CN106601701B - Three-dimensional packaging method and structure of high-power electronic component with two end surface lead-out pins - Google Patents
Three-dimensional packaging method and structure of high-power electronic component with two end surface lead-out pins Download PDFInfo
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- CN106601701B CN106601701B CN201710044009.6A CN201710044009A CN106601701B CN 106601701 B CN106601701 B CN 106601701B CN 201710044009 A CN201710044009 A CN 201710044009A CN 106601701 B CN106601701 B CN 106601701B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
Abstract
The invention discloses a three-dimensional packaging method and a structure of a high-power two-end-surface pin-out electronic component.A polyhedral column cathode is manufactured in advance when a separated electronic component chip is packaged to form the high-power two-end-surface pin-out electronic component, an anode is fixed on the polyhedral column cathode, and the anode and the polyhedral column cathode are mutually insulated; and then sticking and fixing more than three electronic component chips on the polyhedral column plane of the polyhedral column cathode, connecting the electronic component chips with each other and the polyhedral column cathode and the polyhedral column anode according to the use requirement, fixedly sleeving a seal cap on the anode, and sealing and covering the polyhedral column of the polyhedral column cathode and the electronic component chips by the seal cap. The invention adopts a three-dimensional packaging mode, effectively improves the power/volume ratio of the whole electronic component, reduces the volume of the whole electronic component and effectively improves the working stability of the whole electronic component.
Description
Technical Field
The invention relates to a three-dimensional packaging method and a structure for electronic components with high-power two-end surface lead-out pins, belonging to the technical field of electronic component packaging.
Background
The high-power electronic component with two end outgoing lines has wide application. At present, the packaging mode of a single element is often adopted in the prior art, and the power/volume ratio of the single element packaging is smaller, so that the advantages of use and development are not available. In order to improve the power/volume ratio, electronic components with large, medium and small power are generally adhered to the same circuit board plane or printed circuit board plane and then packaged in the prior art, and although the packaging mode is greatly improved in the aspect of the power/volume ratio compared with the packaging mode of a single element, the occupied area of the packaging mode is still larger, and the use requirement cannot be met.
Disclosure of Invention
The invention aims to provide a three-dimensional packaging method and a structure of a high-power two-end-surface pin-out electronic component, which have the advantages of simple and compact structure, high power/volume ratio and good working stability, so as to overcome the defects of the prior art.
The technical scheme of the invention is realized as follows:
the invention relates to a three-dimensional packaging method of a high-power two-end-surface pin-out electronic component, which comprises the steps of manufacturing a polyhedral column cathode in advance when a separated electronic component chip is packaged to form the high-power two-end-surface pin-out electronic component, fixing an anode on the polyhedral column cathode, and insulating the anode and the polyhedral column cathode from each other; and then more than three electronic component chips are stuck and fixed on the polyhedral column plane of the polyhedral column cathode, all the electronic component chips are connected with each other and the polyhedral column cathode and the polyhedral column anode according to the use requirement, and then the seal cap is fixedly sleeved on the anode, so that the seal cap completely seals and covers the polyhedral column of the polyhedral column cathode and the electronic component chips.
The polyhedral column surface of the polyhedral column cathode is a conductive surface or a heat-conducting insulating surface; when the polyhedral column surface of the polyhedral column cathode is a heat conductive insulating surface, a printed circuit is etched on the heat conductive insulating surface.
The invention relates to a high-power three-dimensional packaging structure of an electronic component with two lead-out pins on two end surfaces, which is constructed according to the method, and the three-dimensional packaging structure of the electronic component with the two lead-out pins on the two end surfaces consists of a sealing cap, an anode and a cathode of a polyhedral column which are connected, wherein the cathode of the polyhedral column consists of the polyhedral column, a boss and a connecting handle which are integrated, the anode is an integrated structure formed by combining a cone and a cylinder, through holes are arranged in the cone and the cylinder of the anode, the anode is sleeved on the polyhedral column of the cathode of the polyhedral column through the through holes, an anode lead jack is arranged on the anode, an anode lead is inserted in the anode lead jack, one end of the anode lead inserted in the anode lead jack is welded with the anode through silver welding, copper welding or tin welding, an anode lead through hole is arranged in the boss and the connecting handle of the cathode of the polyhedral column, the other end of the anode lead passes through the anode lead through hole and then is exposed outside the connecting handle, an insulating layer is filled between the polyhedral column and the boss of the anode lead and the boss of the connecting handle, and the anode lead are also filled with the insulating layer, and the anode lead are connected with the polyhedral column through the insulating layer to form an integrated structure; a crystal fixing plane for adhering and fixing the chip of the electronic component is arranged on the polyhedral column of the polyhedral column cathode; the sealing cap is connected and fixed on the anode and covers the polyhedral column and the electronic component chip which is stuck and fixed on the polyhedral column in a sealing way.
The polyhedral column is a regular polyhedral column.
The polyhedral column is a regular three-sided column, a regular four-sided column, a regular five-sided column, a regular six-sided column, a regular octahedral column or a regular twelve-sided column.
The anode is sleeved on the polyhedral column of the polyhedral column cathode through the through hole and the other end of the anode wire penetrates through the anode wire through hole, glass slurry is filled between the polyhedral column and the boss of the anode and the polyhedral column cathode and between the anode wire and the anode wire through hole, the glass slurry forms an insulator type insulating layer after being sintered, and the anode wire are mutually isolated from the polyhedral column cathode through the insulating layer.
And the connecting handle of the polyhedral column cathode is provided with a thread connected with the mounting seat or the radiator.
The sealing cap is of a hollow cylinder cover structure or a solid structure which is cast together with the sealed polyhedral column and the electronic component chip.
The sealing cap is of a transparent or opaque structure.
By adopting the technical scheme, different large, medium and small power electronic component chips are pasted and fixed on the polyhedral column of the polyhedral column cathode according to the use requirement and then packaged to form the high-power electronic component with the cathode and the anode and the pin led out from the two end surfaces. The invention applies the large, medium and small power electronic element chips to match power integration packaging, integrates heat dissipation and temperature control, can flexibly meet the technical requirements of various electrical parameters, and improves the reliability of environmental work. The three-dimensional package of the invention can greatly reduce the transverse installation area. The invention can be applied to the manufacture of high-power two-end surface pin-out electronic components such as high-power rectifier elements, high-power voltage-stabilizing tubes, high-power LEDs (3D light sources), high-power resistors, high-power electronic fuses and the like.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic view of a polyhedral column cathode structure of the present invention;
FIG. 3 is a schematic view of the structure of the anode of the present invention in which the major diameter of the cone is the same as the diameter of the cylinder;
FIG. 4 is a schematic view of the anode of the present invention when the major diameter of the cone is smaller than the diameter of the cylinder;
fig. 5 isbase:Sub>A schematic sectional viewbase:Sub>A-base:Sub>A of fig. 1 (the polygonal pillar shown in fig. 5 isbase:Sub>A regular hexagonal pillar).
Description of the reference numerals: 1-sealing cap, 2-anode, 2.1-anode wire jack, 2.2-anode wire, 3-polyhedral column, 3.1-die bonding plane, 4-boss, 5-connecting handle, 5.1-screw thread, 6-insulating layer and 7-electronic component chip.
Detailed Description
The invention is described in further detail below with reference to the following figures and examples, but without any limitation thereto.
The embodiment of the invention comprises the following steps: the invention relates to a three-dimensional packaging method for a high-power two-end-surface pin-out electronic component, which is characterized in that when a high-power two-end-surface pin-out electronic component is formed by packaging separated electronic component chips, a polyhedral column cathode is manufactured in advance, the polyhedral column surface of the polyhedral column cathode can be manufactured into a conductive surface or a heat-conducting insulating surface during manufacturing, and when the polyhedral column surface of the polyhedral column cathode is manufactured into the heat-conducting insulating surface, a printed circuit is etched on the heat-conducting insulating surface according to the traditional mode and the use requirement; then fixing an anode on the polyhedral column cathode, and insulating the anode and the polyhedral column cathode from each other; and then more than three electronic component chips are stuck and fixed on the polyhedral column plane of the polyhedral column cathode (the number and the power of the electronic component chips can be selected according to the use requirement), then all the electronic component chips are connected with each other and the polyhedral column cathode and the polyhedral column anode according to the use requirement, then the seal cap is fixedly sleeved on the polyhedral column cathode, and the polyhedral column of the polyhedral column cathode and the electronic component chips are completely sealed and covered by the seal cap.
The high-power two-end-surface pin-out electronic component three-dimensional packaging structure is constructed according to the method, as shown in fig. 1-5, the high-power two-end-surface pin-out electronic component three-dimensional packaging structure is formed by connecting a sealing cap 1, an anode 2 and a polyhedral column cathode, the polyhedral column cathode is formed by a polyhedral column 3, a boss 4 and a connecting handle 5 (as shown in fig. 2), the anode 2 is formed by combining a cone and a cylinder, the taper diameter of the cone of the anode 2 is made to be the same as the diameter of the cylinder (as shown in fig. 3) or the large diameter of the cone of the anode is made to be smaller than the diameter of the cylinder (as shown in fig. 4), through holes are made in the cone and the cylinder of the anode 2, the anode 2 is sleeved on the polyhedral column 3 of the polyhedral column cathode through the through holes, an anode lead jack 2.1 is made in the anode 2, an anode lead 2.2 is inserted in the anode lead jack 2.1, one end of the anode lead 2.1 is welded with a traditional silver wire, a silver wire, and the anode lead wire 2.2 can be welded together with the traditional silver paste, and the traditional aluminum wire and silver wire can be sintered and silver wire and the traditional aluminum wire can be welded together in the traditional method of sintering process of sintering, and silver paste, and the traditional aluminum wire, and silver paste welding method can be adopted; then, an anode lead through hole is made in advance in the lug boss 4 and the connecting handle 5 of the polyhedral column cathode, the other end of the anode lead 2.2 passes through the anode lead through hole and then is exposed outside the connecting handle 5 (as shown in figure 1), an insulating layer 6 is filled between the anode 2 and the polyhedral column 3 and the lug boss 4 of the polyhedral column cathode, an insulating layer 6 is also filled between the anode lead 2.2 and the anode lead through holes of the lug boss 4 and the connecting handle 5 (as shown in figure 1), and the anode 2 and the anode lead 2.2 are connected with the polyhedral column cathode into a whole through the insulating layer 6; a crystal fixing plane 3.1 for sticking and fixing an electronic component chip 7 is arranged on the polyhedral column 3 of the polyhedral column cathode; the sealing cap 1 is connected and fixed on the anode 2 by adopting a pouring, bonding or tight fit mode, and the polyhedral column 3 and the electronic component chip 7 which is bonded and fixed on the polyhedral column can be completely sealed and covered.
When in manufacturing, the polyhedral column 3 can be manufactured into a regular three-sided column, a regular tetrahedral column, a regular five-sided column, a regular hexahedral column, a regular octahedral column or a regular dodecahedral column according to the use and installation requirements; after the anode 2 is sleeved on the polyhedral column 3 of the polyhedral column cathode through the through hole and the other end of the anode lead 2.2 passes through the anode lead through hole, glass slurry is preferably filled between the anode 2 and the polyhedral column 3 and the boss 4 of the polyhedral column cathode and between the anode lead 2.2 and the anode lead through hole, the glass slurry is sintered according to a traditional mode to form an insulator type insulating layer 6, and the anode 2, the anode lead 2.2 and the polyhedral column cathode can be mutually isolated by the insulating layer 6; the insulating layer 6 can also be made of insulating materials such as silica gel, epoxy resin, insulating glue or plastics. In order to be more convenient to use, when the polyhedral column cathode is manufactured, threads 5.1 which can be connected with threaded holes on a mounting seat or a radiator are manufactured on a connecting handle 5 of the polyhedral column cathode. According to the use requirement, the sealing cap 1 can be made into a hollow cylinder cover structure or a solid structure which is cast with the sealed polyhedral column 3 and the electronic component chip 7; and the sealing cap 1 is made into a transparent or opaque structure by using a transparent or opaque material according to the use requirement.
Claims (8)
1. A three-dimensional packaging method for electronic components with high-power two-end surface lead pins is characterized by comprising the following steps: when the separated electronic component chips are packaged to form the high-power electronic component with two end surfaces leading out pins, a polyhedral column cathode is manufactured in advance, an anode is fixed on the polyhedral column cathode, and the anode and the polyhedral column cathode are mutually insulated; then sticking and fixing more than three electronic component chips on the polyhedral column plane of the polyhedral column cathode, connecting the electronic component chips with each other and the polyhedral column cathode and anode according to the use requirement, fixedly sleeving a seal cap on the anode, and sealing and covering the polyhedral column of the polyhedral column cathode and the electronic component chips by the seal cap;
the high-power two-end-surface pin-out electronic component three-dimensional packaging structure is obtained according to the high-power two-end-surface pin-out electronic component three-dimensional packaging method and consists of a sealing cap (1), an anode (2) and a polyhedron column cathode which are connected, the polyhedron column cathode consists of a polyhedron column (3), a boss (4) and a connecting handle (5) which form an integral structure, the anode (2) is an integral structure formed by combining a cone and a cylinder, through holes are formed in the cone and the cylinder of the anode (2), the anode (2) is sleeved on the polyhedron column (3) of the polyhedron column cathode through the through hole, an anode lead jack (2.1) is arranged on the anode (2), an anode lead (2.2) is inserted in the anode lead jack (2.1), one end of the anode lead (2.2) inserted in the anode lead jack (2.1) is welded with the anode (2) through silver welding, brazing or soldering with the anode (2) together, an insulating layer is arranged in the cathode lead jack (4) of the polyhedron column and the connecting handle (5), a through hole (6) is filled between the anode lead (2.2) and the connecting handle (2), and the connecting handle (6) after the anode lead (2) and the anode lead (2) are inserted in the anode column, the anode (2) and the anode lead (2.2) are connected with the polyhedral column cathode into a whole through an insulating layer (6); a crystal fixing plane (3.1) for sticking and fixing an electronic component chip (7) is arranged on the polyhedron column (3) of the polyhedron column cathode; the sealing cap (1) is connected and fixed on the anode (2) and covers the polyhedral column (3) and the electronic component chip (7) which is stuck and fixed on the polyhedral column in a sealing way.
2. The method for high-power three-dimensional packaging of the electronic component with the pins led out from the two end surfaces as claimed in claim 1, wherein the method comprises the following steps: the polyhedral column surface of the polyhedral column cathode is a conductive surface or a heat-conducting insulating surface; when the polyhedral column surface of the polyhedral column cathode is a heat conductive insulating surface, a printed circuit is etched on the heat conductive insulating surface.
3. The method for three-dimensionally packaging a high-power electronic component with two end-surface lead-outs, according to claim 1, wherein: the polyhedron post (3) is a regular polyhedron post.
4. The method for three-dimensionally packaging a high-power electronic component with two end-surface lead-outs, according to claim 1, wherein: the polyhedral column (3) is a regular three-sided column, a regular four-sided column, a regular five-sided column, a regular six-sided column, a regular octahedral column or a regular twelve-sided column.
5. The method for three-dimensionally packaging a high-power electronic component with two end-surface lead-outs, according to claim 1, wherein: after an anode (2) is sleeved on a polyhedral column (3) of a polyhedral column cathode through a through hole of the anode and the other end of an anode wire (2.2) penetrates through an anode wire through hole, glass slurry is poured between the anode (2) and the polyhedral column (3) and a boss (4) of the polyhedral column cathode and between the anode wire (2.2) and the anode wire through hole, the glass slurry forms an insulating layer (6) of an insulator type after being sintered, and the anode (2) and the anode wire (2.2) are isolated from the polyhedral column cathode by the insulating layer (6).
6. The method for three-dimensionally packaging a high-power electronic component with two end-surface lead-outs, according to claim 1, wherein: and a connecting handle (5) of the polyhedral column cathode is provided with a thread (5.1) connected with the mounting seat or the radiator.
7. The method for three-dimensionally packaging a high-power electronic component with two end-surface lead-outs, according to claim 1, wherein: the sealing cap (1) is of a hollow cylinder cover structure or a solid structure which is cast together with the sealed polyhedral column (3) and the electronic component chip (7).
8. The method for three-dimensional packaging of electronic components with two high-power pins on the surface of two ends according to claim 7, wherein the method comprises the following steps: the sealing cap (1) is of a transparent or opaque structure.
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| CN201710044009.6A CN106601701B (en) | 2017-01-19 | 2017-01-19 | Three-dimensional packaging method and structure of high-power electronic component with two end surface lead-out pins |
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| CN201710044009.6A CN106601701B (en) | 2017-01-19 | 2017-01-19 | Three-dimensional packaging method and structure of high-power electronic component with two end surface lead-out pins |
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| CN106601701A CN106601701A (en) | 2017-04-26 |
| CN106601701B true CN106601701B (en) | 2023-03-28 |
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| CN108980785B (en) * | 2018-04-23 | 2020-01-03 | 东莞市莱硕光电科技有限公司 | Manufacturing process of LED bracket |
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| CN106601701A (en) | 2017-04-26 |
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