CN106607667A - Manufacturing method for target material assembly - Google Patents
Manufacturing method for target material assembly Download PDFInfo
- Publication number
- CN106607667A CN106607667A CN201510705224.7A CN201510705224A CN106607667A CN 106607667 A CN106607667 A CN 106607667A CN 201510705224 A CN201510705224 A CN 201510705224A CN 106607667 A CN106607667 A CN 106607667A
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- China
- Prior art keywords
- target
- backboard
- solder
- protection board
- manufacture method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a manufacturing method for a target material assembly. The manufacturing method comprises the steps that a target material, a back plate and a protection plate are provided, the face, used for being welded, of the target material is a first welding face, the face, opposite to the first welding face, of the target material is a sputtering face, and the face, used for being welded, of the back plate is a second welding face; the protection plate is bonded to the sputtering face of the target material; the first welding face of the target material and the second welding face of the back plate are welded; in the welding process, the heat shock, caused by unmatched heat expansion coefficients, on the target material and the back plate is reduced through the protection plate; and the protection plate is removed after welding. Before the target material and the back plate are welded, the protection plate is bonded to the sputtering face of the target material. In the heating and cooling processes, the heat shock, caused by the unmatched heat expansion coefficients, on the target material and the back plate during temperature changing can be reduced through the protection plate, accordingly, the target material is protected, and the target material is prevented from being broken.
Description
Technical field
The present invention relates to sputtering target material manufacture field, more particularly to a kind of manufacture method of target material assembly.
Background technology
Target is the basic material of sputtering technology, is had in liquid crystal display industry and information Store industry
Significant advantage.In recent years, liquid crystal display significantly replaces computer and TV based on cathode ray tube
Machine display, the technology and the market demand for making target are increased considerably.
Prior art generally prepares the sputtering target material used by liquid crystal display using connecting method, i.e., each
Target material assembly can be spliced by multi-disc target.In order to ensure that spliced target has good conductive and heat conduction
Performance, target need welded together with backboard (material such as copper or aluminum) before sputtering.Semiconductor applications
Development more and more higher is required to the welding quality of spliced target component.
But, the manufacturing process of existing spliced target component has that target is frangible.
The content of the invention
The problem that the present invention is solved is to provide a kind of manufacture method of target material assembly, and it is several that reduction target is crushed
Rate.
To solve the above problems, the present invention provides a kind of manufacture method of target material assembly, including：Target is provided
Material, backboard and protection board, the thermal coefficient of expansion of the protection board are less than the thermal coefficient of expansion of target, or
The thermal coefficient of expansion of protection board is same or equivalent with the thermal coefficient of expansion of target；The target is used for welding
Face is the first solder side, and the face relative with the first solder side is sputter face, and the backboard is used for the face of welding
For the second solder side；The protection board is pasted in the sputter face of the target；Weld the target
Second solder side of the first solder side and the backboard；Protection board is removed after welding.
Optionally, the target material assembly is spliced target component, including the multiple targets on backboard；
The step of providing target, backboard and protection board includes：Multiple targets, a backboard and multiple guarantors are provided
Backplate；The protection board is pasted in the step in the sputter face of the target, in splashing for each target
Penetrate；
The step of second solder side of the first solder side and the backboard that weld the target, includes：Heating
The target and backboard；Respectively on the second solder side of first solder side and backboard of the plurality of target
Coated with solder；The plurality of target is sequentially placed on the second solder side of the backboard, and in adjacent target
Support bar is inserted between material；Cool down and when solder does not solidify, remove the support bar；Target after cooling
The first solder side of material and the second solder side of backboard weld together.
Optionally, the support bar is stainless steel substrates.
Optionally, the length of the support bar is equal to the length of side of target and support bar adjacent edge.
Optionally, the length of the support bar is 135～165mm, and width is 9～11mm, and thickness is
0.2～0.4mm.
Optionally, before between adjacent target the step of insertion support bar, the manufacture method also includes,
Thermal tape is pasted in the side of support bar.
Optionally, using target described in Welding the first solder side and the backboard the second solder side,
The solder is cored solder.
Optionally, the manufacture method also includes：
Respectively on the second solder side of first solder side and backboard of the target the step of coated with solder it
Afterwards, two copper wires are placed in parallel on the second solder side of backboard；
The step of the plurality of target is sequentially placed on the second solder side of the backboard include, will be multiple
Target is placed sequentially on two copper wires on the second solder side of backboard, makes the copper wire support target.
Optionally, the heating target and include the step of backboard：The target and backboard are placed on
On heating platform, the fusing point of the solder is warming up to；The solder is indium solder；
It is described cooling and when solder does not solidify, remove the support bar the step of include：By heating platform
150～160 degrees Celsius are cooled to, support bar is extracted out；Close heating platform, make backboard and target with plus
Hot platform cooling；When being cooled to less than 80 degrees Celsius, the backboard and target are taken out；Self-heating is cooled to room
Temperature.
Optionally, the backboard is rectangle, includes two ends and be located at both ends on long side direction
Between zone line；
It is described to include the step of naturally cool to room temperature：The both ends of the backboard are supported, in making backboard
Between region it is hanging, naturally cool to room temperature.
Optionally, the target and protection board are rectangle.
Optionally, the little 1～2mm of the length of side of the side ratio target corresponding edge of the protection board.
Optionally, the material of the target is silicon, and the material of the backboard is copper；The material of the protection board
Expect for silicon or silicon oxide.
Optionally, the thermal coefficient of expansion of the protection board and thermal coefficient of expansion of target is suitable refers to protection board
With the ratio of the thermal coefficient of expansion of target in the range of 0.9～1.1.
Optionally, it is first side that the target is located at the face between the first solder side and sputter face, described
Protection board is sticking veneer for the face bondd with target, and the face relative with the sticking veneer is the back side, described
Face between sticking veneer and the back side is second side；
The step that the protection board is pasted in the sputter face of the target is included：Target as sputter face with
Between protection board sticking veneer, thermal tape is set；The target exposed in protection board second side and protection board splashes
Penetrate, so that the thermal tape covers the gap between target and protection board.
Optionally, the manufacture method also includes：Weld first solder side and the backboard of the target
The second solder side the step of before, by abrasive blast equipment to first solder side and backboard of target second
Solder side carries out blasting treatment.
Optionally, the manufacture method also includes：The protection board is pasted on into the sputter face of the target
On step before, target as sputter face is polished by pneumatic polisher；And isopropyl is used after a polish
Alcoholic solution cleaning target as sputter face.
Compared with prior art, technical scheme has advantages below：
In the manufacture method of the target material assembly of the present invention, before heating to target and backboard, by institute
State protection board to be pasted on target as sputter face.In heating and cooling procedure, the protection board can reduce
Due to the thermal shock that target and backboard thermal coefficient of expansion are mismatched and caused in temperature change, so as to protect
Target, prevents target from crushing.
In alternative, support bar is inserted between adjacent target, target is aligned using support bar,
Relatively easily the position of target can be calibrated on the basis of the support bar such that it is able to be easier to
Ground is adjusted and is controlled to the width and uniformity of weld seam between target.
Description of the drawings
Fig. 1 to Fig. 8 is the structural representation of each step of one embodiment of manufacture method of target material assembly of the present invention.
Specific embodiment
During the manufacture method of existing target material assembly has welding process, target is frangible.
In conjunction with the manufacture method of the target material assembly of prior art, the frangible original of target in analysis welding process
Cause：
In the manufacture method of the target material assembly of prior art, backboard and target heated and is being cooled down
During, the change of temperature makes target and backboard expand with heat and contract with cold phenomenon.However, due to target and the back of the body
The thermal coefficient of expansion of plate is mismatched, and target is deformed mismatching with backboard, and target can be subject to backboard power
Effect, so that stress is produced in target, causes target to crush, and welding quality is reduced.
To solve the technical problem, the invention provides a kind of manufacture method of target material assembly, the present invention
Target material assembly manufacture method in, before heating to target and backboard, the protection board is glued
It is affixed on target as sputter face.In heating and cooling procedure, the protection board can reduce due to target and
The thermal shock that backboard thermal coefficient of expansion is mismatched and caused in temperature change, so as to protect target, prevents
Target is crushed.Meanwhile, the protection board can reduce the directly contact of target and the external world, so as to reduce target
Because of outer bound pair, which is touched and is caused broken probability material.
In alternative, target is aligned using support bar, can be compared with the basis of the support bar
Easily the position of target is calibrated such that it is able to the relatively easily width to the weld seam between target
It is adjusted with uniformity and controls.
It is understandable to enable the above objects, features and advantages of the present invention to become apparent from, below in conjunction with the accompanying drawings
The specific embodiment of the present invention is described in detail.
It is that the structure of each step of one embodiment of manufacture method of target material assembly of the present invention is shown referring to figs. 1 to Fig. 8
It is intended to.The manufacture method of the target material assembly, including：
Refer to Fig. 1, there is provided target 101, backboard 100 and protection board 102, the protection board 102
Thermal coefficient of expansion is same or equivalent with the thermal coefficient of expansion of target 101；The target 101 is used for welding
Face is the first solder side, and the face relative with the first solder side is sputter face, and the backboard 100 is used to weld
Face be the second solder side.
It should be noted that in welding process, target 101 and backboard 100 can be because of the changes of temperature
It is deformed, in target material assembly technical field, the thermal coefficient of expansion of usual backboard 100 is more than target 101
Thermal coefficient of expansion so that backboard 100 deformation more than target 101 deformation.Therefore, in welding
When process occurrence temperature changes, target 101 can also be because being carried on the back in addition to itself expanding with heat and contract with cold and being deformed
The effect of 100 power of plate and occur further to deform.The protection board 102 being pasted on target 101 it is hot swollen
Thermal coefficient of expansion of the swollen coefficient less than target 101, or it is same or like with 101 thermal coefficient of expansion of target,
Therefore, when occurrence temperature changes, protection board 102 is deformed less than or equal to the deformation of target 101, from
And the effect to the generation power of target 101, and protection board 102 is applied to the power and backboard 100 of target 101
The force direction of target 101 is applied to conversely, so that reducing with joint efforts suffered by target 101, and then is subtracted
Stress in little target 101, reduces the broken probability of target 101.
Additionally, the protection board 102 can reduce target 101 and extraneous directly contact, so as to reduce
Because of outer bound pair, which is touched and is caused broken probability target 101.
In the present embodiment, the target 101 is silicon chip.The target 101 is shaped as rectangle, rectangle
Target 101 is easy to splice and adjust the weld seam between target 101.But the present invention is not construed as limiting to this,
The target 101 can also be parallelogram.
In the present embodiment, the material of the backboard 100 is copper, of the invention to be not construed as limiting to this, the back of the body
The material of plate 100 can also be aluminum.
In the present embodiment, the material of the protection board 102 is the hot swollen of silicon or silicon oxide, silicon or silicon oxide
Swollen coefficient is same or like with the thermal coefficient of expansion of the target 101.But, the present invention is to the protection
The material of plate 102 is not limited, and the material of the protection board 102 can be according to backboard 100 and target 101
Material select other materials.
In the present embodiment, the protection board 102 is also rectangle.But the present invention is not construed as limiting to this, institute
The shape for stating protection board 102 can be selected according to the shape of target 101.
If it should be noted that the protection board 102 is excessive to be unfavorable for protection board 102 and target 101
Stickup, the protection board 102 is too small, it is difficult to the 101 interior-heat punching of reduction target is played in welding process
The effect hit.Therefore, the little 1～2mm of the length of side of 101 corresponding edge of side ratio target of protection board 102.Example
Such as, in the present embodiment rectangle protection board 102 it is long while than rectangle target 101 it is long while little 1～2mm, square
The minor face of shape protection board 102 1～2mm less than the minor face of rectangle target 101.
Also, it should be noted that in the present embodiment, the target material assembly is spliced target component, including position
Multiple targets 101 on backboard 100.
Specifically, include the step of the offer target 101, backboard 100 and protection board 102：There is provided many
Individual target 101 (being 3 in the present embodiment), 102 (the present embodiment of a backboard 100 and multiple protection boards
In be 3).
With continued reference to Fig. 1, the protection board 102 is pasted in the sputter face of the target 101.It is described
Protection board 102 can not reduce target 101 and backboard 100 because of thermal coefficient of expansion not in welding process
With the thermal shock for causing.
In the present embodiment, the protection board 102 is pasted on into the step in the sputter face of the target 101
Including：A protection board 102 is pasted in the sputter face of each target 101.
Specifically, it is first side that the target 101 is located at the face between the first solder side and sputter face,
The protection board 102 is sticking veneer for the face pasted with target 101, the face relative with the sticking veneer
For the back side, the face between sticking veneer and the back side is second side.The protection board 102 is pasted on
Step in the sputter face of the target 101 includes：Paste in 101 sputter face of target and protection board 102
Thermal tape is set between face；In the target 101 that 102 second side of protection board and protection board 102 expose
Thermal tape is pasted in sputter face, so that the thermal tape is covered between target 101 and protection board 102
Gap, and expose first solder side and first side of target 101.
It should be noted that in the present embodiment, the protection board 102 is pasted on the target 101
Before step in sputter face, the manufacture method also includes：Target 101 is splashed by pneumatic polisher
The face of penetrating is polished and utilizes aqueous isopropanol to wipe 101 surface of target, makes 101 sputter face of target flat
And ensure that 101 sputter face of target is cleaned, so as to reduce the difficulty that target 101 is pasted with protection board 102.
Refer to Fig. 2 to Fig. 5, weld the target 101 the first solder side and the backboard 100 the
Two solders side；In welding process, the protection board 102 reduces target 101 and backboard 100 because heat is swollen
Swollen coefficient mismatches the thermal shock for causing.
In the present embodiment, the second weldering of first solder side and the backboard 100 of the target 101 is welded
The step of junction, includes：Heat the target 101 and backboard 100；Respectively the first of the target 101
Coated with solder on second solder side of solder side and backboard 100；In the second solder side of the backboard 100
On be sequentially placed the plurality of target 101, and support bar 104 is inserted between adjacent target 101, it is described
Support bar 104 is used to adjust the weld seam between adjacent target 101；Cool down and when solder does not solidify, go
Except the support bar 104；After cooling, 101 first solder side of target and 100 second solder side of backboard are welded
Together.
In the present embodiment, using target described in Welding 101 and the backboard 100, the solder is pricker
Solder, cored solder have good wellability to copper backboard and silicon target, and repeat can backboard 100
Utilize, it is cost-effective.Specifically, the solder is indium solder.The fusing point of indium solder is low, welding temperature
Low, thermal shock of the welding process to target 101 is little, and target 101 is non-friable.
In the present embodiment, include the step of the heating backboard 100 and protection board 102：By backboard
100th, and the target 101 of the bonding of protection board 102, support bar 104 and briquetting 103 are positioned over heating platform
On, heating platform is warming up to into 190～200 degrees Celsius, solder fusing.
It should be noted that described slowly should enter the process that heating platform is warming up to 190～200 degrees Celsius
OK, heat up the too fast thermal shock that can increase in target 101, easily causes target 101 to crush.
Also, it should be noted that in the present embodiment, the side of the backboard 100 has screwed hole, described
Screwed hole fixes the target material assembly in the use process of follow-up target material assembly.Heating the target 101
Before backboard 100, thermal tape is pasted in 100 side of backboard, the thermal tape is used to protect institute
Screwed hole is stated, prevents solder from immersing.
In the present embodiment, it is described respectively the target 101 the first solder side and backboard 100 second
Include the step of coated with solder on solder side：By ultrasonic treatment unit the first of the target 101
Coated with solder on second solder side of solder side and backboard 100, make the first solder side described in wetting and
Second solder side.And leaching of the solder to the first solder side and the second solder side is detected with aqueous isopropanol
Lubricant nature.
As shown in Fig. 2 in the present embodiment, being sequentially placed institute on the second solder side of the backboard 100
Before the step of stating multiple targets 101, also include：It is placed in parallel on the solder side of the backboard 100
Two copper wires 107, the copper wire 107 are used to preserve the solder on the second solder side of backboard 100.
Specifically, in the present embodiment, it is sequentially placed on the second solder side of the backboard 100 described many
In the step of individual target 101, the plurality of target 101 is sequentially placed on two copper wires 107,
Make the copper wire 107 support target 101, space is provided for solder, make the first solder side and the second solder side
Between solder thickness more than or equal to the copper wire 107 diameter.In the present embodiment, the plurality of target
101 are arranged in order along 107 bearing of trend of described two copper wires.
In the present embodiment, if the diameter of the copper wire 107 is too small, it is difficult to play a part of to preserve solder,
If the diameter of the copper wire 107 is excessive, easily make to produce seam between the first solder side and the second solder side
Gap, and cause weld strength to decline.Specifically, model of the diameter of the copper wire 107 in 0.2～0.3mm
In enclosing.
As shown in Figure 3 and Figure 4, in the present embodiment, the step for adjusting weld seam between adjacent target 101
Suddenly include：After the plurality of target 101 is sequentially placed on the second solder side of the backboard 100,
Briquetting 103 is placed on first piece of target 101, the briquetting 103 is used to fix first piece of target
101.Support bar 104 is inserted between first piece of target 101 and second piece of target 101, the support bar
104 are used to control the width of weld seam between target 101, increase the uniformity of weld seam；Adjust second piece of target
101 position, makes second piece of target 101 press close to support bar 104, so as to be adjusted to the width of weld seam.
Repeat the above steps are adjusted to all weld seams and are finished.
Specifically, in the present embodiment, the material of the support bar 104 is rustless steel.
It should be noted that the thickness H of the support bar 104 is used for the width for controlling weld seam, if institute
The thickness H for stating support bar 104 crosses conference and causes weld seam excessive, if the thickness H of support bar 104 is too small
It is difficult to prevent the 101 lower section solder of target pushed down by briquetting 103 from trickling to weld seam, and make solder in weld seam
Increase, hinder the regulation of weld seam.Specifically, in the present embodiment, the thickness H of the support bar 104 is
0.2～0.4mm.
In the present embodiment, the needs of the target 101 are fixed to meet later use fixture, described
Length L of stay 104 is equal to the length of side of target 101 and 104 adjacent edge of support bar.Specifically, it is described
Length L (as shown in Figure 5) of support bar 104 is 135～165mm, and width W is 9～11mm.But
It is that the present invention is not construed as limiting to this, in other embodiments, length L of the support bar 104 can be with
More than target 101 and the length of side of 104 adjacent edge of support bar.
In the present embodiment, between adjacent target 101 insert support bar 104 the step of before, described
Paste thermal tape in 104 side of support bar.The thermal tape is prevented from support bar 104 and scratches target
101, in addition with beneficial to weld seam adjust after the completion of relatively easily extract the support bar 104 out.
As shown in figure 5, in the present embodiment, between adjacent target 101 the step of insertion support bar 104
Afterwards, before the step of removing support bar 104, the manufacture method also includes：Fixture 105 is provided,
The fixture 105 is annular, for fixing target 101 and making 101 adjacent edge of target parallel；Will be described
Fixture 105 is positioned on 100 second solder side of backboard that target 101 exposes, and makes to be welded in backboard 100
On all targets 101 be placed in annular holder 105；Target 101 is fixed on by institute by bolt 106
State on fixture 105.
Specifically, the fixture 105 is side's annular, and with rectangular aperture, the rectangular aperture is used to hold
Receive the target 101 for welding together, the fixture 105 is positioned over into the backboard 100 that target 101 exposes
During on two solders side, the target 101 for welding together is made to be positioned in the rectangular aperture.
In the present embodiment, the fixture 105 has screw on relative two side, and fixture 105 is relative
Screw on the wall of side is relative.Side wall of the screw through the fixture 105.By bolt 106 by target
The step that material 101 is fixed on the fixture 105 includes：Bolt 106 is made to be each passed through 105 side of fixture
Two screws relative on wall are simultaneously contacted with target 101, so as to the target 101 is fixed on fixture 105
On, while make the side that target 101 is contacted with fixture 105 parallel with the corresponding edge of fixture 105, so that
The adjacent edge of target 101 is parallel to each other.
It should be noted that in the present embodiment, the process for fixing target 101 with fixture 105 is in heating
Carry out on platform.The fixture 105 is being positioned over into the welding of backboard 100 second that target 101 exposes
Before on face, fixture 105 is heated to into 190～200 degrees Celsius on heating platform.
As shown in Figures 4 to 6, in the present embodiment, the solder be indium solder, the cooling and weldering
Material is not when solidifying, and includes the step of remove support bar 104：Heating platform is cooled to into 150～160
Degree Celsius, support bar 104 is extracted out；Heating platform is closed, and backboard 100 and target 101 is made with heating
Platform is cooled down；When being cooled to less than 80 degrees Celsius, take out；Self-heating is cooled to room temperature.
It should be noted that heating platform is cooled to into 150～160 degrees Celsius, by the support bar 104
During extraction, if support bar 104 takes out too late, solder solidification, support bar 104 can be pasted onto
It is difficult to extract out in weld seam between target 101；Support bar 104 takes out too early, takes in support bar 104
During going out to solder solidification, target 101 is susceptible to mobile and makes weld width change.Cause
This, in the present embodiment, when heating platform is cooled to 150～160 degrees Celsius, solder starts solidification, in weldering
Material will solidify and when not yet solidifying completely take out the support bar 104.
In the present embodiment, the backboard is rectangle, includes two ends and be located at two on long side direction
Zone line between end states the step of naturally cooling to room temperature to be included：Support the two of the backboard 100
End, makes the zone line of backboard 100 hanging, naturally cools to room temperature.Target 101 can so be made
With the zone line of backboard 100 during cooling free shrink, so as to reduce target 101 and backboard
100 in heating process because expansion produce flexural deformation.
Specifically, in the present embodiment, the target 101 being fixed together, backboard 100 and fixture 105 are put
It is placed on shelf, makes middle hanging.
It should be noted that in the present embodiment, welding first solder side and the back of the body of the target 101
Before the step of second solder side of plate 100, the manufacture method also includes：By sand blasting unit to target
Second solder side of first solder side and backboard 100 of material 101 carries out blasting treatment.The blasting treatment
The roughness of first, second solder side can be increased, so as to increase rubbing between first, second solder side
Power is wiped, increases the weld strength after welding.
Specifically, the sand blasting unit includes spray gun and the grains of sand.If the dynamics of the sandblasting is excessive easily
Target 101 is caused to crush, the dynamics of the sandblasting can not be excessive.
In the present embodiment, the grains of sand are No. 125 carborundums, and blasting pressure is 1～4kgf/cm2, it is described
Spray gun to 100 second solder side of 101 first solder side of target and backboard distance be 18～22cm.Sandblasting
To first, second solder side without obvious lines, uniform surface is coarse.
In the present embodiment, after the blasting treatment, the target material assembly manufacture method also includes：With sky
Air gun blows clean first, second solder side, and wipes first, second solder side with aqueous isopropanol.
Fig. 7 and Fig. 8 is refer to, protection board 102 (as shown in Figure 6) after welding, is removed.
Specifically, as shown in fig. 7, in the present embodiment, including the step of removal protection board 102 after welding：
The thermal tape on 101 surface of protection board 102 and target is removed, so that protection board 102 and target 101
Separate.
In the present embodiment, the step of removal protection board 102 before, also including removing the briquetting 103
(referring to Fig. 6).
As shown in figure 8, in the present embodiment, the step of protection board 102 are removed after the welding after, institute
Stating manufacture method also includes, removes the fixture 105 (referring to Fig. 7).
In the present embodiment, after the welding remove protection board 102 the step of after, the manufacture method is also
Including：After removing the fixture 105, adhesive waterproof tape is pasted on target 101 and backboard 100, made
The adhesive waterproof tape covers the gap between target 101 and backboard 100, and in the solder side of target 101
Upper stickup adhesive waterproof tape, makes the adhesive waterproof tape cover the weld seam between adjacent target 101；By ultrasound
The ratio of defects of ripple detection welding, if solder bond rate is more than 97%, and individual defect area is less than or equal to
2%, then it is qualified to weld, and otherwise returns weldering；Remove the thermal tape of 100 side of the adhesive waterproof tape and backboard.
In the present embodiment, after welding remove protection board 102 the step of after, the manufacture method also includes：
Machining is carried out to the target 101 and backboard 100, the target group for meeting design requirement is processed into
Part.
To sum up, in the manufacture method of target material assembly of the invention, before heating to target and backboard,
The protection board is pasted in the sputter face of target.In heating and cooling procedure, the protection board energy
It is enough to reduce the thermal shock for mismatching and causing in temperature change due to target and backboard thermal coefficient of expansion, so as to
Protection target, prevents target from crushing.Additionally, the present invention is aligned to target using support bar, with institute
Relatively easily the position of target can be calibrated on the basis of stating the position of support bar, so as to target it
Between weld seam width and uniformity be adjusted and control.Thus, it is possible to realize the butt welding in welding process
The regulation of seam.
Although present disclosure is as above, the present invention is not limited to this.Any those skilled in the art,
Without departing from the spirit and scope of the present invention, can make various changes or modifications, therefore the guarantor of the present invention
Shield scope should be defined by claim limited range.
Claims (17)
1. a kind of manufacture method of target material assembly, it is characterised in that include：
Target, backboard and protection board are provided, the thermal coefficient of expansion of the protection board is less than the thermal expansion of target
Coefficient, or the thermal coefficient of expansion of protection board is same or equivalent with the thermal coefficient of expansion of target；The target
Face for welding is the first solder side, and the face relative with the first solder side is sputter face, the backboard use
In welding face be the second solder side；
The protection board is pasted in the sputter face of the target；
Weld the second solder side of first solder side and the backboard of the target；
Protection board is removed after welding.
2. the manufacture method of target material assembly as claimed in claim 1, it is characterised in that the target material assembly is
Spliced target component, including the multiple targets on backboard；
The step of providing target, backboard and protection board includes：Multiple targets, a backboard and multiple protections are provided
Plate；
The protection board is pasted in the step in the sputter face of the target, in the sputter face of each target
On paste a protection board；
The step of second solder side of the first solder side and the backboard that weld the target, includes：
Heat the target and backboard；
The coated with solder on the second solder side of first solder side and backboard of the plurality of target respectively；
The plurality of target is sequentially placed on the second solder side of the backboard, and is inserted between adjacent target
Enter support bar；
Cool down and when solder does not solidify, remove the support bar；
The first solder side of target and the second solder side of backboard after cooling welds together.
3. the manufacture method of target material assembly as claimed in claim 2, it is characterised in that the support bar is not for
Rust steel disc.
4. the manufacture method of target material assembly as claimed in claim 2, it is characterised in that the length of the support bar
Degree is equal to target and the length of side of support bar adjacent edge.
5. the manufacture method of target material assembly as claimed in claim 2, it is characterised in that the length of the support bar
Spend for 135～165mm, width is 9～11mm, and thickness is 0.2～0.4mm.
6. the manufacture method of target material assembly as claimed in claim 2, it is characterised in that between adjacent target
Before the step of insertion support bar, the manufacture method also includes, pastes heatproof in the side of support bar
Adhesive tape.
7. the manufacture method of target material assembly as claimed in claim 2, it is characterised in that using Welding institute
The second solder side of first solder side and the backboard of target is stated, the solder is cored solder.
8. the manufacture method of target material assembly as claimed in claim 2, it is characterised in that the manufacture method is also
Including：
Respectively on the second solder side of first solder side and backboard of the target the step of coated with solder it
Afterwards, two copper wires are placed in parallel on the second solder side of backboard；
The step of the plurality of target is sequentially placed on the second solder side of the backboard includes, by multiple targets
Material is placed sequentially on two copper wires on the second solder side of backboard, makes the copper wire support target.
9. the manufacture method of the target material assembly described in claim 2, it is characterised in that the heating target
And include the step of backboard：The target and backboard are placed on heating platform, the solder is warming up to
Fusing point；
The solder is indium solder；
It is described cooling and when solder does not solidify, remove the support bar the step of include：
Heating platform is cooled to into 150～160 degrees Celsius, support bar is extracted out；
Heating platform is closed, backboard and target is cooled down with heating platform；
When being cooled to less than 80 degrees Celsius, the backboard and target are taken out；
Self-heating is cooled to room temperature.
10. the manufacture method of target material assembly as claimed in claim 9, it is characterised in that the backboard is rectangular
Shape, includes two ends and the zone line between both ends on long side direction；
It is described to include the step of naturally cool to room temperature：The both ends of the backboard are supported, the centre of backboard is made
Region is hanging, naturally cools to room temperature.
The manufacture method of 11. target material assemblies as claimed in claim 1, it is characterised in that the target and protection
Plate is rectangle.
The manufacture method of 12. target material assemblies as claimed in claim 1, it is characterised in that the side of the protection board
Length 1～2mm less than the length of side of target corresponding edge.
The manufacture method of 13. target material assemblies as claimed in claim 1, it is characterised in that the material of the target
For silicon, the material of the backboard is copper；
The material of the protection board is silicon or silicon oxide.
The manufacture method of 14. target material assemblies as claimed in claim 1, it is characterised in that the heat of the protection board
The coefficient of expansion ratio for referring to protection board and the thermal coefficient of expansion of target suitable with the thermal coefficient of expansion of target
In the range of 0.9～1.1.
The manufacture method of 15. target material assemblies as claimed in claim 1, it is characterised in that the target is located at the
Face between one solder side and sputter face is first side, and the protection board is for the face that bonds with target
For sticking veneer, the face relative with the sticking veneer is the back side, and the face between the sticking veneer and the back side is
Second side；
The step that the protection board is pasted in the sputter face of the target is included：
Between target as sputter face and protection board sticking veneer, thermal tape is set；
Thermal tape is pasted on the target as sputter face that protection board second side and protection board expose, so that described
Thermal tape covers the gap between target and protection board.
The manufacture method of 16. target material assemblies as claimed in claim 1, it is characterised in that the manufacture method is also
Including：Before the step of second solder side of the first solder side and the backboard that weld the target,
Blasting treatment is carried out to the second solder side of first solder side and backboard of target by abrasive blast equipment.
The manufacture method of 17. target material assemblies as claimed in claim 1, it is characterised in that the manufacture method is also
Including：Before the step that the protection board is pasted in the sputter face of the target,
Target as sputter face is polished by pneumatic polisher；
And clean target as sputter face after a polish with aqueous isopropanol.
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| CN201510705224.7A CN106607667B (en) | 2015-10-26 | 2015-10-26 | The manufacture method of target material assembly |
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|---|---|---|---|
| CN201510705224.7A CN106607667B (en) | 2015-10-26 | 2015-10-26 | The manufacture method of target material assembly |
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| Publication Number | Publication Date |
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| CN106607667A true CN106607667A (en) | 2017-05-03 |
| CN106607667B CN106607667B (en) | 2018-05-08 |
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ID=58615295
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| CN201510705224.7A Active CN106607667B (en) | 2015-10-26 | 2015-10-26 | The manufacture method of target material assembly |
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|---|---|---|---|---|
| CN108655525A (en) * | 2018-05-17 | 2018-10-16 | 洛阳丰联科绑定技术有限公司 | A kind of binding method of target |
| CN108673064A (en) * | 2018-05-29 | 2018-10-19 | 宁波江丰电子材料股份有限公司 | The method of sputtering target material SB welding sandblasting rear protectings |
| CN109093218A (en) * | 2017-06-20 | 2018-12-28 | 宁波江丰电子材料股份有限公司 | A kind of manufacturing method of target material assembly |
| CN109112490A (en) * | 2017-06-23 | 2019-01-01 | 宁波江丰电子材料股份有限公司 | Spliced target welding method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1494602A (en) * | 2000-10-30 | 2004-05-05 | ����Τ�����ʹ�˾ | Assembly of physical vapor deposition target and method for producing same |
| CN1742111A (en) * | 2003-02-20 | 2006-03-01 | 贝克特股份有限公司 | A method of manufacturing a sputter target |
| CN1763240A (en) * | 2004-10-19 | 2006-04-26 | 株式会社钢臂功科研 | Assembly for sputtering aluminum-neodymium alloys |
| US20060266643A1 (en) * | 2005-05-31 | 2006-11-30 | Applied Materials, Inc. | Elastomer bonding of large area sputtering target |
| CN1982502A (en) * | 2001-10-12 | 2007-06-20 | 东曹株式会社 | Sputtering target |
| CN102699519A (en) * | 2012-05-26 | 2012-10-03 | 烟台希尔德新材料有限公司 | Method for adhering large-scale plane targetto back plate |
-
2015
- 2015-10-26 CN CN201510705224.7A patent/CN106607667B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1494602A (en) * | 2000-10-30 | 2004-05-05 | ����Τ�����ʹ�˾ | Assembly of physical vapor deposition target and method for producing same |
| CN1982502A (en) * | 2001-10-12 | 2007-06-20 | 东曹株式会社 | Sputtering target |
| CN1742111A (en) * | 2003-02-20 | 2006-03-01 | 贝克特股份有限公司 | A method of manufacturing a sputter target |
| CN1763240A (en) * | 2004-10-19 | 2006-04-26 | 株式会社钢臂功科研 | Assembly for sputtering aluminum-neodymium alloys |
| US20060266643A1 (en) * | 2005-05-31 | 2006-11-30 | Applied Materials, Inc. | Elastomer bonding of large area sputtering target |
| CN102699519A (en) * | 2012-05-26 | 2012-10-03 | 烟台希尔德新材料有限公司 | Method for adhering large-scale plane targetto back plate |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109093218A (en) * | 2017-06-20 | 2018-12-28 | 宁波江丰电子材料股份有限公司 | A kind of manufacturing method of target material assembly |
| CN109093218B (en) * | 2017-06-20 | 2019-12-27 | 宁波江丰电子材料股份有限公司 | Manufacturing method of target assembly |
| CN109112490A (en) * | 2017-06-23 | 2019-01-01 | 宁波江丰电子材料股份有限公司 | Spliced target welding method |
| CN108655525A (en) * | 2018-05-17 | 2018-10-16 | 洛阳丰联科绑定技术有限公司 | A kind of binding method of target |
| CN108673064A (en) * | 2018-05-29 | 2018-10-19 | 宁波江丰电子材料股份有限公司 | The method of sputtering target material SB welding sandblasting rear protectings |
| CN110414131A (en) * | 2019-07-29 | 2019-11-05 | 中国科学院金属研究所 | A kind of choosing method of sandwich structure Co target backboard diffusion welding (DW) component middle layer |
| CN110414131B (en) * | 2019-07-29 | 2023-04-07 | 中国科学院金属研究所 | Method for selecting interlayer of diffusion welding assembly of Co target backboard with sandwich structure |
| CN110355520B (en) * | 2019-08-27 | 2021-08-10 | 宁波江丰电子材料股份有限公司 | Briquetting placing device and briquetting placing method |
| CN110355520A (en) * | 2019-08-27 | 2019-10-22 | 宁波江丰电子材料股份有限公司 | Briquetting apparatus for placing and briquetting laying method |
| CN110670030A (en) * | 2019-09-29 | 2020-01-10 | 洛阳丰联科绑定技术有限公司 | Bonding method of ITO spliced target material |
| CN111015090A (en) * | 2019-11-25 | 2020-04-17 | 有研亿金新材料有限公司 | Copper-based target and back plate welding method |
| CN111118459A (en) * | 2019-12-30 | 2020-05-08 | 有研亿金新材料有限公司 | Preparation method of high-performance ferromagnetic target material |
| CN113210832A (en) * | 2021-06-02 | 2021-08-06 | 宁波江丰电子材料股份有限公司 | Diffusion welding method for aluminum-scandium alloy target |
| TWI806224B (en) * | 2021-11-05 | 2023-06-21 | 臺灣蘇晶股份有限公司 | Target and back plate lamination manufacturing method |
| CN114750079A (en) * | 2022-04-24 | 2022-07-15 | 广东江丰电子材料有限公司 | Preparation method of target material assembly |
| CN115302066A (en) * | 2022-09-09 | 2022-11-08 | 宁波江丰电子材料股份有限公司 | Spliced tungsten-nickel alloy target material assembly and welding method thereof |
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