CN106457687A - 用于由粉末状的构造材料产生式地制造三维物体的装置 - Google Patents

用于由粉末状的构造材料产生式地制造三维物体的装置 Download PDF

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CN106457687A
CN106457687A CN201580025427.XA CN201580025427A CN106457687A CN 106457687 A CN106457687 A CN 106457687A CN 201580025427 A CN201580025427 A CN 201580025427A CN 106457687 A CN106457687 A CN 106457687A
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F·赫尔佐克
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CL Schutzrechtsverwaltung GmbH
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Abstract

本发明涉及一种用于在引入射束能量的情况下由粉末状的构造材料(3)产生式地制造三维物体(2)的装置(1)，该装置尤其是激光烧结装置和/或激光熔融装置，该装置具有至少一个包括工艺过程腔(5)的壳体(4)，在该工艺过程腔中布置有具有高度能改变的构造平台的构造空间或互换容器(6)，用于借助于射束能量而固化的粉末状构造材料(3)能够放到该构造平台上，其特征在于能随着互换容器(6)和/或随着构造好的物体(2)从装置(1)的工艺过程腔(5)中取出的、能通过电子读取设备读取的存储芯片(16)，在该存储芯片上存储有从属于产生式的制造方法的制造数据和/或接下来的加工步骤和/或加工站用于加工设备(7‑11)和/或输送路径(12)和/或仓储位置(8)的自动控制，和/或存储有用于控制互换容器本身的有源元件的数据。

Description

用于由粉末状的构造材料产生式地制造三维物体的装置
技术领域
本发明涉及一种用于在引入射束能量/辐射能的情况下由粉末状的构造材料产生式地/生成式地制造三维物体的装置，该装置具有权利要求1的其它特征。这种装置尤其被称为激光烧结装置或激光熔融装置并包括具有工艺过程腔(Prozesskammer)的壳体，在该工艺过程腔中布置有具有高度能改变的构造平台的构造空间或互换容器。
背景技术
在构造过程中，在构造平台上放置粉末状的构造材料形成的薄层，随后局部地、与要制造的构件的预先规定的结构相应地固化。这个过程通过相应对先前的粉末层或已固化的部分层重新覆层而继续进行，直到三维的构件以层式结构的方式在辐照作用下完成。
在这种装置中已知的是，应用所谓的互换容器，该互换容器可以进入到工艺过程腔中，以便可以进行构造过程并在构造过程结束之后连同位于其中的物体被从工艺过程腔中重新取出。这个互换容器随后被送入所谓的取出站中或再加工站中并在那里相应地继续加工工件。
这种类型的装置例如从文献DE 10 2009 036153 A1中得到。
发明内容
本发明的目的是，如此改进具有权利要求1的前序部分的特征的装置，即，在构造过程之后可以向着其它站自动地、适应于个别物体地实现工件的客户分配、分析和/或继续输送和/或有针对性的继续加工。
上述目的根据权利要求1的特征部分由此实现，即，设置有能随着互换容器和/或随着构造好的物体从装置的工艺过程腔中取出的、配属于物体的、能通过电子读取设备读取的存储芯片，在该存储芯片上存储有从属于产生式的制造方法的制造数据、接下来的加工步骤和/或接下来的加工站和/或用于自动存储的构造记录和/或用于加工设备、输送路径和/或仓储位置的控制(方式)。
看作本发明的核心的是，为在该装置中制造的物体提供存储芯片以备用，该存储芯片要么集成在互换容器中，要么能拆松地或不能拆松地固定在该互换容器上，或者嵌入构造腔的内部的未固化的构造材料中，或者甚至与物体通过产生式的固化步骤连接，或者布置在构造平台或支持结构中。在这个芯片中可以首先通过写入装置输入构造数据，该构造数据适用于使在该装置中实施的构造过程可以在“逆向工程(reverse engineering)”的意义方面再次返回进行，以便确定，在该装置中制造的物体是否可能具有例如内部的结构缺陷以及类似情况。构造数据是例如激光功率、覆层数据、在构造腔中的空气数据、温度、尤其在粉末层上的激光焦点区域中的熔池温度或熔池大小、或适用于解释已经进行的构造过程的其它数据。
另外在同一芯片中还可以存储客户信息，例如客户号码、制造日期、供货日期和供货地点。在此，在客户数据或供货数据方面没有限制。
还可能的是，当制造的物体例如经受特别的表面加工或应被输送到雕刻装置处，则将芯片用于控制接下来的加工步骤。在该制造装置后面的加工设备、如铣削站、热处理站、磨光站、搬运站、光学测量站或用于对构件和类似部件进行消毒的消毒站可以通过芯片自动地控制。
存储芯片同样可以有针对性地经过通向这些加工设备的输送路径，该输送路径涵盖在原本的制造装置和加工设备之间的路程，从而在将物体输送到另外的加工站时不需要人工的干涉。最后还可能的是，在该芯片上存储仓储区域中的位置，运输装置随后自动地驶向该仓储区域。如果该芯片是RFID-芯片，则可以通过RFID-读取设备在踏入仓储空间时立即盘点并确定，哪个已经制造的物体在仓储空间中的何处，以及要在确定时刻取出和发送哪个已经制造的物体。
最后在本发明的范围内可行的是，使用存储芯片控制设有该存储芯片的互换容器的有源元件(aktive Elemente)。尤其可以控制集成在互换容器中的用于使互换容器移动的驱动马达、用于使构造平台改变高度的伺服电机、加热元件、冷却元件、通风电机、抽气装置和诸如此类。因为存储芯片可以个别地为每个构造过程编程，所以互换容器的有源元件的控制可以精确地适配于构造过程和接下来的处理步骤。
所有这些数据可以保留在一个及同一个芯片上，其中，在本发明的范围内提出，也可以设置多个可读取的存储芯片，这些存储芯片可以被提供给互换容器或构造好的投影(Projekt)，并且可以随着互换容器或构造好的投影从该装置的工艺过程腔中取出。可以在装置自身中进行编程，但也可以提供预编程的芯片，该芯片已经完全地或部分地预编程，例如仅装载有制造数据。
激光烧结装置或激光熔融装置可以设有输入设备、例如读卡器或其它输入设备，该输入设备适用于或多或少完全地对存储芯片进行编程。
在制造过程之后将互换容器从装置中移出，并可以在规定的输送轨道上将其带入到其它的加工站处，该加工站在存储芯片上被存储为中间站或目标站。中间站可以是例如中间加工站，而目标站可以是仓储场地。
在激光烧结装置或激光熔融装置中以及在其它的加工站中、例如铣削站或者热处理站或者互换容器或物体在装置和其它加工站或仓储设施之间的行驶路段的部段上可以布置与存储芯片共同作用的电子读取设备，该电子读取设备适用于控制道岔装置，由此使物体或互换容器驶向正确的站。
原则上也可行的是，将处理器与存储芯片连接，该处理器与在互换容器内部的至少一个传感器元件共同作用。由此可以确定物理数据，例如压力、温度、时间、加速度值和类似数据，以便在存储芯片上记录：在制造过程之后是否有任何的外部情况作用在物体上，该外部情况导致物体的损坏。加速度传感器可以例如确定猛烈的冲撞，该冲撞能够导致物体的断裂或部分断裂。
附图说明
根据在附图中的有利的实施例详细描述本发明。附图示出：
图1示出具有多个输送路径、加工站和仓储位置的根据本发明的装置的示意图；
图2示出具有可读取的存储芯片的两个简示的位置的互换容器的示意性视图；
图3示出具有嵌入粉末铺层中的存储芯片的互换容器的示意图；
图4示出构造腔连同在构造腔中构成的物体的示意性的剖面图，存储芯片通过连接板固定在该物体上。
具体实施方式
图1中示出的装置1用于在引入射束能量的情况下由粉末状的构造材料3制造三维的物体2。该装置尤其是激光烧结装置或激光熔融装置。在壳体4中布置工艺过程腔5，在该工艺过程腔中布置带有高度能改变的构造平台的构造空间或互换容器6，在该构造平台上可以放置用于借助于射束能量而固化的粉末状构造材料。
在图1中还示出，除了原本的制造装置之外还设置其它加工站7、仓储站8、至少一个取出站9、测试站10和例如雕刻站11，这些站全部通过输送路径12彼此连接，从而要么互换容器6要么脱离粉末铺层的物体2可以沿着输送路径12被运输到不同的加工站7、仓储场地8或其它位置处。为此也可以使用受到自动控制的运输路径、传送带或其它作为现有技术已知的和适用的运输机构。
为了控制向着不同的输送路径12或加工设备或仓储位置的行驶，设置可以要么随着互换容器6要么随着构造好的物体2从装置1的工艺过程腔中取出的、可以通过电子读取装置15读取的存储芯片16，在该存储芯片上存储从属于产生式的制造方法的制造数据和/或接下来的加工步骤或加工站用于加工设备、输送路径和/或仓储位置的自动控制。
可以以不同方式进行在互换容器6和存储芯片16之间的分配。
在图1中示出，存储芯片16安装在互换容器6的外壁部上。
图2中简略示出，可以将存储芯片16插入互换容器6的槽状凹口17中并例如卡锁在那里。
在图3中示出，将存储芯片16插入构造材料3的粉末铺层18中并保留在那里也足以使存储芯片16可以随着互换容器6从工艺过程腔中取出。为了暂时固定存储芯片16，该存储芯片可以例如利用伸入粉末铺层中的锚栓突出部引入到壳体中。
存储芯片16的布置结构的另一种可能性在图4中示意性示出。在那里存储芯片16通过连接板25与物体2连接，从而在从构造材料3中取出物体后仍然保持了在存储芯片16和物体2之间的固定的分配关系。在本发明的范围内提出，除了与物体连接的存储芯片16之外，还可以设置与互换容器6连接的一个或多个存储芯片26。该存储芯片26可以例如为此用于影响输送路径12的道岔装置，而在物体2上的存储芯片16包含客户数据、处理数据，例如制造温度、熔池温度或诸如此类。当然也可以在两个存储芯片16、26上记录所有数据并可以相应地读取以及利用所有数据。
在图4中示出，存储芯片可以被安置在构造板27中，在构造过程中向该构造板上堆放粉末状的构造材料3并在那里使构造材料固化，以便构造物体2的第一层。
在图1中还示出，可以在工艺过程腔5中设置编程设备30，该编程设备与输入单元31连接，以便在存储芯片16上装载相应的数据。
在本发明的范围内还提出，将至少一个处理器40与存储芯片16连接，该处理器与互换容器6内部的至少一个传感器元件共同作用，以便记录或登记例如有害的加速度、温度或其它对物体2的影响因素。
附图标记列表：
1 装置
2 物体
3 构造材料
4 壳体
5 工艺过程腔
6 互换容器
7 加工站
8 仓储位置
9 取出站
10 测试站
11 雕刻站
12 输送路径
15 读取设备
16 存储芯片
25 连接板
26 存储芯片
27 构造板
30 编程设备
31 输入单元
40 处理器

Claims (17)

1.一种用于在引入射束能量的情况下由粉末状的构造材料(3)产生式地制造三维物体(2)的装置(1)，该装置尤其是激光烧结装置和/或激光熔融装置，该装置具有至少一个包括工艺过程腔(5)的壳体(4)，在该工艺过程腔中布置有具有高度能改变的构造平台的构造空间或互换容器(6)，用于借助于射束能量而固化的粉末状构造材料(3)能够放到该构造平台上，其特征在于能随着互换容器(6)和/或随着构造好的物体(2)从装置(1)的工艺过程腔(5)中取出的、能通过电子读取设备(15)读取的存储芯片(16)，在该存储芯片上存储有从属于产生式的制造方法的制造数据和/或接下来的加工步骤和/或加工站用于加工设备(7-11)和/或输送路径(12)和/或仓储位置(8)的自动控制，和/或存储有用于控制互换容器本身的有源元件的数据。
2.根据权利要求1所述的装置，其特征在于，存储芯片(16)集成集成在互换容器(6)中或者能拆松地或不能拆松地固定在该互换容器上。
3.根据权利要求1或2所述的装置，其特征在于，存储芯片(16)布置在互换容器(6)内部的未固化的构造材料(3)的部段中。
4.根据权利要求1至3中任一项所述的装置，其特征在于，存储芯片(16)通过产生式的固化步骤与物体(2)连接。
5.根据前述权利要求中任一项所述的装置，其特征在于，存储芯片(16)与布置在构造平台上的构造板(27)连接或布置在该构造板中。
6.根据前述权利要求中任一项所述的装置，其特征在于，用于存储芯片(16)的编程设备(30，31)布置在工艺过程腔(5)的区域中。
7.根据前述权利要求中任一项所述的装置，其特征在于，互换容器(6)能够在规定的输送路径(12)上向其它的加工站(7)移动，所述其它的加工站作为中间站或目标站存储在存储芯片(16)上。
8.根据前述权利要求中任一项所述的装置，其特征在于，要在其它的加工站(7)中在物体(2)上进行的加工流程作为信息存储在存储芯片(16)上。
9.根据前述权利要求中任一项所述的装置，其特征在于，在装置(1)中、在其它的加工站(7)中和/或在互换容器(6)在装置(1)与其它的加工站(7)之间的输送路径(12)部段上布置有与存储芯片(16)共同作用的电子读取设备(15)。
10.根据前述权利要求中任一项所述的装置，其特征在于，存储芯片(16)与至少一个处理器(40)连接，该处理器与互换容器(6)内部的至少一个传感器元件共同作用。
11.根据前述权利要求中任一项所述的装置，其特征在于，互换容器(6)能驶向多个其它的加工站(7，8，9，10)，其中，沿着输送路径(12)设置有多个能通过存储芯片(16)的信息电子控制的道岔装置。
12.根据前述权利要求中任一项所述的装置，其特征在于，存储在存储芯片(16)上的加工流程涉及热处理步骤、机械的表面处理步骤、光学测量步骤、表面辐照步骤、标记步骤、冷却时间和冷却环境。
13.根据前述权利要求中任一项所述的装置，其特征在于，其它的加工站(7-10)分别是至少一个热辐照站、标记站、激光表面加工站、测量站、冷却站和/或取出站。
14.根据前述权利要求中任一项所述的装置，其特征在于，多个用于进行产生式的制造的装置(1)与多个其它的加工站(7-11)通过多个输送路径(12)彼此连接，其中，在该多个输送路径(12)中设置有分支，在分支的区域中能够通过在输送路径(12)的不同部段上的能电子读取的存储芯片控制互换容器(6)。
15.根据前述权利要求中任一项所述的装置，其特征在于，通过存储芯片能控制互换容器的至少一个伺服电机或驱动马达。
16.根据权利要求15所述的装置，其特征在于，驱动马达基于存储在存储芯片上的信息来控制布置在互换容器中的构造平台的高度改变。
17.根据权利要求1所述的装置，其特征在于，互换容器的加热装置能通过存储在存储芯片上的信息来控制。
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CN109108282B (zh) * 2017-06-23 2021-09-07 通用电气公司 使用增材制造形成物件的设备以及制造物件的方法

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