CN106520064A - 一种柔性好不易裂的pcb电路板用有机硅电子灌封胶 - Google Patents
一种柔性好不易裂的pcb电路板用有机硅电子灌封胶 Download PDFInfo
- Publication number
- CN106520064A CN106520064A CN201610976631.6A CN201610976631A CN106520064A CN 106520064 A CN106520064 A CN 106520064A CN 201610976631 A CN201610976631 A CN 201610976631A CN 106520064 A CN106520064 A CN 106520064A
- Authority
- CN
- China
- Prior art keywords
- vinyl
- parts
- silicone oil
- electronic
- organic silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000565 sealant Substances 0.000 title abstract 4
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 30
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 24
- 239000001257 hydrogen Substances 0.000 claims abstract description 24
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920002545 silicone oil Polymers 0.000 claims abstract description 20
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 13
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000008367 deionised water Substances 0.000 claims abstract description 7
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 7
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000006229 carbon black Substances 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims abstract description 3
- 230000001070 adhesive effect Effects 0.000 claims description 30
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 29
- 239000000853 adhesive Substances 0.000 claims description 26
- 238000004382 potting Methods 0.000 claims description 26
- 229910052710 silicon Inorganic materials 0.000 claims description 26
- 239000010703 silicon Substances 0.000 claims description 26
- 239000012530 fluid Substances 0.000 claims description 19
- 150000002431 hydrogen Chemical class 0.000 claims description 16
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 12
- 238000002360 preparation method Methods 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- -1 Alkynyl cyclohexanol Chemical compound 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 6
- 239000005977 Ethylene Substances 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- 239000001294 propane Substances 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 229920000260 silastic Polymers 0.000 claims description 6
- 230000002209 hydrophobic effect Effects 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 229920006387 Vinylite Polymers 0.000 claims description 3
- 238000013019 agitation Methods 0.000 claims description 3
- 238000009835 boiling Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- RSNQKPMXXVDJFG-UHFFFAOYSA-N tetrasiloxane Chemical compound [SiH3]O[SiH2]O[SiH2]O[SiH3] RSNQKPMXXVDJFG-UHFFFAOYSA-N 0.000 claims description 3
- 238000005292 vacuum distillation Methods 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 229920002379 silicone rubber Polymers 0.000 abstract description 2
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 abstract 1
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 abstract 1
- 239000004944 Liquid Silicone Rubber Substances 0.000 abstract 1
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 abstract 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 19
- 238000005266 casting Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 235000019241 carbon black Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004964 aerogel Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000000039 congener Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000000505 pernicious effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 238000002444 silanisation Methods 0.000 description 1
- HFQQZARZPUDIFP-UHFFFAOYSA-M sodium;2-dodecylbenzenesulfonate Chemical compound [Na+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O HFQQZARZPUDIFP-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000019640 taste Nutrition 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明公开了一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,由下列重量份的原料制备制成:端乙烯基硅油‑140‑50、端乙烯基硅油‑2 50‑60、12%铂催化剂0.38‑0.5、乙炔基环己醇0.02‑0.04、乙烯基硅树脂25‑30、1‑烯丙氧基‑2,3‑环氧丙烷14.8‑16.8、1,3,5,7‑四甲基环四硅氧烷23‑25、硅烷偶联剂A1712.7‑3.6、含氢硅油适量、液体硅橡胶6‑8、3‑缩水甘油醚丙基三甲氧基硅烷0.5‑0.7、十二烷基苯磺酸钠0.2‑0.3、白炭黑3.6‑5、去离子水适量;本发明制备的灌封胶透明、耐高温、柔性好,不易撕裂,对电子电路具有良好的粘结和保护作用,值得推广。
Description
技术领域
本发明涉及印制电路板灌封胶技术领域,尤其涉及一种柔性好不易裂的PCB电路板用有机硅电子灌封胶。
背景技术
随着电子科学技术的快速发展,电子元件、器件、仪器以及仪表在电子工业中得到广泛的应用。由于许多电子设备的工作环境复杂多变,有时甚至会遇到极端恶劣的自然条件,为保护电子元件和集成电路不受工作环境影响,提高电子器件的电气性能和稳定性,尝尝需要对电子设备进行灌封保护。灌封是电子器件组装的重要工序之一,它是将灌封材料用机械或者手工等方法填充到电子器件的空隙中,在一定条件下加工成型,使器件内部的电子元件和线路与环境隔离的操作工艺。目前,电子元件和集成电路正向高性能、密集化、高精度以及大功率的方向快速发展,这必然导致电子器件的发热量大幅提高。同时,电子器件的小型化又使其散热空间急剧减小,散热通道比较拥挤,导致热量大量积聚,如果热量不能及时有效的传导出去,将会使电路的工作温度迅速上升,导致电子器件失效的可能性成倍增加,严重影响电子器件的稳定性和可靠性,甚至会缩短电子设备的使用寿命。因此,用于电子器件的灌封材料不仅要有良好的电绝缘性能还应具有较高的导热能力,为了避免高电压和放电等工作条件下引发灌封材料着火,还要求灌封材料具有良好的阻燃性能,此外,为了防止水分和有害气体通过电子器件之间的缝隙引起电路板的污染和腐蚀,灌封材料海英具有良好的粘结性能。有机硅材料具有优异的电绝缘性能,尤其是加成型有机硅灌封胶固化时催化剂的用量较少,无副产物产生,固化物的尺寸稳定性高,线性收缩率低,化学稳定性好,因而发展前景广泛,但是普通的有机硅灌封胶存在热导率低、阻燃性和粘结性能差等缺点,严重影响了应用范围,虽然通过大量添加导热填料、阻燃剂和粘接剂可以改善灌封胶的性能,但是会对灌封胶的力学性能、加工性能产生不利的影响,所以研究自粘性无卤阻燃导热加成型有机硅灌封胶具有重要的理论意义和应用前景。
黄志彬在《导热透明有机硅灌封胶的制备与性能研究》一文中,通过对乙烯基硅油和含氢硅油的结构特性、与补强填料体系相容性、增粘剂的种类等进行研究,制备了具备良好力学性能、光学性能和粘接性能的有机硅灌封胶,研究了VMQ硅树脂、纳米二氧化硅、增粘剂等对灌封胶性能的影响,在此基础上,添加导热填料纳米氧化铝和纳米氧化锌,制备了具备高强度、高热导率和高透光率的有机硅灌封胶,并且研究了纳米粒子、偶联剂改性等对灌封胶性能的影响。结果表明粘度19mPa•S与3000mPa•S的端乙烯基硅油以质量比8:100复配作为基础聚合物,添加活性氢质量分数为0.8%的含氢硅油,使摩尔比n(Si-H):n(Si-Vi)为1.2,VMQ硅树脂的用量为30phr时制备最优综合性能的LED灌封胶,利用加成反应合成了不同种类的增粘剂DA、DAVE和DAVM,其中DAVM的灌封胶具备最佳的粘接性能和光学性能,对导热填料进行表面硅烷化处理,灌封胶的热导率和折射率逐渐上升,透光率、热膨胀系数和体积电阻率逐渐降低,耐热性明显提高。但是文章中合成的灌封胶还不能满足市场上PCB线路板对灌封胶的使用要求,并且各方面性能不高,必须进一步改进才能扩大使用范围。
发明内容
本发明目的就是为了弥补已有技术的缺陷,提供一种柔性好不易裂的PCB电路板用有机硅电子灌封胶。
本发明是通过以下技术方案实现的:
一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,由下列重量份的原料制备制成:端乙烯基硅油-1 40-50、端乙烯基硅油-2 50-60、12%铂催化剂0.38-0.5、乙炔基环己醇0.02-0.04、乙烯基硅树脂25-30、1-烯丙氧基-2,3-环氧丙烷14.8-16.8、1,3,5,7-四甲基环四硅氧烷23-25、硅烷偶联剂A1712.7-3.6、含氢硅油适量、液体硅橡胶6-8、3-缩水甘油醚丙基三甲氧基硅烷0.5-0.7、十二烷基苯磺酸钠0.2-0.3、白炭黑3.6-5、去离子水适量。
所述一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,由下列具体步骤制备制成:
(1)在四口烧瓶中依次加入1-烯丙氧基-2,3-环氧丙烷、1,3,5,7-四甲基环四硅氧烷和硅烷偶联剂A171,在搅拌条件下滴加1/4的12%铂催化剂,在40-45℃下反应2-3h,再升高温度至68-78℃反应2-3h,反应结束后将混合物减压蒸馏,自然冷却后备用;
(2)将3-缩水甘油醚丙基三甲氧基硅烷和十二烷基苯磺酸钠溶于总重量7-8倍量的丙酮中分散均匀,调节pH值至6-8后得到混合溶液,将白炭黑加到3-4倍量的去离子水中搅拌均匀,然后加入上述混合溶液中搅拌,超声处理,出料后过滤,洗涤,干燥研磨后得到疏水白炭黑;
(3)将步骤(2)制备的产物加到液体硅橡胶中,以1200-1400r/min转速搅拌30-40min,搅拌结束后静置除泡备用;
(4)在室温下将3/4混合的端乙烯基硅油、含氢硅油、乙烯基树脂、步骤(3)制备的产物和乙炔基环己醇按照比例混合,在真空动力混合机的作用下充分搅拌25min制得A组分;将剩余的混合端乙烯基硅油、乙烯基硅树脂、步骤(1)制备的产物和剩余12%铂催化剂在真空动力混合机中混合充分搅拌35-45min得到B组分,将A组分和B组分按照质量比1;1在高速剪切分散的作用下进行混合,置于真空干燥箱中(真空度为-0.1MPa)脱泡10min,倒入模具中110℃固化2h即得到有机硅灌封胶。
所述一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,所述端乙烯基硅油-1的粘度为300mPa•s,乙烯基含量为1.92mol%,端乙烯基硅油-2的粘度为1000mPa•s,乙烯基含量为0.8mol%。
所述一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,所述的含氢硅油中活性氢含量为0.50Wt%,并且含氢硅油的加入量为n(Si-H):n(Si-Vi)为1.2-1.4。
本发明的优点是:乙烯基硅油是加成型有机硅灌封胶最基本的成分之一,本发明通过选择不同粘度系数和乙烯基含量的乙烯基硅油复配得到拉伸强度和硬度、断裂伸长率和弹性都较高的有机硅灌封胶,含氢硅油作为交联剂,其活性氢含量较高时,与有机硅灌封胶的交联密度就会较大,可以使应力分散在更多的分子链上,表现出更高的拉伸强度、硬度和断裂伸长率,但当活性氢含量太高时,交联速度过快,分子链来不及形成完善的交联网络,并且在卡斯特催化剂下也容易发生副反应,使有机硅灌封胶中形成较多的气泡,造成缺陷,所以本发明选择活性氢含量为0.5Wt%较为适宜,本发明选择乙烯基硅树脂作为补强填料,是因为具有乙烯基含量多、外层被有机团覆盖、分子量小的特点,并且与有机硅灌封胶具有良好的分散和相容性,能够保持较好的流动性和透明性,并且还可以与含氢硅油发生硅氢加成反应,能够提高灌封胶的力学性能,因为有机硅材料普遍的无粘接性,固化后与基材之间有空隙,长时间水汽渗透导致出现电路故障,本发明利用化学反应合成了增粘剂,能够有效的提高有机硅灌封胶的粘结性、拉伸剪切强度,不影响粘度和流动性,本发明还利用填料提高灌封胶的导热性和阻燃性,然而填料与基体在分子结构和物理性能方面存在着极大的差异,并且体系的分散性越差,灌封胶的热导率提升越难,填料的表面修饰可促进填料在基体中的分散,减少热流方向上的界面热阻,从而可有效的提升体系的热导率等性能,利用3-缩水甘油醚丙基三甲氧基硅烷等改性白炭黑,使其具备优良的疏水、抗撕裂、耐热老化性能,并且表面富含大量的有机官能团,能够与硅橡胶形成有效的交联,并且在灌封胶中分散相容性良好,提高了漆膜的抗撕裂、柔韧性、防潮和耐热老化的性能,本发明制备的灌封胶透明、耐高温、折射率高的特点,柔性好,不易撕裂,制备工艺简单,成本低,对电子电路具有良好的粘结和保护作用,值得推广。
具体实施方式
一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,由下列重量份(公斤)的原料制备制成:端乙烯基硅油 40、端乙烯基硅油 50、12%铂催化剂0.38、乙炔基环己醇0.02、乙烯基硅树脂25、1-烯丙氧基-2,3-环氧丙烷14.8、1,3,5,7-四甲基环四硅氧烷23、硅烷偶联剂A171 2.7、含氢硅油适量、液体硅橡胶6、3缩水甘油醚丙基三甲氧基硅烷0.5、十二烷基苯磺酸钠0.2、白炭黑3.6、去离子水适量。
所述一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,由下列具体步骤制备制成:
(1)在四口烧瓶中依次加入1-烯丙氧基-2,3-环氧丙烷、1,3,5,7-四甲基环四硅氧烷和硅烷偶联剂A171,在搅拌条件下滴加1/4的12%铂催化剂,在40℃下反应2h,再升高温度至68℃反应2h,反应结束后将混合物减压蒸馏,自然冷却后备用;
(2)将3缩水甘油醚丙基三甲氧基硅烷和十二烷基苯磺酸钠溶于总重量7倍量的丙酮中分散均匀,调节pH值至6后得到混合溶液,将白炭黑加到3倍量的去离子水中搅拌均匀,然后加入上述混合溶液中搅拌,超声处理,出料后过滤,洗涤,干燥研磨后得到疏水白炭黑;
(3)将步骤(2)制备的产物加到液体硅橡胶中,以1200r/min转速搅拌30min,搅拌结束后静置除泡备用;
(4)在室温下将3/4混合的端乙烯基硅油、含氢硅油、乙烯基树脂、步骤(3)制备的产物和乙炔基环己醇按照比例混合,在真空动力混合机的作用下充分搅拌25min制得A组分;将剩余的混合端乙烯基硅油、乙烯基硅树脂、步骤(1)制备的产物和剩余12%铂催化剂在真空动力混合机中混合充分搅拌35min得到B组分,将A组分和B组分按照质量比1;1在高速剪切分散的作用下进行混合,置于真空干燥箱中(真空度为MPa)脱泡10min,倒入模具中110℃固化2h即得到有机硅灌封胶。
所述一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,所述端乙烯基硅油-1的粘度为300mPa•s,乙烯基含量为1.92mol%,端乙烯基硅油-2的粘度为1000mPa•s,乙烯基含量为0.8mol%。
所述一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,所述的含氢硅油中活性氢含量为0.50Wt%,并且含氢硅油的加入量为n(SiH):n(SiVi)为1.2。
按照实施例制备的灌封胶,对其进行性能测试,结果如下:
热导率(W/m•K):0.59;拉伸强度(MPa):3.5;剪切强度(MPa):1.6;体积电阻率(Ω•cm):2.5×1015;阻燃性(UL94;V 0):通过;介电常数(50HZ):3.3;伸长率(%):230。
Claims (4)
1.一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,其特征在于,由下列重量份的原料制备制成:端乙烯基硅油-1 40-50、端乙烯基硅油-2 50-60、12%铂催化剂0.38-0.5、乙炔基环己醇0.02-0.04、乙烯基硅树脂25-30、1-烯丙氧基-2,3-环氧丙烷14.8-16.8、1,3,5,7-四甲基环四硅氧烷23-25、硅烷偶联剂A1712.7-3.6、含氢硅油适量、液体硅橡胶6-8、3-缩水甘油醚丙基三甲氧基硅烷0.5-0.7、十二烷基苯磺酸钠0.2-0.3、白炭黑3.6-5、去离子水适量。
2.根据权利要求1所述一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,其特征在于,由下列具体步骤制备制成:
(1)在四口烧瓶中依次加入1-烯丙氧基-2,3-环氧丙烷、1,3,5,7-四甲基环四硅氧烷和硅烷偶联剂A171,在搅拌条件下滴加1/4的12%铂催化剂,在40-45℃下反应2-3h,再升高温度至68-78℃反应2-3h,反应结束后将混合物减压蒸馏,自然冷却后备用;
(2)将3-缩水甘油醚丙基三甲氧基硅烷和十二烷基苯磺酸钠溶于总重量7-8倍量的丙酮中分散均匀,调节pH值至6-8后得到混合溶液,将白炭黑加到3-4倍量的去离子水中搅拌均匀,然后加入上述混合溶液中搅拌,超声处理,出料后过滤,洗涤,干燥研磨后得到疏水白炭黑;
(3)将步骤(2)制备的产物加到液体硅橡胶中,以1200-1400r/min转速搅拌30-40min,搅拌结束后静置除泡备用;
(4)在室温下将3/4混合的端乙烯基硅油、含氢硅油、乙烯基树脂、步骤(3)制备的产物和乙炔基环己醇按照比例混合,在真空动力混合机的作用下充分搅拌25min制得A组分;将剩余的混合端乙烯基硅油、乙烯基硅树脂、步骤(1)制备的产物和剩余12%铂催化剂在真空动力混合机中混合充分搅拌35-45min得到B组分,将A组分和B组分按照质量比1;1在高速剪切分散的作用下进行混合,置于真空干燥箱中(真空度为-0.1MPa)脱泡10min,倒入模具中110℃固化2h即得到有机硅灌封胶。
3.根据权利要求1-2所述一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,其特征在于,所述端乙烯基硅油-1的粘度为300mPa•s,乙烯基含量为1.92mol%,端乙烯基硅油-2的粘度为1000mPa•s,乙烯基含量为0.8mol%。
4.根据权利要求1-2所述一种柔性好不易裂的PCB电路板用有机硅电子灌封胶,其特征在于,所述的含氢硅油中活性氢含量为0.50Wt%,并且含氢硅油的加入量为n(Si-H):n(Si-Vi)为1.2-1.4。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610976631.6A CN106520064A (zh) | 2016-11-08 | 2016-11-08 | 一种柔性好不易裂的pcb电路板用有机硅电子灌封胶 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610976631.6A CN106520064A (zh) | 2016-11-08 | 2016-11-08 | 一种柔性好不易裂的pcb电路板用有机硅电子灌封胶 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106520064A true CN106520064A (zh) | 2017-03-22 |
Family
ID=58349950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610976631.6A Withdrawn CN106520064A (zh) | 2016-11-08 | 2016-11-08 | 一种柔性好不易裂的pcb电路板用有机硅电子灌封胶 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106520064A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110951448A (zh) * | 2019-10-23 | 2020-04-03 | 深圳市新纶科技股份有限公司 | 一种双组份加成型有机硅导热胶及其制备方法 |
CN116120891A (zh) * | 2023-04-20 | 2023-05-16 | 德朗聚(常州)新材料有限公司 | 用于hjt或topcon或perc工艺中的有机硅树脂组合物及其制备方法 |
-
2016
- 2016-11-08 CN CN201610976631.6A patent/CN106520064A/zh not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110951448A (zh) * | 2019-10-23 | 2020-04-03 | 深圳市新纶科技股份有限公司 | 一种双组份加成型有机硅导热胶及其制备方法 |
CN110951448B (zh) * | 2019-10-23 | 2022-05-17 | 新纶光电材料(深圳)有限公司 | 一种双组份加成型有机硅导热胶及其制备方法 |
CN116120891A (zh) * | 2023-04-20 | 2023-05-16 | 德朗聚(常州)新材料有限公司 | 用于hjt或topcon或perc工艺中的有机硅树脂组合物及其制备方法 |
CN116120891B (zh) * | 2023-04-20 | 2023-06-16 | 德朗聚(常州)新材料有限公司 | 用于hjt或topcon或perc工艺中的有机硅树脂组合物及其制备方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106751904B (zh) | 一种导热有机硅凝胶及其制备方法 | |
CN103865271B (zh) | 一种纳米杂化材料改性的有机硅导热电子灌封胶的制备方法 | |
CN101735619B (zh) | 一种无卤阻燃导热有机硅电子灌封胶及其制备方法 | |
CN102337033B (zh) | 一种加成型高导热有机硅电子灌封胶及其制备方法 | |
CN103589387B (zh) | Led用高强度粘接性室温固化有机硅灌封胶及其制备方法 | |
CN103131381B (zh) | 高性能环保阻燃型有机硅电子灌封胶及其制备方法 | |
CN105176484B (zh) | 一种电力电子器件用灌封胶及其制备方法 | |
CN102618208B (zh) | 一种无卤阻燃导热有机硅电子灌封胶及其制备工艺 | |
CN106753213A (zh) | 一种具有优异防潮防水性能的pcb电路板用有机硅电子灌封胶 | |
CN106753208B (zh) | 一种氧化石墨烯改性的led导热灌封胶及其制备方法 | |
CN106467668A (zh) | 一种有机硅树脂铝基覆铜板及其制备方法 | |
CN105670555A (zh) | 一种高导热型的有机硅灌封胶 | |
CN106701012A (zh) | 一种轻量化导热有机硅灌封胶基础胶料、组合物及其制备方法 | |
CN105754542A (zh) | 双组份有机硅灌封胶及其制备工艺 | |
CN104031388B (zh) | 苯基硅橡胶纳米复合材料及其制备方法 | |
CN104232015B (zh) | 一种大功率型白光led用的单包装有机硅橡胶封装胶及制备方法 | |
CN106381121A (zh) | 透明的有机灌封胶 | |
CN105586001A (zh) | 低粘度高透明自粘性有机硅灌封胶及其制备方法 | |
CN106634814A (zh) | 一种抗紫外散热性能良好的pcb电路板用有机硅电子灌封胶 | |
CN106753212A (zh) | 一种粘结性好透明度高的pcb电路板用有机硅电子灌封胶 | |
CN113444487A (zh) | Led照明芯片散热用双组分加成型导热硅胶 | |
CN106833508A (zh) | 一种耐高温pcb电路板用有机硅灌封胶 | |
CN106753211A (zh) | 一种阻燃导热pcb电路板用有机硅电子灌封胶 | |
CN106479431A (zh) | 一种固化收缩性小的pcb电路板用有机硅电子灌封胶 | |
CN104312529B (zh) | 一种有机硅导热电子灌封胶及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170322 |
|
WW01 | Invention patent application withdrawn after publication |