CN106504966B - A kind of integration array electronic rifle and electron beam selective melting rapid forming system - Google Patents

A kind of integration array electronic rifle and electron beam selective melting rapid forming system Download PDF

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Publication number
CN106504966B
CN106504966B CN201610906011.5A CN201610906011A CN106504966B CN 106504966 B CN106504966 B CN 106504966B CN 201610906011 A CN201610906011 A CN 201610906011A CN 106504966 B CN106504966 B CN 106504966B
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electron beam
generating unit
independent
array
scanning
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CN106504966A (en
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郭光耀
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Xi'an Zhirong Metal Printing System Co Ltd
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Xi'an Zhirong Metal Printing System Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/46Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
    • H01J29/48Electron guns
    • H01J29/488Schematic arrangements of the electrodes for beam forming; Place and form of the elecrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/46Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
    • H01J29/48Electron guns
    • H01J29/50Electron guns two or more guns in a single vacuum space, e.g. for plural-ray tube
    • H01J29/503Three or more guns, the axes of which lay in a common plane
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00Cathode ray tubes; Electron beam tubes
    • H01J31/02Cathode ray tubes; Electron beam tubes having one or more output electrodes which may be impacted selectively by the ray or beam, and onto, from, or over which the ray or beam may be deflected or de-focused
    • H01J31/06Cathode ray tubes; Electron beam tubes having one or more output electrodes which may be impacted selectively by the ray or beam, and onto, from, or over which the ray or beam may be deflected or de-focused with more than two output electrodes, e.g. for multiple switching or counting

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  • Electron Sources, Ion Sources (AREA)

Abstract

The present invention relates to increasing material manufacturing technical field of processing equipment, more particularly to a kind of integrated array electronic rifle and electron beam selective melting rapid forming system, by the way that multiple e-book transmitter units are carried out ordered arrangement according to array way, so as to which each electron beam generating unit is responsible for a region, the electron beam emission unit of different array positions is controlled to carry out accurate scan shaping to powder bed different position, the electron beam quality of beam of each electron beam generating unit is guaranteed, each area is by being effectively connected, so as on the premise of part forming precision and quality is ensured, solve the problems, such as that existing powder bed type electron beam selective melting quickly shaping device cannot produce larger part since electron beam deflection angle is excessive, realize that the powder bed type electron beam constituency of large scale parts quickly manufactures.

Description

A kind of integration array electronic rifle and electron beam selective melting rapid forming system
Technical field
The present invention relates to increasing material manufacturing technical field of processing equipment, more particularly to a kind of integrated array electronic rifle and electronics Beam selective melting rapid forming system.
Background technology
Increases material manufacturing technology also known as 3D printing or RP technique.It is one kind based on digital model file, With metal powder, metal wire material or can adhesiveness plastic or other material, come constructed object by way of successively stacking accumulation Technology.Fast Forming Technique is widely used in the fields such as mold manufacturing, industrial design, is now increasingly used for some products It directly manufactures, particularly the application (such as hip joint or tooth or some airplane components) of some high values.
Metal parts method for quickly forming and manufacturing mainly have selective laser sintering (SLS), selective laser fusing (SLM), The sides such as laser coaxial powder feeding directly manufactures, electron beam fuse shaping (EBAM), powder bed type electron beam selective melting shaping (EBM) Method.All there is limitations, such as several increasing material manufacturing methods and electricity for using laser as heat source in various degree for these types of method The shaping of beamlet selective melting is all as raw shaping material using metal powder, these method formed precisions are high, but cannot manufacture The part of large-size.The shaping of electron beam fuse, as raw shaping material, although forming speed is fast, is shaped using metal wire material Precision is relatively low, it is difficult to which the higher part of figuration manufacture precision is simply possible to use in the manufacture of part blank.
For accuracy of manufacture height, the metal parts of reliable in quality, the shaping of powder bed type electron beam selective melting is usually selected Technology mainly has the following advantages:
Formation of parts dimensional accuracy is high, and final use state is reached after being simply surface-treated and being machined, and shortens Product development cycle;
Electron beam imperceptible can focus on, and scan burn-off rate up to 8000mm/s, forming speed is fast;
Electron beam can preheat powder bed, and part forming process is made to be maintained at a higher temperature, reduces part Occurrence probability caused by thermal stress the defects of residual stress height, crackle, deformation.
Existing electron beam selective melting forming technique is all to realize single electron beam in certain area by deflection coil The fusing shaping of metal powder accurate scan.Electron beam is not to be exactly perpendicularly to working surface after deflection coil, but with Vertical direction forms an angle.With the increase of deflection of a beam of electrons angle, electron beam quality of beam declines to a great extent, and electromagnetic calibration is It can not ensure that quality of beam meets the needs of shaping.In addition, deflection of a beam of electrons angle increases powder bed shaped region edge Beam spot has certain deformation, causes melting pool shape and Energy distribution that deviation occurs, so as to cause formation of parts precision and forming quality Difference.Using mechanical movement mobile electron rifle or powder cylinder, since mechanical movement speed is slow, shaping efficiency, same time shift will be substantially reduced Dynamic electron gun or powder cylinder make equipment electrically and mechanically complicated, and the operational reliability for be easy to causeing equipment declines.It is simple to increase The number of electron gun, due to arrangement space the problem of, can not also make each electron gun be responsible for region to be effectively connected.
In short, on the premise of the parts accuracy of manufacture and quality is ensured, merely by the scanning of electron beam electromagnetic deflection not The parts of large-size can be produced;The simple number for increasing electron gun can not also manufacture the parts of large-size.
The content of the invention
To overcome drawbacks described above, the present invention proposes a kind of integrated array electronic rifle therefore.
A kind of integration array electronic rifle, including an integrated box body and multiple independent electron beam generating units;It is more A electron beam generating unit is evenly arranged in integrated box body.
As a preferred embodiment, multiple independent electron beam generating units are arranged in one in the form of N × M rectangular arrays Change in babinet.
Further, multiple independent vacuum chambers are provided in the integrated box body, the independent vacuum chamber is located at one Change the top of babinet, the electron beam generating unit is installed in the independent vacuum room.
As an improvement the one side of the integrated box body is equipped with vacuum system interface, to connect vacuum system;Institute It states and is additionally provided with intercommunicating pore between independent vacuum chamber, each independent vacuum chamber is vacuumized for vacuum system.
Further, the integrated box body lower part further includes a shared Electron Beam Focusing scanning vacuum chamber, the electricity Beamlet focuses on scanning vacuum chamber and is communicated respectively with each independent vacuum chamber by anode hole.
Specifically, the electron beam generating unit includes high-voltage cable joint, cathode filament, grid, anode.
Specifically, set gradually alignment coil, focus coil and scanning coil below each anode hole.
A kind of electron beam selective melting rapid forming system including above-mentioned integrated array electronic rifle, further includes high pressure Power supply, electron gun control system, vacuum system, the high voltage power supply provide high for respectively to the electron beam generating unit Pressure;The electron gun control system is controlling the grid of each electron beam generating unit, beam alignment coil, focal line The big minor adjustment of line, beam spot calibration, Electron Beam Focusing and accurate scan action is adjusted in circle, scanning coil;The vacuum system It unites to vacuumize entire formation system.
As a further improvement, the electron gun control system is arranged according to the quantity and array of independent electrical beamlet transmitter unit Powder bed is divided into corresponding array scanning region by cloth position, and each independent electrical beamlet transmitter unit corresponds to a block array scanning area Domain, by electron gun control system control corresponding region above independent electrical beamlet transmitter unit to corresponding array scanning region into Row accurate scan shapes.
A kind of integrated array electronic rifle of the present invention, by the way that multiple electron beam emission units are had according to array way Sequence arranges, and control the electron beam emission units of different array positions its corresponding powder bed position region is carried out accurate scan into Shape, each electron beam generating unit electron beam quality of beam are guaranteed, and so as to be responsible for a region, each area passes through Effective linking, so as on the premise of part forming precision and quality is ensured, solve existing powder bed type electron beam selective melting Quickly shaping device realizes the powder bed of large scale parts due to electron beam deflection angle excessive the problem of cannot producing larger part Formula electron beam constituency quickly manufactures.
Description of the drawings
For ease of explanation, the present invention is described in detail by following preferred embodiments and attached drawing.
Fig. 1 is a kind of integrated array electronic rifle cross-sectional view of the present invention;
Fig. 2 is a kind of electron beam selective melting rapid forming system cross-sectional view of the present invention;
Fig. 3 is that a kind of electron beam generating unit of integrated array electronic rifle of the present invention arranges schematic diagram;
Fig. 4 is a kind of electron beam selective melting rapid forming system powder bed array scanning area distribution schematic diagram of the present invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.
As shown in Figure 1, a kind of integrated array electronic rifle 20 of the present invention, including an integrated box body 3 and multiple independences Electron beam generating unit, multiple electron beam generating units are evenly arranged in integrated box body 3;Wherein integrated box body 3 is Vacuum chamber, and be divide into upper part and lower part, top, which is set up separately, puts multiple independent vacuum chambers 8 for being used to install electron beam generating unit, Lower part is divided into electron beam scanning vacuum chamber 2;For each 8 top tool of independent vacuum chamber there are one opening, opening lower section is equipped with high-voltage electricity Cable joint 6 is used to connect the high-tension cable 7 of external access;The high-voltage cable joint 6 is sealed processing with opening, and the other end connects Connect grid 5 and cathode 10;8 lower part of independent vacuum chamber is equipped with anode hole 11, and 3 lower part of integrated box body further includes one Shared Electron Beam Focusing scanning vacuum chamber, the Electron Beam Focusing scanning vacuum chamber are true with each independence respectively by anode hole 11 Empty room 8 communicates;The top of anode hole 11 is equipped with anode 4, and the electric energy that the cathode 10 conveys high-tension cable 7 is with the shape of electron beam Formula is sent to anode 4, and 11 lower section of anode hole is disposed with alignment coil 13, focus coil 14 and scanning coil 15;Institute 2 bottom of electronics beam scanning vacuum chamber is stated equipped with electron gun bottom plate 1, the electron gun bottom plate 1 corresponds to each independent electrical beamlet and occurs Device is opened up there are one through hole, is passed through for electron beam 19.
As a preferred embodiment, as shown in figure 3, multiple independent electron beam generating units are in the form of N × M rectangular arrays Be arranged in integrated box body 3, array format can be 1 × 2 rectangular array, 2 × 2 rectangular arrays, 2 × 3 rectangular arrays or 3 × The arrangement modes such as 3 rectangular arrays.
As a kind of preferred embodiment, the one side of the integrated box body 3 is equipped with the first vacuum system interface 12, to connect Vacuum system;Intercommunicating pore 9 is additionally provided between the independent vacuum chamber 8, each independent vacuum chamber 8 is vacuumized for vacuum system.
Specifically, the electron beam generating unit includes 7 high-tension cable of high-tension cable, 7 connector 6,10 filament of cathode, grid 5th, anode 4.
As shown in Fig. 2, a kind of electron beam selective melting rapid forming system, including above-mentioned integrated array electronic rifle 20, further include high voltage power supply (not shown), electron gun control system (not shown), vacuum system (not shown), the high-voltage electricity Source provides high pressure to the electron beam generating unit respectively by high-tension cable 7;The electron gun control system is controlling Line is adjusted in grid 5, beam alignment coil 13, focus coil 14, the scanning coil 15 of each electron beam generating unit Big minor adjustment, beam spot calibration, Electron Beam Focusing and accurate scan action;The vacuum system is true to be taken out to entire formation system It is empty.The lower section joint forming vacuum chamber 18 of integrated array electronic rifle 20, the one side of shaping vacuum chamber 18 are provided with the second vacuum System interface 24, to connect vacuum system;Powder bed carrying platform 16, powder bed carrying platform are equipped in the shaping vacuum chamber 18 Place forming part to be processed on 16,16 lower section of powder bed carrying platform set powder bed elevating mechanism 21 be used for by it is to be processed into Shape part 17 is delivered to forming position;The one side of the powder bed carrying platform 16 is equipped with power spreading device 22, the powdering dress The top for putting 22 is equipped with powder cabin 23, and the powder cabin 23 carries out powder feeding, powder is uniformly laid on to shaping to be processed by dust feeder On part 17.
As a further improvement, as shown in figure 4, the electron gun control system is according to the number of independent electrical beamlet transmitter unit Powder bed is divided into corresponding array scanning region by amount and array arrangement position, and each independent electrical beamlet transmitter unit corresponds to one piece of battle array Corresponding array is swept by the independent electrical beamlet transmitter unit above electron gun control system control corresponding region in column scan region It retouches region and carries out accurate scan shaping.It, can be effective using a kind of electron beam selective melting rapid forming system of the present invention Reduce the deflection angle of electron beam, the beam spot shape of electron beam quality of beam and shaped region edge is ensure that, so as to change Melting pool shape and Energy distribution when kind electronics beam scanning is fused into shape.
A kind of integrated array electronic rifle 20 of the present invention, by by multiple independent electrical beamlet transmitter units according to array way Ordered arrangement is carried out, so as to which each electron beam generating unit is responsible for an array scanning region, controls different array positions Independent electrical beamlet transmitter unit carries out accurate scan shaping, each electron beam generating unit to powder bed difference array scanning region Electron beam quality of beam is guaranteed, and each area is by being effectively connected, so as to ensure part forming precision and quality On the premise of, solving existing powder bed type electron beam selective melting quickly shaping device cannot give birth to since electron beam deflection angle is excessive The problem of producing larger part realizes that the powder bed type electron beam constituency of large scale parts quickly manufactures.
The producible metal parts size ratio of device using the present invention does not possess the movement of powder bed and electron beam gun moves work( Big 3 times of accessory size of electron beam selective melting equipment production of energy or more.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention Interior made all any modification, equivalent and improvement of god and principle etc., should be included in the interior of protection scope of the present invention.

Claims (6)

1. a kind of integration array electronic rifle, which is characterized in that including an integrated box body and multiple independent electron beam hairs Raw unit;Multiple electron beam generating units are evenly arranged in integrated box body;Multiple independent electron beams occur Unit is arranged in the form of N × M rectangular arrays in integrated box body;Multiple independent vacuums are provided in the integrated box body Room, the independent vacuum chamber are located at the top of integrated box body, and the electron beam generating unit is installed on the independent vacuum chamber It is interior;The one side of the integrated box body is equipped with vacuum system interface, to connect vacuum system;Between the independent vacuum chamber also Equipped with intercommunicating pore, each independent vacuum chamber is vacuumized for vacuum system.
2. integration array electronic rifle as described in claim 1, which is characterized in that the integrated box body lower part further includes one A shared Electron Beam Focusing scanning vacuum chamber, the Electron Beam Focusing scanning vacuum chamber are true with each independence respectively by anode hole Empty room communicates.
3. integration array electronic rifle as claimed in claim 2, which is characterized in that the electron beam generating unit includes high pressure Cable connector, cathode filament, grid, anode.
4. integration array electronic rifle as claimed in claim 3, which is characterized in that set gradually calibration below each anode hole Coil, focus coil and scanning coil.
5. a kind of electron beam selective melting rapid forming system, including the integrated array electronic rifle as described in claim 1-4, It is characterized in that, further including high voltage power supply, electron gun control system, vacuum system, the high voltage power supply is used for respectively to described Electron beam generating unit provide high pressure;The electron gun control system to control the grid of each electron beam generating unit, The big minor adjustment of line, beam spot calibration, Electron Beam Focusing and essence is adjusted in beam alignment coil, focus coil, scanning coil True scanning motion;The vacuum system is vacuumizing entire formation system.
6. electron beam selective melting rapid forming system as claimed in claim 5, which is characterized in that the electron gun control system Powder bed is divided into corresponding array scanning region by system according to the quantity and array arrangement position of independent electron beam generating unit, often A independent electron beam generating unit corresponds to a block array scanning area, above electron gun control system control corresponding region Independent electron beam generating unit carries out accurate scan shaping to corresponding array scanning region.
CN201610906011.5A 2016-10-18 2016-10-18 A kind of integration array electronic rifle and electron beam selective melting rapid forming system Active CN106504966B (en)

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107030356B (en) * 2017-05-03 2023-07-04 桂林电子科技大学 Multifunctional composite numerical control vacuum electron beam processing equipment
CN109411319A (en) * 2018-11-16 2019-03-01 合肥飞帆等离子科技有限公司 A kind of novel plasma cathode electronics electron gun and 3D printer
CN110052609B (en) * 2019-05-29 2021-06-29 中国航空制造技术研究院 Electron beam tow coaxial fuse deposition forming equipment
CN110838427B (en) * 2019-11-20 2022-04-29 中国航空制造技术研究院 Electronic gun device for fuse wire additive manufacturing
CN112397363B (en) * 2020-09-28 2022-08-30 西安增材制造国家研究院有限公司 Electron gun beam spot correction device and correction method
CN112379639B (en) * 2020-09-28 2021-10-22 西安增材制造国家研究院有限公司 Control method based on multi-electron gun EBSM equipment control system
CN114834038A (en) * 2021-02-02 2022-08-02 湖州超群电子科技有限公司 Electron beam 3D printing system and using method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101109905A (en) * 2006-07-21 2008-01-23 东元电机股份有限公司 Electron beam etching device and method thereof
CN104759623A (en) * 2015-03-10 2015-07-08 清华大学 Additive manufacturing device allowing electron beam and laser composite scanning
CN104810225A (en) * 2015-05-26 2015-07-29 电子科技大学 Cold cathode electron source array with external grid and electronic gun formed thereby
EP2937163A1 (en) * 2014-03-13 2015-10-28 Jeol Ltd. Machine and method for additive manufacturing
US9453681B2 (en) * 2007-03-30 2016-09-27 Ati Properties Llc Melting furnace including wire-discharge ion plasma electron emitter

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015199195A (en) * 2014-04-04 2015-11-12 株式会社松浦機械製作所 Three-dimensional object molding device
CN103962557B (en) * 2014-05-05 2016-08-17 上海电气(集团)总公司 A kind of separable constituency quickly shaping device
CN106001562B (en) * 2016-06-08 2018-12-14 西安智熔金属打印系统有限公司 Mobile powder bed electron beam rapid molding device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101109905A (en) * 2006-07-21 2008-01-23 东元电机股份有限公司 Electron beam etching device and method thereof
US9453681B2 (en) * 2007-03-30 2016-09-27 Ati Properties Llc Melting furnace including wire-discharge ion plasma electron emitter
EP2937163A1 (en) * 2014-03-13 2015-10-28 Jeol Ltd. Machine and method for additive manufacturing
CN104759623A (en) * 2015-03-10 2015-07-08 清华大学 Additive manufacturing device allowing electron beam and laser composite scanning
CN104810225A (en) * 2015-05-26 2015-07-29 电子科技大学 Cold cathode electron source array with external grid and electronic gun formed thereby

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