CN106503783B - 半导体存储装置 - Google Patents
半导体存储装置 Download PDFInfo
- Publication number
- CN106503783B CN106503783B CN201610137229.9A CN201610137229A CN106503783B CN 106503783 B CN106503783 B CN 106503783B CN 201610137229 A CN201610137229 A CN 201610137229A CN 106503783 B CN106503783 B CN 106503783B
- Authority
- CN
- China
- Prior art keywords
- plate
- shaped member
- interarea
- semiconductor storage
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 95
- 238000003860 storage Methods 0.000 title claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000015654 memory Effects 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 229910052573 porcelain Inorganic materials 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 2
- 239000012212 insulator Substances 0.000 description 20
- 230000033001 locomotion Effects 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 206010037660 Pyrexia Diseases 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
- H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
- H05K5/0278—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces of USB type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562214666P | 2015-09-04 | 2015-09-04 | |
US62/214,666 | 2015-09-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106503783A CN106503783A (zh) | 2017-03-15 |
CN106503783B true CN106503783B (zh) | 2019-10-15 |
Family
ID=58190891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610137229.9A Active CN106503783B (zh) | 2015-09-04 | 2016-03-10 | 半导体存储装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10104806B2 (zh) |
CN (1) | CN106503783B (zh) |
TW (1) | TWI632557B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018203362A1 (de) * | 2018-03-07 | 2019-09-12 | Robert Bosch Gmbh | Kühleinrichtung zur Kühlung eines Leistungsbauelements |
JP2019160044A (ja) * | 2018-03-15 | 2019-09-19 | 東芝メモリ株式会社 | 半導体記憶装置 |
EP3759827A4 (en) * | 2018-04-06 | 2021-11-10 | IPG Photonics Corporation | OPTICAL UNDERWATER AMPLIFIER WITH HIGH VOLTAGE INSULATION |
JP7283041B2 (ja) * | 2018-08-30 | 2023-05-30 | 日本電気株式会社 | 放熱部品及び電気装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2847806Y (zh) * | 2005-12-13 | 2006-12-13 | 高新 | 防水散热型闪存盘 |
CN201550395U (zh) * | 2009-12-10 | 2010-08-11 | 华为终端有限公司 | 无线终端和壳体 |
TW201201110A (en) * | 2010-03-16 | 2012-01-01 | Toshiba Kk | Semiconductor memory device |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6781846B1 (en) * | 1996-01-17 | 2004-08-24 | Fujitsu Limited | IC card and IC card cooling tray |
KR100563122B1 (ko) * | 1998-01-30 | 2006-03-21 | 다이요 유덴 가부시키가이샤 | 하이브리드 모듈 및 그 제조방법 및 그 설치방법 |
US7428605B2 (en) * | 2000-01-06 | 2008-09-23 | Super Talent Electronics Inc. | Symmetric USB device with metal-tube plastic-plug shell with USB plug centered and integrated with circuit board substrate |
US20050156333A1 (en) | 2003-09-11 | 2005-07-21 | Super Talent Electronics Inc. | Narrow Universal-Serial-Bus (USB) Flash-Memory Card with Straight Sides using a Ball-Grid-Array (BGA) Chip |
TWM259257U (en) * | 2004-06-11 | 2005-03-11 | Datafab Sys Inc | Portable information storage apparatus having a structure to support housing for avoiding deformation in the process |
JP4886308B2 (ja) * | 2005-09-16 | 2012-02-29 | 株式会社東芝 | Usbメモリ装置 |
TWM305385U (en) * | 2006-08-22 | 2007-01-21 | Avermedia Tech Inc | Portable electronic device |
CN201104378Y (zh) * | 2007-04-04 | 2008-08-20 | 华为技术有限公司 | 屏蔽和散热装置 |
TWM343230U (en) * | 2008-04-16 | 2008-10-21 | Walton Advanced Eng Inc | Space minimized flash drive |
JP4466692B2 (ja) * | 2007-07-18 | 2010-05-26 | セイコーエプソン株式会社 | 半導体装置 |
US8359418B2 (en) * | 2009-02-26 | 2013-01-22 | Sandisk Il Ltd. | Host device with USB interface |
KR101589441B1 (ko) * | 2009-08-07 | 2016-01-28 | 삼성전자주식회사 | 반도체 모듈 |
JP5459907B2 (ja) * | 2010-01-27 | 2014-04-02 | 東京エレクトロン株式会社 | 基板載置装置の評価装置、及びその評価方法、並びにそれに用いる評価用基板 |
CA2704683A1 (en) * | 2010-05-28 | 2010-08-12 | Ibm Canada Limited - Ibm Canada Limitee | Grounded lid for micro-electronic assemblies |
JP5351107B2 (ja) * | 2010-07-23 | 2013-11-27 | 三菱電機株式会社 | コンデンサの冷却構造およびインバータ装置 |
US9179538B2 (en) * | 2011-06-09 | 2015-11-03 | Apple Inc. | Electromagnetic shielding structures for selectively shielding components on a substrate |
KR101343233B1 (ko) * | 2011-11-28 | 2013-12-18 | 삼성전기주식회사 | 전력 모듈 패키지 |
KR101994931B1 (ko) * | 2012-07-19 | 2019-07-01 | 삼성전자주식회사 | 기억 장치 |
KR102041265B1 (ko) * | 2013-05-02 | 2019-11-27 | 삼성전자주식회사 | Emi 차폐기능과 방열 기능을 가지는 반도체 패키지 |
US9362233B2 (en) | 2013-06-29 | 2016-06-07 | Intel IP Corporation | Radio frequency shielding within a semiconductor package |
-
2016
- 2016-03-07 US US15/062,359 patent/US10104806B2/en active Active
- 2016-03-09 TW TW105107235A patent/TWI632557B/zh active
- 2016-03-10 CN CN201610137229.9A patent/CN106503783B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2847806Y (zh) * | 2005-12-13 | 2006-12-13 | 高新 | 防水散热型闪存盘 |
CN201550395U (zh) * | 2009-12-10 | 2010-08-11 | 华为终端有限公司 | 无线终端和壳体 |
TW201201110A (en) * | 2010-03-16 | 2012-01-01 | Toshiba Kk | Semiconductor memory device |
Also Published As
Publication number | Publication date |
---|---|
TWI632557B (zh) | 2018-08-11 |
TW201711023A (zh) | 2017-03-16 |
CN106503783A (zh) | 2017-03-15 |
US10104806B2 (en) | 2018-10-16 |
US20170071075A1 (en) | 2017-03-09 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170814 Address after: Tokyo, Japan Applicant after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Applicant before: Toshiba Corp. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo Patentee before: Pangea Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220228 Address after: Tokyo Patentee after: Pangea Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo Patentee after: Kaixia Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |