CN106605273A - 导电性粒子、导电材料及连接结构体 - Google Patents

导电性粒子、导电材料及连接结构体 Download PDF

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Publication number
CN106605273A
CN106605273A CN201580044245.7A CN201580044245A CN106605273A CN 106605273 A CN106605273 A CN 106605273A CN 201580044245 A CN201580044245 A CN 201580044245A CN 106605273 A CN106605273 A CN 106605273A
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CN
China
Prior art keywords
conductive part
mentioned
particle
electroconductive particle
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580044245.7A
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English (en)
Chinese (zh)
Inventor
王晓舸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
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Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN106605273A publication Critical patent/CN106605273A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
CN201580044245.7A 2014-10-22 2015-10-22 导电性粒子、导电材料及连接结构体 Pending CN106605273A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014215456 2014-10-22
JP2014-215456 2014-10-22
PCT/JP2015/079816 WO2016063941A1 (fr) 2014-10-22 2015-10-22 Particules conductrices, matériau conducteur et structure de connexion

Publications (1)

Publication Number Publication Date
CN106605273A true CN106605273A (zh) 2017-04-26

Family

ID=55760971

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580044245.7A Pending CN106605273A (zh) 2014-10-22 2015-10-22 导电性粒子、导电材料及连接结构体

Country Status (4)

Country Link
JP (1) JPWO2016063941A1 (fr)
KR (2) KR20220041240A (fr)
CN (1) CN106605273A (fr)
WO (1) WO2016063941A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112384994A (zh) * 2018-07-10 2021-02-19 日本化学工业株式会社 包覆颗粒
CN112740338A (zh) * 2018-11-07 2021-04-30 日本化学工业株式会社 包覆颗粒和包含其的导电性材料、和包覆颗粒的制造方法
CN113299892A (zh) * 2021-05-21 2021-08-24 浙江云顶新材料有限公司 一种铁掺杂的二氧化钛/碳化钨锂离子电池负极材料的制备方法
TWI780277B (zh) * 2017-12-14 2022-10-11 日商則武股份有限公司 感光性組成物、複合體、電子零件及電子零件的製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102598343B1 (ko) 2020-10-06 2023-11-06 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011204531A (ja) * 2010-03-26 2011-10-13 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体
KR101151072B1 (ko) * 2007-11-01 2012-06-01 히다치 가세고교 가부시끼가이샤 도전 입자, 절연 피복 도전 입자 및 그의 제조 방법, 및 이방 도전성 접착제
JP2013149611A (ja) * 2011-12-22 2013-08-01 Sekisui Chem Co Ltd 導電性粒子、導電材料及び接続構造体
CN103748636A (zh) * 2011-12-21 2014-04-23 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
TW201421491A (zh) * 2012-10-02 2014-06-01 Sekisui Chemical Co Ltd 導電性粒子、導電材料及連接構造體

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5024260B2 (ja) * 2007-11-01 2012-09-12 日立化成工業株式会社 導電粒子、絶縁被覆導電粒子及びその製造方法、異方導電性接着剤
TWI602198B (zh) * 2012-01-11 2017-10-11 日立化成股份有限公司 導電粒子、絕緣被覆導電粒子以及異向導電性接著劑
JP6188456B2 (ja) * 2012-07-03 2017-08-30 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6478308B2 (ja) * 2012-11-28 2019-03-06 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101151072B1 (ko) * 2007-11-01 2012-06-01 히다치 가세고교 가부시끼가이샤 도전 입자, 절연 피복 도전 입자 및 그의 제조 방법, 및 이방 도전성 접착제
JP2011204531A (ja) * 2010-03-26 2011-10-13 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体
CN103748636A (zh) * 2011-12-21 2014-04-23 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
JP2013149611A (ja) * 2011-12-22 2013-08-01 Sekisui Chem Co Ltd 導電性粒子、導電材料及び接続構造体
TW201421491A (zh) * 2012-10-02 2014-06-01 Sekisui Chemical Co Ltd 導電性粒子、導電材料及連接構造體
CN104471650A (zh) * 2012-10-02 2015-03-25 积水化学工业株式会社 导电性粒子、导电材料及连接结构体

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI780277B (zh) * 2017-12-14 2022-10-11 日商則武股份有限公司 感光性組成物、複合體、電子零件及電子零件的製造方法
CN112384994A (zh) * 2018-07-10 2021-02-19 日本化学工业株式会社 包覆颗粒
TWI819017B (zh) * 2018-07-10 2023-10-21 日商日本化學工業股份有限公司 被覆粒子
CN112740338A (zh) * 2018-11-07 2021-04-30 日本化学工业株式会社 包覆颗粒和包含其的导电性材料、和包覆颗粒的制造方法
CN113299892A (zh) * 2021-05-21 2021-08-24 浙江云顶新材料有限公司 一种铁掺杂的二氧化钛/碳化钨锂离子电池负极材料的制备方法

Also Published As

Publication number Publication date
JPWO2016063941A1 (ja) 2017-08-03
KR20170072169A (ko) 2017-06-26
KR20220041240A (ko) 2022-03-31
WO2016063941A1 (fr) 2016-04-28

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Application publication date: 20170426