JP6890537B2 - 片面プリント回路基板を有するデバイス - Google Patents
片面プリント回路基板を有するデバイス Download PDFInfo
- Publication number
- JP6890537B2 JP6890537B2 JP2017510835A JP2017510835A JP6890537B2 JP 6890537 B2 JP6890537 B2 JP 6890537B2 JP 2017510835 A JP2017510835 A JP 2017510835A JP 2017510835 A JP2017510835 A JP 2017510835A JP 6890537 B2 JP6890537 B2 JP 6890537B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- sided printed
- metallized
- remote control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 239000000523 sample Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000013256 coordination polymer Substances 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Selective Calling Equipment (AREA)
- Structure Of Printed Boards (AREA)
- Push-Button Switches (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
TC リモートコントロールデバイスの上部筐体(top casing)
KM キーマット(key‐mat)
B キーマット上のボタン
CP キーマットの底部におけるカーボンプリント領域(carbon print area)
PCB プリント回路基板(printed circuit board)
CA プリント回路基板上の接続領域(connection area)
BC リモートコントロールデバイスの底部筐体(bottom casing)
BL 電池蓋(battery lid)
P プローブ(probe)
Claims (2)
- リモートコントロールのエンドユーザーによって単一のプローブの挿入及び抜去を行う孔を有する底部筐体と、
片面プリント回路基板であり、前記底部筐体中の前記孔と揃えられている非金属化孔と、当該片面プリント回路基板の金属化面にあって前記非金属化孔に近接する接続領域とを有する、片面プリント回路基板と、
前記接続領域からの導通ブリッジであり、かつ、前記非金属化孔を介して前記片面プリント回路基板の非金属化面からの単一の前記プローブと前記接続領域とを接触させることを可能にするため、前記非金属化孔を少なくとも部分的に覆う、導通ブリッジと、
を含み、
前記片面プリント回路基板、接続領域及び導通ブリッジは、接着剤を要することなく、作動的に接続可能な接触状態で、ハウジング内に維持され、
単一の前記プローブは、前記非金属化孔に挿入可能かつ抜去可能であり、
前記底部筐体中の前記孔と、前記片面プリント回路基板中の前記非金属化孔とを介して単一の前記プローブが挿入されると、単一の前記プローブと前記接続領域との間で前記導通ブリッジを介して電気的接続がなされ、
前記リモートコントロールの試験、プログラミング又はリセットを開始するために、前記電気的接続が作用可能である、
リモートコントロールデバイス。 - カーボンプリント領域を有するキーマットを更に含み、前記導通ブリッジは、前記カーボンプリント領域によって形成される、請求項1に記載のリモートコントロールデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14182073.8 | 2014-08-25 | ||
EP14182073.8A EP2991459B1 (en) | 2014-08-25 | 2014-08-25 | Device having a single-sided printed circuit board |
PCT/SG2015/000137 WO2016032395A1 (en) | 2014-08-25 | 2015-08-24 | Device having a single-sided printed circuit board |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017535055A JP2017535055A (ja) | 2017-11-24 |
JP2017535055A5 JP2017535055A5 (ja) | 2018-09-27 |
JP6890537B2 true JP6890537B2 (ja) | 2021-06-18 |
Family
ID=51390047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017510835A Active JP6890537B2 (ja) | 2014-08-25 | 2015-08-24 | 片面プリント回路基板を有するデバイス |
Country Status (6)
Country | Link |
---|---|
US (1) | US10206282B2 (ja) |
EP (1) | EP2991459B1 (ja) |
JP (1) | JP6890537B2 (ja) |
CN (1) | CN106576420B (ja) |
BR (1) | BR112017003491B1 (ja) |
WO (1) | WO2016032395A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2991459B1 (en) | 2014-08-25 | 2018-02-14 | Home Control Singapore Pte. Ltd. | Device having a single-sided printed circuit board |
DE102016123917A1 (de) * | 2016-12-09 | 2018-06-14 | Endress+Hauser SE+Co. KG | Elektronik-Baugruppe |
DE102018217349A1 (de) * | 2018-10-10 | 2020-04-16 | Conti Temic Microelectronic Gmbh | Leiterplatte |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2827640A1 (de) * | 1978-06-23 | 1980-01-10 | Chuo Meiban Mfg Co | Verfahren zur befestigung von leitungsdraehten von bauteilen an einer grundplatte fuer eine gedruckte schaltung und grundplatte zur durchfuehrung des verfahrens |
JPS61196420U (ja) * | 1985-05-29 | 1986-12-08 | ||
JP2977145B2 (ja) * | 1993-03-18 | 1999-11-10 | 富士通株式会社 | キーボード回路装置 |
JPH08264956A (ja) * | 1995-03-23 | 1996-10-11 | Internatl Business Mach Corp <Ibm> | 電気的接続構造 |
US6064576A (en) * | 1997-01-02 | 2000-05-16 | Texas Instruments Incorporated | Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board |
EP1116420B1 (de) * | 1998-08-18 | 2002-06-26 | Infineon Technologies AG | Leiterplatte zur verwendung bei der prüfung von elektrischen bauteilen |
US6285081B1 (en) * | 1999-07-13 | 2001-09-04 | Micron Technology, Inc. | Deflectable interconnect |
EP1509938B1 (en) * | 2002-05-23 | 2006-05-03 | Digit Wireless, Llc | Keypads and key switches |
US7391342B1 (en) * | 2003-02-05 | 2008-06-24 | Zilog, Inc. | Low-cost keypad encoding circuit |
TW200839823A (en) * | 2007-03-23 | 2008-10-01 | Jensin Intl Technology Corp | Membrane switch |
JP5161617B2 (ja) | 2008-03-03 | 2013-03-13 | 日本メクトロン株式会社 | フレキシブル回路基板、及びその製造方法 |
KR100991749B1 (ko) * | 2008-05-20 | 2010-11-03 | (주)미내사시스템 | 멤브레인 스위치시트 |
US7618846B1 (en) * | 2008-06-16 | 2009-11-17 | Stats Chippac, Ltd. | Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device |
US8896743B2 (en) * | 2011-06-08 | 2014-11-25 | Omnivision Technologies, Inc. | Enclosure for image capture systems with focusing capabilities |
EP2991459B1 (en) | 2014-08-25 | 2018-02-14 | Home Control Singapore Pte. Ltd. | Device having a single-sided printed circuit board |
-
2014
- 2014-08-25 EP EP14182073.8A patent/EP2991459B1/en active Active
-
2015
- 2015-08-24 WO PCT/SG2015/000137 patent/WO2016032395A1/en active Application Filing
- 2015-08-24 JP JP2017510835A patent/JP6890537B2/ja active Active
- 2015-08-24 US US15/328,322 patent/US10206282B2/en active Active
- 2015-08-24 CN CN201580045626.7A patent/CN106576420B/zh active Active
- 2015-08-24 BR BR112017003491-3A patent/BR112017003491B1/pt active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
BR112017003491A2 (pt) | 2017-12-05 |
EP2991459B1 (en) | 2018-02-14 |
CN106576420A (zh) | 2017-04-19 |
BR112017003491B1 (pt) | 2022-03-15 |
WO2016032395A1 (en) | 2016-03-03 |
EP2991459A1 (en) | 2016-03-02 |
CN106576420B (zh) | 2019-11-08 |
JP2017535055A (ja) | 2017-11-24 |
US20170215283A1 (en) | 2017-07-27 |
US10206282B2 (en) | 2019-02-12 |
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