CN102802347A - 定向导热pcb板及电子设备 - Google Patents
定向导热pcb板及电子设备 Download PDFInfo
- Publication number
- CN102802347A CN102802347A CN2011101637013A CN201110163701A CN102802347A CN 102802347 A CN102802347 A CN 102802347A CN 2011101637013 A CN2011101637013 A CN 2011101637013A CN 201110163701 A CN201110163701 A CN 201110163701A CN 102802347 A CN102802347 A CN 102802347A
- Authority
- CN
- China
- Prior art keywords
- pcb
- circuit board
- printed circuit
- heat conduction
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110163701.3A CN102802347B (zh) | 2011-06-17 | 2011-06-17 | 定向导热pcb板及电子设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110163701.3A CN102802347B (zh) | 2011-06-17 | 2011-06-17 | 定向导热pcb板及电子设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102802347A true CN102802347A (zh) | 2012-11-28 |
CN102802347B CN102802347B (zh) | 2015-10-07 |
Family
ID=47201275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110163701.3A Active CN102802347B (zh) | 2011-06-17 | 2011-06-17 | 定向导热pcb板及电子设备 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102802347B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016115702A1 (zh) * | 2015-01-22 | 2016-07-28 | 华为技术有限公司 | 一种小尺寸器件的散热装置和电路板散热系统 |
CN107757030A (zh) * | 2017-11-29 | 2018-03-06 | 李国强 | 一种散热型智能手机 |
US11563879B2 (en) * | 2018-05-15 | 2023-01-24 | Vivo Mobile Communication Co., Ltd. | Image shooting apparatus and mobile terminal |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6462410B1 (en) * | 2000-08-17 | 2002-10-08 | Sun Microsystems Inc | Integrated circuit component temperature gradient reducer |
CN2603595Y (zh) * | 2003-01-29 | 2004-02-11 | 博大科技股份有限公司 | 电路板导热结构 |
TWM292259U (en) * | 2005-12-09 | 2006-06-11 | Insight Electronic Group Inc | Electric circuit board structure with a heat dissipating layer |
CN200956685Y (zh) * | 2006-09-26 | 2007-10-03 | 蔡勇 | 电子元器件封装铝基板 |
US20070259160A1 (en) * | 2006-05-05 | 2007-11-08 | Insight Electronic Group Inc. | Circuit board with heat radiating sheet |
CN101841973A (zh) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | 基于金属基制作高导热性电路板的方法及电路板 |
TW201105222A (en) * | 2009-07-17 | 2011-02-01 | Kinik Co | Highly thermal conductive circuit board |
-
2011
- 2011-06-17 CN CN201110163701.3A patent/CN102802347B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6462410B1 (en) * | 2000-08-17 | 2002-10-08 | Sun Microsystems Inc | Integrated circuit component temperature gradient reducer |
CN2603595Y (zh) * | 2003-01-29 | 2004-02-11 | 博大科技股份有限公司 | 电路板导热结构 |
TWM292259U (en) * | 2005-12-09 | 2006-06-11 | Insight Electronic Group Inc | Electric circuit board structure with a heat dissipating layer |
US20070259160A1 (en) * | 2006-05-05 | 2007-11-08 | Insight Electronic Group Inc. | Circuit board with heat radiating sheet |
CN200956685Y (zh) * | 2006-09-26 | 2007-10-03 | 蔡勇 | 电子元器件封装铝基板 |
TW201105222A (en) * | 2009-07-17 | 2011-02-01 | Kinik Co | Highly thermal conductive circuit board |
CN101841973A (zh) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | 基于金属基制作高导热性电路板的方法及电路板 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016115702A1 (zh) * | 2015-01-22 | 2016-07-28 | 华为技术有限公司 | 一种小尺寸器件的散热装置和电路板散热系统 |
CN106416447A (zh) * | 2015-01-22 | 2017-02-15 | 华为技术有限公司 | 一种小尺寸器件的散热装置和电路板散热系统 |
CN107757030A (zh) * | 2017-11-29 | 2018-03-06 | 李国强 | 一种散热型智能手机 |
US11563879B2 (en) * | 2018-05-15 | 2023-01-24 | Vivo Mobile Communication Co., Ltd. | Image shooting apparatus and mobile terminal |
Also Published As
Publication number | Publication date |
---|---|
CN102802347B (zh) | 2015-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7872869B2 (en) | Electronic chip module | |
US20140029201A1 (en) | Power package module and manufacturing method thereof | |
US9832856B2 (en) | Circuit board | |
CN108990254B (zh) | 内建纵向散热陶瓷块印刷电路板及具该电路板的电路组件 | |
US20160007440A1 (en) | Heat channeling and dispersing structure and manufacturing method thereof | |
CN105188318A (zh) | 散热装置、电子设备及制造方法 | |
CN107708286A (zh) | 印刷电路板组件 | |
US20040080915A1 (en) | Thermal-conductive substrate package | |
CN102802347B (zh) | 定向导热pcb板及电子设备 | |
CN101841976A (zh) | 油印法制作高导热性电路板的方法及高导热性电路板 | |
JP2008205344A (ja) | 熱伝導基板とその製造方法及びこれを用いた回路モジュール | |
KR20110129820A (ko) | 전기적으로 접지된 히트 싱크를 갖는 전자 디바이스 및 그 제조 방법 | |
US20140254104A1 (en) | Heat dissipating module | |
KR102194720B1 (ko) | 방열 구조체를 포함하는 회로기판 | |
CN102802379B (zh) | 散热组件及电子设备 | |
CN201758491U (zh) | 油印法制作的高导热性电路板 | |
KR101602706B1 (ko) | 방열 금속이 부착된 임베디드 기판 및 그 제작 방법 | |
CN101908528A (zh) | 电子封装结构及其载板 | |
JPH1168263A (ja) | 電子回路基板 | |
JP2017204589A (ja) | 放熱チップ及び放熱構造 | |
KR102107033B1 (ko) | 방열기판 | |
CN207283915U (zh) | 一种散热性能好的线路板 | |
CN208424885U (zh) | 具有高导热双面铝基板的电路板 | |
JP2009218254A (ja) | 回路モジュールとその製造方法 | |
JP2011166029A (ja) | 配線基板、それを用いた電子装置、及び配線基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170302 Address after: 850100 Tibet Industrial Park of Lhasa County Patentee after: Tibet Dagze stern Industrial Development Co.,Ltd. Address before: 518000 Nanshan District City, Guangdong province high tech Zone in the middle of a high tech building, No. 9 software building Patentee before: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20230315 Address after: 2 / F, software building, No.9, Gaoxin Zhongyi Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Address before: 850100 Dazi Industrial Park, Lhasa, Tibet Patentee before: Tibet Dagze stern Industrial Development Co.,Ltd. |
|
TR01 | Transfer of patent right |