CN106604558A - 一种石墨烯电路板的制备方法 - Google Patents

一种石墨烯电路板的制备方法 Download PDF

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CN106604558A
CN106604558A CN201710029082.6A CN201710029082A CN106604558A CN 106604558 A CN106604558 A CN 106604558A CN 201710029082 A CN201710029082 A CN 201710029082A CN 106604558 A CN106604558 A CN 106604558A
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graphene
circuit board
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electrode substrate
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王奉瑾
戴雪青
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796Oxidant in aqueous solution, e.g. permanganate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157Using means for chemical reduction

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

本发明提供了一种石墨烯电路板的制备方法,包括有带电压的正极电路、可导电金属负极衬底,以及涂覆于负极衬底上的氧化石墨烯溶液涂层,当正极电路接通后,其与负极衬底导电,产生电流,将负极衬底上的氧化石墨烯溶液还原成石墨烯,这样,就会在负极衬底上还原成石墨烯层,由于正极可XY寻址,就可以按照设定的电路路线在负极衬底上形成石墨烯轨迹图案层,在最后将负极衬底腐蚀后,就形成石墨烯电路图案,也即为石墨烯电路板。这种方法可以快速地进行石墨烯电路板的原型制作,也可快速地进行石墨烯电路板电路图案和路线的原型绘制和制作,其步骤简单、快捷,在制备的过程中由于不采用化学药品,环保、无污染。

Description

一种石墨烯电路板的制备方法
【技术领域】
本发明属于碳材料技术领域,具体是涉及一种氧化石墨烯的制备方法。
【背景技术】
石墨烯是目前发现的唯一存在的二维自由态原子晶体,是构筑零维富勒烯、一维碳纳米管、三维石墨的基本结构单元。它具有高电导、高热导、高硬度和高强度等奇特的物理、化学性质,在电子、信息、能源、材料和生物医药领域有广阔的应用前景。
石墨烯作为未来可能替代硅成为下一代半导体行业基础材料,其有着不一样的优良的性能。石墨烯具有远比硅高的载流子迁移率,石墨烯具有室温下高速的电子迁移率200000 cm2 ∕ V·s、量子霍尔效应、高的理论比表面积2600 m2/g、还具有高热导率3000 W/m·K 和出色的力学性能( 高模量 1060GPa,高强度130GPa),被认为在单分子探测器、集成电路、场效应晶体管等量子器件、功能性复合材料、储能材料、催化剂载体等方面有广泛的应用前景。
对于石墨烯的制备,一般都用到低压化学气相沉积的方法,因为这种方法可以制备大面积连续的石墨烯,比起撕石墨烯的方法简单快速便捷。然而在铜上生长石墨烯很难直接制备石墨烯器件。
【发明内容】
针对现有技术中的上述技术问题,本发明提供了一种石墨烯电路板的制备方法,其可快速地进行石墨烯电路板的原型制作,其步骤简单、快捷,在制备的过程环保、无污染。
为了解决上述存在的技术问题,本发明采用下述技术方案:
一种石墨烯电路板的制备方法,包括有如下步骤:
S1:提供氧化石墨烯溶液;
S2:提供可导电金属材料作为负极衬底;
S3:提供带电压的正极;
S4:在负极衬底上涂覆氧化石墨烯溶液;
S5:将带电压的正极接向氧化石墨烯溶液,在负极衬底上还原出石墨烯层;
S6:倾倒掉负极衬底上剩余的氧化石墨烯溶液;
S7:清洗负极衬底:
S8:腐蚀负极衬底,得到石墨烯电路板。
在对上述一种石墨烯电路板的制备方法的改进方案中,所述的正极为可XY寻址移动的正极。
在对上述一种石墨烯电路板的制备方法的改进方案中,步骤S7中的清洗处理为去离子清洗。
与现有技术相比,本发明的有益效果是:本发明提供的石墨烯电路板的制备方法可以快速地进行单层石墨烯电路板的制作,也可快速地进行石墨烯电路板电路图案和路线的原型绘制和制作,其步骤简单、快捷,在制备的过程中由于不采用化学药品,环保、无污染。
下面结合具体实施方式对本发明作进一步的详细描述:
【具体实施方式】
一种石墨烯电路板的制备方法,包括有如下步骤:
S1:提供氧化石墨烯溶液;
S2:提供可导电金属材料作为负极衬底;
S3:提供带电压的正极,所述的正极可XY寻址;
S4:在负极衬底上涂覆氧化石墨烯溶液;
S5:将带电压的正极接向氧化石墨烯溶液,在负极衬底上还原出石墨烯层;
S6:倾倒掉负极衬底上剩余的氧化石墨烯溶液;
S7:去离子清洗负极衬底:
S8:腐蚀负极衬底,得到石墨烯电路板。
当正极电路接通后,其与氧化石墨烯溶液导电,产生电流,将负极衬底上的氧化石墨烯溶液还原成石墨烯,这样,就会在负极衬底上还原成石墨烯层,由于正极可XY寻址,就可以按照设定的电路路线在负极衬底上形成石墨烯轨迹图案层,在最后将负极衬底腐蚀后,就形成石墨烯电路图案,也即为石墨烯电路板。这种方法可以快速地进行石墨烯电路板的原型制作,其步骤简单、快捷,在制备的过程中由于不采用化学药品,环保、无污染。
在本发明的实施例中,所述的负极衬底为铜板,当然,也可以为其他适合的可导电材料。
尽管参照上面实施例详细说明了本发明,但是通过本公开对于本领域技术人员显而易见的是,而在不脱离所述的权利要求限定的本发明的原理及精神范围的情况下,可对本发明做出各种变化或修改。因此,本公开实施例的详细描述仅用来解释,而不是用来限制本发明,而是由权利要求的内容限定保护的范围。

Claims (3)

1.一种石墨烯电路板的制备方法,其特征在于,包括有如下步骤:
S1:提供氧化石墨烯溶液;
S2:提供可导电金属材料作为负极衬底;
S3:提供带电压的正极;
S4:在负极衬底上涂覆氧化石墨烯溶液;
S5:将带电压的正极接向氧化石墨烯溶液,在负极衬底上还原出石墨烯层;
S6:倾倒掉负极衬底上剩余的氧化石墨烯溶液;
S7:清洗负极衬底:
S8:腐蚀负极衬底,得到石墨烯电路板。
2.根据权利要求1所述的一种石墨烯电路板的制备方法,其特征在于,所述的正极为可XY寻址移动的正极。
3.根据权利要求1所述的一种石墨烯电路板的制备方法,其特征在于,步骤S7中的清洗处理为去离子清洗。
CN201710029082.6A 2017-01-16 2017-01-16 一种石墨烯电路板的制备方法 Pending CN106604558A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107580422A (zh) * 2017-08-25 2018-01-12 维沃移动通信有限公司 一种电路板及其制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101204872A (zh) * 2006-12-22 2008-06-25 帕洛阿尔托研究中心公司 以高的点定位精度进行印刷的方法
US20130156678A1 (en) * 2010-06-16 2013-06-20 Sarbajit Banerjee Graphene Films and Methods of Making Thereof
CN103402303A (zh) * 2013-07-23 2013-11-20 南昌欧菲光电技术有限公司 柔性线路板及其制作方法
KR20140018538A (ko) * 2012-08-02 2014-02-13 충북대학교 산학협력단 전기화학적 환원에 의한 환원 산화그래핀의 제조방법
CN104961124A (zh) * 2015-06-18 2015-10-07 浙江工业大学 一种石墨烯纸的制备方法
WO2016175498A1 (ko) * 2015-04-28 2016-11-03 성균관대학교산학협력단 환원-산화그래핀의 제조 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101204872A (zh) * 2006-12-22 2008-06-25 帕洛阿尔托研究中心公司 以高的点定位精度进行印刷的方法
US20130156678A1 (en) * 2010-06-16 2013-06-20 Sarbajit Banerjee Graphene Films and Methods of Making Thereof
KR20140018538A (ko) * 2012-08-02 2014-02-13 충북대학교 산학협력단 전기화학적 환원에 의한 환원 산화그래핀의 제조방법
CN103402303A (zh) * 2013-07-23 2013-11-20 南昌欧菲光电技术有限公司 柔性线路板及其制作方法
WO2016175498A1 (ko) * 2015-04-28 2016-11-03 성균관대학교산학협력단 환원-산화그래핀의 제조 방법
CN104961124A (zh) * 2015-06-18 2015-10-07 浙江工业大学 一种石墨烯纸的制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107580422A (zh) * 2017-08-25 2018-01-12 维沃移动通信有限公司 一种电路板及其制作方法

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