CN106497509A - 一种高抗冲击型有机硅粘接胶 - Google Patents
一种高抗冲击型有机硅粘接胶 Download PDFInfo
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- CN106497509A CN106497509A CN201610965276.2A CN201610965276A CN106497509A CN 106497509 A CN106497509 A CN 106497509A CN 201610965276 A CN201610965276 A CN 201610965276A CN 106497509 A CN106497509 A CN 106497509A
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- bonded adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
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Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610965276.2A CN106497509B (zh) | 2016-11-04 | 2016-11-04 | 一种高抗冲击型有机硅粘接胶 |
Applications Claiming Priority (1)
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CN201610965276.2A CN106497509B (zh) | 2016-11-04 | 2016-11-04 | 一种高抗冲击型有机硅粘接胶 |
Publications (2)
Publication Number | Publication Date |
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CN106497509A true CN106497509A (zh) | 2017-03-15 |
CN106497509B CN106497509B (zh) | 2019-07-09 |
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CN201610965276.2A Expired - Fee Related CN106497509B (zh) | 2016-11-04 | 2016-11-04 | 一种高抗冲击型有机硅粘接胶 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109294514A (zh) * | 2018-09-29 | 2019-02-01 | 烟台德邦先进硅材料有限公司 | 一种led芯片有机硅固晶胶 |
CN111471429A (zh) * | 2020-05-14 | 2020-07-31 | 南京科矽新材料科技有限公司 | 一种耐高温黄化粘接性强的led用有机硅黏合剂 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08101500A (ja) * | 1994-10-03 | 1996-04-16 | Nippon Paint Co Ltd | 体積ホログラム記録用感光性組成物、及びそれを用いた記録媒体ならびに体積ホログラム形成方法 |
WO2006014367A1 (en) * | 2004-07-02 | 2006-02-09 | Honeywell International Inc. | Functionalized silicon compounds |
US20100221638A1 (en) * | 2009-03-02 | 2010-09-02 | Honda Motor Co., Ltd. | Adhesive for fuel cell and membrane-electrode assembly produced using the same |
CN102070996A (zh) * | 2010-12-14 | 2011-05-25 | 东莞市永固绝缘材料有限公司 | 一种Led大功率封装硅胶 |
CN103627362A (zh) * | 2013-11-29 | 2014-03-12 | 烟台德邦科技有限公司 | 一种反应型聚氨酯热熔胶及其制备方法 |
CN103881393A (zh) * | 2014-03-20 | 2014-06-25 | 东莞优邦材料科技有限公司 | 双组分加成型有机聚硅氧烷组合物及其制备方法及应用 |
CN104193996A (zh) * | 2014-08-21 | 2014-12-10 | 烟台德邦先进硅材料有限公司 | 一种uv/湿气双固化有机硅胶水 |
CN105367593A (zh) * | 2015-11-17 | 2016-03-02 | 烟台德邦先进硅材料有限公司 | 一种硅苯撑/碳硅烷化合物及其制备方法 |
JP2016117839A (ja) * | 2014-12-22 | 2016-06-30 | フジコピアン株式会社 | 両面粘着フィルム及びそれを用いた情報表示画面用の保護部材 |
-
2016
- 2016-11-04 CN CN201610965276.2A patent/CN106497509B/zh not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08101500A (ja) * | 1994-10-03 | 1996-04-16 | Nippon Paint Co Ltd | 体積ホログラム記録用感光性組成物、及びそれを用いた記録媒体ならびに体積ホログラム形成方法 |
WO2006014367A1 (en) * | 2004-07-02 | 2006-02-09 | Honeywell International Inc. | Functionalized silicon compounds |
US20100221638A1 (en) * | 2009-03-02 | 2010-09-02 | Honda Motor Co., Ltd. | Adhesive for fuel cell and membrane-electrode assembly produced using the same |
CN102070996A (zh) * | 2010-12-14 | 2011-05-25 | 东莞市永固绝缘材料有限公司 | 一种Led大功率封装硅胶 |
CN103627362A (zh) * | 2013-11-29 | 2014-03-12 | 烟台德邦科技有限公司 | 一种反应型聚氨酯热熔胶及其制备方法 |
CN103881393A (zh) * | 2014-03-20 | 2014-06-25 | 东莞优邦材料科技有限公司 | 双组分加成型有机聚硅氧烷组合物及其制备方法及应用 |
CN104193996A (zh) * | 2014-08-21 | 2014-12-10 | 烟台德邦先进硅材料有限公司 | 一种uv/湿气双固化有机硅胶水 |
JP2016117839A (ja) * | 2014-12-22 | 2016-06-30 | フジコピアン株式会社 | 両面粘着フィルム及びそれを用いた情報表示画面用の保護部材 |
CN105367593A (zh) * | 2015-11-17 | 2016-03-02 | 烟台德邦先进硅材料有限公司 | 一种硅苯撑/碳硅烷化合物及其制备方法 |
Non-Patent Citations (2)
Title |
---|
R.J.P. CORRIU等: "Siloxane bond formation by heterofunctional condensation of alkoxysilane and halogenosilane. Application to the preparation of copoly(tetramethyl-p-silphenylenesiloxane-dimethylsiloxane)", 《JOURNAL OF ORGANOMETALLIC CHEMISTRY》 * |
WILLIAN4 J.等: "Polymers from Siloxane-Containing Epoxides", 《JOURNAL OF POLYMER SCIENCE: PART A-1》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109294514A (zh) * | 2018-09-29 | 2019-02-01 | 烟台德邦先进硅材料有限公司 | 一种led芯片有机硅固晶胶 |
CN111471429A (zh) * | 2020-05-14 | 2020-07-31 | 南京科矽新材料科技有限公司 | 一种耐高温黄化粘接性强的led用有机硅黏合剂 |
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Publication number | Publication date |
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CN106497509B (zh) | 2019-07-09 |
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