CN103486535A - LED (light-emitting diode) light source fluorescent powder light matching plate - Google Patents
LED (light-emitting diode) light source fluorescent powder light matching plate Download PDFInfo
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- CN103486535A CN103486535A CN201310495834.XA CN201310495834A CN103486535A CN 103486535 A CN103486535 A CN 103486535A CN 201310495834 A CN201310495834 A CN 201310495834A CN 103486535 A CN103486535 A CN 103486535A
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Abstract
The invention discloses an LED (light-emitting diode) light source fluorescent powder light distributing plate which is covered above an LED light source. The LED light source fluorescent powder light distributing plate comprises a carrier plate, wherein the surface of one side of the carrier plate is provided with a micro structure, and a fluorescent powder is mixed in the carrier plate or the surface of the other side of the carrier plate is provided with a naked fluorescent powder coating. The LED light source fluorescent powder light distributing plate provided by the invention has the advantages that the reliable property of the LED light source is good, the service life of the LED light source is long, the light of the LED light source is distributed for two times, the lighting effect of the LED light source is effectively improved, and the luminous efficiency of the fluorescent powder is improved.
Description
Technical field
The present invention relates to a kind of LED light source light distribution panel, relate in particular to a kind of LED light source fluorescent material light distribution panel.
Background technology
In tradition LED packaged type, the coating method of fluorescent material is: fluorescent material colloid mixture class material is coated on to chip surface, then is heating and curing.Blue light-white light formal dress the module of take is example, and the typical package process is: 1) the LED light source die bond is in substrate surface, and 2) bonding wire, 3) coating fluorescent powder, 4) be heating and curing.There are a lot of intrinsic problems in it, be mainly: 1) coating, heating steps length consuming time, complex process, for important production capacity bottleneck, 2) coating, heating process is strict to technological requirement, even so, still uniformity is poor, having a strong impact on yields, 3) there is intrinsic optical defect in coating, the light source that completes of heating processing, and brightness is low, spectrum widening is large, 4) colloid is attached to chip surface, easily aging under the hot operation state, forms the hydraulic performance declines such as light decay, 5) colloid is subject to thermal stress deformation, break bonding line when serious, cause losing efficacy, light source is scrapped.
At present, the high-power applications field of LED is future trend, is also the most important developing direction of LED technology, is the important symbol of weighing the LED lighting engineering.The high heat that high-power LED illumination produces, if adopt the conventional package mode, to cause the aging and adhesive stress type inefficacy rapidly of fluorescent material carrier material, light fixture may be scrapped at any time, this is the problem that the conventional package mode is intrinsic and can not eliminate, so the conventional package mode is difficult to realize super high power (high-power) illumination.For example: the high-power plant growth lamp of macrophyte factory simulated solar light, need 24 continuous throughout the twenty-four hour24s, produce amount of heat, inconvenience maybe can not be safeguarded (installation environment complexity again, interrupt plant growth), this just needs high reliability and long life-span, and at present, this is a problem demanding prompt solution.
Summary of the invention
The purpose of this invention is to provide a kind of LED light source fluorescent material light distribution panel, make the good reliability of LED light source and life-span long.
For achieving the above object, the invention provides a kind of LED light source fluorescent material light distribution panel, cover the top of LED light source, comprise carrier board, at a side surface of described carrier board with micro-structure, be mixed with fluorescent material in described carrier board or in another opposite flank of described carrier board with exposed fluorescent coating.
Preferably, described fluorescent coating and described micro-structure are selectively positioned at the side of described carrier board towards described LED light source.
Preferably, described exposed fluorescent coating surface also is provided with protective layer.
Preferably, described micro-structure is cross section hackly structure or lattice-like structure or cylinder structure.
Preferably, described micro-structure is arranged on the surface of described carrier board by hot extrusion mode or high accuracy impression mode.
Compared with prior art, LED light source fluorescent material light distribution panel of the present invention by a certain side surface of described carrier board with micro-structure, micro-structure can produce the even multiple optical effect such as 3D figure of optically focused, sheen, brightened local portion, color fringe, use can be carried out secondary light-distribution to the light of LED light source on the fluorescent material light distribution panel, as direction of light, effect, distribution and color etc., thereby can effectively improve the light efficiency of LED light source, increase the LED light source reliability, and improved the luminous efficiency of fluorescent material; And by another opposite flank of described carrier board with fluorescent coating or in described carrier board mixed fluorescent powder, can change the color of the light of LED light source, can meet the growth demand of plant different times when the fluorescent material light distribution panel is used on plant growth lighting; And the fluorescent material light distribution panel directly overlays the top of LED light source, replace the mode of direct coating fluorescent material of the prior art at chip surface, thereby extended the service life of LED light source, reduced cost, and technique is simple, has improved production capacity.
By following description also by reference to the accompanying drawings, it is more clear that the present invention will become, and these accompanying drawings are for explaining embodiments of the invention.
The accompanying drawing explanation
The structural representation that Fig. 1 is LED light source fluorescent material light distribution panel of the present invention.
The enlarged diagram of a kind of scheme that Fig. 2 is micro-structure.
The enlarged diagram of the another kind of scheme that Fig. 3 is micro-structure.
The enlarged diagram of the third scheme that Fig. 4 is micro-structure.
The specific embodiment
With reference now to accompanying drawing, describe embodiments of the invention, in accompanying drawing, similar element numbers represents similar element.
Please refer to Fig. 1-4, described LED light source fluorescent material light distribution panel covers the top of blue-ray LED light source, and it comprises carrier board 1, described carrier board 1 light-permeable.Be mixed with a side surface of fluorescent material or described carrier board 1 in described carrier board 1 with exposed fluorescent coating 2, described fluorescent coating 2 is described on the surface of carrier board 1 by being coated in after fluorescent material and mixed with resin, replaced the mode that directly is coated in chip surface of the prior art, thereby extended the service life of LED light source, reduced cost, and technique is simple, improved production capacity.The surface of described exposed fluorescent coating 2 also is provided with the protective layer (not shown).Another opposite flank of described carrier board 1 is with micro-structure 3.Described fluorescent coating 2 and described micro-structure 3 are selectively positioned at the side of described carrier board 1 towards described LED light source.In this specific embodiment, described fluorescent coating 2 is positioned at the side of described carrier board 1 towards described LED light source, and described fluorescent coating 2 can be in order to change the glow color of LED light source, as blue light-white light transforms.Described micro-structure 3 is positioned at the side that described carrier board 1 deviates from described LED light source, the light that can send LED light source carries out secondary light-distribution, as direction of light, effect, distribution and color etc., thereby can effectively improve the light efficiency of LED light source, increase the LED light source reliability, and improved the luminous efficiency of fluorescent material.
Described micro-structure 3 can be identical with the material of described carrier board 1, also can be different from the material of described carrier board 1, and described micro-structure 3 generally is comprised of PPT plastics and sensitising agent.Described micro-structure 3 can be formed directly into by hot extrusion mode or high accuracy impression mode the surface of described carrier board 1; Also can be arranged on one deck optical thin film, then optical thin film be sticked to the surface of carrier board 1.Described micro-structure 3 is hackly structure (as Fig. 2 and Fig. 3) or lattice-like structure (as Fig. 4) or cylinder structure, these surfaces that are configured in described carrier board 1 can ordered arrangement also can lack of alignment.As Fig. 2 sectional view that is hackly structure, in jagged micro-structure 3, two adjacent sawtooth 31 apart from d, be 50.09 μ m, the angle a of part sawtooth 31 is 95 °, the angle a of part sawtooth 31 is 93 °.When LED light source is luminous, jagged micro-structure 3 can periodically locally increase brightness, to change the distribution of light intensity in space, the LED light source fluorescent material light distribution panel of this local increment can be used between the white light LEDs lamp plate that uses conventional point glue mode to make and liquid crystal display to meet the illumination needs of liquid crystal display.As the sectional view that Fig. 3 is another kind of hackly structure, the surface of each sawtooth 31 of micro-structure 3 is curved surface, and this micro-structure 3 can optically focused.As the sectional view that Fig. 4 is the lattice-like structure, the micro-structure 3 of lattice-like can change the luminous efficiency of fluorescent material.
Above in conjunction with most preferred embodiment, invention has been described, but the present invention is not limited to the embodiment of above announcement, and should contain the various modifications of carrying out according to essence of the present invention, equivalent combinations.
Claims (5)
1. a LED light source fluorescent material light distribution panel, cover the top of LED light source, comprise carrier board, it is characterized in that: at a side surface of described carrier board with micro-structure, be mixed with fluorescent material in described carrier board or in another opposite flank of described carrier board with exposed fluorescent coating.
2. LED light source fluorescent material light distribution panel as claimed in claim 1, it is characterized in that: described fluorescent coating and described micro-structure are selectively positioned at the side of described carrier board towards described LED light source.
3. LED light source fluorescent material light distribution panel as claimed in claim 1 or 2, it is characterized in that: described exposed fluorescent coating surface also is provided with protective layer.
4. LED light source fluorescent material light distribution panel as claimed in claim 1 or 2 is characterized in that: described micro-structure is hackly structure or lattice-like structure or cylinder structure.
5. LED light source fluorescent material light distribution panel as claimed in claim 1 or 2, it is characterized in that: described micro-structure is arranged on the surface of described carrier board by hot extrusion mode or high accuracy impression mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310495834.XA CN103486535A (en) | 2013-10-21 | 2013-10-21 | LED (light-emitting diode) light source fluorescent powder light matching plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310495834.XA CN103486535A (en) | 2013-10-21 | 2013-10-21 | LED (light-emitting diode) light source fluorescent powder light matching plate |
Publications (1)
| Publication Number | Publication Date |
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| CN103486535A true CN103486535A (en) | 2014-01-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310495834.XA Pending CN103486535A (en) | 2013-10-21 | 2013-10-21 | LED (light-emitting diode) light source fluorescent powder light matching plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106611812A (en) * | 2015-10-23 | 2017-05-03 | 华中科技大学 | A far-away phosphor powder adhesive coating method and product |
| CN108317478A (en) * | 2016-01-08 | 2018-07-24 | 扬州艾笛森光电有限公司 | Light-emitting device |
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| CN101297234A (en) * | 2005-08-27 | 2008-10-29 | 3M创新有限公司 | Illumination assembly and system |
| CN101470300A (en) * | 2007-12-27 | 2009-07-01 | 达方电子股份有限公司 | Backlight module and production method of its substrate |
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| CN106611812A (en) * | 2015-10-23 | 2017-05-03 | 华中科技大学 | A far-away phosphor powder adhesive coating method and product |
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| CN108317478A (en) * | 2016-01-08 | 2018-07-24 | 扬州艾笛森光电有限公司 | Light-emitting device |
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Application publication date: 20140101 |