CN106457168A - 为cvd或pvd覆层装置供给处理气体混合物的设备和方法 - Google Patents

为cvd或pvd覆层装置供给处理气体混合物的设备和方法 Download PDF

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Publication number
CN106457168A
CN106457168A CN201580027176.9A CN201580027176A CN106457168A CN 106457168 A CN106457168 A CN 106457168A CN 201580027176 A CN201580027176 A CN 201580027176A CN 106457168 A CN106457168 A CN 106457168A
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CN
China
Prior art keywords
gas
mixing chamber
flow
air
mixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580027176.9A
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English (en)
Chinese (zh)
Inventor
B.P.戈皮
E.O.S.皮内罗
M.格斯多夫
M.雅各布
S.诺伊曼
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Aixtron SE
Original Assignee
Aixtron SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aixtron SE filed Critical Aixtron SE
Publication of CN106457168A publication Critical patent/CN106457168A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
    • B01F23/10—Mixing gases with gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/40—Static mixers
    • B01F25/42—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
    • B01F25/421—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions by moving the components in a convoluted or labyrinthine path
    • B01F25/423—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions by moving the components in a convoluted or labyrinthine path by means of elements placed in the receptacle for moving or guiding the components
    • B01F25/4231—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions by moving the components in a convoluted or labyrinthine path by means of elements placed in the receptacle for moving or guiding the components using baffles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
    • B01F25/40—Static mixers
    • B01F25/42—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
    • B01F25/43—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction
    • B01F25/431—Straight mixing tubes with baffles or obstructions that do not cause substantial pressure drop; Baffles therefor
    • B01F25/4314—Straight mixing tubes with baffles or obstructions that do not cause substantial pressure drop; Baffles therefor with helical baffles
    • B01F25/43141—Straight mixing tubes with baffles or obstructions that do not cause substantial pressure drop; Baffles therefor with helical baffles composed of consecutive sections of helical formed elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/50—Mixing receptacles
    • B01F35/52—Receptacles with two or more compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/71—Feed mechanisms
    • B01F35/712—Feed mechanisms for feeding fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
    • B01F35/71—Feed mechanisms
    • B01F35/716—Feed mechanisms characterised by the relative arrangement of the containers for feeding or mixing the components
    • B01F35/7163—Feed mechanisms characterised by the relative arrangement of the containers for feeding or mixing the components the containers being connected in a mouth-to-mouth, end-to-end disposition, i.e. the openings are juxtaposed before contacting the contents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45512—Premixing before introduction in the reaction chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Physical Vapour Deposition (AREA)
CN201580027176.9A 2014-05-09 2015-05-07 为cvd或pvd覆层装置供给处理气体混合物的设备和方法 Pending CN106457168A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014106523.9A DE102014106523A1 (de) 2014-05-09 2014-05-09 Vorrichtung und Verfahren zum Versorgen einer CVD- oder PVD-Beschichtungseinrichtung mit einem Prozessgasgemisch
DE102014106523.9 2014-05-09
PCT/EP2015/060017 WO2015169882A1 (de) 2014-05-09 2015-05-07 Vorrichtung und verfahren zum versorgen einer cvd- oder pvd-beschichtungseinrichtung mit einem prozessgasgemisch

Publications (1)

Publication Number Publication Date
CN106457168A true CN106457168A (zh) 2017-02-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580027176.9A Pending CN106457168A (zh) 2014-05-09 2015-05-07 为cvd或pvd覆层装置供给处理气体混合物的设备和方法

Country Status (6)

Country Link
JP (1) JP6796491B2 (enExample)
KR (1) KR102413577B1 (enExample)
CN (1) CN106457168A (enExample)
DE (1) DE102014106523A1 (enExample)
TW (1) TWI694168B (enExample)
WO (1) WO2015169882A1 (enExample)

Cited By (9)

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Publication number Priority date Publication date Assignee Title
CN110237734A (zh) * 2019-06-10 2019-09-17 中国石油大学(北京) 气体混合器及废气处理装置
CN110917914A (zh) * 2019-12-19 2020-03-27 北京北方华创微电子装备有限公司 气体混合装置及半导体加工设备
CN111744340A (zh) * 2020-07-02 2020-10-09 天津市英格环保科技有限公司 一种在低温环境下脱硫脱硝的方法
CN112680717A (zh) * 2019-10-18 2021-04-20 台湾积体电路制造股份有限公司 用于半导体制作的气体混合系统及混合气体的方法
CN112973483A (zh) * 2021-03-29 2021-06-18 深圳市科曼医疗设备有限公司 一种气体混合装置
CN114530394A (zh) * 2020-11-23 2022-05-24 细美事有限公司 用于处理基板的设备
CN115066513A (zh) * 2019-10-29 2022-09-16 艾克斯特朗欧洲公司 用于沉积有机层的方法和设备
WO2022262701A1 (zh) * 2021-06-18 2022-12-22 北京北方华创微电子装备有限公司 半导体工艺设备及其混合进气装置
CN119132927A (zh) * 2024-11-11 2024-12-13 无锡尚积半导体科技有限公司 一种晶圆表面预清洁的装置及方法

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JP2020020532A (ja) * 2018-08-01 2020-02-06 三菱電機株式会社 温度均一化装置、構造物およびパラボラアンテナ装置
CN110773061B (zh) * 2019-11-05 2021-09-21 浙江工业职业技术学院 一种搅拌装置
DE102020112568A1 (de) 2020-02-14 2021-08-19 AIXTRON Ltd. Gaseinlassorgan für einen CVD-Reaktor
CN111804453B (zh) * 2020-07-21 2021-10-12 宁波诺歌休闲用品有限公司 一种用于铝合金型材的表面喷涂机中的喷涂机构
CN113813858B (zh) * 2021-11-10 2023-01-31 西安国际医学中心有限公司 一种治疗癌症疼痛膏药制作的混料装置
CN116949392A (zh) * 2022-04-18 2023-10-27 中微半导体设备(上海)股份有限公司 一种气体混合器、气体喷淋装置及使用方法
KR102831131B1 (ko) * 2022-05-18 2025-07-04 한화모멘텀 주식회사 기판 처리 장치
CN114768578B (zh) * 2022-05-20 2023-08-18 北京北方华创微电子装备有限公司 混气装置及半导体工艺设备
KR102828639B1 (ko) * 2022-10-31 2025-07-02 주식회사 에스지에스코리아 기판 처리 장치의 가스 공급 기구 및 이를 구비한 기판 처리 장치
WO2025029735A1 (en) * 2023-08-01 2025-02-06 Lam Research Corporation Processing tool showerhead with integrated static mixer
US20250277307A1 (en) * 2024-03-01 2025-09-04 Applied Materials, Inc. 3d printed integrated gas mixer

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110237734A (zh) * 2019-06-10 2019-09-17 中国石油大学(北京) 气体混合器及废气处理装置
CN112680717B (zh) * 2019-10-18 2023-11-17 台湾积体电路制造股份有限公司 用于半导体制作的气体混合系统及混合气体的方法
CN112680717A (zh) * 2019-10-18 2021-04-20 台湾积体电路制造股份有限公司 用于半导体制作的气体混合系统及混合气体的方法
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US11772058B2 (en) 2019-10-18 2023-10-03 Taiwan Semiconductor Manufacturing Company Limited Gas mixing system for semiconductor fabrication
CN115066513A (zh) * 2019-10-29 2022-09-16 艾克斯特朗欧洲公司 用于沉积有机层的方法和设备
CN115066513B (zh) * 2019-10-29 2024-11-01 艾克斯特朗欧洲公司 用于沉积有机层的方法和设备
CN110917914A (zh) * 2019-12-19 2020-03-27 北京北方华创微电子装备有限公司 气体混合装置及半导体加工设备
CN110917914B (zh) * 2019-12-19 2022-09-16 北京北方华创微电子装备有限公司 气体混合装置及半导体加工设备
CN111744340A (zh) * 2020-07-02 2020-10-09 天津市英格环保科技有限公司 一种在低温环境下脱硫脱硝的方法
CN114530394A (zh) * 2020-11-23 2022-05-24 细美事有限公司 用于处理基板的设备
CN112973483A (zh) * 2021-03-29 2021-06-18 深圳市科曼医疗设备有限公司 一种气体混合装置
TWI817557B (zh) * 2021-06-18 2023-10-01 大陸商北京北方華創微電子裝備有限公司 半導體製程設備及其混合進氣裝置
WO2022262701A1 (zh) * 2021-06-18 2022-12-22 北京北方华创微电子装备有限公司 半导体工艺设备及其混合进气装置
US12264393B2 (en) 2021-06-18 2025-04-01 Beijing Naura Microelectronics Equipment Co., Ltd. Semiconductor processing apparatus and mixing inlet device
CN119132927A (zh) * 2024-11-11 2024-12-13 无锡尚积半导体科技有限公司 一种晶圆表面预清洁的装置及方法

Also Published As

Publication number Publication date
JP2017522447A (ja) 2017-08-10
DE102014106523A1 (de) 2015-11-12
TW201602398A (zh) 2016-01-16
TWI694168B (zh) 2020-05-21
JP6796491B2 (ja) 2020-12-09
KR102413577B1 (ko) 2022-06-24
WO2015169882A1 (de) 2015-11-12
KR20170003965A (ko) 2017-01-10

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