CN106467652B - 一种导电的复合封装材料及其制备方法 - Google Patents
一种导电的复合封装材料及其制备方法 Download PDFInfo
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- CN106467652B CN106467652B CN201510518475.4A CN201510518475A CN106467652B CN 106467652 B CN106467652 B CN 106467652B CN 201510518475 A CN201510518475 A CN 201510518475A CN 106467652 B CN106467652 B CN 106467652B
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052738 indium Inorganic materials 0.000 claims abstract description 7
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- 229910052718 tin Inorganic materials 0.000 claims abstract description 7
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 6
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- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims abstract description 6
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 4
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- 150000001875 compounds Chemical class 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
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- WURBVZBTWMNKQT-UHFFFAOYSA-N 1-(4-chlorophenoxy)-3,3-dimethyl-1-(1,2,4-triazol-1-yl)butan-2-one Chemical compound C1=NC=NN1C(C(=O)C(C)(C)C)OC1=CC=C(Cl)C=C1 WURBVZBTWMNKQT-UHFFFAOYSA-N 0.000 description 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 239000013589 supplement Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
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Families Citing this family (9)
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CN107320155A (zh) * | 2017-06-30 | 2017-11-07 | 深圳市倍康美医疗电子商务有限公司 | 一种口内肿瘤切除及修补用辅助部件的数字化成型方法 |
CN108172336A (zh) * | 2017-12-26 | 2018-06-15 | 张家港康得新光电材料有限公司 | 导电透明薄膜的制程方法及其应用 |
CN108198665B (zh) * | 2017-12-29 | 2020-05-08 | 中国科学院宁波材料技术与工程研究所 | 一种弹性导体的制备方法 |
CN109461577B (zh) * | 2018-11-01 | 2020-07-17 | 电子科技大学 | 一种介电储能复合材料的制备方法及应用 |
CN110041636B (zh) * | 2019-04-24 | 2022-04-26 | 安徽大学 | 一种无卤阻燃抗静电木塑复合材料及其制备方法 |
CN111849251A (zh) * | 2019-04-30 | 2020-10-30 | 北京梦之墨科技有限公司 | 电子油墨、导电连接结构、多层电路及对应制作方法 |
CN111849252A (zh) * | 2019-04-30 | 2020-10-30 | 北京梦之墨科技有限公司 | 电子油墨、导电连接结构、多层电路及对应制作方法 |
CN111238695B (zh) * | 2020-01-17 | 2021-09-21 | 清华大学 | 压阻材料层、压力传感器及制备方法 |
CN113265121A (zh) * | 2021-05-18 | 2021-08-17 | 吉林大学 | 一种基于温度变化的变刚度复合材料及其制备方法 |
Citations (4)
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CN101704984A (zh) * | 2009-11-18 | 2010-05-12 | 北京工商大学 | 聚合物基导电梯度功能材料及其制备方法 |
CN102176340A (zh) * | 2011-01-31 | 2011-09-07 | 上海长园维安电子线路保护股份有限公司 | 聚合物基导电复合材料及由其制备的过电流保护元件 |
CN103594215A (zh) * | 2013-11-13 | 2014-02-19 | 兴勤(常州)电子有限公司 | 一种复合型高分子热敏电阻 |
CN104098813A (zh) * | 2013-04-12 | 2014-10-15 | 中国石油化工股份有限公司 | 一种导电塑料及其制备方法 |
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CN101704984A (zh) * | 2009-11-18 | 2010-05-12 | 北京工商大学 | 聚合物基导电梯度功能材料及其制备方法 |
CN102176340A (zh) * | 2011-01-31 | 2011-09-07 | 上海长园维安电子线路保护股份有限公司 | 聚合物基导电复合材料及由其制备的过电流保护元件 |
CN104098813A (zh) * | 2013-04-12 | 2014-10-15 | 中国石油化工股份有限公司 | 一种导电塑料及其制备方法 |
CN103594215A (zh) * | 2013-11-13 | 2014-02-19 | 兴勤(常州)电子有限公司 | 一种复合型高分子热敏电阻 |
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Application publication date: 20170301 Assignee: BEIJING DREAM INK TECHNOLOGIES Co.,Ltd. Assignor: Technical Institute of Physics and Chemistry Chinese Academy of Sciences Contract record no.: X2021110000040 Denomination of invention: Conductive composite packaging material and preparation method thereof Granted publication date: 20181002 License type: Exclusive License Record date: 20210924 |
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Effective date of registration: 20240218 Address after: Room 9009, 9th Floor, No. 65 North Fourth Ring West Road, Haidian District, Beijing, 100190 Patentee after: BEIJING DREAM INK TECHNOLOGIES Co.,Ltd. Country or region after: China Address before: No. 29 East Zhongguancun Road, Haidian District, Beijing 100190 Patentee before: Technical Institute of Physics and Chemistry Chinese Academy of Sciences Country or region before: China |
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