CN106514774B - 一种pcb钻孔用盖板及其制备方法 - Google Patents
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Abstract
本发明公开一种PCB钻孔用盖板及其制备方法,所述盖板由片材、散热型树脂和纸制备而成,所述片材排屑性良好,利于钻孔促排,避免钻孔时屑料缠绕钻针,降低钻孔断针风险;并且本发明所采用的散热型树脂能有效降低钻针温度,使得钻孔孔壁质量提升,且其材质偏软,使得钻针钻孔瞬间具有较好的定位效果,能有效提升PCB钻孔精度,故而能在保证钻孔品质的同时增加PCB叠板层数,从而提高PCB的加工效率。
Description
技术领域
发明涉及盖板领域,尤其涉及一种PCB钻孔用盖板及其制备方法。
背景技术
印制电路板(简称PCB)在钻孔时通常需要用到盖板,现在市场上常用的有铝片、冷冲板、涂树脂铝片等盖板。
然而,当采用铝片作为盖板对PCB板进行钻孔时,钻孔过程中经常会出现残丝导致钻孔断针,且铝片表面光滑,入钻定位效果较差;当采用冷冲板作为PCB钻孔用盖板时,其在厚板PCB方面适用性较差,对于增加PCB叠板层数也没有明显效果;当采用涂树脂铝片作为PCB钻孔用盖板时,虽然其功能性较强,但铝基材质会导致PCB钻孔时铝屑对钻针缠绕,且铝金属在PCB孔内残留会对后工序的进行带来不利影响。
因此,现有技术还有待于改进和发展。
发明内容
鉴于上述现有技术的不足,本发明的目的在于提供一种PCB钻孔用盖板及其制备方法,旨在解决现有的PCB盖板定位效果差、断针率高以及PCB加工效率慢的问题。
本发明的技术方案如下:
一种PCB钻孔用盖板的制备方法,其中,包括步骤:
A、按重量百分比计,用15-35%丙烯酸乳液,30-50%聚乙二醇,10-20%聚乙烯醇,1-5%聚丙烯酸树脂,0.5-2.5%硅烷偶联剂以及40-60%水,制备散热型树脂;
B、将所述散热型树脂与纸经过浸渍工艺,制成上胶量为30-40%、均匀性<2%的树脂浸胶纸;
C、将片材与所述树脂浸胶纸叠合,置于压机压制,压制温度为80-120℃,压制压力为2-4MPa,压制时间为30-60min,得到PCB钻孔用盖板。
较佳地,所述的PCB钻孔用盖板的制备方法,其中,所述步骤A具体包括:
A1、向反应釜中加入水,温度保持在80-90℃,之后加入聚乙烯醇并进行搅拌,搅拌速度为80-200r/min,搅拌时间为1-2h;
A2、依次向反应釜中加入聚丙烯酸树脂、聚乙二醇、丙烯酸乳液以及硅烷偶联剂,并且每加入一种化合物后均在室温下搅拌0.5-2h,再加入下一种化合物,最后制得散热型树脂。
较佳地,所述的PCB钻孔用盖板的制备方法,其中,所述步骤A2中,向反应釜中加入聚丙烯酸树脂,在室温下以100 r/min的搅拌速度搅拌2h;接着加入聚乙二醇,在室温下以150 r/min的搅拌速度搅拌1h;之后加入丙烯酸乳液,在室温下以80 r/min的搅拌速度搅拌0.5h,最后加入硅烷偶联剂,在室温下以200 r/min的搅拌速度搅拌1h,制得散热型树脂。
较佳地,所述的PCB钻孔用盖板的制备方法,其中,所述纸为高级离型纸、钛白纸、牛皮纸、平衡纸、漂白木浆纸中的一种或多种。
较佳地,所述的PCB钻孔用盖板的制备方法,其中,所述片材为聚氨酯树脂、酚醛树脂、聚对苯二甲酸丁二醇酯、聚对苯二甲酸乙二醇酯中的一种或多种。
较佳地,所述的PCB钻孔用盖板的制备方法,其中,所述片材的厚度为0.1-0.4mm。
较佳地,所述的PCB钻孔用盖板的制备方法,其中,在所述步骤B的浸渍工艺中,车速为20-25m/min,温度为100-120℃。
较佳地,所述的PCB钻孔用盖板的制备方法,其中,所述步骤B中,将所述散热型树脂与纸经过浸渍工艺,在车速为22m/min,温度为115℃的条件下,制成上胶量为36%、均匀性1.5%的树脂浸胶纸.
较佳地,所述的PCB钻孔用盖板的制备方法,其中,所述散热型树脂的厚度为40-180μm。
一种PCB钻孔用盖板,其中,采用上述任一所述的PCB钻孔用盖板的制备方法制备而成。
有益效果:本发明提供一种PCB钻孔用盖板及其制备方法,所述盖板由片材、散热型树脂和纸制备而成,所述片材排屑性良好,利于钻孔促排,避免钻孔时屑料缠绕钻针,降低钻孔断针风险;并且本发明所采用的散热型树脂能有效降低钻针温度,使得钻孔孔壁质量提升,且其材质偏软,使得钻针钻孔瞬间具有较好的定位效果,能有效提升PCB钻孔精度,故而能在保证钻孔品质的同时增加PCB叠板层数,从而提高PCB的加工效率。
附图说明
图1为本发明一种PCB钻孔用盖板的制备方法较佳实施例的流程图。
具体实施方式
本发明提供一种PCB钻孔用盖板及其制备方法,为使本发明的目的、技术方案及效果更加清楚、明确,以下对本发明进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
请参阅图1,图1为本发明一种PCB钻孔用盖板的制备方法较佳实施例的流程图,如图1所示,其中,包括步骤:
S100、按重量百分比计,用15-35%丙烯酸乳液,30-50%聚乙二醇,10-20%聚乙烯醇,1-5%聚丙烯酸树脂,0.5-2.5%硅烷偶联剂以及40-60%水,制备散热型树脂;
进一步,所述步骤S100具体包括:
S110、向反应釜中加入水,温度保持在80-90℃,之后加入聚乙烯醇并进行搅拌,搅拌速度为80-200r/min,搅拌时间为1-2h;
S120、依次向反应釜中加入聚丙烯酸树脂、聚乙二醇、丙烯酸乳液以及硅烷偶联剂,并且每加入一种化合物后均在室温下搅拌0.5-2h,再加入下一种化合物,最后制得散热型树脂。
优选地,本发明在反应釜内先加入50%水,温度保持在85℃,之后加入聚乙烯醇并进行搅拌,搅拌速度为110r/min,搅拌时间为2h;再向反应釜中加入聚丙烯酸树脂,在室温下以100 r/min的搅拌速度搅拌2h;接着加入聚乙二醇,在室温下以150 r/min的搅拌速度搅拌1h;之后加入丙烯酸乳液,在室温下以80 r/min的搅拌速度搅拌0.5h,最后加入硅烷偶联剂,在室温下以200 r/min的搅拌速度搅拌1h,制得散热型树脂。
通过上述方法制备的散热型树脂能够起到吸收钻头钻孔后热量的作用,降低钻针温度,从而减少钻孔时钻头对于树脂材料的烧蚀,较少残胶和碳化,从而保证钻孔孔壁质量;并且本发明制备的散热型树脂其材质偏软,使得钻针钻孔瞬间具有较好的定位效果,能有效提升PCB钻孔精度;进一步,本发明制备的散热型树脂的厚度为40-180μm,优选散热型树脂的厚度为80μm,在该厚度范围内,能够保证降温效果以及钻孔品质的同时增加PCB叠板层数,从而提高PCB的加工效率。
S200、将所述散热型树脂与纸经过浸渍工艺,制成上胶量为30-40%、均匀性<2%的树脂浸胶纸;
具体地,所述纸为高级离型纸、钛白纸、牛皮纸、平衡纸、漂白木浆纸中的一种或多种;优选地,所述纸为牛皮纸,由于牛皮纸是一种富含纸质纤维的材料,而纤维物质可以将钻头钻孔后的残留物清理掉,其相对于酚醛树脂盖板而言可以有效减少钻针所受轴向力,保护钻针,降低断针率。
进一步,在所述浸渍工艺中,控制车速为20-25m/min,温度为100-120℃,在该条件下,能够制备出上胶量适中且均匀性优良的树脂浸胶纸;优选地,本发明将所述散热型树脂与纸经过浸渍工艺,在车速为22m/min,温度为115℃的条件下,制成上胶量为36%、均匀性1.5%的树脂浸胶纸,通过上述方法制备的树脂浸胶纸性能较佳。
S300、将片材与所述树脂浸胶纸叠合,置于压机压制,压制温度为80-120℃,压制压力为2-4MPa,压制时间为30-60min,得到PCB钻孔用盖板。
具体地,在本发明中,所述片材为聚氨酯树脂、酚醛树脂、聚对苯二甲酸丁二醇酯、聚对苯二甲酸乙二醇酯中的一种或多种;进一步,本发明所述片材的厚度为0.1-0.4mm,厚度公差为±0.05mm,优选地,所述片材的厚度为0.25mm,在该厚度时,片材的排屑性能最佳,有利于钻孔排屑,有效避免屑料缠绕钻针,极大地降低了钻针率。
基于上述方法,本发明还提供一种PCB钻孔用盖板,其中,采用上述任一所述的PCB钻孔用盖板的制备方法制备而成。
下面通过具体实施例对本发明进行详细说明:
实施例1
a.散热型树脂制备:反应釜内先加入50%水,温度保持在80℃,搅拌速率90r/min;而后加入20%聚乙烯醇,室温搅拌时间2h;再加入1%聚丙烯酸树脂,室温搅拌时间1h;然后加入28%丙烯酸乳液,室温搅拌时间0.5h;最后加入1%硅烷偶联剂,室温搅拌时间1h。
b.步骤a的树脂与漂白木浆纸进过浸渍工艺,车速25m/min,温度100℃,制成上胶量30%、均匀性1%的树脂浸胶纸。
c. 将酚醛树脂片材、树脂浸胶纸叠合,置于压机压制,压制温度80℃,压制压力2MPa,压制时间30min。
结果:板材翘曲度<1%,粘接良好,钻孔cpk为1.534,孔粗6.91μm,钉头1.4。
实施例2:
a. 散热型树脂制备:反应釜内先加入45%水,温度保持在80℃,搅拌速率90r/min;而后加入20%聚乙烯醇,室温搅拌时间2h;再加入1%聚丙烯酸树脂,室温搅拌时间1h;然后加入33%丙烯酸乳液,室温搅拌时间0.5h;最后加入1%硅烷偶联剂,室温搅拌时间1h。
b.步骤a的树脂与高级离型纸进过浸渍工艺,车速23m/min,温度100℃,制成上胶量33%、均匀性1.2%的树脂浸胶纸。
c. 将酚醛树脂片材、树脂浸胶纸叠合,置于压机压制,压制温度90℃,压制压力2MPa,压制时间30min。
结果:板材翘曲度<1%,粘接良好,钻孔cpk为1.54,孔粗6.74μm,钉头1.37。
实施例3:
a.散热型树脂制备:反应釜内先加入40%水,温度保持在85℃,搅拌速率90r/min;而后加入1%聚丙烯酸树脂,室温搅拌时间1h;然后加入43%聚乙二醇,室温搅拌时间1h;再者加入25%丙烯酸乳液,室温搅拌时间0.5h;最后加入1%硅烷偶联剂,室温搅拌时间1h。
b.步骤a的树脂与漂白木浆纸进过浸渍工艺,车速22m/min,温度100℃,制成上胶量36%、均匀性1.3%的树脂浸胶纸。
c. 将酚醛树脂片材、树脂浸胶纸叠合,置于压机压制,压制温度90℃,压制压力4MPa,压制时间30min。
结果:板材翘曲度<1%,粘接良好,钻孔cpk为1.55,孔粗6.6μm,钉头1.31。
实施例4:
a. 散热型树脂制备:反应釜内先加入60%水,温度保持在90℃,搅拌速率90r/min;而后加入5%聚丙烯酸树脂,室温搅拌时间1h;然后加入50%聚乙二醇,室温搅拌时间1h;再者加入35%丙烯酸乳液,室温搅拌时间0.5h;最后加入2.5%硅烷偶联剂,室温搅拌时间1h。
b.步骤a的树脂与漂白木浆纸进过浸渍工艺,车速25m/min,温度120℃,制成上胶量40%、均匀性1.35%的树脂浸胶纸。
c. 将酚醛树脂片材、树脂浸胶纸叠合,置于压机压制,压制温度120℃,压制压力4MPa,压制时间60min。
结果:板材翘曲度<1%,粘接良好,钻孔cpk为1.584,孔粗6.53μm,钉头1.3。
综上所述,本发明提供一种PCB钻孔用盖板及其制备方法,所述盖板由片材、散热型树脂和纸制备而成,所述片材排屑性良好,利于钻孔促排,避免钻孔时屑料缠绕钻针,降低钻孔断针风险;并且本发明所采用的散热型树脂能有效降低钻针温度,使得钻孔孔壁质量提升,且其材质偏软,使得钻针钻孔瞬间具有较好的定位效果,能有效提升PCB钻孔精度,故而能在保证钻孔品质的同时增加PCB叠板层数,从而提高PCB的加工效率。
应当理解的是,本发明的应用不限于上述的举例,对本领域普通技术人员来说,可以根据上述说明加以改进或变换,所有这些改进和变换都应属于本发明所附权利要求的保护范围。
Claims (9)
1.一种PCB钻孔用盖板的制备方法,其特征在于,包括步骤:
A、按重量百分比计,用15-35%丙烯酸乳液,30-50%聚乙二醇,10-20%聚乙烯醇,1-5%聚丙烯酸树脂,0.5-2.5%硅烷偶联剂以及40-60%水,制备散热型树脂;
B、将所述散热型树脂与纸经过浸渍工艺,制成上胶量为30-40%、均匀性<2%的树脂浸胶纸;
C、将片材与所述树脂浸胶纸叠合,置于压机压制,压制温度为80-120℃,压制压力为2-4MPa,压制时间为30-60min,得到PCB钻孔用盖板;
所述步骤A具体包括:
A1、向反应釜中加入水,温度保持在80-90℃,之后加入聚乙烯醇并进行搅拌,搅拌速度为80-200r/min,搅拌时间为1-2h;
A2、依次向反应釜中加入聚丙烯酸树脂、聚乙二醇、丙烯酸乳液以及硅烷偶联剂,并且每加入一种化合物后均在室温下搅拌0.5-2h,再加入下一种化合物,最后制得散热型树脂。
2.根据权利要求1所述的PCB钻孔用盖板的制备方法,其特征在于,所述步骤A2中,向反应釜中加入聚丙烯酸树脂,在室温下以100 r/min的搅拌速度搅拌2h;接着加入聚乙二醇,在室温下以150 r/min的搅拌速度搅拌1h;之后加入丙烯酸乳液,在室温下以80 r/min的搅拌速度搅拌0.5h,最后加入硅烷偶联剂,在室温下以200 r/min的搅拌速度搅拌1h,制得散热型树脂。
3.根据权利要求1所述的PCB钻孔用盖板的制备方法,其特征在于,所述纸为高级离型纸、钛白纸、牛皮纸、平衡纸、漂白木浆纸中的一种或多种。
4.根据权利要求1所述的PCB钻孔用盖板的制备方法,其特征在于,所述片材为聚氨酯树脂、酚醛树脂、聚对苯二甲酸丁二醇酯、聚对苯二甲酸乙二醇酯中的一种或多种。
5.根据权利要求1所述的PCB钻孔用盖板的制备方法,其特征在于,所述片材的厚度为0.1-0.4mm。
6.根据权利要求1所述的PCB钻孔用盖板的制备方法,其特征在于,在所述步骤B的浸渍工艺中,车速为20-25m/min,温度为100-120℃。
7.根据权利要求6所述的PCB钻孔用盖板的制备方法,其特征在于,所述步骤B中,将所述散热型树脂与纸经过浸渍工艺,在车速为22m/min,温度为115℃的条件下,制成上胶量为36%、均匀性1.5%的树脂浸胶纸。
8.根据权利要求1所述的PCB钻孔用盖板的制备方法,其特征在于,所述散热型树脂的厚度为40-180μm。
9.一种PCB钻孔用盖板,其特征在于,采用如权利要求1~8任一所述的PCB钻孔用盖板的制备方法制备而成。
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