CN106543563B - 热塑性高压电缆绝缘材料及其制备方法 - Google Patents
热塑性高压电缆绝缘材料及其制备方法 Download PDFInfo
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- CN106543563B CN106543563B CN201610972673.2A CN201610972673A CN106543563B CN 106543563 B CN106543563 B CN 106543563B CN 201610972673 A CN201610972673 A CN 201610972673A CN 106543563 B CN106543563 B CN 106543563B
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2244—Oxides; Hydroxides of metals of zirconium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
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- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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CN201610972673.2A CN106543563B (zh) | 2016-11-04 | 2016-11-04 | 热塑性高压电缆绝缘材料及其制备方法 |
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CN201610972673.2A CN106543563B (zh) | 2016-11-04 | 2016-11-04 | 热塑性高压电缆绝缘材料及其制备方法 |
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CN106543563A CN106543563A (zh) | 2017-03-29 |
CN106543563B true CN106543563B (zh) | 2021-03-09 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108219299A (zh) * | 2018-02-05 | 2018-06-29 | 哈尔滨理工大学 | 一种三元乙丙橡胶基电缆附件材料的制备方法及其三元乙丙橡胶基电缆附件材料 |
CN111540499B (zh) * | 2020-05-19 | 2021-06-15 | 杭州存宝科技有限公司 | 一种具有压电性能绝缘层的无线充电线圈漆包线及其制备方法 |
CN111893332A (zh) * | 2020-08-07 | 2020-11-06 | 北京科技大学 | 铜合金的制备方法及采用该方法得到的铜合金、铜合金的应用、电子元件、机械元件 |
CN111893343B (zh) * | 2020-08-07 | 2021-09-17 | 北京科技大学 | 改性纳米粒子弥散强化铜合金及其制备方法和应用、电子元件、机械元件 |
CN112029177B (zh) * | 2020-09-17 | 2022-12-13 | 九江学院 | 一种耐高温电缆内部绝缘材料及其制备方法和应用 |
CN112538025A (zh) * | 2020-12-08 | 2021-03-23 | 湖北福力德鞋业有限责任公司 | 一种疏水表面处理剂用含氟化合物的制备方法 |
WO2023057519A1 (en) * | 2021-10-05 | 2023-04-13 | Borealis Ag | Cable |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105504453A (zh) * | 2016-01-08 | 2016-04-20 | 上海交通大学 | 一种高热氧稳定性的聚烯烃复合绝缘材料及其制备方法 |
CN105647015A (zh) * | 2016-03-18 | 2016-06-08 | 华北电力大学 | 一种具有高热导率的聚丙烯复合材料及其制备方法 |
CN105733189A (zh) * | 2016-03-06 | 2016-07-06 | 北京化工大学 | 基于二维纳米填料磁致取向的高阻隔复合材料及制备方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105504453A (zh) * | 2016-01-08 | 2016-04-20 | 上海交通大学 | 一种高热氧稳定性的聚烯烃复合绝缘材料及其制备方法 |
CN105733189A (zh) * | 2016-03-06 | 2016-07-06 | 北京化工大学 | 基于二维纳米填料磁致取向的高阻隔复合材料及制备方法 |
CN105647015A (zh) * | 2016-03-18 | 2016-06-08 | 华北电力大学 | 一种具有高热导率的聚丙烯复合材料及其制备方法 |
Non-Patent Citations (1)
Title |
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"Novel L -DOPA-Derived Poly(ester amide)s: Monomers, Polymers, and the First L -DOPA-Functionalized Biobased Adhesive Tape";Manolakis,I.et al.;《Macromolecular Rapid Communications》;20141231;第71-76页 * |
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Inventor after: Huang Xingyi Inventor after: Jiang Pingkai Inventor after: Zhang Jun Inventor after: Zhou Yan Inventor before: Huang Xingyi Inventor before: Jiang Pingkai |
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Effective date of registration: 20171130 Address after: 200240 Dongchuan Road, Shanghai, No. 800, No. Applicant after: Shanghai Jiao Tong University Applicant after: Shanghai Huapu Cable Co., Ltd. Address before: 200240 Dongchuan Road, Shanghai, No. 800, No. Applicant before: Shanghai Jiao Tong University |
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