CN106576420B - 具有单侧印刷电路板的设备 - Google Patents

具有单侧印刷电路板的设备 Download PDF

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Publication number
CN106576420B
CN106576420B CN201580045626.7A CN201580045626A CN106576420B CN 106576420 B CN106576420 B CN 106576420B CN 201580045626 A CN201580045626 A CN 201580045626A CN 106576420 B CN106576420 B CN 106576420B
Authority
CN
China
Prior art keywords
printed circuit
circuit board
sided printed
metallic
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580045626.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN106576420A (zh
Inventor
张英鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Home Control Singapore Pte Ltd
Original Assignee
Home Control Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Home Control Singapore Pte Ltd filed Critical Home Control Singapore Pte Ltd
Publication of CN106576420A publication Critical patent/CN106576420A/zh
Application granted granted Critical
Publication of CN106576420B publication Critical patent/CN106576420B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Selective Calling Equipment (AREA)
  • Structure Of Printed Boards (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Push-Button Switches (AREA)
CN201580045626.7A 2014-08-25 2015-08-24 具有单侧印刷电路板的设备 Active CN106576420B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14182073.8A EP2991459B1 (en) 2014-08-25 2014-08-25 Device having a single-sided printed circuit board
EP14182073.8 2014-08-25
PCT/SG2015/000137 WO2016032395A1 (en) 2014-08-25 2015-08-24 Device having a single-sided printed circuit board

Publications (2)

Publication Number Publication Date
CN106576420A CN106576420A (zh) 2017-04-19
CN106576420B true CN106576420B (zh) 2019-11-08

Family

ID=51390047

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580045626.7A Active CN106576420B (zh) 2014-08-25 2015-08-24 具有单侧印刷电路板的设备

Country Status (6)

Country Link
US (1) US10206282B2 (enExample)
EP (1) EP2991459B1 (enExample)
JP (1) JP6890537B2 (enExample)
CN (1) CN106576420B (enExample)
BR (1) BR112017003491B1 (enExample)
WO (1) WO2016032395A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2991459B1 (en) 2014-08-25 2018-02-14 Home Control Singapore Pte. Ltd. Device having a single-sided printed circuit board
DE102016123917A1 (de) * 2016-12-09 2018-06-14 Endress+Hauser SE+Co. KG Elektronik-Baugruppe
DE102018217349A1 (de) * 2018-10-10 2020-04-16 Conti Temic Microelectronic Gmbh Leiterplatte
DE102024203579A1 (de) * 2024-04-18 2025-10-23 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zum Auslesen eines Datenträgers eines Kraftfahrzeugs

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7391342B1 (en) * 2003-02-05 2008-06-24 Zilog, Inc. Low-cost keypad encoding circuit

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2827640A1 (de) * 1978-06-23 1980-01-10 Chuo Meiban Mfg Co Verfahren zur befestigung von leitungsdraehten von bauteilen an einer grundplatte fuer eine gedruckte schaltung und grundplatte zur durchfuehrung des verfahrens
JPS5523503A (en) * 1978-07-10 1980-02-20 Tokai Tsushin Kogyo Kk Switch board
JPS6081718A (ja) * 1983-10-12 1985-05-09 松下電器産業株式会社 押釦スイツチ
JPS61196420U (enExample) * 1985-05-29 1986-12-08
JP2977145B2 (ja) * 1993-03-18 1999-11-10 富士通株式会社 キーボード回路装置
JPH08264956A (ja) 1995-03-23 1996-10-11 Internatl Business Mach Corp <Ibm> 電気的接続構造
US6064576A (en) * 1997-01-02 2000-05-16 Texas Instruments Incorporated Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board
JPH10288638A (ja) * 1997-04-15 1998-10-27 Nemic Lambda Kk 電源装置のフレーム構造
DE59901875D1 (de) * 1998-08-18 2002-08-01 Infineon Technologies Ag Leiterplatte zur verwendung bei der prüfung von elektrischen bauteilen
US6285081B1 (en) * 1999-07-13 2001-09-04 Micron Technology, Inc. Deflectable interconnect
KR101021157B1 (ko) * 2002-05-23 2011-03-15 디지트 와이어리스 엘엘씨 키패드 및 키 스위치
TW200839823A (en) * 2007-03-23 2008-10-01 Jensin Intl Technology Corp Membrane switch
JP5161617B2 (ja) * 2008-03-03 2013-03-13 日本メクトロン株式会社 フレキシブル回路基板、及びその製造方法
KR100991749B1 (ko) * 2008-05-20 2010-11-03 (주)미내사시스템 멤브레인 스위치시트
US7618846B1 (en) * 2008-06-16 2009-11-17 Stats Chippac, Ltd. Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device
US8896743B2 (en) * 2011-06-08 2014-11-25 Omnivision Technologies, Inc. Enclosure for image capture systems with focusing capabilities
EP2991459B1 (en) 2014-08-25 2018-02-14 Home Control Singapore Pte. Ltd. Device having a single-sided printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7391342B1 (en) * 2003-02-05 2008-06-24 Zilog, Inc. Low-cost keypad encoding circuit

Also Published As

Publication number Publication date
JP6890537B2 (ja) 2021-06-18
US10206282B2 (en) 2019-02-12
BR112017003491B1 (pt) 2022-03-15
JP2017535055A (ja) 2017-11-24
EP2991459B1 (en) 2018-02-14
WO2016032395A1 (en) 2016-03-03
EP2991459A1 (en) 2016-03-02
BR112017003491A2 (pt) 2017-12-05
CN106576420A (zh) 2017-04-19
US20170215283A1 (en) 2017-07-27

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