Cross section be it is trapezoidal.
6. a kind of high heat-radiating semiconductor laser instrument according to claim 1, it is characterised in that first air vent（15）
Near the second air vent（16）One end path length be less than the first air vent（15）Away from the second air vent（16）One end path length, and
Second air vent（16）Near the first air vent（15）One end path length be more than the second air vent（16）Away from the first air vent
（15）One end path length, first air vent（15）Near the second air vent（16）One end path length be more than the second air vent
（16）Near the first air vent（15）One end path length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710158305.9A CN106654849B (en) | 2017-03-17 | 2017-03-17 | A kind of high heat-radiating semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710158305.9A CN106654849B (en) | 2017-03-17 | 2017-03-17 | A kind of high heat-radiating semiconductor laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106654849A true CN106654849A (en) | 2017-05-10 |
| CN106654849B CN106654849B (en) | 2019-08-20 |
Family
ID=58847570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710158305.9A Active CN106654849B (en) | 2017-03-17 | 2017-03-17 | A kind of high heat-radiating semiconductor laser |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107182193A (en) * | 2017-07-25 | 2017-09-19 | 江苏中色锐毕利实业有限公司 | A kind of automobile controller high heat conduction aluminium alloy heat radiator |
| CN111829381A (en) * | 2020-06-01 | 2020-10-27 | 佛山市伟卓铝业有限公司 | Aluminum alloy heat abstractor with automatic sealing mechanism |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS625679A (en) * | 1985-07-02 | 1987-01-12 | Nec Corp | Composite semiconductor laser device |
| US20090101926A1 (en) * | 2007-10-17 | 2009-04-23 | Sang Hyun Lee | Semiconductor light emitting device and method of manufacturing the same |
| US20130147050A1 (en) * | 2011-12-12 | 2013-06-13 | Advanced Cooling Technologies, Inc. | Semiconductor having integrally-formed enhanced thermal management |
| CN204258031U (en) * | 2014-12-26 | 2015-04-08 | 北京镭宝光电技术有限公司 | A kind of air-cooling laser laser pump cavity device of diode pumping |
-
2017
- 2017-03-17 CN CN201710158305.9A patent/CN106654849B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS625679A (en) * | 1985-07-02 | 1987-01-12 | Nec Corp | Composite semiconductor laser device |
| US20090101926A1 (en) * | 2007-10-17 | 2009-04-23 | Sang Hyun Lee | Semiconductor light emitting device and method of manufacturing the same |
| US20130147050A1 (en) * | 2011-12-12 | 2013-06-13 | Advanced Cooling Technologies, Inc. | Semiconductor having integrally-formed enhanced thermal management |
| CN204258031U (en) * | 2014-12-26 | 2015-04-08 | 北京镭宝光电技术有限公司 | A kind of air-cooling laser laser pump cavity device of diode pumping |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107182193A (en) * | 2017-07-25 | 2017-09-19 | 江苏中色锐毕利实业有限公司 | A kind of automobile controller high heat conduction aluminium alloy heat radiator |
| CN111829381A (en) * | 2020-06-01 | 2020-10-27 | 佛山市伟卓铝业有限公司 | Aluminum alloy heat abstractor with automatic sealing mechanism |
| CN111829381B (en) * | 2020-06-01 | 2024-01-09 | 佛山市伟卓铝业有限公司 | Aluminum alloy heat abstractor with automatic sealing mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106654849B (en) | 2019-08-20 |
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