CN106611812B - A kind of separate phosphor gel coating method and product - Google Patents
A kind of separate phosphor gel coating method and product Download PDFInfo
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- CN106611812B CN106611812B CN201510698771.7A CN201510698771A CN106611812B CN 106611812 B CN106611812 B CN 106611812B CN 201510698771 A CN201510698771 A CN 201510698771A CN 106611812 B CN106611812 B CN 106611812B
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- gel
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 148
- 238000000576 coating method Methods 0.000 title claims abstract description 58
- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
- 239000004033 plastic Substances 0.000 claims abstract description 22
- 229920003023 plastic Polymers 0.000 claims abstract description 22
- 238000005538 encapsulation Methods 0.000 claims abstract description 17
- 238000007711 solidification Methods 0.000 claims abstract description 11
- 230000008023 solidification Effects 0.000 claims abstract description 11
- 239000000499 gel Substances 0.000 claims description 127
- 239000000843 powder Substances 0.000 claims description 46
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 235000019353 potassium silicate Nutrition 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 38
- 238000000034 method Methods 0.000 abstract description 20
- 239000000758 substrate Substances 0.000 description 8
- 238000004026 adhesive bonding Methods 0.000 description 7
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 238000009736 wetting Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
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- 238000009738 saturating Methods 0.000 description 3
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- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of separate phosphor gel coating method and products, belong to LED encapsulation field.It includes the following steps that phosphor gel is first coated on the inner concave of toroidal lens by S1, then stands the toroidal lens indent until the phosphor gel stable appearance up;The toroidal lens indent is placed face down in curing apparatus by S2, until the phosphor gel for being coated in the toroidal lens inner concave completes solidification;S3 covers the toroidal lens to LED chip, and then packaging plastic is filled in the gap between LED chip and the toroidal lens, solidifies the packaging plastic, completes the encapsulation of LED.The present invention also provides the products prepared using above method.The method of the present invention easier realizes the separate coating of phosphor gel.
Description
Technical field
The invention belongs to LED encapsulation fields, more particularly, to a kind of separate fluorescence based on fluid wetting Surface Theory
Arogel coating method and product.
Background technique
LED (Light Emitting Diode) is a kind of based on semiconductor light emitting made of P-N junction electroluminescent principle
Device has many advantages, such as electro-optical efficiency high, high colour developing coefficient, long service life, environmental protection and energy saving, small in size, is known as 21
Century green illumination light source.Due to the unique superiority of LED, has begun and be used widely in many fields, recognized by industry
For the main direction of development for being the following lighting engineering, there is huge market potential.
Large power white light LED is usually by two wavelength lights or blue light and the green light of blue light and sodium yellow and red
Three wavelength lights of coloured light mix.Since two wavelength light hybrid modes obtain the simple process of white light LEDs and at low cost, obtain
It is widely used.In actual production, yellow YAG phosphor or yellow TAG fluorescent powder are usually coated on blue LED die
To obtain white light LEDs product.Phosphor powder layer pattern and geometric dimension significantly impact the light efficiency out of LED in LED encapsulation
The important optical properties such as rate, colour temperature, spatial color uniformity.
During LED actual package, ideal phosphor powder layer geometrical morphology is mainly obtained by phosphor gel coating
And size.Traditional phosphor gel coating method is free dispensing coating, and first passing through spot gluing equipment in coating procedure will prepare
Good certain density phosphor gel is dripped over and around the LED chip being fixed on substrate, to send after its flowing forming
Enter the equipment that is heating and curing to be heating and curing.In this process, structure of the final geometrical morphology of phosphor gel by substrate
And the influence of spreading property of the phosphor gel on substrate, it often can be only formed the smaller ball cap shape phosphor gel geometry of curvature
Pattern, phosphor gel coating volume is excessive to be occurred to overflow that packaged sample is caused to scrap at the edge of substrate.Further, since
The density of fluorescent powder is greater than silica gel/epoxide-resin glue density, and phosphor gel arrives after coating is complete is sent into the equipment that is heating and curing
It will appear fluorescent powder deposited phenomenon in the process and during the basal plate preheating of solidification process, deposited phenomenon will lead to fluorescent powder point
Cloth is uneven.The precipitating of lesser curvature pattern and phosphor gel will lead to LED color uniformity and optical homogeneity is poor, also
It is low to will lead to luminous efficiency.
In order to make up the deficiency of free dispensing coating, the development of many novel coating processes has been carried out both at home and abroad, and
Developed the shape-preserving coating of fluorescent powder and far from coating method, but currently, realize shape-preserving coating and technology far from coating compared with
Pattern for complicated and higher cost, and its realization phosphor gel is limited by the mold and technique of specific structure, is realized
Pattern can not be controlled freely.
Therefore, it is necessary to develop a kind of novel phosphor gel coating method, energy simple realization is coated far from phosphor gel,
And flexibly control phosphor gel pattern.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, the present invention provides a kind of separate phosphor gel coating methods
And product, it is intended that by adjusting the planform of toroidal lens and the coating volume of phosphor gel, it is easier real
Existing phosphor gel can flexibly control phosphor gel pattern far from coating.Thus it is complicated that separate coating processes at present are solved, and nothing
Method freely controls the technical issues of phosphor gel pattern.
To achieve the above object, according to one aspect of the present invention, a kind of separate phosphor gel coating method is provided,
It is characterized in that comprising following steps:
Phosphor gel: being first coated on the inner concave of toroidal lens by S1, then that the toroidal lens indent is face-up
It stands until the phosphor gel stable appearance;
S2: the toroidal lens indent is placed face down in curing apparatus, until being coated in the toroidal lens indent
The phosphor gel in face completes solidification;
S3: the toroidal lens is covered to LED chip, then between LED chip and the toroidal lens
Packaging plastic is filled in gap, solidifies the packaging plastic, completes the encapsulation of LED.
In the above inventive concept, phosphor gel is coated on the inner concave of existing toroidal lens, then solidified, guarantee
The external surface shape of phosphor gel is identical with toroidal lens interior concave shape, then by the inner concave cured song for having phosphor gel
Cured phosphor gel and LED chip gluing are integrated by lens capping in face above LED chip, then with packaging plastic, complete envelope
Dress, in above-mentioned encapsulation, it is a kind of separate phosphor gel coating method, with top that phosphor gel is not direct and LED chip contacts
Method is easy to operate, low to the Yi Naidu of equipment.
Further, the inner concave of the toroidal lens is hemisphere face, and is coated in the fluorescence of the inner concave of toroidal lens
The volume of arogel and the inner concave surface area ratio of the toroidal lens are the hemisphere radius surfaceIt obtains uniformly thick
The phosphor gel of degree.When phosphor gel volume and smaller toroidal lens inner concave surface area fraction, phosphor gel pattern is remote
From uniform thickness.
Further, the inner concave of the toroidal lens is hemisphere face, and is coated in the fluorescence of the inner concave of toroidal lens
The volume of arogel and the inner concave surface area ratio of the toroidal lens are the hemisphere radius surfaceIt obtains non-homogeneous
The phosphor gel of thickness.When phosphor gel volume and larger toroidal lens inner concave surface area fraction, phosphor gel pattern is
Far from non-uniform thickness, specifically, to show as thick middle two sides thin for phosphor gel.
Further, the material of the toroidal lens is in silica gel, polymethyl methacrylate, polycarbonate or glass
It is one or more kinds of.
Further, the phosphor gel fluorescent powder includes the one or more of YAG fluorescent powder, TAG fluorescent powder, described
The phosphor gel adhesive that includes include one of silica gel, epoxy resin or liquid glass or a variety of.
Further, the packaging plastic in step S3 includes one of silica gel, epoxy resin or liquid glass or more
Kind.It is as the adhesive material that the material of packaging plastic can include with phosphor gel or different.
Further, the concentration for the fluorescent powder for including in the phosphor gel is 0.01 grams per milliliter~5 grams per milliliters.
It is another aspect of this invention to provide that additionally providing a kind of LED lamp that method encapsulation as described above obtains.
Further, include LED chip in the LED lamp, be coated with multilayered fluorescent arogel on LED chip, wherein
2 layers~10 layers phosphor gel are preferably coated on LED chip.
In the present invention, phosphor gel is the adhesive for being mixed with fluorescent powder;Phosphor powder layer is consolidating of obtaining after solidifying
Fixed molding fluorescent powder glue-line;Phosphor gel pattern (also known as phosphor powder layer pattern) is the fixed-type fluorescence obtained after solidifying
The three-dimensional stereo topography of arogel layer.
In the present invention, toroidal lens is the toroidal lens of existing LED encapsulation field, inner concave can be it is hemispherical,
Ball cap shape, cylindric, rectangular-shaped etc. various shape, can also be the other shapes of flexible customization as needed.
In general, contemplated above technical scheme can achieve the following beneficial effects through the invention:
1, phosphor gel is coated in toroidal lens, is covered after phosphor gel solidification, then by toroidal lens to LED chip
On, using the phosphor gel and LED chip of packaging plastic adhesive solidification, coating is completed, has simply implemented and has been applied far from phosphor gel
It covers.In addition, the shape of change toroidal lens inner concave can be led to control the pattern far from coating phosphor powder layer pattern outer surface.
2, the pattern that separate coating phosphor powder layer inner surface can be controlled by adjusting the spot printing volume of phosphor gel, obtains
The phosphor gel of the phosphor gel of uniform thickness either uneven gauge can promote LED by controlling phosphor gel thickness
Color homogeneity and the photochromic consistency of encapsulation.
3, phosphor gel is coated in toroidal lens and carries out, and can effectively avoid carrying out directly on chip in traditional handicraft glimmering
The problem of phosphor gel caused by the coating of light arogel overflows substrate, improves the yield rate of product, furthermore by coating processes and core
Piece encapsulation separation, can make coating processes are synchronous with die bond technique to carry out, improve production efficiency.
4, it coats and solidifies the method repeatedly carried out and allow for multiple coating, and in the different fluorescent powders of every layer of coating
The phosphor gel of concentration, number of plies range are 2~10 layers, and such coating method makes the light extraction efficiency of LED higher, can be one
Determine the luminous efficiency that LED is improved in degree.
5, phosphor gel is coated in toroidal lens, is coated phosphor gel technique directly on chip compared to tradition, is applied
It covers volume not limited by substrate shape, therefore coating volume adjustable extent is very big, larger range of colour temperature adjustment may be implemented, increase
Encapsulation and the flexibility of technique are added.
6, the method for the present invention is easy to operate, at low cost.
Detailed description of the invention
The flow diagram of Fig. 1 the method for the present invention;
Fig. 2 (a), (b), (c) are to use different phosphor gel coated bodies in the embodiment of the present invention in hemispherical toroidal lens
The phosphor gel geometrical morphology that product is realized, it is 5ul that (a), which coats volume, and (b) coating volume is 10ul, (c) coats volume and is
15ul;
Fig. 3 (a), (b), (c) are the phosphor gel shape realized in the embodiment of the present invention using toroidal lens of different shapes
Looks, (a) hemispherical toroidal lens, (b) ball cap shape toroidal lens, (c) cylindric toroidal lens;
Fig. 4 (a), (b) are for the separate uniform thickness of toroidal lens realization hemispherical in the embodiment of the present invention and far from non-equal
The Multi-layer phosphor powder pattern of even thickness, (a) uniform thickness, (b) non-uniform thickness.
In all the appended drawings, identical appended drawing reference is used to denote the same element or structure, in which: 1001-LED core
Piece, 1002- packaging plastic, 1003- toroidal lens, 1004- phosphor gel, 1005- package substrate, 1006- be heating and curing equipment,
1007- spot gluing equipment.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
The flow diagram of Fig. 1 the method for the present invention, it can be seen that the method for the present invention mainly includes the following steps:
Phosphor gel: being first coated on the inner concave of toroidal lens by S1, then that the toroidal lens indent is face-up
It stands until the phosphor gel stable appearance;
S2: the toroidal lens indent is placed face down in curing apparatus, until being coated in the toroidal lens indent
The phosphor gel in face completes solidification;
S3: the toroidal lens is covered to LED chip, then between LED chip and the toroidal lens
Packaging plastic is filled in gap, solidifies the packaging plastic, completes the encapsulation of LED.
Embodiment 1
Separate phosphor gel coating method in the present embodiment includes the following steps:
S1: first phosphor gel is coated on the inner concave of toroidal lens, the present embodiment uses indent radius surface for 2.5mm
Hemispherical toroidal lens, the material of the toroidal lens is polymethyl methacrylate (abbreviation PMMA), passes through spot gluing equipment
1007 are coated in the phosphor gel 1004 that the concentration of fluorescent powder is 2g/ml on the concave surface of toroidal lens 1003, then will
The toroidal lens indent is stood up, and phosphor gel will soak the indent of toroidal lens under the action of fluid wetting ability
Surface, until phosphor gel stable appearance, can carry out next step to form spill thin layer fluorescence bisque pattern.
Fluorescent powder is YAG fluorescent powder in phosphor gel in the present embodiment, and the adhesive that phosphor gel includes is silica gel, coating
Phosphor gel volume be 5ul.
S2: the toroidal lens indent, which is placed face down on, to heat 1 hour in curing apparatus 1006 makes its solidification;
S3: the toroidal lens is covered to 1001 top of LED chip, LED chip is arranged on package substrate 1005, connects
Gap between LED chip 1001 and the toroidal lens fill packaging plastic 1002, solidify the packaging plastic, complete
The encapsulation of LED.
Embodiment 2
The present embodiment and embodiment 1 are not uniquely both, and in step S1, the phosphor gel volume of coating is 10ul.
Embodiment 3
The present embodiment and embodiment 1 are not uniquely both, and in step S1, the phosphor gel volume of coating is 15ul.
Fig. 2 (a), (b), (c) are to use different phosphor gel coated bodies in the embodiment of the present invention in hemispherical toroidal lens
The phosphor gel geometrical morphology that product is realized, it is 5ul that (a), which coats volume, and (b) coating volume is 10ul, (c) coats volume and is
15ul, Fig. 2 (a), (b) and the phosphor gel pattern for (c) respectively corresponding embodiment 1, embodiment 2 and the acquisition of embodiment 3.Figure
2 (a) be to coat uniform thickness that volume is realized when being 5ul far from phosphor powder layer pattern, when Fig. 2 (b) be that coat volume be 10ul
Realize close to uniform thickness far from fluorescence coating pattern, Fig. 2 (c) be the remote of the non-uniform thickness that coating volume is realized when being 15ul
From fluorescence coating pattern.Comparative example 1-3 explanation, the coated weight by changing phosphor gel can realize the separate glimmering of different-shape
Light bisque pattern.
Embodiment 4
Separate phosphor gel coating method in the present embodiment includes the following steps:
S1: first phosphor gel is coated on the inner concave of toroidal lens, the present embodiment uses interior concave shape for hemisphere
The toroidal lens of shape, the material of the toroidal lens are glass, by the concentration of fluorescent powder are the glimmering of 1g/ml by spot gluing equipment 1007
Light arogel 1004 is coated on the concave surface of toroidal lens, is then stood the toroidal lens indent up, fluorescent powder
Glue will soak the concave surface of toroidal lens under the action of fluid wetting ability, to form spill thin layer fluorescence bisque shape
Looks can carry out next step until phosphor gel stable appearance.
Fluorescent powder is TAG fluorescent powder in phosphor gel in the present embodiment, and the adhesive that phosphor gel includes is epoxy resin,
The phosphor gel volume of coating is 3ul.
S2: the toroidal lens indent, which is placed face down on, to heat 1 hour in curing apparatus 1006 makes its solidification;
S3: the toroidal lens is covered to 1001 top of LED chip, then saturating in LED chip 1001 and the curved surface
Packaging plastic 1002 is filled in gap between mirror, solidifies the packaging plastic, completes the encapsulation of LED.
Embodiment 5
Unlike the present embodiment is unique from embodiment 4, the interior concave shape of the toroidal lens used in step S1 is ball
Hat shape, ball cap shape also are understood as spherical crown shape, and the vertical sphere diameter in the section to be not passed through the centre of sphere intercepts sphere, small volume
A part is ball cap shape.
Embodiment 6
Unlike the present embodiment is unique from embodiment 4, the interior concave shape of the toroidal lens used in step S1 is circle
Column.
Fig. 3 (a), (b), (c) are the phosphor gel shape realized in the embodiment of the present invention using toroidal lens of different shapes
Looks, (a) hemispherical toroidal lens, (b) ball cap shape toroidal lens, (c) cylindric toroidal lens.Fig. 3 (a), (b), (c) are right respectively
The phosphor gel pattern for answering embodiment 4-6 to obtain, that is, Fig. 3 (a) is the separate phosphor powder layer realized using hemispherical toroidal lens
Pattern, Fig. 3 (b) are the separate fluorescence coating pattern realized using ball cap shape, and Fig. 3 (c) is use, cylindric realization far from fluorescence coating
Pattern.The above comparative example explanation, by flexibly changing the inner concave pattern of toroidal lens, can flexibly control phosphor gel shape
Looks.
Embodiment 7
Separate phosphor gel coating method in the present embodiment includes the following steps:
S1: first phosphor gel is coated on the inner concave of toroidal lens, the present embodiment uses interior concave shape for hemisphere
The toroidal lens of shape, the radius of inner concave are 2.5mm, and the material of the toroidal lens is silica gel, will by spot gluing equipment 1007
The phosphor gel 1004 that the concentration of fluorescent powder is 0.1g/ml is coated on the concave surface of toroidal lens, then by the curved surface
Lens indent stands five minutes up, and phosphor gel will soak the indent table of toroidal lens under the action of fluid wetting ability
Face, until phosphor gel stable appearance, can carry out next step to form spill thin layer fluorescence bisque pattern.
Fluorescent powder is TAG fluorescent powder in phosphor gel in the present embodiment, and the adhesive that phosphor gel includes is liquid glass,
The phosphor gel volume of coating is 5ul every time.The volume of the phosphor gel of inner concave coated in toroidal lens and the curved surface
The inner concave surface area ratio of lens is the indent radius surface
S2: the toroidal lens indent, which is placed face down on, to heat one hour in curing apparatus 1006 makes its solidification;Then
It is five minutes cooling, the coating of second of phosphor gel is carried out afterwards.Phosphor gel after five minutes to second of coating is stablized
Forming, the lens are placed in heating equipment to be heating and curing and complete the coating of second layer phosphor gel.
S3: the toroidal lens is covered to 1001 top of LED chip, then saturating in LED chip 1001 and the curved surface
Packaging plastic 1002 is filled in gap between mirror, solidifies the packaging plastic, completes the encapsulation of LED.
The phosphor gel that the present embodiment obtains has two layers, and the thickness of every layer of phosphor gel is uniform.
Embodiment 8
The phosphor gel volume in the present embodiment with embodiment 7 not uniquely being both coating is 12ul every time, is coated in curved surface
The volume of the phosphor gel of the inner concave of lens and the inner concave surface area ratio of the toroidal lens are the indent radius surface
's
The phosphor gel that the present embodiment obtains has two layers, and every layer of phosphor gel is in uneven thickness, intermediate thicker, and two
Side is relatively thin, similar meniscus shape.
Fig. 4 (a), (b) are for the separate uniform thickness of toroidal lens realization hemispherical in the embodiment of the present invention and far from non-equal
The Multi-layer phosphor powder pattern of even thickness, (a) uniform thickness, (b) non-uniform thickness.Fig. 4 (a), (b) respectively correspond embodiment 7,
Embodiment 8 obtains phosphor gel pattern.That is, Fig. 4 (a) is the uniform thickness realized when coating volume is 5ul every time far from glimmering
Light bisque pattern, Fig. 4 (b) are to coat the non-uniform thickness realized when volume is 12ul far from fluorescence coating pattern.
Embodiment 9
Separate phosphor gel coating method in the present embodiment includes the following steps:
S1: first phosphor gel is coated on the inner concave of toroidal lens, the present embodiment uses interior concave shape for hemisphere
The toroidal lens of shape, the radius of inner concave are 2.5mm, and the material of the toroidal lens is silica gel, will by spot gluing equipment 1007
The phosphor gel 1004 that the concentration of fluorescent powder is 0.1g/ml is coated on the concave surface of toroidal lens, then by the curved surface
Lens indent stands five minutes up, and phosphor gel will soak the indent table of toroidal lens under the action of fluid wetting ability
Face, until phosphor gel stable appearance, can carry out next step to form spill thin layer fluorescence bisque pattern.
Fluorescent powder is TAG fluorescent powder in phosphor gel in the present embodiment, and the adhesive that phosphor gel includes is liquid glass,
The phosphor gel volume of coating is 5ul.The volume of the phosphor gel of inner concave coated in toroidal lens and the toroidal lens
Inner concave surface area ratio be the indent radius surface
S2: the toroidal lens indent, which is placed face down on, to heat one hour in curing apparatus 1006 makes its solidification.
S3: the toroidal lens is covered to 1001 top of LED chip, then saturating in LED chip 1001 and the curved surface
Packaging plastic 1002 is filled in gap between mirror, solidifies the packaging plastic, completes the encapsulation of LED.
The separate phosphor powder layer pattern of the present embodiment acquisition uniform thickness.
Embodiment 10
Unlike the present embodiment is unique from embodiment 9, the volume of the phosphor gel of the inner concave coated in toroidal lens
Inner concave surface area ratio with the toroidal lens is the indent radius surface
The separate phosphor powder layer pattern of the present embodiment acquisition uniform thickness.
Embodiment 11
Unlike the present embodiment is unique from embodiment 9, the volume of the phosphor gel of the inner concave coated in toroidal lens
Inner concave surface area ratio with the toroidal lens is the indent radius surface
The separate phosphor powder layer pattern of the present embodiment acquisition non-uniform thickness.
Embodiment 12
Unlike the present embodiment is unique from embodiment 9, the volume of the phosphor gel of the inner concave coated in toroidal lens
Inner concave surface area ratio with the toroidal lens is the indent radius surface
The separate phosphor powder layer pattern of the present embodiment acquisition non-uniform thickness.
Embodiment 13
Unlike the present embodiment is unique from embodiment 9, the volume of the phosphor gel of the inner concave coated in toroidal lens
Inner concave surface area ratio with the toroidal lens is the indent radius surface
The separate phosphor powder layer pattern of the present embodiment acquisition non-uniform thickness.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (1)
1. a kind of separate phosphor gel coating method, which is characterized in that it includes the following steps:
S1: first phosphor gel is coated on the inner concave of toroidal lens, then stands the toroidal lens indent up
Until the phosphor gel stable appearance;
S2: the toroidal lens indent is placed face down in curing apparatus, until being coated in the toroidal lens inner concave
The phosphor gel completes solidification;
S3: the toroidal lens is covered to LED chip, then the gap between LED chip and the toroidal lens
Place's filling packaging plastic, solidifies the packaging plastic, completes the encapsulation of LED,
When the toroidal lens inner concave be hemisphere face, and be coated in toroidal lens inner concave phosphor gel volume with
The inner concave surface area ratio of the toroidal lens is the hemisphere radius surfaceObtain the fluorescent powder of uniform thickness
Glue,
When the toroidal lens inner concave be hemisphere face, and be coated in toroidal lens inner concave phosphor gel volume with
The inner concave surface area ratio of the toroidal lens is the hemisphere radius surfaceObtain the fluorescent powder of non-uniform thickness
Glue,
The material of the toroidal lens is one or more of silica gel, polymethyl methacrylate, polycarbonate or glass,
The phosphor gel fluorescent powder includes the one or more of YAG fluorescent powder, TAG fluorescent powder, the phosphor gel packet
The adhesive contained includes one of silica gel, epoxy resin or liquid glass or a variety of,
The packaging plastic in step S3 includes one of silica gel, epoxy resin or liquid glass or a variety of,
The concentration for the fluorescent powder for including in the phosphor gel is 0.01 grams per milliliter~5 grams per milliliters.
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070120135A1 (en) * | 2002-08-30 | 2007-05-31 | Soules Thomas F | Coated led with improved efficiency |
CN102496673A (en) * | 2011-12-22 | 2012-06-13 | 映瑞光电科技(上海)有限公司 | Light emitting diode packaging structure and packaging method thereof |
CN102800794A (en) * | 2012-08-17 | 2012-11-28 | 南通脉锐光电科技有限公司 | Optical wavelength conversion device and application thereof in white light emitting device |
CN103486535A (en) * | 2013-10-21 | 2014-01-01 | 广州市松叶电子科技有限公司 | LED (light-emitting diode) light source fluorescent powder light matching plate |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070120135A1 (en) * | 2002-08-30 | 2007-05-31 | Soules Thomas F | Coated led with improved efficiency |
CN102496673A (en) * | 2011-12-22 | 2012-06-13 | 映瑞光电科技(上海)有限公司 | Light emitting diode packaging structure and packaging method thereof |
CN102800794A (en) * | 2012-08-17 | 2012-11-28 | 南通脉锐光电科技有限公司 | Optical wavelength conversion device and application thereof in white light emitting device |
CN103486535A (en) * | 2013-10-21 | 2014-01-01 | 广州市松叶电子科技有限公司 | LED (light-emitting diode) light source fluorescent powder light matching plate |
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