CN106647180A - 直写曝光机中基于标定板的误差校正和补偿方法及其装置 - Google Patents
直写曝光机中基于标定板的误差校正和补偿方法及其装置 Download PDFInfo
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- CN106647180A CN106647180A CN201611065507.0A CN201611065507A CN106647180A CN 106647180 A CN106647180 A CN 106647180A CN 201611065507 A CN201611065507 A CN 201611065507A CN 106647180 A CN106647180 A CN 106647180A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
Abstract
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CN201611065507.0A CN106647180B (zh) | 2016-11-28 | 2016-11-28 | 直写曝光机中基于标定板的误差校正和补偿方法 |
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CN201611065507.0A CN106647180B (zh) | 2016-11-28 | 2016-11-28 | 直写曝光机中基于标定板的误差校正和补偿方法 |
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CN106647180A true CN106647180A (zh) | 2017-05-10 |
CN106647180B CN106647180B (zh) | 2018-09-28 |
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CN201611065507.0A Active CN106647180B (zh) | 2016-11-28 | 2016-11-28 | 直写曝光机中基于标定板的误差校正和补偿方法 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106125515A (zh) * | 2016-08-17 | 2016-11-16 | 无锡影速半导体科技有限公司 | 直写式光刻机扫描采用不等距触发进行图形校正的方法 |
CN108333881A (zh) * | 2018-01-22 | 2018-07-27 | 合肥芯碁微电子装备有限公司 | 一种应用于直写式曝光机的拼接调试方法 |
CN109827607A (zh) * | 2017-11-23 | 2019-05-31 | 清华大学 | 线结构光焊缝跟踪传感器的标定方法及装置 |
CN109870883A (zh) * | 2019-04-16 | 2019-06-11 | 苏州源卓光电科技有限公司 | 一种用于直写式曝光机的标定板的位置补偿方法 |
CN110823155A (zh) * | 2018-08-10 | 2020-02-21 | 维嘉数控科技(苏州)有限公司 | 机械平台的误差修正方法及装置 |
CN112770499A (zh) * | 2019-11-06 | 2021-05-07 | 珠海方正科技高密电子有限公司 | 电路板的加工处理方法和装置 |
CN114236976A (zh) * | 2021-12-28 | 2022-03-25 | 杭州新诺微电子有限公司 | 一种双台面ldi系统的曝光方法 |
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JPH11295186A (ja) * | 1998-04-06 | 1999-10-29 | Sony Corp | 露光に用いるレンズの評価方法、及び同装置 |
US20020048020A1 (en) * | 2000-09-13 | 2002-04-25 | Yasuhiro Yoshitake | Process and apparatus for manufacturing semiconductor device |
CN1501171A (zh) * | 2002-11-15 | 2004-06-02 | ��ʿ��Ƭ��ʽ���� | 曝光装置 |
CN101120620A (zh) * | 2005-02-24 | 2008-02-06 | 富士胶片株式会社 | 绘图设备的校准方法和绘图设备 |
CN101169595A (zh) * | 2007-11-28 | 2008-04-30 | 上海微电子装备有限公司 | 一种用于步进光刻机对准系统的标定装置及其标定方法 |
CN101414130A (zh) * | 2007-10-18 | 2009-04-22 | 株式会社阿迪泰克工程 | 曝光装置 |
CN103529654A (zh) * | 2013-10-29 | 2014-01-22 | 天津芯硕精密机械有限公司 | 一种直写式光刻系统中内层对位的方法 |
CN104199257A (zh) * | 2014-08-26 | 2014-12-10 | 合肥芯硕半导体有限公司 | 一种精密定位平台绝对定位精度的测量及补偿方法 |
US20150109596A1 (en) * | 2013-10-23 | 2015-04-23 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Method and system for achieving automatic compensation in glass substrate exposure process |
CN104820344A (zh) * | 2015-03-31 | 2015-08-05 | 合肥芯硕半导体有限公司 | 一种精密定位平台Yaw值的测量方法 |
CN105278260A (zh) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | 一种pcb曝光图形正确性验证方法 |
-
2016
- 2016-11-28 CN CN201611065507.0A patent/CN106647180B/zh active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US5291223A (en) * | 1991-09-19 | 1994-03-01 | Konica Corporation | Exposure unit for a multicolor image forming apparatus capable of better registration of the multicolor images |
JPH11295186A (ja) * | 1998-04-06 | 1999-10-29 | Sony Corp | 露光に用いるレンズの評価方法、及び同装置 |
US20020048020A1 (en) * | 2000-09-13 | 2002-04-25 | Yasuhiro Yoshitake | Process and apparatus for manufacturing semiconductor device |
CN1501171A (zh) * | 2002-11-15 | 2004-06-02 | ��ʿ��Ƭ��ʽ���� | 曝光装置 |
CN101120620A (zh) * | 2005-02-24 | 2008-02-06 | 富士胶片株式会社 | 绘图设备的校准方法和绘图设备 |
CN101414130A (zh) * | 2007-10-18 | 2009-04-22 | 株式会社阿迪泰克工程 | 曝光装置 |
CN101169595A (zh) * | 2007-11-28 | 2008-04-30 | 上海微电子装备有限公司 | 一种用于步进光刻机对准系统的标定装置及其标定方法 |
US20150109596A1 (en) * | 2013-10-23 | 2015-04-23 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Method and system for achieving automatic compensation in glass substrate exposure process |
CN103529654A (zh) * | 2013-10-29 | 2014-01-22 | 天津芯硕精密机械有限公司 | 一种直写式光刻系统中内层对位的方法 |
CN104199257A (zh) * | 2014-08-26 | 2014-12-10 | 合肥芯硕半导体有限公司 | 一种精密定位平台绝对定位精度的测量及补偿方法 |
CN104820344A (zh) * | 2015-03-31 | 2015-08-05 | 合肥芯硕半导体有限公司 | 一种精密定位平台Yaw值的测量方法 |
CN105278260A (zh) * | 2015-11-20 | 2016-01-27 | 合肥芯碁微电子装备有限公司 | 一种pcb曝光图形正确性验证方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106125515A (zh) * | 2016-08-17 | 2016-11-16 | 无锡影速半导体科技有限公司 | 直写式光刻机扫描采用不等距触发进行图形校正的方法 |
CN109827607A (zh) * | 2017-11-23 | 2019-05-31 | 清华大学 | 线结构光焊缝跟踪传感器的标定方法及装置 |
CN109827607B (zh) * | 2017-11-23 | 2021-01-26 | 清华大学 | 线结构光焊缝跟踪传感器的标定方法及装置 |
CN108333881A (zh) * | 2018-01-22 | 2018-07-27 | 合肥芯碁微电子装备有限公司 | 一种应用于直写式曝光机的拼接调试方法 |
CN110823155A (zh) * | 2018-08-10 | 2020-02-21 | 维嘉数控科技(苏州)有限公司 | 机械平台的误差修正方法及装置 |
CN109870883A (zh) * | 2019-04-16 | 2019-06-11 | 苏州源卓光电科技有限公司 | 一种用于直写式曝光机的标定板的位置补偿方法 |
CN112770499A (zh) * | 2019-11-06 | 2021-05-07 | 珠海方正科技高密电子有限公司 | 电路板的加工处理方法和装置 |
CN114236976A (zh) * | 2021-12-28 | 2022-03-25 | 杭州新诺微电子有限公司 | 一种双台面ldi系统的曝光方法 |
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Effective date of registration: 20191121 Address after: 518000, Shenzhen, Guangdong, Baoan District province Xixiang Industrial Road, No. 3012, West building, veterans building, two floor Patentee after: CAIZ OPTRONICS CORP. Address before: 432900 Industrial Park, Xiaochang Economic Development Zone, Xiaogan, Hubei, China Patentee before: HUBEI KAICHANG PHOTOELECTRIC TECHNOLOGY CO., LTD. |
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Effective date of registration: 20200131 Address after: No.85, Torch Road, high tech Zone, Suzhou, Jiangsu Patentee after: Suzhou lithography Laser Technology Co., Ltd. Address before: 518000, Shenzhen, Guangdong, Baoan District province Xixiang Industrial Road, No. 3012, West building, veterans building, two floor Patentee before: CAIZ OPTRONICS CORP. |