CN106449913A - 石墨烯/银量子点/氮化镓双向发光二极管及其制备方法 - Google Patents
石墨烯/银量子点/氮化镓双向发光二极管及其制备方法 Download PDFInfo
- Publication number
- CN106449913A CN106449913A CN201610914870.9A CN201610914870A CN106449913A CN 106449913 A CN106449913 A CN 106449913A CN 201610914870 A CN201610914870 A CN 201610914870A CN 106449913 A CN106449913 A CN 106449913A
- Authority
- CN
- China
- Prior art keywords
- gallium nitride
- graphene
- quantum dot
- silver
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 60
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 58
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 229910002601 GaN Inorganic materials 0.000 title claims abstract description 57
- 239000002096 quantum dot Substances 0.000 title claims abstract description 45
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 35
- 239000004332 silver Substances 0.000 title claims abstract description 35
- 230000002457 bidirectional effect Effects 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 9
- 239000010703 silicon Substances 0.000 claims abstract description 9
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 6
- 239000010980 sapphire Substances 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 20
- 238000004020 luminiscence type Methods 0.000 claims description 18
- 230000008021 deposition Effects 0.000 claims description 6
- 238000005137 deposition process Methods 0.000 claims description 6
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 238000005566 electron beam evaporation Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- HJELPJZFDFLHEY-UHFFFAOYSA-N silicide(1-) Chemical compound [Si-] HJELPJZFDFLHEY-UHFFFAOYSA-N 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 23
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- 238000000151 deposition Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 238000002207 thermal evaporation Methods 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- -1 graphite Alkene Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
本发明公开了一种石墨烯/银量子点/氮化镓双向发光二极管及其制备方法,该发光二极管是自下而上依次有蓝宝石衬底层或硅衬底层、p型的氮化镓层、银量子点层、石墨烯层,在氮化镓层上还设有侧面电极,在石墨烯层上设有正面电极,所述的氮化镓层为p型多晶材料,厚度为2~10μm;本发明的石墨烯/银量子点/氮化镓双向发光二极管利用银量子点表面等离子体增强发光,同时结合石墨烯材料的高透光性、高导电性和氮化镓优异的发光性能,正反偏压下均可发光且波段多样,亮度高,制备工艺简单,成本低。
Description
技术领域
本发明涉及一种发光二极管及其制造方法,尤其涉及一种石墨烯/银量子点/氮化镓双向发光二极管及其制造方法,属于发光二极管领域。
背景技术
发光二极管以其寿命长、重量轻、体积小和污染低的优点,有望取代日光灯成为第三代照明器件,现在已经被广泛应用到照明,显示等方面。氮化镓作为宽禁带直接带隙半导体,有较大的禁带宽度(3.5eV)十分适合制作短波长发光器件。石墨烯的电子迁移率是硅的100倍,高的电子迁移率有利于提高发光二极管的发光效率;银量子点的表面等离子体增强可大幅提高器件的发光强度。在此基础上,本发明提出了石墨烯/银量子点/氮化镓结构,并利用简单工艺实现了所述发光二极管的制备。且该发光二极管正反偏压下均可工作,石墨烯接正电压时发出黄绿光,石墨烯接负电压时发蓝光。
发明内容
本发明的目的在于提供一种亮度高,工艺简单的石墨烯/银量子点/氮化镓双向发光二极管及其制备方法,该发光二极管正反偏压下均可工作,石墨烯接正电压时发出黄绿光,石墨烯接负电压时发蓝光。
本发明的石墨烯/银量子点/氮化镓双向发光二极管,其特征在于,自下而上依次有蓝宝石衬底层或硅衬底层、p型的氮化镓层、银量子点层、石墨烯层,在氮化镓层上还设有侧面电极,在石墨烯层上设有正面电极,所述的氮化镓层为p型多晶材料,厚度为2~10μm。
上述技术方案中,所述的银量子点的直径为5~100nm。
所述的正面电极为金、钯、银、钛、铬、镍的一种或者几种的复合电极。
所述的侧面电极为镍金电极。
所述的石墨烯的厚度为1-5层。
制备上述的石墨烯/银量子点/氮化镓双向发光二极管的方法,包括如下步骤:
1)在蓝宝石或硅衬底上用金属化学气相沉积法生长P型氮化镓外延层;
2)在步骤1)所得氮化镓片上用电子束蒸发镀膜方法沉积侧面电极,并预留面积;
3)将步骤2)所得氮化镓片进行表面清洗并干燥表面;
4)将银量子点旋涂至步骤3)处理后的氮化镓片的预留面积处;
5)将石墨烯转移至步骤4)制备的银量子点层上;
6)在石墨烯上制作正面电极。
与现有技术相比,本发明具有的有益效果是:本发明的发光二极管通过独特的结构设计,使得其可以实现双向发光,单个器件可发出多种波长的光,即在正反偏压下均可工作,石墨烯接正电压时发出黄绿光,石墨烯接负电压时发蓝光,且该发光二极管亮度高;工艺简单,成本低。
附图说明
图1为石墨烯/银量子点/氮化镓双向发光二极管截面图;
图2为石墨烯/银量子点/氮化镓双向发光二极管俯视图;
图3为石墨烯/银量子点/氮化镓双向发光二极管的IV曲线图;
图4为石墨烯/银量子点/氮化镓双向发光二极管在石墨烯接正偏压时的发光谱;
图5为石墨烯/银量子点/氮化镓双向发光二极管在石墨烯接负偏压时的发光谱。
具体实施方式
下面结合附图进一步说明本发明。
参照图1、2,本发明的石墨烯/银量子点/氮化镓双向发光二极管自下而上依次有蓝宝石衬底层或硅衬底层1、p型的氮化镓层2、银量子点层4、石墨烯层5,在氮化镓层2上还设有侧面电极3,在石墨烯层5上设有正面电极6,所述的氮化镓层为p型多晶材料,厚度为2~10μm。图3、4、5分别为本发明制得的发光二极管的IV曲线图、石墨烯接正偏压时的发光谱及石墨烯接负偏压时的发光谱,可以看出该发光二极管可以实现双向发光,单个器件可发出多种波长的光,即在正反偏压下均可工作,石墨烯接正电压时发出黄绿光,石墨烯接负电压时发蓝光。
实施例1
1)在蓝宝石衬底上用金属化学气相沉积法生长P型多晶氮化镓外延层,厚度2μm;
2)在氮化镓外延片一侧利用电子束蒸发法沉积镍金电极;
3)将得到的样品依次浸入去离子水,丙酮和异丙醇中进行表面清洗;
4)将直径100nm银量子点匀涂至清洗干净的氮化镓单晶片上;
5)将单层石墨烯转移至银量子点上;
6)在石墨烯上利用热蒸发工艺沉积银电极得到石墨烯/银量子点/氮化镓双向发光二极管。
实施例2
1)在硅衬底上用金属化学气相沉积法生长P型多晶氮化镓外延层,厚度4μm;
2)在氮化镓外延片一侧利用电子束蒸发法沉积镍金电极;
3)将得到的样品依次浸入去离子水,丙酮和异丙醇中进行表面清洗;
4)将50nm直径银量子点匀涂至清洗干净的氮化镓单晶片上;
5)将双层石墨烯转移至银量子点上;
6)在石墨烯上利用热蒸发工艺沉积金电极得到石墨烯/银量子点/氮化镓双向发光二极管。
实施例3
1)在硅衬底上用金属化学气相沉积法生长P型多晶氮化镓外延层,厚度8μm;
2)在氮化镓外延片一侧利用电子束蒸发法沉积镍金电极;
3)将得到的样品依次浸入去离子水,丙酮和异丙醇中进行表面清洗;
4)将10nm直径银量子点匀涂至清洗干净的氮化镓单晶片上;
5)将三层石墨烯转移至银量子点上;
6)在石墨烯上利用热蒸发工艺沉积钛电极得到石墨烯/银量子点/氮化镓双向发光二极管。
实施例4
1)在硅衬底上用金属化学气相沉积法生长P型多晶氮化镓外延层,厚度10μm;
2)在氮化镓外延片一侧利用电子束蒸发法沉积镍金电极;
3)将得到的样品依次浸入去离子水,丙酮和异丙醇中进行表面清洗;
4)将5nm直径银量子点匀涂至清洗干净的氮化镓单晶片上;
5)将五层石墨烯转移至银量子点上;
6)在石墨烯上利用热蒸发工艺沉积银电极得到石墨烯/银量子点/氮化镓双向发光二极管。
Claims (6)
1.一种石墨烯/银量子点/氮化镓双向发光二极管,其特征在于,自下而上依次有蓝宝石衬底层或硅衬底层(1)、p型的氮化镓层(2)、银量子点层(4)、石墨烯层(5),在氮化镓层(2)上还设有侧面电极(3),在石墨烯层(5)上设有正面电极(6),所述的氮化镓层为p型多晶材料,厚度为2~10μm。
2.根据权利要求1所述的石墨烯/银量子点/氮化镓双向发光二极管,其特征在于,所述的银量子点的直径为5~100nm。
3.根据权利要求1所述的石墨烯/银量子点/氮化镓双向发光二极管,其特征在于,所述的正面电极为金、钯、银、钛、铬、镍的一种或者几种的复合电极。
4.根据权利要求1所述的石墨烯/银量子点/氮化镓双向发光二极管,其特征在于,所述的侧面电极为镍金电极。
5.根据权利要求1所述的石墨烯/银量子点/氮化镓双向发光二极管,其特征在于,所述的石墨烯的厚度为1-5层。
6.制备如权利要求1-5任一项所述的石墨烯/银量子点/氮化镓双向发光二极管的方法,其特征在于,该方法包括如下步骤:
1)在蓝宝石或硅衬底上用金属化学气相沉积法生长P型氮化镓外延层;
2)在步骤1)所得氮化镓片上用电子束蒸发镀膜方法沉积侧面电极,并预留面积;
3)将步骤2)所得氮化镓片进行表面清洗并干燥表面;
4)将银量子点旋涂至步骤3)处理后的氮化镓片的预留面积处;
5)将石墨烯转移至步骤4)制备的银量子点层上;
6)在石墨烯上制作正面电极。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610914870.9A CN106449913A (zh) | 2016-10-20 | 2016-10-20 | 石墨烯/银量子点/氮化镓双向发光二极管及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610914870.9A CN106449913A (zh) | 2016-10-20 | 2016-10-20 | 石墨烯/银量子点/氮化镓双向发光二极管及其制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106449913A true CN106449913A (zh) | 2017-02-22 |
Family
ID=58176072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610914870.9A Pending CN106449913A (zh) | 2016-10-20 | 2016-10-20 | 石墨烯/银量子点/氮化镓双向发光二极管及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106449913A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020215441A1 (zh) * | 2019-04-25 | 2020-10-29 | 东南大学 | 一种基于N-ZnO/N-GaN/N-ZnO异质结的双向紫外发光二极管及制备方法 |
CN113614933A (zh) * | 2020-03-03 | 2021-11-05 | 东莞市中麒光电技术有限公司 | 发光二极管及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104409580A (zh) * | 2014-11-12 | 2015-03-11 | 无锡格菲电子薄膜科技有限公司 | 一种GaN基LED外延片及其制备方法 |
CN104868028A (zh) * | 2014-02-25 | 2015-08-26 | 璨圆光电股份有限公司 | 发光二极管芯片 |
-
2016
- 2016-10-20 CN CN201610914870.9A patent/CN106449913A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104868028A (zh) * | 2014-02-25 | 2015-08-26 | 璨圆光电股份有限公司 | 发光二极管芯片 |
CN104409580A (zh) * | 2014-11-12 | 2015-03-11 | 无锡格菲电子薄膜科技有限公司 | 一种GaN基LED外延片及其制备方法 |
Non-Patent Citations (1)
Title |
---|
ZHIQIAN WU ET AL.: ""Surface plasmon enhanced graphene/p-GaN heterostructure light-emitting-diode by Ag nano-particles"", 《NANO ENERGY》 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020215441A1 (zh) * | 2019-04-25 | 2020-10-29 | 东南大学 | 一种基于N-ZnO/N-GaN/N-ZnO异质结的双向紫外发光二极管及制备方法 |
US11575066B2 (en) | 2019-04-25 | 2023-02-07 | Southeast University | N-ZnO/N-GaN/N-ZnO heterojunction-based bidirectional ultraviolet light-emitting diode and preparation method therefor |
CN113614933A (zh) * | 2020-03-03 | 2021-11-05 | 东莞市中麒光电技术有限公司 | 发光二极管及其制备方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI600184B (zh) | 發光裝置 | |
CN106711291A (zh) | 一种led垂直芯片结构及其制作方法 | |
JP2015092634A (ja) | 発光装置およびその製造方法 | |
CN102394264A (zh) | 增强ZnO基发光二极管紫光电致发光性能的方法 | |
US20100155765A1 (en) | Light emitting device having vertical structure and method for manufacturing the same | |
CN104051589A (zh) | 一种横向氧化锌纳米棒阵列发光二极管 | |
CN107425098B (zh) | 可实现纯紫外发光的ZnO基异质结发光二极管的制备方法 | |
CN106449913A (zh) | 石墨烯/银量子点/氮化镓双向发光二极管及其制备方法 | |
CN107634125B (zh) | 一种双向发光二极管及其制备方法 | |
CN106684221A (zh) | 石墨烯/氮化镓/金属纳米颗粒双向发光二极管及其制备方法 | |
WO2016023352A1 (zh) | 氮化镓发光二极管及其制作方法 | |
US8852974B2 (en) | Semiconductor light-emitting device and method for manufacturing the same | |
CN206271742U (zh) | 一种石墨烯/银量子点/氮化镓双向发光二极管 | |
TWI642204B (zh) | 發光二極體元件 | |
CN110993754B (zh) | 具有仿生金属纳米岛状结构的led管芯及其制备方法 | |
TWI258876B (en) | Compound semiconductor light-emitting device and production method thereof | |
CN110808319B (zh) | 反极性垂直发光二极管及其制备方法 | |
KR100765236B1 (ko) | 패터닝된 발광다이오드용 기판 제조방법 및 그것을채택하는 발광 다이오드 제조방법 | |
CN102157650A (zh) | 一种垂直结构的GaN基发光二极管的制备方法 | |
TWI287878B (en) | Light-emitting diodes and method of manufacturing same using metal bonding technique | |
CN205790052U (zh) | 一种高光萃取效率的近紫外led芯片 | |
TWI447960B (zh) | 發光二極體晶粒及其製造方法 | |
CN108735868A (zh) | 一种GaN基LED包覆式电极结构的制作方法 | |
CN109360874B (zh) | 基于石墨烯及多环银纳米薄膜电极的发光器件及其制备方法 | |
CN106920872A (zh) | 一种新型偏振发光二极管 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |