JP6890537B2 - 片面プリント回路基板を有するデバイス - Google Patents

片面プリント回路基板を有するデバイス Download PDF

Info

Publication number
JP6890537B2
JP6890537B2 JP2017510835A JP2017510835A JP6890537B2 JP 6890537 B2 JP6890537 B2 JP 6890537B2 JP 2017510835 A JP2017510835 A JP 2017510835A JP 2017510835 A JP2017510835 A JP 2017510835A JP 6890537 B2 JP6890537 B2 JP 6890537B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
sided printed
metallized
remote control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017510835A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017535055A5 (enExample
JP2017535055A (ja
Inventor
キム テオ，エン
キム テオ，エン
Original Assignee
ホーム コントロール シンガポール プライベート リミテッド
ホーム コントロール シンガポール プライベート リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ホーム コントロール シンガポール プライベート リミテッド, ホーム コントロール シンガポール プライベート リミテッド filed Critical ホーム コントロール シンガポール プライベート リミテッド
Publication of JP2017535055A publication Critical patent/JP2017535055A/ja
Publication of JP2017535055A5 publication Critical patent/JP2017535055A5/ja
Application granted granted Critical
Publication of JP6890537B2 publication Critical patent/JP6890537B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Selective Calling Equipment (AREA)
  • Structure Of Printed Boards (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Push-Button Switches (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2017510835A 2014-08-25 2015-08-24 片面プリント回路基板を有するデバイス Active JP6890537B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14182073.8A EP2991459B1 (en) 2014-08-25 2014-08-25 Device having a single-sided printed circuit board
EP14182073.8 2014-08-25
PCT/SG2015/000137 WO2016032395A1 (en) 2014-08-25 2015-08-24 Device having a single-sided printed circuit board

Publications (3)

Publication Number Publication Date
JP2017535055A JP2017535055A (ja) 2017-11-24
JP2017535055A5 JP2017535055A5 (enExample) 2018-09-27
JP6890537B2 true JP6890537B2 (ja) 2021-06-18

Family

ID=51390047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017510835A Active JP6890537B2 (ja) 2014-08-25 2015-08-24 片面プリント回路基板を有するデバイス

Country Status (6)

Country Link
US (1) US10206282B2 (enExample)
EP (1) EP2991459B1 (enExample)
JP (1) JP6890537B2 (enExample)
CN (1) CN106576420B (enExample)
BR (1) BR112017003491B1 (enExample)
WO (1) WO2016032395A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2991459B1 (en) 2014-08-25 2018-02-14 Home Control Singapore Pte. Ltd. Device having a single-sided printed circuit board
DE102016123917A1 (de) * 2016-12-09 2018-06-14 Endress+Hauser SE+Co. KG Elektronik-Baugruppe
DE102018217349A1 (de) * 2018-10-10 2020-04-16 Conti Temic Microelectronic Gmbh Leiterplatte
DE102024203579A1 (de) * 2024-04-18 2025-10-23 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zum Auslesen eines Datenträgers eines Kraftfahrzeugs

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2827640A1 (de) * 1978-06-23 1980-01-10 Chuo Meiban Mfg Co Verfahren zur befestigung von leitungsdraehten von bauteilen an einer grundplatte fuer eine gedruckte schaltung und grundplatte zur durchfuehrung des verfahrens
JPS5523503A (en) * 1978-07-10 1980-02-20 Tokai Tsushin Kogyo Kk Switch board
JPS6081718A (ja) * 1983-10-12 1985-05-09 松下電器産業株式会社 押釦スイツチ
JPS61196420U (enExample) * 1985-05-29 1986-12-08
JP2977145B2 (ja) * 1993-03-18 1999-11-10 富士通株式会社 キーボード回路装置
JPH08264956A (ja) 1995-03-23 1996-10-11 Internatl Business Mach Corp <Ibm> 電気的接続構造
US6064576A (en) * 1997-01-02 2000-05-16 Texas Instruments Incorporated Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board
JPH10288638A (ja) * 1997-04-15 1998-10-27 Nemic Lambda Kk 電源装置のフレーム構造
JP2002523756A (ja) * 1998-08-18 2002-07-30 インフィネオン テクノロジース アクチエンゲゼルシャフト 電気的な構成素子を検査する場合に使用するためのプリント配線板および該プリント配線板を製造する方法
US6285081B1 (en) * 1999-07-13 2001-09-04 Micron Technology, Inc. Deflectable interconnect
ATE436083T1 (de) * 2002-05-23 2009-07-15 Digit Wireless Llc Elektrischer tastschalter
US7391342B1 (en) * 2003-02-05 2008-06-24 Zilog, Inc. Low-cost keypad encoding circuit
TW200839823A (en) * 2007-03-23 2008-10-01 Jensin Intl Technology Corp Membrane switch
JP5161617B2 (ja) 2008-03-03 2013-03-13 日本メクトロン株式会社 フレキシブル回路基板、及びその製造方法
KR100991749B1 (ko) * 2008-05-20 2010-11-03 (주)미내사시스템 멤브레인 스위치시트
US7618846B1 (en) 2008-06-16 2009-11-17 Stats Chippac, Ltd. Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device
US8896743B2 (en) * 2011-06-08 2014-11-25 Omnivision Technologies, Inc. Enclosure for image capture systems with focusing capabilities
EP2991459B1 (en) 2014-08-25 2018-02-14 Home Control Singapore Pte. Ltd. Device having a single-sided printed circuit board

Also Published As

Publication number Publication date
CN106576420A (zh) 2017-04-19
EP2991459A1 (en) 2016-03-02
JP2017535055A (ja) 2017-11-24
US10206282B2 (en) 2019-02-12
US20170215283A1 (en) 2017-07-27
CN106576420B (zh) 2019-11-08
WO2016032395A1 (en) 2016-03-03
EP2991459B1 (en) 2018-02-14
BR112017003491B1 (pt) 2022-03-15
BR112017003491A2 (pt) 2017-12-05

Similar Documents

Publication Publication Date Title
JP6890537B2 (ja) 片面プリント回路基板を有するデバイス
US20140340353A1 (en) Light-emitting touch-switch device and light-emitting touch-switch module
WO2007149362A3 (en) Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
TW201628288A (zh) 電源插座
CN102684665B (zh) 电容式开关模块
CN207910754U (zh) 一种触摸按键开关模组及电子装置
US20200018004A1 (en) Appliance control module with in-molded electronics
TW201828149A (zh) 指紋辨識模組
US10297404B1 (en) Illuminated pushbuttion switch
TWI600039B (zh) Press the switch structure
CN107230574B (zh) 按压开关结构
CN205656548U (zh) 移动终端的盖板组件及移动终端
US11330722B2 (en) Appliance control panel with in-molded electronic film directly mounted to printed circuit board
US8253597B2 (en) Keyboard providing power control
JP2018101461A (ja) 照光式スイッチ
WO2009007252A3 (de) Steuervorrichtung
TWI595523B (zh) 發光鍵盤及鍵盤模組
US9442582B2 (en) Portable electronic device with a surface mounted technology touch pad
JP2008310971A (ja) 電気機器のボタン構造
TWM551711U (zh) 滑鼠
CN204946772U (zh) 按键组件和具有其的豆浆机
JP6202898B2 (ja) 漏電検知機能を備えた電子装置
JP3188485U (ja) ソケット
CN103208679A (zh) 一种改进的继电器
JPS61151921A (ja) 制御回路の防滴装置

Legal Events

Date Code Title Description
A529 Written submission of copy of amendment under article 34 pct

Free format text: JAPANESE INTERMEDIATE CODE: A529

Effective date: 20170223

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180820

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180820

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190620

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190625

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190925

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200204

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200501

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20201013

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210212

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20210212

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20210219

C21 Notice of transfer of a case for reconsideration by examiners before appeal proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C21

Effective date: 20210224

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210427

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210525

R150 Certificate of patent or registration of utility model

Ref document number: 6890537

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250