CN106496886A - 导热界面材料 - Google Patents
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- 239000000463 material Substances 0.000 title claims abstract description 75
- 229920001971 elastomer Polymers 0.000 claims abstract description 51
- 239000005060 rubber Substances 0.000 claims abstract description 51
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 48
- 239000011737 fluorine Substances 0.000 claims abstract description 48
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- 239000000203 mixture Substances 0.000 claims description 14
- 229910017083 AlN Inorganic materials 0.000 claims description 7
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 7
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- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 229930185605 Bisphenol Natural products 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 5
- 150000002978 peroxides Chemical class 0.000 claims description 5
- 239000003431 cross linking reagent Substances 0.000 claims description 4
- 125000001153 fluoro group Chemical group F* 0.000 claims description 4
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- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
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- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 abstract description 4
- 150000002221 fluorine Chemical class 0.000 abstract 2
- 238000012545 processing Methods 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 241001441571 Hiodontidae Species 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
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- 229920001577 copolymer Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229920003249 vinylidene fluoride hexafluoropropylene elastomer Polymers 0.000 description 2
- PBVZTJDHQVIHFR-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene Chemical compound FC(F)=C(F)C(F)(F)F.FC(F)=C(F)C(F)(F)F PBVZTJDHQVIHFR-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- WFLOTYSKFUPZQB-UHFFFAOYSA-N 1,2-difluoroethene Chemical group FC=CF WFLOTYSKFUPZQB-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
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- 239000004568 cement Substances 0.000 description 1
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- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/28—Nitrogen-containing compounds
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/20—Oxides; Hydroxides
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Abstract
导热界面材料包含氟系橡胶及均匀分散于该氟系橡胶中的导热填料。氟系橡胶的含氟量大于50%,且于121℃时的门尼黏度ML(1+10)小于60。导热填料占该导热界面材料的体积百分比介于40~65%。该导热界面材料系经无溶剂工艺制作,且其导热率介于0.7W/m·K~9W/m·K。
Description
技术领域
本发明系关于一种导热界面材料(thermal interface material),特别是关于一种具有高导热率和高耐热特性的导热界面材料。
背景技术
电子元件、发光二极体(LED)或其他半导体元件在使用时会产生热,而热如果无法有效排除,将会降低电子元件效能,甚至失效或烧毁。该等半导体元件通常会连接于散热座(heat sink),其间需要使用导热界面材料,将半导体元件与散热座结合,并将该等半导体元件所产生的热有效传导至散热座,以进行散热。
传统上,导热界面材料可采用例如有机硅高分子系统或环氧树脂系统等。有机硅高分子系统可选用例如硅脂(silicone grease)或硅橡胶(silicone rubber),但其在长时间使用上,会产生流油与硬化等缺点。环氧树脂系统虽然有黏着性与低价的优势,但环氧树脂的耐温性过差,在高温长时间的使用下,会产生材料裂化的问题。
美国专利US6,776,226公开了一种使用氟系橡胶的导热界面材料,用以取代以上传统材料,并改善其缺点。导热界面材料包含氟系橡胶的混合物,例如使用六氟丙烯(hexafluoropropylene)和二氟乙烯(vinylidene fluoride)共聚合物(copolymer),其中使用两种不同门尼黏度(Mooney viscosity)的氟系橡胶,分别大于50(MU)和小于50。低门尼黏度的氟系橡胶在热或压力环境下可提供良好的表面润湿(surface wetting)特性.而高门尼黏度的氟系橡胶则提供较佳的操作性及压缩性。结合高和低黏度氟系橡胶可在室温下呈现固体状但具有低黏度的特性,因而具有可润湿不同性质表面(如金属和塑胶)的特点。然而该导热界面材料因需要搭配两种不同黏度的氟系橡胶,而高和低黏度的氟系橡胶的比例也会影响热阻值,因而增加制程复杂度,也可能会影响材料的稳定性。就制程而言,该导热界面材料需先将氟系橡胶溶解于溶剂(solvent)中,之后再进行混炼或加入导热填料,制程较复杂,且溶剂对于环境不友善,不利于环境保护需求。
发明内容
为了解决上述导热界面材料的问题,本发明提供一种使用氟系橡胶的导热界面材料或热传导界面材料,除了具有高导热所能提供的优异散热特性外,同时也具备优良的耐热特性、耐化学特性,以及橡胶所有的弹性及压缩性。
根据本发明一实施例,导热界面材料包含氟系橡胶及均匀分散于该氟系橡胶中的导热填料。氟系橡胶的含氟量大于50%(重量比),且根据ASTM D1646于121℃时测得的门尼黏度ML(1+10)小于60。导热填料占该导热界面材料的体积百分比介于40~65%。该氟系橡胶可适用于无溶剂的制程,亦即该导热界面材料系经由无溶剂工艺制作而成。该导热界面材料的导热率介于0.7W/m·K~9W/m·K。
一实施例中,氟系橡胶选自以下结构式的聚合物、共聚合物或混合物:
以及:
其中l,m和n为正整数。
一实施例中,导热填料可以为氧化铝、氮化铝、氮化硼、碳化硅或其混合物,该导热填料占该导热界面材料的体积百分率在40~65%范围,例如45%、50%、55%、60%。
一实施例中,该导热界面材料只包含单一种类之氟系橡胶,不包含其他不同的氟系橡胶。亦即单纯使用一种氟系橡胶即可达到耐化学性、耐热性等效果。
一实施例中,该导热界面材料另包含偶合剂,该偶合剂包含一个或多个氟官能团。
一实施例中,该氟系橡胶占该导热界面材料的体积百分比在30~60%范围,例如35%、40%、45%、50%、55%。
一实施例中,该导热填料包含氧化铝、氮化铝、氮化硼、碳化硅、氧化镁、氧化锌或其混合物。该导热填料的粒径约为3-70μm。
一实施例中,该导热界面材料另包含交联剂(crosslink agent),该交联剂可为双酚(bisphenol)、过氧化物(peroxide)或胺类(amine)。此外,亦可采用放射线的方式进行交联。
因该导热界面材料俱备橡胶特性,故可以经由高分子加工制程,例如:挤押(extrusion)、轮压(calendaring)、或射出(injection molding)等方式出片成形。
本发明选用特定的氟系橡胶可有效增进导热界面材料的耐热性和耐化学性,且可经由挤押、轮压或射出制程制作出片状材料。优选地,本发明选用可适用于无溶剂工艺的氟系橡胶,不仅工艺单纯,不对环境造成污染。
具体实施方式
为让本发明的上述和其他技术内容、特征和优点能更明显易懂,下文特举出相关实施例,作详细说明如下。
本发明公开一种导热界面材料,其包含氟系橡胶和均匀分散于该氟系橡胶中的导热填料。氟系橡胶占该导热界面材料的体积百分比在30~60%的范围。导热填料占该导热界面材料的体积百分比在40~65%的范围。本发明的导热界面材料的导热率可达到0.7W/m·K~9W/m·K,从而有效进行热逸散。
本发明所选用的氟系橡胶的含氟量大于50%或大于60%,进一步言之,氟系橡胶可选自以下结构式:
以及:
其中l,m和n为正整数。该导热界面材料可以只包含单一种类的氟系橡胶,亦即不包含其他不同的氟系橡胶,以简化制程并提升材料稳定性。此外也可以选用氟系橡胶的共聚合物或混合物。
氟系橡胶可采用大金工业株式会社的DAI-EL G751、G752、G755、G763、G781、G783、G558、G575、G902;3M Dyneon的FC2211、FC2210、FC2145、FE5522、FE5832、FT2350等。该等氟系橡胶于121℃时的门尼黏度ML(1+10)小于60(单位MU)或小于40(MU),该门尼黏度是根据ASTM D1646规范测试而得。
一实施例中,导热填料可包含氧化铝、氮化铝、氮化硼、碳化硅、氧化镁、氧化锌或其混合物。导热填料的粒径约3~70μm,或特别是10~50μm。
以下表1和表2显示本发明相关实施例的导热界面材料的成分。实施例中的氟系橡胶是采用大金工业株式会社产制的DAI-EL G755,其含氟量为66%,且于121℃时的门尼黏度ML(1+10)为25,或者是3MTM DyneonTM的FT2350,其含氟量为68.6%,且于121℃时的门尼黏度ML(1+10)约为56。导热填料可采用氧化铝、氮化铝及/或氮化硼,但并不以此为限。比较例中使用传统的硅高分子而非使用氟系橡胶。实施例中偶合剂使用道康宁(Dow Corning)Q3-9030,该偶合剂包含单数个或复数个氟官能团。氟官能团如以下结构式,用于氟系橡胶与导热陶瓷粉(导热填料)间的偶合作用。
[表1]
[表2]
如表1和表2所示,选用G755或FT2350作为氟系橡胶,并添加氧化铝、氮化铝、氮化硼或其混合物等导热填料,可在无溶剂工艺下制作出导热界面材料,其导热率约0.7~9W/m·K,或特别为1W/m·K、2W/m·K、4W/m·K、6W/m·K、8W/m·K。导热填料添加百分比愈多,导热率愈高,且通常氮化铝和氮化硼相较于氧化铝可提供较高的导热率。氟系橡胶占导热界面材料的体积百分比约在30~60%,而导热填料占导热界面材料的体积百分比约在40~65%。偶合剂的体积百分比约在0.5~1%
表3所示为实施例17和比较例的导热率随时间的变化值。实施例15的导热率初始值为5.15W/m·K,在230℃的环境温度下经过200小时(hrs)、400小时、600小时、800小时和1000小时后并冷却至室温(25℃)时的导热率分别为5.21W/m·K、5.17W/m·K、5.07W/m·K、5.08W/m·K和5.11W/m·K。由此可见本发明的导热界面材料长时间处在高温环境下仍保持约等同的导热率,并没有材料劣化的情况。相对的,使用硅高分子的比较例,其初始值约4.65W/m·K,在230℃的环境温度下经过200小时(hrs)、400小时、600小时、800小时和1000小时后并冷却至室温(25℃)时的导热率分别为4.53W/m·K、4.15W/m·K、3.87W/m·K、2.81W/m·K和1.85W/m·K。很明显的,处于高温时间愈长,使用硅高分子的比较例的导热率愈低,由此可知使用硅高分子的导热界面材料有高温劣化的问题。
[表3]
本发明的导热界面材料生产时先以密练机(kneader)将氟系橡胶与导热填料密练成均匀密练胶,之后将密练胶投入出片机,利用挤押、轮压或射出方式制作需求厚度的片材,全制程无使用溶剂。本发明因为采用无溶剂的挤押、轮压或射出,所以无法采用黏度太高的材料,不像有溶剂制程因采用涂布或网印方式,可容许使用黏度较高的材料。另外,相较于传统的溶剂制程,本发明不需要后续除去溶剂的步骤,没有溶剂残留或溶剂去除过快导致材料的孔洞产生。
此外,本发明的导热界面材料可添加交联剂,例如采用双酚(bisphenol)、过氧化物(peroxide)或胺类(diamine),在高温下将该界面材料交联,或可采取放射线的方式,将导热界面材料交联,而形成一具有机械强度、尺寸稳定性与耐环境性的片状材料。交联温度大约在150~210℃,交联时间约在60分钟以内。
本发明选用特定的氟系橡胶可有效增进导热界面材料的耐热性和耐化学性,且可经由挤押、轮压或射出制程制作出片状材料。优选地,本发明选用可适用于无溶剂工艺的氟系橡胶,不仅制程单纯,不对环境造成污染。
本发明的技术内容及技术特点已揭示如上,然而本领域技术人员仍可能基于本发明的教示及揭示而作种种不背离本发明精神的替换及修饰。因此,本发明的保护范围应不限于实施例所揭示者,而应包括各种不背离本发明的替换及修饰,并为权利要求书的范围所涵盖。
Claims (10)
1.一种导热界面材料,包括:
氟系橡胶,含氟量大于50wt%,且于121℃的门尼黏度ML(1+10)小于60;以及
导热填料,均匀分散于该氟系橡胶中,且占该导热界面材料的体积百分比介于40~65%;
其中该导热界面材料的导热率介于0.7W/m·K~9W/m·K;
其中该导热界面材料经无溶剂工艺制作。
2.根据权利要求1所述的导热界面材料,其中该氟系橡胶选自以下结构式的聚合物、共聚合物或混合物:
以及:
其中l,m和n为正整数。
3.根据权利要求1所述的导热界面材料,其中该氟系橡胶使用双酚、过氧化物或胺类交联剂,或以放射线进行交联。
4.根据权利要求1所述的导热界面材料,其中该导热界面材料只包含单一的氟系橡胶,不包含其他不同的氟系橡胶。
5.根据权利要求1所述的导热界面材料,其还包含偶合剂,该偶合剂包含一个或多个氟官能团。
6.根据权利要求1所述的导热界面材料,其中该氟系橡胶占该导热界面材料的体积百分比在30~60%范围。
7.根据权利要求1所述的导热界面材料,其中该导热填料包含氧化铝、氮化铝、氮化硼、碳化硅、氧化镁、氧化锌或其混合物。
8.根据权利要求1所述之的导热界面材料,其中该导热填料的粒径为3-70μm。
9.根据权利要求1所述的导热界面材料,其还包含双酚、过氧化物或胺类的交联剂。
10.根据权利要求1所述的导热界面材料,其中该导热界面材料采用挤压、轮压或射出方式形成。
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CN111295431B (zh) * | 2017-11-02 | 2022-01-11 | 大金工业株式会社 | 散热材料用含氟弹性体组合物和片 |
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EP3422831B1 (en) * | 2016-02-25 | 2021-12-01 | Zeon Corporation | Heat conductive sheet and a heat dissipation device |
JP6900693B2 (ja) * | 2017-02-07 | 2021-07-07 | 日本ゼオン株式会社 | 熱伝導シート |
US20200303621A1 (en) * | 2019-03-19 | 2020-09-24 | Sabic Global Technologies B.V. | Polymeric Piezoelectric Composite Compositions Including Passive Polymer Matrices |
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US11781002B2 (en) | 2017-11-02 | 2023-10-10 | Daikin Industries, Ltd. | Fluorine-containing elastomer composition for heat dissipation material and sheet thereof |
CN111004461A (zh) * | 2019-12-19 | 2020-04-14 | 四川东方绝缘材料股份有限公司 | 一种尺寸稳定导热聚四氟乙烯薄片及其制备方法 |
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