CN106645336B - 一种多孔金属修饰表面的微针电极及其制备方法 - Google Patents
一种多孔金属修饰表面的微针电极及其制备方法 Download PDFInfo
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- CN106645336B CN106645336B CN201611004612.3A CN201611004612A CN106645336B CN 106645336 B CN106645336 B CN 106645336B CN 201611004612 A CN201611004612 A CN 201611004612A CN 106645336 B CN106645336 B CN 106645336B
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 106
- 239000002184 metal Substances 0.000 title claims abstract description 106
- 238000002360 preparation method Methods 0.000 title abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 28
- 239000000956 alloy Substances 0.000 claims description 28
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 17
- 238000004544 sputter deposition Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 229910052786 argon Inorganic materials 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 239000003153 chemical reaction reagent Substances 0.000 claims description 8
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 8
- 238000005240 physical vapour deposition Methods 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- 239000007789 gas Substances 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 4
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- 238000004070 electrodeposition Methods 0.000 claims description 4
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical group [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 4
- 238000005477 sputtering target Methods 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 3
- SAOPTAQUONRHEV-UHFFFAOYSA-N gold zinc Chemical compound [Zn].[Au] SAOPTAQUONRHEV-UHFFFAOYSA-N 0.000 claims description 3
- 229910001093 Zr alloy Inorganic materials 0.000 claims description 2
- YPANPSDPZOVDOM-UHFFFAOYSA-N gold zirconium Chemical compound [Zr].[Au] YPANPSDPZOVDOM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 3
- 210000003491 skin Anatomy 0.000 description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 210000002615 epidermis Anatomy 0.000 description 2
- 239000008103 glucose Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000012742 biochemical analysis Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 210000004207 dermis Anatomy 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012377 drug delivery Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000000944 nerve tissue Anatomy 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Media Introduction/Drainage Providing Device (AREA)
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CN201611004612.3A CN106645336B (zh) | 2016-11-15 | 2016-11-15 | 一种多孔金属修饰表面的微针电极及其制备方法 |
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CN106645336B true CN106645336B (zh) | 2020-12-29 |
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CN109239151A (zh) * | 2018-08-10 | 2019-01-18 | 广州钰芯传感科技有限公司 | 一种双修饰微针电极及其制备方法和血糖微针电化学传感器电极 |
CN111254439A (zh) * | 2020-02-24 | 2020-06-09 | 哈尔滨理工大学 | 基于电场蒸发制备钨针尖电极的方法及其实现装置 |
CN112255293B (zh) * | 2020-10-15 | 2023-03-10 | 华中科技大学同济医学院附属协和医院 | 一种微针电极的制备方法及其应用 |
CN114776390B (zh) * | 2022-04-21 | 2023-06-20 | 西安交通大学 | 一种基于超声波的末级静叶除湿结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102038493A (zh) * | 2010-12-20 | 2011-05-04 | 长沙三诺生物传感技术股份有限公司 | 微针型生物传感器 |
WO2014197995A1 (en) * | 2013-06-13 | 2014-12-18 | Microdermics Inc. | Metallic microneedles |
CN204767021U (zh) * | 2015-05-07 | 2015-11-18 | 苏州大学 | 一种空心丝素蛋白微针结构 |
CN106063971A (zh) * | 2016-05-24 | 2016-11-02 | 中山大学 | 基于金属多孔微针阵列的经皮电渗给药装置及给药方法 |
CN106093121A (zh) * | 2016-05-28 | 2016-11-09 | 惠州市力道电子材料有限公司 | 一种表面设有纳米多孔金的基体、其制备方法和应用 |
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2016
- 2016-11-15 CN CN201611004612.3A patent/CN106645336B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102038493A (zh) * | 2010-12-20 | 2011-05-04 | 长沙三诺生物传感技术股份有限公司 | 微针型生物传感器 |
WO2014197995A1 (en) * | 2013-06-13 | 2014-12-18 | Microdermics Inc. | Metallic microneedles |
CN204767021U (zh) * | 2015-05-07 | 2015-11-18 | 苏州大学 | 一种空心丝素蛋白微针结构 |
CN106063971A (zh) * | 2016-05-24 | 2016-11-02 | 中山大学 | 基于金属多孔微针阵列的经皮电渗给药装置及给药方法 |
CN106093121A (zh) * | 2016-05-28 | 2016-11-09 | 惠州市力道电子材料有限公司 | 一种表面设有纳米多孔金的基体、其制备方法和应用 |
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Address after: 516000, Room 618, Yipin International Business Apartment, No. 228 Dayawan Avenue, Dayawan West District, Huizhou City, Guangdong Province (office only) Patentee after: Huizhou Yuxin Electronic Materials Co.,Ltd. Country or region after: China Address before: 516000 No.5, science and Technology Innovation Park, Dayawan West District, Huizhou City, Guangdong Province Patentee before: HUIZHOU LEADAO ELECTRONIC MATERIAL Co.,Ltd. Country or region before: China |
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Effective date of registration: 20240617 Address after: Room 1104, No. 8 Jingang Avenue, Nansha Street, Nansha District, Guangzhou City, Guangdong Province, 510000 (for office only) Patentee after: GUANGZHOU YUXIN SENSING TECHNOLOGY Co.,Ltd. Country or region after: China Address before: 516000, Room 618, Yipin International Business Apartment, No. 228 Dayawan Avenue, Dayawan West District, Huizhou City, Guangdong Province (office only) Patentee before: Huizhou Yuxin Electronic Materials Co.,Ltd. Country or region before: China |