CN104690487A - Method for adhesively connecting target and backboard - Google Patents
Method for adhesively connecting target and backboard Download PDFInfo
- Publication number
- CN104690487A CN104690487A CN201310664863.4A CN201310664863A CN104690487A CN 104690487 A CN104690487 A CN 104690487A CN 201310664863 A CN201310664863 A CN 201310664863A CN 104690487 A CN104690487 A CN 104690487A
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- Prior art keywords
- target
- backboard
- attachment
- bonding method
- glue
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P11/00—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention belongs to the technical field of manufacturing of targets, and particularly relates to a method for adhesively connecting a target and a backboard. The method comprises the following steps: providing the target and the backboard; processing an adhesion surface of the target and the backboard; evenly coating and adhering required organic glue on the adhesion surface of the target and the backboard; adhering the target and the backboard, and using a normal-temperature solidifying or low-temperature solidifying mode to guarantee reliable adhesion. The organic glue is used in adhesion to achieve the reliable connection of the target at the normal temperature or low temperature, the excellent thermal conductivity and electric conductivity and the enough connection strength are guaranteed in the sputtering process of the target, meanwhile, the connection temperature is reduced, so that the problems of target fragmentation, deformation and the like possibly caused by high-temperature heating are avoided, the requirement of connection of the special target at the normal temperature is met, meanwhile, the operation difficulty is lowered, and the yield is improved.
Description
Technical field
The invention belongs to target manufacturing technology field, particularly the bonding method of attachment of a kind of target and backboard.
Background technology
Sputter coating is a kind of common technology in integrated circuit, plane display and the chip such as solar cell and element manufacturing, and sputtering target material assembly to be normally combined with backboard to form by meeting target that sputtering requires.Backboard has certain intensity, provides support when target material assembly is mounted to sputtering machine table, has good heat-conductivity conducting performance simultaneously.
At present, target has with the main connected mode of backboard and is mechanically connected and welds two kinds.Wherein, the interface of mechanical connection target and backboard is difficult to completely fine and close, and the gap of existence can cause bond strength between target and backboard to reduce, and affects the conduction of electricity and heat in sputter procedure simultaneously.Be welded with the multiple methods such as solder, solder brazing, diffusion welding (DW), electron beam welding, in connection procedure, target and backboard need bear the high temperature of more than 200 DEG C usually, and heating process may cause fragility target to ftracture, fracture, the problems such as thin plate target distortion.In addition, under high temperature, target welding operation difficulty is high; After the target larger with backboard difference of thermal expansion coefficients welds, thermal stress is large, and post welding distortion is larger; Need to increase smoothing operation after the target welding of temperature distortion.
Therefore, a kind of bonding method of attachment ensureing to possess in target as sputter process good thermal conductivity, electric conductivity and enough bonding strengths need be provided.Bonding method of attachment is conducting resinl or the heat-conducting glue of selecting organic matter matrix, and under low temperature or normal temperature, complete connection to target and backboard, adhesive glue is fully filled between target and backboard, can guarantee that target possesses good electrical and thermal conductivity performance.Adhesive bonding method compares the temperature that welding method greatly reduces connection procedure, avoids target in connection procedure, occurs the problems such as cracked, distortion, reduce operation easier simultaneously.
Summary of the invention
The object of this invention is to provide the bonding method of attachment of a kind of target and backboard, use conducting resinl or heat-conducting glue to replace conventional metals solder, significantly reduce and connect temperature, realize target and be connected with the reliable of backboard.
Not enough for prior art, the invention provides the bonding method of attachment of a kind of target and backboard, its concrete steps are as follows:
(1) target and backboard are provided;
(2) adhesive surface of target and backboard is processed;
(3) on target and backboard adhesive surface, evenly adhesive glue is applied;
(4) target and backboard carry out pressurization fix, adhesive glue is solidified.
Described target material is metal, alloy or nonmetallic materials.
Described metal is the metals such as aluminium, copper, titanium, tantalum, tungsten, ruthenium, cobalt, platinum, gold, silver, molybdenum, chromium, iron or nickel metal, but is not limited thereto.
Described alloy is the alloy of aluminium, tungsten, titanium, silver, ruthenium, cobalt, platinum or nickel, but is not limited thereto.
Described nonmetallic materials are silicon, carbon, tin indium oxide, zinc oxide aluminum, tin ash or zinc oxide etc., but are not limited thereto.
Described backboard material is metal or alloy material.
Described metal or alloy material is copper, iron, titanium, aluminium, brass alloys, chrome copper, corronil, steel, titanium alloy, aluminium alloy, but is not limited thereto.
Described in step (2), processing method is: carry out blasting treatment or machined at target and backboard adhesive surface, improves bonding plane roughness, increases the bonded area of glue and adhesive surface, and after process, roughness is between 1 μm ~ 15 μm.
Adhesive glue described in step (3) is one or more in epoxy type, phenol aldehyde type, the conducting resinl of organic silicon type or heat-conducting glue.
Described adhesive glue performance need ensure to solidify rear bonding strength and invalid temperature reaches target product requirement, and solidification after-drawing intensity is not less than 0.5MPa, and invalid temperature is not less than 100 DEG C, should take into account the specific demand of different product simultaneously.
Described adhesive glue be epoxy type, phenol aldehyde type, organic silicon type one or more of heat-conducting glue time, the wire netting of conduction, heat conductivility must be had at bonding place place mat, and suitably fixation pressure is improved in heat-conducting glue solidification process, after guaranteeing adhesive glue solidification, wire netting and target and backboard all have good contact.
Described wire netting is aluminium net, copper mesh or silver-colored net.
If selected adhesive glue be epoxy type, phenol aldehyde type, organic silicon type one or more of conducting resinl time, place mat wire netting is not must step, can select to be encased inside wire or wire netting in bonding place, control bonding seam thickness and also improve heat-conductivity conducting performance.
Target and backboard also, after being optionally encased inside wire netting or silk, pressurizeing and fix by coating adhesive glue, and when described in step (4), pressurization is fixing, applied pressure should be not less than 0.05MPa.
According to the special requirement of selected adhesive glue performance and different target, when described in step (4), pressurization is fixing, adhesive glue solidification temperature scope is 20 DEG C ~ 100 DEG C, when described in step (4), pressurization is fixing, adhesive glue hardening time is 2h ~ 48h, and adhesive glue is fully solidified, and realizes reliably connecting.
Beneficial effect of the present invention is:
(1) adopt bonding method of attachment by two kinds of metals or nonmetally well can to combine, and heat-conductivity conducting performance when ensureing target as sputter, thus realize target and be connected with the large area of backboard; (2) significantly reduce connection temperature, the reliable connection of target can be completed at normal temperatures, the connection request of special target can be met, avoid in heating process simultaneously and occur target cracking, fracture, improve yield rate; (3) connect temperature low, be easy to operation, and avoid the temperature distortion of target in connection procedure, without the need to increasing smoothing operation upon connection, greatly reducing operation easier and decreasing operating procedure.
Accompanying drawing explanation
Fig. 1 is the process chart of the inventive method;
Fig. 2 is target material structure schematic diagram of the present invention;
Fig. 3 is back board structure schematic diagram of the present invention;
Fig. 4 a is structural representation after target adhesive surface of the present invention coating adhesive glue, and Fig. 4 b is structural representation after backboard adhesive surface of the present invention coating adhesive glue;
Fig. 5 connects by the inventive method bonding the target material assembly structural representation obtained.
Detailed description of the invention
The invention provides the bonding method of attachment of a kind of target and backboard, below in conjunction with the drawings and specific embodiments, the present invention will be further described.
As shown in Figure 1, perform step S101, target and backboard are provided;
Perform step S102, target and backboard adhesive surface are processed;
Metal targets can carry out blasting treatment or mechanical process at adhesive surface, and nonmetal target can carry out blasting treatment by demand.
Perform step S103, target and backboard adhesive surface apply adhesive glue, makes adhesive surface uniform fold skim adhesive glue;
Perform step S104, be encased inside wire or wire netting if necessary in bonding place, pressurization is carried out to target and backboard and fixes, adhesive glue is solidified, completes bonding operation.
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is elaborated.
As shown in Figure 2, provide target 20, the shape of target 20, can be any one of circle, rectangle, triangle, annular etc. according to the requirement of sputtering base station, material be simple metal, alloy, the nonmetal targets such as titanium, silver, nickel alloy, silicon.As a preferred embodiment, the shape of target 20 is rectangle, adhesive surface size 130mm × 450mm, thickness 6mm, and material is nickel-vanadium alloy.
As shown in Figure 3, provide backboard 21, described backboard 21 material can be oxygen-free copper, brass alloys, chrome copper, corronil etc. any one, but be not limited to above-mentioned alloy.Used in embodiment is oxygen-free copper backboard, and thickness is 5mm.
Carry out processing process to target adhesive surface 200 and backboard adhesive surface 210, metal targets adhesive surface 200 and backboard adhesive surface 210 can carry out blasting treatment; Or retain machined lines; Cleaning adhesive surface 200 and 210 guarantees that surface remains without spot.All do blasting treatment to adhesive surface 200 and 210 in embodiment, after process, roughness is between 1 μm ~ 15 μm, and surface sand-blasting can activate adhesive surface 200 and 210, increases effective bond area, improves bonding strength.
As shown in Figure 4, at adhesive surface 200 and 210 surface uniform coating adhesive glue 22, adhesive glue 22 should select conducting resinl or the heat-conducting glue of epoxy type, phenol aldehyde type, organic silicon type or other types, and its performance need ensure to solidify rear bonding strength and invalid temperature reaches target product requirement.Organosilicon conductive adhesive is selected, evenly coating adhesive surface 200 and 210 in embodiment.
As shown in Figure 5, be encased inside wire or wire netting 23 if necessary in bonding place, pressurization carried out to target 20 and backboard 21 and fixes, between 20 DEG C ~ 100 DEG C, be incubated 2h ~ 24h, adhesive glue 22 solidified, completes bonding operation.At bonding place place mat metal copper mesh 23 in the present embodiment, exert pressure subsequently fixing, pressure reaches 0.1MPa, and at 25 DEG C, pressurize 24h makes adhesive glue solidify, and forms target material assembly.Carry out dimension control to target after embodiment bonding, the depth of parallelism is 0.1mm, meets dimensional requirement.
Claims (15)
1. a bonding method of attachment for target and backboard, it is characterized in that, concrete steps are as follows:
(1) target and backboard are provided;
(2) adhesive surface of target and backboard is processed;
(3) on target and backboard adhesive surface, evenly adhesive glue is applied;
(4) target and backboard carry out pressurization fix, adhesive glue is solidified.
2. the bonding method of attachment of a kind of target according to claim 1 and backboard, is characterized in that: described target material is metal, alloy or nonmetallic materials.
3. the bonding method of attachment of a kind of target according to claim 2 and backboard, is characterized in that: described metal is aluminium, copper, titanium, tantalum, tungsten, ruthenium, cobalt, platinum, gold, silver, molybdenum, chromium, iron or nickel metal.
4. the bonding method of attachment of a kind of target according to claim 2 and backboard, is characterized in that: described alloy is the alloy of aluminium, tungsten, titanium, silver, ruthenium, cobalt, platinum or nickel.
5. the bonding method of attachment of a kind of target according to claim 2 and backboard, is characterized in that: described nonmetallic materials are silicon, carbon, tin indium oxide, zinc oxide aluminum, tin ash or zinc oxide.
6. the bonding method of attachment of a kind of target according to claim 1 and backboard, is characterized in that: described backboard material is metal or alloy material.
7. the bonding method of attachment of a kind of target according to claim 1 and backboard, is characterized in that: described metal or alloy material is copper, iron, titanium, aluminium, brass alloys, chrome copper, corronil, steel, titanium alloy, aluminium alloy.
8. the bonding method of attachment of a kind of target according to claim 1 and backboard, it is characterized in that, described in step (2), processing method is: carry out blasting treatment or machined at target and backboard adhesive surface, improve bonding plane roughness, increase the bonded area of glue and adhesive surface, after process, roughness is between 1 μm ~ 15 μm.
9. the bonding method of attachment of a kind of target according to claim 1 and backboard, is characterized in that: adhesive glue described in step (3) is one or more in epoxy type, phenol aldehyde type, the conducting resinl of organic silicon type or heat-conducting glue.
10. the bonding method of attachment of a kind of target according to claim 5 and backboard, is characterized in that: described adhesive glue performance need ensure to solidify rear bonding strength and invalid temperature reaches target product requirement.
The bonding method of attachment of 11. a kind of target and backboards according to claim 5, it is characterized in that: described adhesive glue be epoxy type, phenol aldehyde type, organic silicon type one or more of heat-conducting glue time, the wire netting of conduction, heat conductivility must be had at bonding place place mat.
The bonding method of attachment of 12. a kind of target and backboards according to claim 7, is characterized in that: described wire netting is aluminium net, copper mesh or silver-colored net.
The bonding method of attachment of 13. a kind of target and backboards according to claim 1, is characterized in that: when described in step (4), pressurization is fixing, applied pressure should be not less than 0.05MPa.
The bonding method of attachment of 14. a kind of target and backboards according to claim 1, is characterized in that: when described in step (4), pressurization is fixing, adhesive glue solidification temperature scope is 20 DEG C ~ 100 DEG C.
The bonding method of attachment of 15. a kind of target and backboards according to claim 1, is characterized in that: when described in step (4), pressurization is fixing, and adhesive glue hardening time is 2h ~ 48h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310664863.4A CN104690487A (en) | 2013-12-09 | 2013-12-09 | Method for adhesively connecting target and backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310664863.4A CN104690487A (en) | 2013-12-09 | 2013-12-09 | Method for adhesively connecting target and backboard |
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| CN104690487A true CN104690487A (en) | 2015-06-10 |
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| CN201310664863.4A Pending CN104690487A (en) | 2013-12-09 | 2013-12-09 | Method for adhesively connecting target and backboard |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108605063A (en) * | 2016-07-27 | 2018-09-28 | 华为技术有限公司 | A kind of adhesive method, housing unit and the mobile terminal of shell and display screen |
| CN108588652A (en) * | 2018-03-07 | 2018-09-28 | 住华科技股份有限公司 | Bearing plate, sputtering target and pasting method thereof |
| CN110359020A (en) * | 2018-03-26 | 2019-10-22 | Ｊｘ金属株式会社 | The manufacturing method of sputtering target member, sputtering target assembly and sputtering target member |
| CN110394538A (en) * | 2019-06-27 | 2019-11-01 | 有研新材料股份有限公司 | A kind of welding method of high-purity chalcogenide phase-change alloy target |
| CN110846627A (en) * | 2019-11-14 | 2020-02-28 | 张俊杰 | Cold binding process for rotary target material |
| CN110977328A (en) * | 2019-12-17 | 2020-04-10 | 宁波江丰电子材料股份有限公司 | Method for mounting self-tapping thread sleeve in target assembly |
| CN113927117A (en) * | 2021-11-29 | 2022-01-14 | 宁波江丰电子材料股份有限公司 | Method for welding brittle target material assembly |
| CN114231931A (en) * | 2021-12-28 | 2022-03-25 | 深圳市友容新材料科技有限公司 | Binding method of graphite rotary target material |
| CN114833417A (en) * | 2022-06-13 | 2022-08-02 | 宁波江丰电子材料股份有限公司 | Method for welding ITO target and Mo back plate |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108605063A (en) * | 2016-07-27 | 2018-09-28 | 华为技术有限公司 | A kind of adhesive method, housing unit and the mobile terminal of shell and display screen |
| CN108588652B (en) * | 2018-03-07 | 2020-06-12 | 住华科技股份有限公司 | Bearing plate, sputtering target and pasting method thereof |
| CN108588652A (en) * | 2018-03-07 | 2018-09-28 | 住华科技股份有限公司 | Bearing plate, sputtering target and pasting method thereof |
| CN110359020A (en) * | 2018-03-26 | 2019-10-22 | Ｊｘ金属株式会社 | The manufacturing method of sputtering target member, sputtering target assembly and sputtering target member |
| CN110359020B (en) * | 2018-03-26 | 2022-01-11 | Ｊｘ金属株式会社 | Sputtering target member, sputtering target assembly, and method for producing sputtering target member |
| CN110394538A (en) * | 2019-06-27 | 2019-11-01 | 有研新材料股份有限公司 | A kind of welding method of high-purity chalcogenide phase-change alloy target |
| CN110846627A (en) * | 2019-11-14 | 2020-02-28 | 张俊杰 | Cold binding process for rotary target material |
| CN110977328A (en) * | 2019-12-17 | 2020-04-10 | 宁波江丰电子材料股份有限公司 | Method for mounting self-tapping thread sleeve in target assembly |
| CN113927117A (en) * | 2021-11-29 | 2022-01-14 | 宁波江丰电子材料股份有限公司 | Method for welding brittle target material assembly |
| CN114231931A (en) * | 2021-12-28 | 2022-03-25 | 深圳市友容新材料科技有限公司 | Binding method of graphite rotary target material |
| CN114231931B (en) * | 2021-12-28 | 2023-09-08 | 深圳市友容新材料科技有限公司 | Binding method of graphite rotary target |
| CN114833417A (en) * | 2022-06-13 | 2022-08-02 | 宁波江丰电子材料股份有限公司 | Method for welding ITO target and Mo back plate |
| CN114833417B (en) * | 2022-06-13 | 2024-05-14 | 宁波江丰电子材料股份有限公司 | Welding method of ITO target and Mo backboard |
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